JP2008122392A - フィンガー・テスター - Google Patents
フィンガー・テスター Download PDFInfo
- Publication number
- JP2008122392A JP2008122392A JP2007303001A JP2007303001A JP2008122392A JP 2008122392 A JP2008122392 A JP 2008122392A JP 2007303001 A JP2007303001 A JP 2007303001A JP 2007303001 A JP2007303001 A JP 2007303001A JP 2008122392 A JP2008122392 A JP 2008122392A
- Authority
- JP
- Japan
- Prior art keywords
- test
- circuit board
- magnetic flux
- finger tester
- needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07392—Multiple probes manipulating each probe element or tip individually
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Gloves (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
【解決手段】互いに対向して配列された2個の静磁束部材(31,32;47,48;52,53)を有するリニアモータと、それらの間に移動可能に搭載され、非磁性材料で形成され、しかも規則的な間隔で磁性材料により形成した帯状の電機子部材(45)を持つ電機子プレート(43)とで構成された、コンポーネント化されていない回路基板の試験に用いるフィンガー・テスターで試験プローブを駆動する。
Description
フィンガー・テスターは試験用回路基板21を保持する領域を有しており、支え部材64がこれを保持している。この保持領域の上方には、保持領域の上方に延びたクロスバー65が少なくとも1つ配置されている。好ましくは、フィンガー・テスターに固定された、あるいは移動可能な数個のクロスバー65からなる。もしクロスバー65をフィンガー・テスターから動けないように固定するときは、試験ヘッドを旋回ユニットで構成する。そうすれば、少なくとも関係する試験プローブ 1は垂直軸のまわりを旋回することができる。
Claims (4)
- 互いに対向して配列された2個の静磁束部材(31,32;47,48;52,53)を有するリニアモータと、それらの間に移動可能に搭載され、非磁性材料で形成され、しかも規則的な間隔で磁性材料により形成した帯状の電機子部材(45)を持つ電機子プレート(43)とで構成された、コンポーネント化されていない回路基板の試験に用いるフィンガー・テスターにおいて、
独立した駆動源を持たず、回路基板の試験点に接触するまで移動可能なプローブ素子を備えた試験針を有し、少なくとも2個の柔軟なばね性のある線部材で形成された支えアーム対手段により台に旋回可能に取り付けられた回路基板の試験に用いるフィンガー・テスター用試験プローブ(1)であって、
前記支えアームの少なくとも1個が電気的に伝導性のある材料で形成され、かつ前記試験針に電気的に接続されており、
前記それぞれの支えアーム対は、一方の端部が前記試験針に、他方の端部が前記台の所定距離離間した2カ所に固定され、上から見て三角形に橋掛けする態様で、ひとつの平面に搭載されていることを特徴とするフィンガー・テスター用試験プローブ (1)が前記電機子プレート(43)に搭載されていること
を特徴とするフィンガー・テスター。 - 少なくとも前記磁束部材(31、32;47)のひとつが、1個またはそれ以上の永久磁石を有し、かつ前記電機子プレート(43)に面した前記端部区域上に、駆動コイル(39)が搭載された複数のポール壁(38)を有することを特徴とする請求項1に記載のフィンガー・テスター。
- 1個またはそれ以上の磁束部材(52)が、少なくとも1個の静磁界を生成するコイル(54)を有し、かつ前記電機子プレート(43)に面した前記端部区域上に、駆動コイル(39)が搭載された複数のポール壁(38)を有することを特徴とする請求項1に記載のフィンガー・テスター。
- 両磁束部材(31、32;47、48;52、53)の上に、複数のエアーノズルが備えられ、おのおの前記電機子プレート(43)と前記磁束部材(31、32;47、48;52、53)の間にエアークッションを形成するために前記電機子プレートに導かれていることを特徴とする請求項1〜3のいずれかに記載のフィンガー・テスター。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10160119.0 | 2001-12-07 | ||
DE10160119A DE10160119A1 (de) | 2001-12-07 | 2001-12-07 | Prüfsonde für einen Fingertester |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003549931A Division JP4073024B2 (ja) | 2001-12-07 | 2002-11-14 | フィンガー・テスター用試験プローブ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008122392A true JP2008122392A (ja) | 2008-05-29 |
JP4780677B2 JP4780677B2 (ja) | 2011-09-28 |
Family
ID=7708348
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003549931A Expired - Lifetime JP4073024B2 (ja) | 2001-12-07 | 2002-11-14 | フィンガー・テスター用試験プローブ |
