KR20070028643A - 적외선 필터 및 윈도우 일체형 카메라 모듈 장치 - Google Patents
적외선 필터 및 윈도우 일체형 카메라 모듈 장치 Download PDFInfo
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- KR20070028643A KR20070028643A KR1020050080143A KR20050080143A KR20070028643A KR 20070028643 A KR20070028643 A KR 20070028643A KR 1020050080143 A KR1020050080143 A KR 1020050080143A KR 20050080143 A KR20050080143 A KR 20050080143A KR 20070028643 A KR20070028643 A KR 20070028643A
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- Prior art keywords
- camera module
- filter
- window
- circuit board
- printed circuit
- Prior art date
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Abstract
본 발명은 적외선 필터 및 윈도우 일체형 카메라 모듈 장치에 관한 것으로, 카메라 모듈의 윈도우 글라스에 적외선 컷 코팅(cut coating)을 실시하여 기존의 적외선 차단용 필터를 제거시킴으로써, 원가 절감 및 광 특성을 개선시키고 설계 시간 및 작업 시간을 단축할 수 있는 효과가 있다.
이를 위한 본 발명에 의한 적외선 필터 및 윈도우 일체형 카메라 모듈 장치는, 하부 하우징; 상기 하부 하우징 상에 설치되며, 이미지 센서를 구비한 인쇄회로기판; 상기 인쇄회로기판상에 설치되며, 상기 이미지 센서의 위쪽에 렌즈를 구비한 렌즈 홀더; 상기 렌즈의 위쪽에 설치되며, 적외선 컷 코팅(IR cut coating)된 윈도우 글라스; 및 상기 윈도우 글라스의 위쪽에 개구부가 형성되어 있고, 상기 하부 하우징과 결합되는 상부 하우징;을 포함한다.
적외선 필터, 윈도우, 코팅, 카메라 모듈, 센서, 일체
Description
도 1은 종래 기술에 따른 카메라 모듈 장치의 분해 사시도
도 2는 본 발명에 의한 적외선 필터 및 윈도우 일체형 카메라 모듈 장치의 분해 사시도
<도면의 주요 부호에 대한 설명>
100 : 카메라 모듈 또는 카메라 모듈 장치
110 : 상부 하우징(Housing)
120 ; 윈도우 글라스(Window glass)
130 : 렌즈(Lens)
140 : 렌즈-홀더(Lens-holder)
160 : 연성 인쇄회로기판(F-PCB) 또는 경연성 인쇄회로기판(RF-PCB)
170 : 하부 하우징
180 : 이미지 센서(Image Sensor)
본 발명은 카메라 모듈 장치에 관한 것으로, 특히 적외선 필터와 윈도우를 일체화시켜 카메라 모듈에서의 원가 절감 및 광 특성을 개선시키고 설계시간 및 작업시간을 단축할 수 있는 적외선 필터 및 윈도우 일체형 카메라 모듈 장치에 관한 것이다.
오늘날, 모바일 폰(Mobile Phone)은 카메라 모듈(camera module)의 채용 비율이 매년 급속도로 증가 되고 있다. 특히, 2005년도의 경우, 핸드폰 출하량의 50% 이상이 카메라 모듈을 채용한 핸드폰이 생산될 것으로 예상하고 있다.
한편, 모바일 폰용 카메라 모듈 패키지 방식은 플립칩 방식의 COF(Chip On Flim), 와이어 본딩 방식의 COB(Chip On Board), 그리고 CSP(Chip Scale Package) 등이 있다.
이 중, 상기 COB 방식은 기존의 반도체 생산라인과 유사한 공정으로 다른 패키지 방식에 비해 생산성이 높지만, 와이어(wire)를 이용하여 인쇄회로기판(PCB)과 연결해야 하기 때문에 모듈의 크기가 커지고 추가적인 공정이 필요한 단점이 있다. 따라서, 칩 크기의 축소, 열 방출 및 전기적 수행 능력 향상, 신뢰성 향상을 위한 새로운 패키징 기술이 요구되었다. 이에 따라 외부 돌출 접합부를 가진 범프(bump)를 기초로 한 COF 방식이 등장하였다.
