JP2014107571A - 半導体素子 - Google Patents
半導体素子 Download PDFInfo
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- JP2014107571A JP2014107571A JP2013244400A JP2013244400A JP2014107571A JP 2014107571 A JP2014107571 A JP 2014107571A JP 2013244400 A JP2013244400 A JP 2013244400A JP 2013244400 A JP2013244400 A JP 2013244400A JP 2014107571 A JP2014107571 A JP 2014107571A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 123
- 210000000746 body region Anatomy 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims description 46
- 239000013078 crystal Substances 0.000 claims description 12
- 239000012535 impurity Substances 0.000 description 25
- 230000008569 process Effects 0.000 description 17
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 15
- 229910010271 silicon carbide Inorganic materials 0.000 description 14
- 238000002513 implantation Methods 0.000 description 10
- 230000000903 blocking effect Effects 0.000 description 7
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- 238000005468 ion implantation Methods 0.000 description 5
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
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- 239000010949 copper Substances 0.000 description 2
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- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
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- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
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Abstract
【解決手段】半導体素子は半導体ボディ内に一体化された少なくとも2つの素子セルを含む。各素子セルは、ドリフト領域、ソース領域、ソース領域とドリフト領域間に配置されたドレイン領域、ダイオード領域、ダイオード領域とドリフト領域間のpn接合、及び第1の側壁と第1の側壁に対向する第2の側壁と底部とを有するトレンチを含む。ボディ領域は第1の側壁に隣接し、ダイオード領域は第2の側壁に隣接し、pn接合はトレンチの底部に隣接する。各素子セルは更に、トレンチ内に配置されボディ領域、ダイオード領域、及びドリフト領域からゲート誘電体により誘電体的に絶縁されたゲート電極を含む。少なくとも2つの素子セルのダイオード領域は半導体ボディの横方向に離れている。
【選択図】図1
Description
12 ソース領域
13 ボディ領域
14 ドレイン領域
15 チャンネル領域
21 ゲート電極
21’ 電極層
22 ゲート誘電体
30 ダイオード領域
31 第1のダイオード領域
32 第2のダイオード領域
41 ソース電極
42 ゲート接続電極
51 絶縁層
52 第1のコンタクト開口
53 第2のコンタクト開口
100 半導体ボディ
101 第1の表面
102 第2の表面
111 ドリフト領域層
112 ソース領域層
113 ボディ領域層
114 ドレイン領域層
210 イオン注入マスク
220 スペーサー
101 第1の素子セル
102 第2の素子セル
111 チャネル領域
411 第1のソース電極層
412 第2のソース電極層
1101 第1の側壁
1102 第2の側壁
1103 底部
D ドレイン端子
G ゲート端子
S ソース端子
Claims (16)
- 半導体ボディと前記半導体ボディに一体化された少なくとも2つの素子セルとを含む半導体素子であって、各素子セルは、
ドリフト領域、ソース領域、及び前記ソース領域と前記ドリフト領域間に配置されたボディ領域と、
ダイオード領域と前記ダイオード領域と前記ドリフト領域間のpn接合と、