JP2007303001A Expired - Lifetime JP4780677B2 (ja) | 2001-12-07 | 2007-11-22 | フィンガー・テスター |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003549931A Expired - Lifetime JP4073024B2 (ja) | 2001-12-07 | 2002-11-14 | フィンガー・テスター用試験プローブ |
Country Status (10)
Country | Link |
---|---|
US (4) | US7119558B2 (ja) |
EP (2) | EP1542023B1 (ja) |
JP (2) | JP4073024B2 (ja) |
KR (1) | KR100670115B1 (ja) |
CN (1) | CN1292258C (ja) |
AT (2) | ATE350672T1 (ja) |
AU (1) | AU2002358505A1 (ja) |
DE (3) | DE10160119A1 (ja) |
TW (1) | TWI275802B (ja) |
WO (1) | WO2003048787A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160014528A (ko) * | 2014-07-29 | 2016-02-11 | 히오끼 덴끼 가부시끼가이샤 | 프로브 유닛, 프로브 유닛 제조 방법 및 검사 방법 |
KR102141535B1 (ko) * | 2020-03-03 | 2020-08-05 | 장용철 | 멀티 플라잉 프로브 테스터 |
Families Citing this family (37)
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US6256882B1 (en) * | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
DE10160119A1 (de) | 2001-12-07 | 2003-10-02 | Atg Test Systems Gmbh | Prüfsonde für einen Fingertester |
DE10220343B4 (de) | 2002-05-07 | 2007-04-05 | Atg Test Systems Gmbh & Co. Kg Reicholzheim | Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde |
DE10320925B4 (de) * | 2003-05-09 | 2007-07-05 | Atg Test Systems Gmbh & Co.Kg | Verfahren zum Testen von unbestückten Leiterplatten |
DE102006005800B4 (de) * | 2006-02-08 | 2007-12-06 | Atg Test Systems Gmbh | Verfahren und Vorrichtung zum Testen von unbestückten Leiterplatten |
DE102006006255A1 (de) | 2006-02-10 | 2007-08-23 | Atg Test Systems Gmbh | Fingertester zum Prüfen von unbestückten Leiterplatten und Verfahren zum Prüfen unbestückter Leiterplatten mit einem Fingertester |
US7648130B2 (en) * | 2006-06-08 | 2010-01-19 | Research In Motion Limited | Use of magnets to provide resilience |
DE102006056646B4 (de) * | 2006-11-29 | 2009-04-30 | Suss Microtec Test Systems Gmbh | Sondenhalter für eine Sonde zur Prüfung von Halbleiterbauelementen |
KR100876940B1 (ko) * | 2007-06-19 | 2009-01-07 | 주식회사 새한마이크로텍 | 등선형 니들을 사용한 프로브 카드 |
CN101487851B (zh) * | 2008-12-30 | 2011-04-13 | 南京协力电子科技集团有限公司 | 一种测试探针装置 |
DE102009004555A1 (de) * | 2009-01-14 | 2010-09-30 | Atg Luther & Maelzer Gmbh | Verfahren zum Prüfen von Leiterplatten |
DE102012107556A1 (de) * | 2012-08-17 | 2014-02-20 | HARTING Electronics GmbH | Vorrichtung und Verfahren zur reversiblen, mechanischen Fixierung und elektrischen Kontaktierung elektrischer Leiter |
US9739826B2 (en) * | 2012-11-21 | 2017-08-22 | Konrad Gmbh | Method and device for testing a workpiece |
DE102013102564A1 (de) | 2013-03-13 | 2014-09-18 | Dtg International Gmbh | Traverseneinheit für eine Prüfvorrichtung für Leiterplatten, sowie Prüfvorrichtung damit |
US9989583B2 (en) | 2013-03-13 | 2018-06-05 | Xcerra Corporation | Cross-bar unit for a test apparatus for circuit boards, and test apparatus containing the former |
TWI574013B (zh) * | 2013-03-15 | 2017-03-11 | 穩懋半導體股份有限公司 | 探針卡、探針結構及其製造方法 |