상기 COF 방식은 무엇보다 와이어를 부착할 공간이 필요하지 않으므로 패키지 면적이 줄어들고, 경통의 높이를 낮출 수가 있어 경박 단소가 가능하다는 장점이 있다. 그리고 얇은 필름(film)이나 연성인쇄회로기판(FPCB: Flexible Printed Circuit Board)을 사용하기 때문에 외부 충격에 견디는 신뢰성 있는 패키지가 가능하며 공정이 상대적으로 간단한 장점이 있다. 그리고, 상기 COF 방식은 소형화와 더불어 저항의 절감으로 인한 신호의 고속처리, 고밀도, 다핀화 추세에도 부응한다.
따라서, 현재는 상기 COF 방식이 모바일 폰용 카메라 모듈 패키지 방식으로 널리 이용되고 있다. 그러나, 향후에는 COF, COB, CSP 방식뿐만 아니라 COG, WTHP, NCP 패키지 등 지속적으로 많은 새로운 방식의 패키지 방식이 개발될 것으로 예상된다.
또한, 모바일 폰 업체에서는 점점 카메라 폰의 최소화와 원가절감을 요구하고 있으며, 여기에 대응하기 위한 대책이 시급한 실정이다.
그러면, 첨부도면을 참조하여 종래의 카메라 모듈의 구조와 문제점에 대해 설명하기로 한다.
도 1은 종래 기술에 따른 카메라 모듈 장치의 분해 사시도이다.
종래의 카메라 모듈(10)은 도 1에 도시된 바와 같이, 개구부(1a)를 구비한 상부 하우징(Housing)(1)과, 상기 개구부(1a)의 하단에 설치되는 윈도우 글라스(Window glass)(2)와, 상기 윈도우 글라스(2)의 하단에 설치되는 렌즈(Lens)(3)와, 상기 렌즈(3)를 고정하는 렌즈 홀더(Lens holder)(4)와, 상기 렌즈(3)가 고정된 렌즈 홀더(4)의 하단에 설치되는 적외선 차단용 필터(IR cut filter)(5)와, 상기 적외선 차단용 필터(5)의 하단에 설치되는 이미지 센서(8)와, 상기 이미지 센서(8)를 고정하는 인쇄회로기판(Printed Circuit Board: PCB)(6)과, 상기 인쇄회로기판(6)의 하단에 설치되며 상기 상부 하우징(10)과 결합되는 하부 하우징(7)을 포함한다.
상기 인쇄회로기판(PCB)(6)은 상기 적외선 차단용 필터(5)의 아래쪽에 개구부(미도시)를 형성하고 있고, 상기 개구부의 일측에 상기 이미지 센서(8)가 설치된다. 이때, 상기 이미지 센서(8)는 수신된 이미지 신호를 처리하는 역할을 하고, 상기 적외선 차단용 필터(5)는 외부로부터 입사되는 적외선을 차단하는 역할을 한다.
한편, 상기 구성을 갖는 종래의 카메라 모듈(10)은 COF 방식과 COB 방식에 따라 상기 적외선 차단용 필터(5)의 부착 위치도 각각 다르다.
즉, 상기 COF 방식은 상기 이미지 센서(8)를 상기 인쇄회로기판(PCB)(6) 상에 부착한 후 상기 이미지 센서(8) 상에 상기 적외선 차단용 필터(5)를 부착하고, 상기 COB 방식은 상기 이미지 센서(8)를 상기 인쇄회로기판(6)에 와이어 본딩(wire bonding) 방식을 이용하여 연결한 다음, 상기 적외선 차단용 필터(5)를 상기 상부 하우징(1)의 내측 안쪽에 접착제를 이용하여 부착한다.
