JP2015180871A5 - - Google Patents
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- JP2015180871A5 JP2015180871A5 JP2015042968A JP2015042968A JP2015180871A5 JP 2015180871 A5 JP2015180871 A5 JP 2015180871A5 JP 2015042968 A JP2015042968 A JP 2015042968A JP 2015042968 A JP2015042968 A JP 2015042968A JP 2015180871 A5 JP2015180871 A5 JP 2015180871A5
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- ceramic green
- electrode
- lid
- container body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 claims description 14
- 238000010304 firing Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
Description
本発明に係るワイヤレス温度センサの製造方法は、第一のセラミックグリーンシートと、第二のセラミックグリーンシートと、を用意する工程と、第二のセラミックグリーンシートよりも熱伝導率が高い第一のセラミックグリーンシートを焼成して容器本体を形成する工程と、第二のセラミックグリーンシートにアンテナ電極及びGND電極を配置し、アンテナ電極及びGND電極が配置された第二のセラミックグリーンシートを、第一のセラミックグリーンシートよりも低い焼成温度で焼成してアンテナを有する蓋を形成する工程と、温度検出素子を、アンテナ電極及びGND電極に電気的に接続する工程と、温度検出素子が容器本体及び蓋の内部に固定されるように、容器本体と蓋とを貼り合わせる工程と、を有することを特徴とする。 A method for manufacturing a wireless temperature sensor according to the present invention includes a step of preparing a first ceramic green sheet and a second ceramic green sheet, and a first thermal conductivity higher than that of the second ceramic green sheet. A step of firing the ceramic green sheet to form a container body, an antenna electrode and a GND electrode are disposed on the second ceramic green sheet, and the second ceramic green sheet on which the antenna electrode and the GND electrode are disposed Forming a lid having an antenna by firing at a firing temperature lower than that of the ceramic green sheet, electrically connecting the temperature detection element to the antenna electrode and the GND electrode, and the temperature detection element including the container body and the lid And a step of bonding the container body and the lid together so as to be fixed inside.
Claims (1)
第一のセラミックグリーンシートと、第二のセラミックグリーンシートと、を用意する工程と、
前記第二のセラミックグリーンシートよりも熱伝導率が高い前記第一のセラミックグリーンシートを焼成して容器本体を形成する工程と、
前記第二のセラミックグリーンシートにアンテナ電極及びGND電極を配置し、前記アンテナ電極及び前記GND電極が配置された前記第二のセラミックグリーンシートを、前記第一のセラミックグリーンシートよりも低い焼成温度で焼成してアンテナを有する蓋を形成する工程と、
温度検出素子を、前記アンテナ電極及び前記GND電極に電気的に接続する工程と、
前記温度検出素子が前記容器本体及び前記蓋の内部に固定されるように、前記容器本体と前記蓋とを貼り合わせる工程と、
を有することを特徴とするワイヤレス温度センサの製造方法。 A method for manufacturing a wireless temperature sensor, comprising:
Preparing a first ceramic green sheet and a second ceramic green sheet;
Firing the first ceramic green sheet having a higher thermal conductivity than the second ceramic green sheet to form a container body;
An antenna electrode and a GND electrode are disposed on the second ceramic green sheet, and the second ceramic green sheet on which the antenna electrode and the GND electrode are disposed is lower in firing temperature than the first ceramic green sheet. Baking to form a lid with an antenna;
Electrically connecting a temperature detection element to the antenna electrode and the GND electrode;
Bonding the container body and the lid so that the temperature detection element is fixed inside the container body and the lid;
A method for manufacturing a wireless temperature sensor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015042968A JP6516513B2 (en) | 2014-03-06 | 2015-03-04 | Wireless temperature sensor and method of manufacturing the same |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014043932 | 2014-03-06 | ||
JP2014043932 | 2014-03-06 | ||
JP2015042968A JP6516513B2 (en) | 2014-03-06 | 2015-03-04 | Wireless temperature sensor and method of manufacturing the same |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015180871A JP2015180871A (en) | 2015-10-15 |
JP2015180871A5 true JP2015180871A5 (en) | 2018-02-08 |
JP6516513B2 JP6516513B2 (en) | 2019-05-22 |
Family
ID=54329175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015042968A Active JP6516513B2 (en) | 2014-03-06 | 2015-03-04 | Wireless temperature sensor and method of manufacturing the same |
Country Status (1)
Country | Link |
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JP (1) | JP6516513B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6852289B2 (en) * | 2016-06-20 | 2021-03-31 | 富士電機株式会社 | Wireless sensor system |
KR20210005335A (en) * | 2019-07-03 | 2021-01-14 | 주식회사 에스아이피 | Wireless date transmitting typed sensor system |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004515757A (en) * | 2000-12-08 | 2004-05-27 | ザ ジョンズ ホプキンズ ユニバーシティ | Wireless multifunctional sensor platform, system having the platform and method of using the same |
JP2006259156A (en) * | 2005-03-16 | 2006-09-28 | Fuji Xerox Co Ltd | Image forming apparatus |
US8730681B2 (en) * | 2011-09-23 | 2014-05-20 | Infineon Technologies Ag | Power semiconductor module with wireless saw temperature sensor |
-
2015
- 2015-03-04 JP JP2015042968A patent/JP6516513B2/en active Active
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