JP2014181937A (ja) * | 2013-03-18 | 2014-09-29 | Fujitsu Semiconductor Ltd | 試験装置、クリーニング方法、及び半導体装置の製造方法 |
US10425448B2 (en) * | 2014-03-17 | 2019-09-24 | Telefonaktiebolaget Lm Ericsson (Publ) | End-to-end data protection |
US9857413B2 (en) | 2014-07-02 | 2018-01-02 | Avery Dennison Retail Information Services, Llc | Systems and methods for testing RFID straps |
TWI645193B (zh) * | 2014-07-29 | 2018-12-21 | 日商日置電機股份有限公司 | Probe unit, probe unit manufacturing method and detection method |
CN104237579B (zh) * | 2014-09-17 | 2017-04-19 | 大族激光科技产业集团股份有限公司 | 四线测试探针装置及其应用方法 |
CN104251923B (zh) * | 2014-09-17 | 2017-06-30 | 大族激光科技产业集团股份有限公司 | 二线测试探针装置及其应用方法 |
CN104950250A (zh) * | 2015-07-29 | 2015-09-30 | 江苏杰进微电子科技有限公司 | 集成电路ic测试头及其装置 |
GB2545496B (en) * | 2015-12-18 | 2020-06-03 | Teraview Ltd | A Test System |
US20180322993A1 (en) * | 2015-12-21 | 2018-11-08 | Intel Corporation | Magnetic pick and place probe |
CN105527578A (zh) * | 2016-01-14 | 2016-04-27 | 广州蓝奇电子实业有限公司 | 一种电池检测控制*** |
US10060950B2 (en) | 2016-01-15 | 2018-08-28 | Formfactor Beaverton, Inc. | Shielded probe systems |
DE102017102700A1 (de) | 2017-02-10 | 2018-09-13 | Atg Luther & Maelzer Gmbh | Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten |
KR101729583B1 (ko) | 2017-02-24 | 2017-04-25 | (주)테스트테크 | Pcb회로기판 전기 검사용 테스트 프로브 핀 |
DE102018101031A1 (de) | 2018-01-18 | 2019-07-18 | Xcerra Corp. | Prüfnadel, Prüfsonde und Fingertester zum Testen von Leiterplatten |
KR20200110667A (ko) | 2018-01-18 | 2020-09-24 | 엑세라 코포레이션 | 인쇄 회로 기판 홀들 내에서 전기 전도성 층들을 측정하기 위한 용량성 테스트 니들 |
CN109116214A (zh) * | 2018-03-30 | 2019-01-01 | Tcl王牌电器(惠州)有限公司 | 机芯主板的LVDS/V-by-one信号测试治具 |
TWI705248B (zh) * | 2019-02-15 | 2020-09-21 | 萬潤科技股份有限公司 | 探針驅動方法及裝置 |
US11747301B2 (en) | 2020-12-22 | 2023-09-05 | Industrial Technology Research Institute | Magnetic field structure |
DE102021114443B4 (de) | 2021-06-04 | 2023-06-15 | Xcerra Corp. | Prüfkopf für einen Fingertester sowie Fingertester mit mehreren solcher Prüfköpfe und Verfahren zum Testen von Leiterplatten |
CN114966143B (zh) * | 2022-06-13 | 2023-01-31 | 法特迪精密科技(苏州)有限公司 | 一种电磁驱动旋转探针及固定插座结构 |
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-
2001
- 2001-12-07 DE DE10160119A patent/DE10160119A1/de not_active Withdrawn
-
2002
- 2002-11-14 EP EP05002153A patent/EP1542023B1/de not_active Expired - Lifetime
- 2002-11-14 EP EP02792764A patent/EP1451594B1/de not_active Expired - Lifetime
- 2002-11-14 AT AT05002153T patent/ATE350672T1/de not_active IP Right Cessation
- 2002-11-14 TW TW091133428A patent/TWI275802B/zh not_active IP Right Cessation
- 2002-11-14 DE DE50209202T patent/DE50209202D1/de not_active Expired - Lifetime
- 2002-11-14 AU AU2002358505A patent/AU2002358505A1/en not_active Abandoned
- 2002-11-14 JP JP2003549931A patent/JP4073024B2/ja not_active Expired - Lifetime
