JP2017050574A5 - Dicing tape heating apparatus and dicing tape heating method - Google Patents

Dicing tape heating apparatus and dicing tape heating method Download PDF

Info

Publication number
JP2017050574A5
JP2017050574A5 JP2016243282A JP2016243282A JP2017050574A5 JP 2017050574 A5 JP2017050574 A5 JP 2017050574A5 JP 2016243282 A JP2016243282 A JP 2016243282A JP 2016243282 A JP2016243282 A JP 2016243282A JP 2017050574 A5 JP2017050574 A5 JP 2017050574A5
Authority
JP
Japan
Prior art keywords
dicing tape
heating
tape heating
slack portion
heating apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016243282A
Other languages
Japanese (ja)
Other versions
JP2017050574A (en
Filing date
Publication date
Application filed filed Critical
Publication of JP2017050574A publication Critical patent/JP2017050574A/en
Publication of JP2017050574A5 publication Critical patent/JP2017050574A5/en
Pending legal-status Critical Current

Links

Claims (4)

ダイシングテープの弛み部分を局所的に加熱する加熱手段と、Heating means for locally heating the slack portion of the dicing tape;
前記加熱手段を前記ダイシングテープの弛み部分に沿って相対的に移動させる移動手段と、  Moving means for relatively moving the heating means along the slack portion of the dicing tape;
を備える、ダイシングテープ加熱装置。  A dicing tape heating device. 前記加熱手段は前記ダイシングテープの弛み部分に対して互いに異なる位置に複数設けられる、
請求項１に記載のダイシングテープ加熱装置。 A plurality of the heating means are provided at different positions with respect to the slack portion of the dicing tape,
The dicing tape heating apparatus according to claim 1. 前記加熱手段は輻射熱または対流熱を用いて加熱を行う、The heating means performs heating using radiant heat or convection heat.
請求項１から３のいずれか１項に記載のダイシングテープ加熱装置。  The dicing tape heating apparatus according to any one of claims 1 to 3. ダイシングテープの弛み部分を局所的に加熱する加熱ステップと、A heating step for locally heating the slack portion of the dicing tape;
前記加熱が行われる位置を前記ダイシングテープの弛み部分に沿って相対的に移動させる移動ステップと、  A moving step of relatively moving a position where the heating is performed along a slack portion of the dicing tape;
を備える、ダイシングテープ加熱方法。  A dicing tape heating method comprising:
JP2016243282A 2011-02-16 2016-12-15 Work division device Pending JP2017050574A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011031291 2011-02-16
JP2011031291 2011-02-16

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2015121666A Division JP6069740B2 (en) 2011-02-16 2015-06-17 Work dividing apparatus and work dividing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017030266A Division JP6383030B2 (en) 2011-02-16 2017-02-21 Work dividing apparatus and work dividing method

Publications (2)

Publication Number Publication Date
JP2017050574A JP2017050574A (en) 2017-03-09
JP2017050574A5 true JP2017050574A5 (en) 2017-06-29

Family

ID=46844533

Family Applications (11)

Application Number Title Priority Date Filing Date
JP2011282761A Active JP5013148B1 (en) 2011-02-16 2011-12-26 Work dividing apparatus and work dividing method
JP2012126847A Active JP5871719B2 (en) 2011-02-16 2012-06-04 Work dividing apparatus and work dividing method
JP2015121666A Active JP6069740B2 (en) 2011-02-16 2015-06-17 Work dividing apparatus and work dividing method
JP2016243282A Pending JP2017050574A (en) 2011-02-16 2016-12-15 Work division device
JP2017030266A Active JP6383030B2 (en) 2011-02-16 2017-02-21 Work dividing apparatus and work dividing method
JP2017099990A Active JP6384975B2 (en) 2011-02-16 2017-05-19 Work dividing apparatus and work dividing method
JP2017203593A Active JP6508286B2 (en) 2011-02-16 2017-10-20 Work division apparatus and work division method
JP2018175177A Active JP6452016B1 (en) 2011-02-16 2018-09-19 Work dividing apparatus and work dividing method
JP2018219316A Active JP6466620B1 (en) 2011-02-16 2018-11-22 Work dividing device
JP2019001461A Active JP6562170B2 (en) 2011-02-16 2019-01-08 Work dividing device
JP2019001460A Active JP6562169B2 (en) 2011-02-16 2019-01-08 Work dividing device