이때, 상기 COF 또는 COB 방식을 이용한 카메라 모듈은 동일하게 윈도우 글라스(2)를 사용하고 있다.
그러나, 상기 구성을 갖는 종래의 카메라 모듈(10)은 상기 적외선 차단용 필 터(5)와 상기 윈도우 글라스(2)를 각각 별도로 사용하기 때문에 제조 원가가 상승하는 문제점이 있었다.
그리고, 상기 이미지 센서(8)에 빛이 투과시 상기 윈도우 글라스(2)와 상기 적외선 차단용 필터(5)를 모두 통과해야 하기 때문에 투과율이 저하되고 이로 인해 광량 부족 현상이 발생하는 문제점이 있었다.
또한, 상기 COB 방식의 경우, 상기 적외선 차단용 필터(5)를 하우징에 조립함에 따른 조립 비용이 추가로 들기 때문에 원가를 상승시키는 문제점이 있었다.
나아가, 상기 COB 방식의 경우, 상기 적외선 차단용 필터(5)를 하우징 내측에 조립함에 따라 상기 이미지 센서(8)와 상기 적외선 차단용 필터(5) 간의 이격 거리가 작을 때 와이어(wire) 접촉에 따른 품질 문제가 발생하였다.
또한, 상기 COF 방식의 경우, 상기 적외선 차단용 필터(5)를 상기 이미지 센서(8) 상에 부착하기 때문에 어태칭(attaching)에 따른 생산성이 저하되는 문제점이 있었다.
따라서, 본 발명은 상기 문제점을 해결하기 위하여 이루어진 것으로, 본 발명의 목적은 카메라 모듈의 윈도우 글라스에 적외선 컷 코팅(IR cut coating)을 실시하여 기존의 적외선 필터를 제거시킴으로써, 원가 절감 및 광 특성을 개선시키고 설계 시간 및 작업 시간을 단축할 수 있는 적외선 필터 및 윈도우 일체형 카메라 모듈 장치를 제공하는 데 있다.
상기 목적을 달성하기 위한 본 발명에 의한 적외선 필터 및 윈도우 일체형 카메라 모듈 장치는, 하부 하우징; 상기 하부 하우징 상에 설치되며, 이미지 센서를 구비한 인쇄회로기판; 상기 인쇄회로기판상에 설치되며, 상기 이미지 센서의 위쪽에 렌즈를 구비한 렌즈 홀더; 상기 렌즈의 위쪽에 설치되며, 적외선 컷 코팅(IR cut coating)된 윈도우 글라스; 및 상기 윈도우 글라스의 위쪽에 개구부가 형성되어 있고, 상기 하부 하우징과 결합되는 상부 하우징;을 포함한다.
여기서, 상기 윈도우 글라스는, 상기 적외선 컷 코팅이 일측면에만 실시된 것을 특징으로 한다.
그리고, 상기 윈도우 글라스는, 상기 적외선 컷 코팅이 양측면에 모두 실시된 것을 특징으로 한다.
또한, 상기 윈도우 글라스는, 상기 적외선 컷 코팅이 일측면에 실시되고, 타측면에 저반사(Anti-Reflection) 코팅이 실시된 것을 특징으로 한다.
또한, 상기 적외선 컷 코팅의 두께는, 대략 640 내지 660nm로 형성하는 것을 특징으로 한다.
또한, 상기 인쇄회로기판은, 연성 인쇄회로기판(F-PCB)인 것을 특징으로 한다 .
또한, 상기 인쇄회로기판은, 경연성 인쇄회로기판(RF-PCB)인 것을 특징으로 한다.
따라서, 카메라 모듈의 윈도우 글라스(window glass)에 적외선 컷 코팅(cut coating)을 실시하여 기존의 적외선 필터를 제거시킴으로써, 원가 절감, 광 특성 개선, 설계 시간 및 작업 시간을 단축할 수 있다.