- 2002-11-14 WO PCT/EP2002/012770 patent/WO2003048787A1/de active IP Right Grant
- 2002-11-14 CN CNB02822468XA patent/CN1292258C/zh not_active Expired - Lifetime
- 2002-11-14 KR KR1020047007869A patent/KR100670115B1/ko active IP Right Grant
- 2002-11-14 DE DE50204420T patent/DE50204420D1/de not_active Expired - Lifetime
- 2002-11-14 AT AT02792764T patent/ATE305613T1/de active
-
2004
- 2004-06-03 US US10/859,795 patent/US7119558B2/en not_active Ceased
-
2005
- 2005-05-04 US US11/121,802 patent/US7190182B2/en not_active Expired - Lifetime
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2006
- 2006-08-24 US US11/466,663 patent/US7355424B2/en not_active Expired - Lifetime
-
2007
- 2007-11-22 JP JP2007303001A patent/JP4780677B2/ja not_active Expired - Lifetime
-
2008
- 2008-10-09 US US12/248,166 patent/USRE43739E1/en not_active Expired - Lifetime
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US4123706A (en) * | 1975-03-03 | 1978-10-31 | Electroglas, Inc. | Probe construction |
JPH06289054A (ja) * | 1993-04-02 | 1994-10-18 | Tescon:Kk | プリント基板検査装置のプローブ用デュアルヘッド |
JP2000105271A (ja) * | 1998-09-28 | 2000-04-11 | Atg Test Syst Gmbh | フィンガ―・テスタ―・プロ―ブ |
JP2000131340A (ja) * | 1998-10-28 | 2000-05-12 | Hioki Ee Corp | コンタクトプローブ装置 |
JP2003528323A (ja) * | 2000-03-20 | 2003-09-24 | アーテーゲー、テスト、ジステムス、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング、ウント、コンパニー、コマンディット、ゲゼルシャフト | 回路基板テスター |
Cited By (4)
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KR20160014528A (ko) * | 2014-07-29 | 2016-02-11 | 히오끼 덴끼 가부시끼가이샤 | 프로브 유닛, 프로브 유닛 제조 방법 및 검사 방법 |
JP2016170159A (ja) * | 2014-07-29 | 2016-09-23 | 日置電機株式会社 | プローブユニットおよびプローブユニット製造方法 |
KR102207791B1 (ko) | 2014-07-29 | 2021-01-26 | 히오끼 덴끼 가부시끼가이샤 | 프로브 유닛, 프로브 유닛 제조 방법 및 검사 방법 |
KR102141535B1 (ko) * | 2020-03-03 | 2020-08-05 | 장용철 | 멀티 플라잉 프로브 테스터 |
Also Published As
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WO2003048787A1 (de) | 2003-06-12 |
JP4073024B2 (ja) | 2008-04-09 |
DE50204420D1 (de) | 2005-11-03 |
EP1451594B1 (de) | 2005-09-28 |
JP2005512062A (ja) | 2005-04-28 |
US20070001693A1 (en) | 2007-01-04 |
EP1542023B1 (de) | 2007-01-03 |
US7190182B2 (en) | 2007-03-13 |
DE50209202D1 (de) | 2007-02-15 |
TWI275802B (en) | 2007-03-11 |
US7355424B2 (en) | 2008-04-08 |
US20050001639A1 (en) | 2005-01-06 |
ATE350672T1 (de) | 2007-01-15 |
US20050206398A1 (en) | 2005-09-22 |
JP4780677B2 (ja) | 2011-09-28 |
CN1585901A (zh) | 2005-02-23 |
KR100670115B1 (ko) | 2007-01-16 |
EP1542023A2 (de) | 2005-06-15 |
USRE43739E1 (en) | 2012-10-16 |
US7119558B2 (en) | 2006-10-10 |
TW200300842A (en) | 2003-06-16 |
AU2002358505A1 (en) | 2003-06-17 |
ATE305613T1 (de) | 2005-10-15 |
EP1542023A3 (de) | 2005-06-29 |
EP1451594A1 (de) | 2004-09-01 |
CN1292258C (zh) | 2006-12-27 |
DE10160119A1 (de) | 2003-10-02 |
KR20050044592A (ko) | 2005-05-12 |
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