Family Applications Before (3)

Application Number Title Priority Date Filing Date
JP2011282761A Active JP5013148B1 (en) 2011-02-16 2011-12-26 Work dividing apparatus and work dividing method
JP2012126847A Active JP5871719B2 (en) 2011-02-16 2012-06-04 Work dividing apparatus and work dividing method
JP2015121666A Active JP6069740B2 (en) 2011-02-16 2015-06-17 Work dividing apparatus and work dividing method

Family Applications After (7)

Application Number Title Priority Date Filing Date
JP2017030266A Active JP6383030B2 (en) 2011-02-16 2017-02-21 Work dividing apparatus and work dividing method
JP2017099990A Active JP6384975B2 (en) 2011-02-16 2017-05-19 Work dividing apparatus and work dividing method
JP2017203593A Active JP6508286B2 (en) 2011-02-16 2017-10-20 Work division apparatus and work division method
JP2018175177A Active JP6452016B1 (en) 2011-02-16 2018-09-19 Work dividing apparatus and work dividing method
JP2018219316A Active JP6466620B1 (en) 2011-02-16 2018-11-22 Work dividing device
JP2019001461A Active JP6562170B2 (en) 2011-02-16 2019-01-08 Work dividing device
JP2019001460A Active JP6562169B2 (en) 2011-02-16 2019-01-08 Work dividing device

Country Status (3)

