SG11201508197UA - Sealing sheet joining method and apparatus for joining sealing sheet - Google Patents
Sealing sheet joining method and apparatus for joining sealing sheetInfo
- Publication number
- SG11201508197UA SG11201508197UA SG11201508197UA SG11201508197UA SG11201508197UA SG 11201508197U A SG11201508197U A SG 11201508197UA SG 11201508197U A SG11201508197U A SG 11201508197UA SG 11201508197U A SG11201508197U A SG 11201508197UA SG 11201508197U A SG11201508197U A SG 11201508197UA
- Authority
- SG
- Singapore
- Prior art keywords
- sealing sheet
- joining
- joining method
- sealing
- sheet
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013080602A JP2014204034A (en) | 2013-04-08 | 2013-04-08 | Sealing sheet adhesive method and sealing sheet adhesive apparatus |
PCT/JP2014/057176 WO2014167948A1 (en) | 2013-04-08 | 2014-03-17 | Method for attaching sealing sheet and apparatus for attaching sealing sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201508197UA true SG11201508197UA (en) | 2015-11-27 |
Family
ID=51689362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201508197UA SG11201508197UA (en) | 2013-04-08 | 2014-03-17 | Sealing sheet joining method and apparatus for joining sealing sheet |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2014204034A (en) |
KR (1) | KR20150143539A (en) |
CN (1) | CN105074891A (en) |
SG (1) | SG11201508197UA (en) |
TW (1) | TW201501215A (en) |
WO (1) | WO2014167948A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7108516B2 (en) * | 2018-10-25 | 2022-07-28 | リンテック株式会社 | Sheet pasting method |
CN114695913A (en) * | 2020-12-30 | 2022-07-01 | 上海德迩新能源技术有限公司 | Sealing ring assembly, assembling method of sealing ring and jig |
CN113380861B (en) * | 2021-05-24 | 2023-04-18 | 云谷(固安)科技有限公司 | Display panel and preparation method thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05291319A (en) | 1992-04-07 | 1993-11-05 | Toshiba Corp | Resin sealing-type semiconductor device |
JP4004755B2 (en) * | 2001-07-17 | 2007-11-07 | シャープ株式会社 | Semiconductor package manufacturing method and semiconductor package |
JP4718734B2 (en) * | 2001-09-12 | 2011-07-06 | 日機装株式会社 | Circuit element mounting method |
JP5203593B2 (en) * | 2006-11-02 | 2013-06-05 | リンテック株式会社 | Sheet for sticking |
JP5324399B2 (en) * | 2009-11-10 | 2013-10-23 | リンテック株式会社 | Sheet sticking device and sticking method |
JP5334135B2 (en) * | 2010-08-20 | 2013-11-06 | ニチゴー・モートン株式会社 | Laminating equipment |
-
2013
- 2013-04-08 JP JP2013080602A patent/JP2014204034A/en active Pending
-
2014
- 2014-03-17 WO PCT/JP2014/057176 patent/WO2014167948A1/en active Application Filing
- 2014-03-17 CN CN201480019211.8A patent/CN105074891A/en active Pending
- 2014-03-17 KR KR1020157031060A patent/KR20150143539A/en not_active Application Discontinuation
- 2014-03-17 SG SG11201508197UA patent/SG11201508197UA/en unknown
- 2014-04-07 TW TW103112648A patent/TW201501215A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2014167948A1 (en) | 2014-10-16 |
CN105074891A (en) | 2015-11-18 |
JP2014204034A (en) | 2014-10-27 |
KR20150143539A (en) | 2015-12-23 |
TW201501215A (en) | 2015-01-01 |
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