第1の側壁、前記第1の側壁に対向する第2の側壁、及び底部を有するトレンチであって、前記ボディ領域は前記第1の側壁に隣接し、前記ダイオード領域は前記第2の側壁に隣接し、前記pn接合は前記トレンチの前記底部に隣接する、トレンチと、
前記トレンチ内に配置されゲート誘電体により前記ボディ領域、前記ダイオード領域、及び前記ドリフト領域から誘電体的に絶縁されるゲート電極と、を含み、
前記少なくとも2つの素子セルの前記ダイオード領域は前記半導体ボディの横方向に離れている、半導体素子。 - 前記ソース領域と各素子の前記ダイオード領域に電気的に接続されたソース電極を更に含む請求項1に記載の半導体素子。
- 各ダイオード領域は、前記ドリフト領域と共に前記pn接合を形成する第1のダイオード領域と、前記第1のダイオード領域より高ドープであり前記ソース電極に接続された第2のダイオード領域とを含む、請求項2に記載の半導体素子。
- 前記第2のダイオード領域は前記トレンチの第2の側壁に隣接する、請求項3に記載の半導体素子。
- 前記少なくとも2つの素子セルは前記ドリフト領域を共有する、請求項1に記載の半導体素子。
- 各素子セルは更に、前記ドリフト領域に隣接し前記半導体ボディの垂直方向において前記ダイオード領域から離れたドレイン領域を含む、請求項1に記載の半導体素子。
- 前記少なくとも2つの素子セルは前記ドレイン領域を共有する、請求項1に記載の半導体素子。
- 前記少なくとも2つの素子セルは隣接し、1つの素子セルの前記ダイオード領域はその他の素子セルの前記ボディ領域に隣接する、請求項1に記載の半導体素子。
- 前記半導体ボディはSiC結晶を含み、前記トレンチの前記第1の側壁はSiC結晶のc軸と整合する、請求項1に記載の半導体素子。
- 前記半導体ボディの前記第1の表面と前記第1の側壁との角度は80°〜89°である、請求項9に記載の半導体素子。
- ドリフト領域層、前記ドリフト領域層に隣接するボディ領域層、及び前記ボディ領域層に隣接し前記半導体ボディの第1の表面を形成するソース領域層を含む半導体ボディを設ける工程と、
各ダイオード領域が前記第1の表面から前記ソース領域層と前記ボディ領域層を通って前記ドリフト領域層中に延在するように少なくとも2つのダイオード領域を形成する工程であって、各ダイオード領域と前記ドリフト領域層が1つのpn接合を形成する、工程と、
それぞれが第1の側壁、前記第1の側壁に対向する第2の側壁、及び底部を有する少なくとも2つのトレンチを、各トレンチが1つの側壁上のボディ領域層、前記第2の側壁上の1つのダイオード領域、及び前記底部の1つのpn接合に隣接するように形成する工程と、
ゲート電極と前記半導体ボディから前記ゲート電極を誘電体的に絶縁するゲート誘電体とを各トレンチ内に形成する工程と、を含む半導体素子を作製する方法であって、
前記ダイオード領域を形成した後に残る前記ソース領域層の部分がソース領域を形成し、
前記ダイオード領域を形成した後に残る前記ボディ領域層の部分がボディ領域を形成する、方法。 - 前記第1の表面上に絶縁層を形成する工程と、
各ダイオード領域と各ソース領域の上の前記絶縁層内に第1のコンタクト開口を形成する工程と、
各第1のコンタクト開口内の前記ソース領域と前記ダイオード領域に電気的に接続されたソース電極を形成する工程とを更に含む請求項11に記載の方法。 - 各ゲート電極の上の前記絶縁層内に第2のコンタクト開口を形成する工程と、
各第2のコンタクト開口内の前記ゲート電極に電気的に接続されたゲート接続電極を形成する工程と、を更に含む請求項12に記載の方法。 - 前記トレンチは細長いトレンチである請求項11に記載の方法。
- 前記半導体ボディはSiC結晶を含み、
前記トレンチは前記トレンチの前記第1の側壁がSiC結晶のc軸と整合するように形成される、請求項11に記載の方法。 - 前記第1のトレンチは前記半導体ボディの前記第1の表面と前記第1の側壁との角度が80°〜89°となるように形成される、請求項15に記載の方法。
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US10679983B2 (en) | 2020-06-09 |
KR101594221B1 (ko) | 2016-02-15 |
US9941272B2 (en) | 2018-04-10 |
CN103839943B (zh) | 2017-04-12 |
DE102013224134A1 (de) | 2014-05-28 |
CN103839943A (zh) | 2014-06-04 |
US9293558B2 (en) | 2016-03-22 |
DE102013224134B4 (de) | 2019-10-02 |
US20180197852A1 (en) | 2018-07-12 |
KR20140067922A (ko) | 2014-06-05 |
US20140145206A1 (en) | 2014-05-29 |
DE102013022598B3 (de) | 2020-10-01 |
US20160190121A1 (en) | 2016-06-30 |
JP5907940B2 (ja) | 2016-04-26 |
DE102013022598B8 (de) | 2020-11-12 |
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