Country Link
JP (11) JP5013148B1 (en)
KR (1) KR101522276B1 (en)
TW (1) TWI433228B (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5013148B1 (en) * 2011-02-16 2012-08-29 株式会社東京精密 Work dividing apparatus and work dividing method
JP2013191718A (en) * 2012-03-14 2013-09-26 Disco Abrasive Syst Ltd Workpiece division device and division method
JP5885033B2 (en) * 2012-09-24 2016-03-15 株式会社東京精密 Work dividing apparatus and work dividing method
US10008405B2 (en) * 2012-12-26 2018-06-26 Hitachi Chemical Company, Ltd Expansion method, method for manufacturing semiconductor device, and semiconductor device
JP6298635B2 (en) * 2014-01-10 2018-03-20 株式会社ディスコ Dividing device and workpiece dividing method
JP6573072B2 (en) * 2015-08-27 2019-09-11 株式会社村田製作所 Film expansion apparatus and method of manufacturing electronic component using the same
JP6570942B2 (en) * 2015-09-18 2019-09-04 株式会社ディスコ Dividing device and wafer dividing method
JP5939416B2 (en) * 2016-02-12 2016-06-22 株式会社東京精密 Work dividing apparatus and work dividing method
JP6060475B2 (en) * 2016-05-16 2017-01-18 株式会社東京精密 Work dividing apparatus and work dividing method
JP6741529B2 (en) * 2016-09-09 2020-08-19 株式会社ディスコ Tip spacing maintenance method
CN109891556B (en) * 2016-10-28 2022-11-22 株式会社东京精密 Workpiece dividing device and workpiece dividing method
JP6414995B2 (en) * 2016-12-14 2018-10-31 株式会社東京精密 Work dividing apparatus and work dividing method
JP6814672B2 (en) * 2017-03-23 2021-01-20 株式会社ディスコ Processing method
JP6820099B2 (en) * 2017-05-10 2021-01-27 リンテック株式会社 Separation device and separation method
JP2018207068A (en) * 2017-06-09 2018-12-27 株式会社ディスコ Pickup method
JP7105120B2 (en) * 2017-07-04 2022-07-22 日東電工株式会社 Dicing tape, dicing die-bonding film, and semiconductor device manufacturing method
JP7109916B2 (en) * 2017-12-27 2022-08-01 株式会社ディスコ splitter
JP7110541B2 (en) * 2018-01-11 2022-08-02 株式会社東京精密 Work dividing device and work dividing method
CN110098148A (en) * 2018-01-30 2019-08-06 株式会社迪思科 The processing method of chip
JP7030006B2 (en) * 2018-04-12 2022-03-04 株式会社ディスコ Expansion method and expansion device
JP7130324B2 (en) * 2018-05-18 2022-09-05 株式会社ディスコ Device chip forming method
JP7033004B2 (en) * 2018-05-24 2022-03-09 日東電工株式会社 Dicing Diebond film and semiconductor device manufacturing method
JP2018170525A (en) * 2018-07-09 2018-11-01 株式会社東京精密 Workpiece division device and workpiece division method
TWI677932B (en) * 2019-02-01 2019-11-21 相豐科技股份有限公司 Expansion method of stretch film and expander thereof
WO2020217397A1 (en) * 2019-04-25 2020-10-29 日立化成株式会社 Method for producing semiconductor device having dolmen structure, method for producing supporting pieces, and multilayer film
JP7386649B2 (en) * 2019-08-29 2023-11-27 株式会社ディスコ tape expansion unit
JP7345328B2 (en) * 2019-09-13 2023-09-15 株式会社ディスコ Processing method of workpiece
CN110729186A (en) * 2019-10-24 2020-01-24 东莞记忆存储科技有限公司 Processing method for wafer cutting and separating
JP7217408B2 (en) * 2020-05-26 2023-02-03 株式会社東京精密 Temperature imparting device and temperature imparting method
US11842907B2 (en) * 2020-07-08 2023-12-12 Applied Materials, Inc. Spot heating by moving a beam with horizontal rotary motion
KR102441184B1 (en) * 2020-07-15 2022-09-07 주식회사 기가레인 Transfer device for easy film exchange and film exchange method
JP7170208B2 (en) * 2021-01-19 2022-11-14 株式会社東京精密 Work dividing device and work dividing method
JPWO2023042261A1 (en) * 2021-09-14 2023-03-23
WO2023042260A1 (en) * 2021-09-14 2023-03-23 ヤマハ発動機株式会社 Expansion device
WO2023209901A1 (en) * 2022-04-27 2023-11-02 ヤマハ発動機株式会社 Expanding device, semiconductor chip production method, and semiconductor chip
CN117894720A (en) * 2024-03-15 2024-04-16 视睿（杭州）信息科技有限公司 Method and device for sorting semiconductor wafer chips

