JP2012009702A5

JP2012009702A5 -

Info

Publication number: JP2012009702A5
Application number: JP2010145457A
Authority: JP
Filing date: 2010-06-25
Publication date: 2013-08-08
Anticipated expiration: 2030-06-25

Claims

固定部を有する発熱体と、
前記発熱体の外周を囲うように設けられ、内壁に前記固定部が固定される断熱体と、
を備えた加熱装置であって、
少なくとも前記発熱体が室温状態の時に、前記発熱体と前記断熱体の内壁との間の距離が、前記固定部から離れるにつれて大きくなるように設定されていることを特徴とする加熱装置。 A heating element having a fixed portion ;
A heat insulator that is provided so as to surround an outer periphery of the heating element, and the fixing portion is fixed to an inner wall ;
A heating apparatus having a,
At least when the heating element is at room temperature, the heating apparatus is set such that a distance between the heating element and an inner wall of the heat insulating body increases as the distance from the fixing portion increases.

前記固定部が前記発熱体の周方向に沿って複数設けられ、
少なくとも前記発熱体が室温状態の時に、前記発熱体と前記断熱体の内壁との間の距離が、隣接する前記固定部間の中央位置から前記固定部に近づくにつれて小さくなるように設定されていることを特徴とする請求項１に記載の加熱装置。 A plurality of the fixing portions are provided along the circumferential direction of the heating element,
At least when the heating element is at room temperature, the distance between the heating element and the inner wall of the heat insulating body is set so as to decrease from the central position between the adjacent fixing parts toward the fixing part. The heating apparatus according to claim 1.

固定部を有する発熱体と、前記発熱体の外周を囲うように設けられ、内壁に前記固定部が固定される断熱体と、を備えた加熱装置と、
前記加熱装置の前記発熱体の内側に設けられた処理室と、
を有し、前記加熱装置は、少なくとも前記発熱体が室温状態の時に、前記発熱体と前記断熱体の内壁との間の距離が、前記固定部から離れるにつれて大きくなるように設定されていることを特徴とする基板処理装置。 A heating element having a fixing portion, provided so as to surround the outer periphery of the heating element, a heating apparatus having a heat-insulating body in which the fixing portion is fixed to the inner wall, and
A processing chamber provided inside the heating element of the heating device;
The heating device is set so that the distance between the heating element and the inner wall of the heat insulator increases as the distance from the fixing portion increases at least when the heating element is at room temperature. A substrate processing apparatus.

固定部を有する発熱体と、前記発熱体の外周を囲うように設けられ、内壁に前記固定部が固定される断熱体と、を備え、少なくとも前記発熱体が室温状態の時に前記発熱体と前記断熱体の内壁との間の距離が前記固定部から離れるにつれて大きくなるように設定された加熱装置の前記発熱体の内側に設けられた処理室内に基板を搬入する工程と、A heating element having a fixing part; and a heat insulator that is provided so as to surround an outer periphery of the heating element and that fixes the fixing part to an inner wall, and at least when the heating element is at room temperature, the heating element and the A step of carrying the substrate into a processing chamber provided inside the heating element of the heating device set so that the distance from the inner wall of the heat insulator increases as the distance from the fixing portion increases;
前記発熱体を昇温させて前記処理室内の基板を加熱して処理する工程と、Heating and heating the heating element to heat the substrate in the processing chamber; and
を有することを特徴とする基板処理方法。A substrate processing method comprising:

固定部を有する発熱体と、前記発熱体の外周を囲うように設けられ、内壁に前記固定部が固定される断熱体と、を備え、少なくとも前記発熱体が室温状態の時に前記発熱体と前記断熱体の内壁との間の距離が前記固定部から離れるにつれて大きくなるように設定された加熱装置の前記発熱体の内側に設けられた処理室内に基板を搬入する工程と、A heating element having a fixing part; and a heat insulator that is provided so as to surround an outer periphery of the heating element and that fixes the fixing part to an inner wall, and at least when the heating element is at room temperature, the heating element and the A step of carrying the substrate into a processing chamber provided inside the heating element of the heating device set so that the distance from the inner wall of the heat insulator increases as the distance from the fixing portion increases;
前記発熱体を昇温させて前記処理室内の基板を加熱して処理する工程と、Heating and heating the heating element to heat the substrate in the processing chamber; and
を有することを特徴とする半導体装置の製造方法。A method for manufacturing a semiconductor device, comprising: