JP2007065650A - 赤外線フィルタ及びウィンドウ一体型カメラモジュール装置 - Google Patents

赤外線フィルタ及びウィンドウ一体型カメラモジュール装置 Download PDF

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JP2007065650A
JP2007065650A JP2006227615A JP2006227615A JP2007065650A JP 2007065650 A JP2007065650 A JP 2007065650A JP 2006227615 A JP2006227615 A JP 2006227615A JP 2006227615 A JP2006227615 A JP 2006227615A JP 2007065650 A JP2007065650 A JP 2007065650A
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camera module
infrared
window
circuit board
printed circuit
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JP2006227615A
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Min Chul Go
ゴ，ミンチョル
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Abstract

【課題】カメラモジュールのウィンドウガラスに赤外線カットコーティング（ｃｕｔ ｃｏａｔｉｎｇ）を施し、既存の赤外線遮断用フィルタを除去することによって、原価低減及び光特性を改善させ、設計時間及び作業時間を短縮できる、赤外線フィルタ及びウィンドウ一体型カメラモジュール装置を提供する。
【解決手段】下部ハウジング１７０と、前記下部ハウジング上に設置され、イメージセンサ１８０を備えたプリント回路基板１６０と、前記プリント回路基板上に設置され、前記イメージセンサの上側にレンズ１３０を備えたレンズホルダー１４０と、前記レンズの上側に設置され、赤外線カットコーティング（ＩＲ ｃｕｔ ｃｏａｔｉｎｇ）されたウィンドウガラス１２０と、前記ウィンドウガラスの上側に開口部１１０ａが形成されており、前記下部ハウジングと結合される上部ハウジング１１０とを備える。
【選択図】 図２

Description

本発明は、カメラモジュール装置に関し、特に、赤外線フィルタとウィンドウとを一体化させ、カメラモジュールにおける原価低減及び光特性を改善させ、設計時間及び作業時間を短縮できる赤外線フィルタ及びウィンドウ一体型カメラモジュール装置に関する。
現在、モバイルフォン（Ｍｏｂｉｌｅ Ｐｈｏｎｅ）におけるカメラモジュール（ｃａｍｅｒａ ｍｏｄｕｌｅ）の採用割合が毎年急速に増加されつつある。特に、２００５年度の場合、携帯電話の出荷量の５０％以上がカメラモジュールを採用したものになると予想されている。
一方、モバイルフォン用カメラモジュールのパッケージ方式には、フリップチップ方式のＣＯＦ（Ｃｈｉｐ Ｏｎ Ｆｌｉｍ）、ワイヤボンディング方式のＣＯＢ（Ｃｈｉｐ Ｏｎ Ｂｏａｒｄ）、そしてＣＳＰ（Ｃｈｉｐ Ｓｃａｌｅ Ｐａｃｋａｇｅ）などがある。
この中で、前記ＣＯＢ方式は、既存の半導体生産ラインと類似した工程であって、他のパッケージ方式に比べて生産性が高いが、ワイヤー（ｗｉｒｅ）を利用してプリント回路基板（ＰＣＢ）と接続しなければならないため、モジュールのサイズが大きくなり、追加工程を必要とするという短所がある。そのため、チップサイズの縮小、熱放出及び電気的遂行能力の向上、信頼性向上のための新しいパッケージ技術が求められた。これにより、外部突出接合部を有するバンプ（ｂｕｍｐ）を基にしたＣＯＦ方式が登場するようになった。
前記ＣＯＦ方式は、何よりワイヤーを付着する空間を必要としないため、パッケージ面積が低減し、鏡筒の高さを低くすることができ、軽薄短小が可能であるという長所がある。そして、薄いフィルム（ｆｉｌｍ）やフレキシブルプリント回路基板（ＦＰＣＢ：Ｆｌｅｘｉｂｌｅ Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ）を使用するため、外部衝撃に耐える、信頼性のあるパッケージが可能であり、工程が相対的に簡単であるという長所がある。そして、前記ＣＯＦ方式は、小型化と共に、抵抗の低減による信号の高速処理、高密度、多ピン化傾向にも相応する。
したがって、現在は、モバイルフォン用カメラモジュールパッケージ方式として、前記ＣＯＦ方式が広く用いられている。しかし、今後は、ＣＯＦ、ＣＯＢ、ＣＳＰ方式のみならず、ＣＯＧ、ＷＴＨＰ、ＮＣＰパッケージなど、多くの新しい方式のパッケージ方式が開発され続けると予想される。
また、モバイルフォンメーカーでは、ますますカメラフォンのサイズ最小化と原価低減を求めており、ここに対応するための対策が至急に必要である。
以下、添付図面を参照しつつ、従来のカメラモジュールの構造と問題点について説明する。
図１は、従来の技術に係るカメラモジュール装置の分解斜視図である。
従来のカメラモジュール１０は、図１に示すように、開口部１ａを備えた上部ハウジング（Ｈｏｕｓｉｎｇ）１と、前記開口部１ａの下段に設置されるウィンドウガラス（Ｗｉｎｄｏｗ ｇｌａｓｓ）２と、前記ウィンドウガラス２の下段に設置されるレンズ（Ｌｅｎｓ）３と、前記レンズ３を固定するレンズホルダー（Ｌｅｎｓ ｈｏｌｄｅｒ）４と、前記レンズ３が固定されたレンズホルダー４の下段に設置される赤外線遮断用フィルタ（ＩＲ ｃｕｔ ｆｉｌｔｅｒ）５と、前記赤外線遮断用フィルタ５の下段に設置されるイメージセンサ８と、前記イメージセンサ８を固定するプリント回路基板（Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ：ＰＣＢ）６と、前記プリント回路基板６の下段に設置され、前記上部ハウジング１０と結合される下部ハウジング７と、を備える。
前記プリント回路基板６は、前記赤外線遮断用フィルタ５の下方に開口部（図示せず）を形成しており、前記開口部の一方に前記イメージセンサ８が設置される。このとき、前記イメージセンサ８は、受信されたイメージ信号を処理する機能を果たし、前記赤外線遮断用フィルタ５は、外部から入射される赤外線を遮断する機能を果たす。
一方、前記構成を有する従来のカメラモジュール１０は、ＣＯＦ方式とＣＯＢ方式に応じて、前記赤外線遮断用フィルタ５の付着位置もそれぞれ異なる。
すなわち、前記ＣＯＦ方式は、前記イメージセンサ８を前記プリント回路基板６上に付着した後、前記イメージセンサ８上に前記赤外線遮断用フィルタ５を付着し、前記ＣＯＢ方式は、前記イメージセンサ８を前記プリント回路基板６にワイヤボンディング（ｗｉｒｅ ｂｏｎｄｉｎｇ）方式を利用して接続した後、前記赤外線遮断用フィルタ５を前記上部ハウジング１の内側に接着剤を利用して付着する。
このとき、前記ＣＯＦ又はＣＯＢ方式を利用したカメラモジュールは、同じくウィンドウガラス２を使用している。
しかしながら、前記構成を有する従来のカメラモジュール１０は、前記赤外線遮断用フィルタ５と前記ウィンドウガラス２をそれぞれ別に使用するため、製造原価が上昇するという問題点があった。
そして、前記イメージセンサ８に光が透過される際、前記ウィンドウガラス２と前記赤外線遮断用フィルタ５を全て通過しなければならないため、透過率が低下し、これによって光量不足という現象が生じるという問題点があった。
また、前記ＣＯＢ方式の場合、前記赤外線遮断用フィルタ５をハウジングに組み立てなければならず、その組み立て費用がさらに必要となるため、原価を上昇させるという問題点があった。
また、前記ＣＯＢ方式の場合、前記赤外線遮断用フィルタ５をハウジング内側に組み立てることによって、前記イメージセンサ８と前記赤外線遮断用フィルタ５との間の離隔距離が小さいとき、ワイヤー接触による品質問題が生じた。
また、前記ＣＯＦ方式の場合、前記赤外線遮断用フィルタ５を前記イメージセンサ８上に付着することから、アタッチ（ａｔｔａｃｈｉｎｇ）にともなう生産性低下という問題点があった。
本発明は、上述の問題点に鑑みてなされたもので、その目的は、カメラモジュールのウィンドウガラスに赤外線カットコーティング（ＩＲ ｃｕｔ ｃｏａｔｉｎｇ）を施し、既存の赤外線フィルタを除去することによって、原価低減及び光特性を改善させ、設計時間及び作業時間を短縮できる赤外線フィルタ及びウィンドウ一体型カメラモジュール装置を提供することにある。
上記目的を達成すべく、本発明に係る赤外線フィルタ及びウィンドウ一体型カメラモジュール装置によれば、下部ハウジングと、前記下部ハウジング上に設置され、イメージセンサを備えたプリント回路基板と、前記プリント回路基板上に設置され、前記イメージセンサの上側にレンズを備えたレンズホルダーと、前記レンズの上側に設置され、赤外線カットコーティング（ＩＲ ｃｕｔ ｃｏａｔｉｎｇ）されたウィンドウガラスと、前記ウィンドウガラスの上側に開口部が形成されており、前記下部ハウジングと結合される上部ハウジングと、を備える。
ここで、前記ウィンドウガラスが、前記赤外線カットコーティングが一方の面のみに施されたことを特徴とする。
そして、前記ウィンドウガラスが、前記赤外線カットコーティングが両方の面に全て施されたことを特徴とする。
また、前記ウィンドウガラスが、前記赤外線カットコーティングが一方の面に施され、他方面に低反射（Ａｎｔｉ−Ｒｅｆｌｅｃｔｉｏｎ）コーティングが施されたことを特徴とする。
また、前記赤外線カットコーティングの厚さが、略６４０〜６６０ｎｍの範囲に形成されることを特徴とする。
また、前記プリント回路基板が、フレキシブルプリント回路基板（Ｆ−ＰＣＢ）であることを特徴とする。
また、前記プリント回路基板が、リジッドフレキシブルプリント回路基板（ＲＦ−ＰＣＢ）であることを特徴とする。
したがって、カメラモジュールのウィンドウガラスに赤外線カットコーティングを施して、既存の赤外線フィルタを除去することによって、原価低減、光特性改善、設計時間及び作業時間を短縮できる。
本発明の赤外線フィルタ及びウィンドウ一体型カメラモジュール装置によれば、赤外線フィルタとウィンドウとの一体化により透過率が向上され、光学的性能を改善させることができ、既存の赤外線フィルタを使用しなくても良いため、原価を低減させることができる。
また、イメージセンサ上に赤外線フィルタを装着するアタッチ（ａｔｔａｃｈｉｎｇ）工程を施さなくてもよいため、生産性を向上させることができ、赤外線フィルタと係る工程不良率を改善させることができる。
以下、本発明の好ましい実施の形態を、添付図面に基づき詳細に説明する。
図２は、本発明による赤外線フィルタ及びウィンドウ一体型カメラモジュール装置の分解斜視図である。
本発明による赤外線フィルタ及びウィンドウ一体型カメラモジュール装置は、図２に示すように、開口部１１０ａを備えた上部ハウジング１１０と、前記上部ハウジング１１０と結合される下部ハウジング１７０と、前記上部ハウジング１１０と前記下部ハウジング１７０との間に順次配置される赤外線カットコーティングされたウィンドウガラス１２０と、レンズ１３０を備えたレンズホルダー１４０と、イメージセンサ１８０を備えたプリント回路基板１６０と、を備える。
上記構成のように、前記上部ハウジング１１０の開口部１１０ａの下部には、赤外線カットコーティングされたウィンドウガラス１２０が、前記上部ハウジング１１０の内側に設置される。
このとき、前記ウィンドウガラス１２０は、赤外線カットコーティングを一方の面又は両方の面に略６４０〜６６０ｎｍの範囲の厚さに形成するが、６４０ｎｍ以下の厚さの場合は、赤外線遮断の効果が期待しがたく、６６０ｎｍ以上の厚さの場合は、イメージセンサに透過される充分の光量を確保するのが困難であるためである。
そして、このとき、ウィンドウガラス１２０の両方の面に赤外線カットコーティングを施す場合、前記ウィンドウガラス１２０に施していた低反射コーティングは施さない。
一方、前記ウィンドウガラス１２０の一方のみに赤外線カットコーティングを施す場合、透過率を良くするために、他方面に低反射コーティングを施すことが好ましい。
本発明による前記赤外線カットコーティングされたウィンドウガラス１２０は、従来の赤外線遮断用フィルタの機能も共に果たすため、別の赤外線遮断用フィルタを備えなくても良い。
一方、前記プリント回路基板１６０として、フレキシブルプリント回路基板（Ｆ−ＰＣＢ）又はリジッドフレキシブルプリント回路基板（ＲＦ−ＰＣＢ）を使用し、それぞれＣＯＦパッケージング方式又はＣＯＢパッケージング方式に応じて、イメージセンサモジュールを構成できる。
まず、ＣＯＦパッケージング方式において、前記プリント回路基板１６０は、前記ウィンドウガラス１２０と前記レンズ１３０を透過した光が、前記イメージセンサ１８０に伝達されるように開口部を形成しており、前記開口部に前記イメージセンサ１８０が設置されている。ここで、前記イメージセンサ１８０は、従来と同様に、受信されたイメージ信号を処理する機能を果たす。
すなわち、前記ＣＯＦ方式の場合には、前記イメージセンサ１８０を前記プリント回路基板１６０に付着した後、前記イメージセンサ１８０上に設置した赤外線遮断用フィルタを設置せず、直ちにレンズ１３０を備えたレンズホルダー１４０を設置する。
したがって、前記イメージセンサ上に前記赤外線遮断用フィルタを付着する工程を省略できるため、前記赤外線遮断用フィルタの付着によるアタッチ（ａｔｔａｃｈｉｎｇ）問題を解決できる。
次に、前記ＣＯＢ方式の場合には、前記イメージセンサ１８０を前記プリント回路基板１８０にワイヤボンディング方式を利用して接続した後、赤外線遮断用フィルタをハウジング内側に付着する工程を省略し、直ちにレンズ１３０を備えたレンズホルダー１４０を設置する。
したがって、前記赤外線遮断用フィルタをハウジングに組み立てることによって必要とされる費用を低減することができる。また、前記赤外線遮断用フィルタをハウジングの内側に組み立てる場合、前記イメージセンサと前記赤外線遮断用フィルタとの間の離隔距離が小さいことから生じる、ワイヤー接触にともなう品質低下という問題を解決できる。
上述した本発明の好ましい実施の形態は、例示の目的のために開示されたものであり、本発明の属する技術の分野における通常の知識を有する者であれば、本発明の技術的思想を逸脱しない範囲内で、様々な置換、変形、及び変更が可能であり、このような置換、変更などは、特許請求の範囲に属するものである。
従来の技術に係るカメラモジュール装置の分解斜視図である。 本発明による赤外線フィルタ及びウィンドウ一体型カメラモジュール装置の分解斜視図である。
符号の説明
１００ カメラモジュール又はカメラモジュール装置
１１０ 上部ハウジング
１１０ａ 開口部
１２０ ウィンドウガラス
１３０ レンズ
１４０ レンズホルダー
１６０ フレキシブルプリント回路基板又はリジッドフレキシブルプリント回路基板
１７０ 下部ハウジング
１８０ イメージセンサ

Claims (7)

  1. カメラモジュール装置において、
    下部ハウジングと、
    前記下部ハウジング上に設置され、イメージセンサを備えたプリント回路基板と、
    前記プリント回路基板上に設置され、前記イメージセンサの上側にレンズを備えたレンズホルダーと、
    前記レンズの上側に設置され、赤外線カットコーティング（ＩＲ ｃｕｔ ｃｏａｔｉｎｇ）されたウィンドウガラスと、
    前記ウィンドウガラスの上側に開口部が形成されており、前記下部ハウジングと結合される上部ハウジングと
    を備える赤外線フィルタ及びウィンドウ一体型カメラモジュール装置。
  2. 前記ウィンドウガラスは、
    前記赤外線カットコーティングが一方の面のみに施されたことを特徴とする請求項１に記載の赤外線フィルタ及びウィンドウ一体型カメラモジュール装置。
  3. 前記ウィンドウガラスは、
    前記赤外線カットコーティングが両方の面に全て施されたことを特徴とする請求項１に記載の赤外線フィルタ及びウィンドウ一体型カメラモジュール装置。
  4. 前記ウィンドウガラスは、
    前記赤外線カットコーティングが一方の面に施され、他方面に低反射（Ａｎｔｉ−Ｒｅｆｌｅｃｔｉｏｎ）コーティングが施されたことを特徴とする請求項１に記載の赤外線フィルタ及びウィンドウ一体型カメラモジュール装置。
  5. 前記赤外線カットコーティングの厚さが、略６４０〜６６０ｎｍの範囲に形成されることを特徴とする請求項１〜４のいずれか一項に記載の赤外線フィルタ及びウィンドウ一体型カメラモジュール装置。
  6. 前記プリント回路基板は、フレキシブルプリント回路基板（Ｆ−ＰＣＢ）であることを特徴とする請求項１〜５のいずれか一項に記載の赤外線フィルタ及びウィンドウ一体型カメラモジュール装置。
  7. 前記プリント回路基板は、リジッドフレキシブルプリント回路基板（ＲＦ−ＰＣＢ）であることを特徴とする請求項１〜５のいずれか一項に記載の赤外線フィルタ及びウィンドウ一体型カメラモジュール装置。
JP2006227615A 2005-08-30 2006-08-24 赤外線フィルタ及びウィンドウ一体型カメラモジュール装置 Pending JP2007065650A (ja)

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