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2831680B2 (en) * 1989-03-06 1998-12-02 株式会社東芝 Wafer sheet stretching device, wafer sheet stretching method, semiconductor pellet removal method, semiconductor pellet removal device, inner lead bonding device, inner lead bonding method
JPH0541451A (en) * 1991-08-06 1993-02-19 Sony Corp Method and device for pelletizing semiconductor wafer
JP4526651B2 (en) * 1999-08-12 2010-08-18 富士通セミコンダクター株式会社 Semiconductor device
JP4392732B2 (en) * 2000-02-07 2010-01-06 リンテック株式会社 Manufacturing method of semiconductor chip
JP4288392B2 (en) * 2003-09-29 2009-07-01 株式会社東京精密 Expanding method
JP2004200381A (en) * 2002-12-18 2004-07-15 Renesas Technology Corp Manufacturing method of semiconductor device and manufacturing device for semiconductor device
JP2005260154A (en) * 2004-03-15 2005-09-22 Tokyo Seimitsu Co Ltd Method of manufacturing chip
US7552528B2 (en) * 2004-05-24 2009-06-30 Panasonic Corporation Wafer expanding device, component feeder, and expanding method for wafer sheet
JP2007027562A (en) * 2005-07-20 2007-02-01 Disco Abrasive Syst Ltd Method of fracturing bonding film attached on wafer
JP2007123658A (en) * 2005-10-31 2007-05-17 Disco Abrasive Syst Ltd Expansion apparatus of adhesive tape
JP2009064905A (en) * 2007-09-05 2009-03-26 Disco Abrasive Syst Ltd Extension method and extension apparatus
JP4935733B2 (en) * 2008-03-24 2012-05-23 富士通株式会社 Lending status display program, lending status display device, and lending status display method
JP5354149B2 (en) * 2008-04-08 2013-11-27 株式会社東京精密 Expanding method
JP5243101B2 (en) * 2008-05-14 2013-07-24 株式会社ディスコ Breaking device
JP5378780B2 (en) * 2008-12-19 2013-12-25 株式会社ディスコ Tape expansion method and tape expansion device
JP5253996B2 (en) * 2008-12-26 2013-07-31 株式会社ディスコ Work dividing method and tape expansion device
JP5791866B2 (en) * 2009-03-06 2015-10-07 株式会社ディスコ Work dividing device
JP5303330B2 (en) * 2009-03-26 2013-10-02 積水化学工業株式会社 Dicing tape and semiconductor chip manufacturing method
JP2011077482A (en) * 2009-10-02 2011-04-14 Disco Abrasive Syst Ltd Tape expanding device
JP5554118B2 (en) * 2010-03-31 2014-07-23 古河電気工業株式会社 Wafer processing tape
JP5536555B2 (en) * 2010-06-22 2014-07-02 株式会社ディスコ Expansion tape shrink device
JP2012156400A (en) * 2011-01-27 2012-08-16 Disco Abrasive Syst Ltd Tape expanding device
JP5013148B1 (en) * 2011-02-16 2012-08-29 株式会社東京精密 Work dividing apparatus and work dividing method

Similar Documents

Publication Publication Date Title
JP2017050574A5 (en) Dicing tape heating apparatus and dicing tape heating method
KR20180084893A (en) Magnetic calorie heat pump, cooling device and operating method thereof
IL256816B (en) Metrology methods, radiation source, metrology apparatus and device manufacturing method
EP3649419A4 (en) Apparatus and methods for additively manufacturing microtube heat exchangers
DE102017120447A8 (en) A semiconductor device, a method of operating the semiconductor device, and a system including the same
KR102369905B9 (en) Feedback device and method for providing thermal feedback using the same
EP3093356A4 (en) Cladded aluminium-alloy material and production method therefor, and heat exchanger using said cladded aluminium-alloy material and production method therefor
EP3139717A4 (en) Heat dissipation device, heat dissipation control method and controller
PL3169638T3 (en) Method for producing a coated substrate, planar substrate, comprising at least two layers applied by means of heating, and the use of the coated substrate
DK3441667T3 (en) Radiant active convection heat sink and stage lighting, which use the same
DK3492822T3 (en) CONTROL PROCEDURE AND DEVICE FOR A HEATING SYSTEM OR COOLING SYSTEM
PL3376122T3 (en) Method and device for detecting the heat given off by a heating surface
EP3121301A4 (en) Cladded aluminium-alloy material and production method therefor, and heat exchanger using said cladded aluminium-alloy material and production method therefor
DK3396285T3 (en) CONTINUOUS DRYING SYSTEM WITH A HEAT EXCHANGE
DE112019004257A5 (en) Heat transfer device
EP3425452A4 (en) Drive device, lithography device, cooling method, and method for manufacturing article
JP2018506175A5 (en) Apparatus for holding and heating a workpiece, method for heating a workpiece, and ring heater assembly
EP3557158A4 (en) Heat transfer device and heat transfer method using same
EP3392298A4 (en) Thermoresponsive material, method for producing thermoresponsive material, and heat control device
SG11202000373YA (en) Heat exchange apparatus, and heat exchange method therefor and vapour deposition device thereof
DK3402774T3 (en) Process with a reactor with cooling device
PT3410055T (en) Heat exchange device
DE102016121398A8 (en) LIGHTING SYSTEM, OPERATING DEVICE, AND LIGHTING RADIATION METHOD
JP2017050573A5 (en) Work dividing apparatus and work dividing method
JP2016036764A5 (en)