이하, 첨부된 도면을 참조하여 본 발명의 실시예에 대해 상세히 설명하기로 한다.
도 2는 본 발명에 의한 적외선 필터 및 윈도우 일체형 카메라 모듈 장치의 분해 사시도이다.
본 발명에 의한 적외선 필터 및 윈도우 일체형 카메라 모듈 장치는 도 2에 도시된 바와 같이, 개구부(110a)를 구비한 상부 하우징(110)과, 상기 상부 하우징(110)과 결합되는 하부 하우징(170)과, 상기 상부 하우징(110)과 상기 하부 하우징(170) 사이에 순차적으로 설치되는 적외선 컷 코팅(IR cut coating)된 윈도우 글라스(120), 렌즈(130)를 구비한 렌즈 홀더(140) 및 이미지 센서(180)를 구비한 인쇄회로기판(PCB)(160)을 포함한다.
상기 구성과 같이, 상기 상부 하우징(110)의 개구부(110a) 아래에는 적외선 컷 코팅된 윈도우 글라스(120)가 상기 상부 하우징(110)의 내측에 설치된다.
이때, 상기 윈도우 글라스(120)는 적외선 컷 코팅을 일측면 또는 양측면에 대략 640 내지 660nm의 두께로 형성하는데, 640nm 이하의 두께일 경우에는 적외선 차단의 효과를 기대하기 힘들고 660nm 이상의 두께일 경우에는 이미지 센서로 투과될 충분한 광량을 확보하기가 어렵기 때문이다.
그리고. 이때, 윈도우 글라스(120)의 양측면에 적외선 컷 코팅을 실시할 경우, 상기 윈도우 글라스(120)에 실시하던 저반사(Anti-Reflection) 코팅은 실시하지 않는다.
한편, 상기 윈도우 글라스(120)의 일측면에만 적외선 컷 코팅을 실시할 경우, 투과율을 좋게 하기 위해 타측면에 저반사(Anti-Reflection) 코팅을 실시하는 것이 바람직하다.
본 발명에 의한 상기 적외선 컷 코팅된 윈도우 글라스(120)는, 종래의 적외선 차단용 필터의 역할도 함께 수행하기 때문에 별도의 적외선 차단용 필터를 포함하지 않아도 된다.
한편, 상기 인쇄회로기판(PCB)(160)으로서 연성 인쇄회로기판(F-PCB) 또는 경연성 인쇄회로기판(RF-PCB)을 사용하여 각각 COF 패키징 방식 또는 COB 패키징 방식에 의하여 이미지 센서 모듈을 구성할 수 있다.
먼저, COF 패키징 방식에 있어서 상기 인쇄회로기판(160)은 상기 윈도우 글라스(120)와 상기 렌즈(130)를 투과한 빛이 상기 이미지 센서(180)로 전달되도록 개구부를 형성하고 있으며, 상기 개구부에 상기 이미지 센서(180)가 설치되어 있다. 여기서, 상기 이미지 센서(180)는 종래와 마찬가지로 수신된 이미지 신호를 처리하는 역할을 한다.
즉, 상기 COF 방식의 경우에는, 상기 이미지 센서(180)를 상기 인쇄회로기판(160)에 부착한 후, 상기 이미지 센서(180) 상에 설치하였던 적외선 차단용 필터 없이 곧바로 렌즈(130)를 구비한 렌즈 홀더(140)를 설치한다.
따라서, 상기 이미지 센서 상에 상기 적외선 차단용 필터를 부착하는 공정을 생략할 수 있기 때문에, 상기 적외선 차단용 필터의 부착에 따른 어태칭(attaching) 문제를 해결할 수 있다.
다음, 상기 COB 방식의 경우에는, 상기 이미지 센서(180)를 상기 인쇄회로기판(180)에 와이어 본딩(wire bonding) 방식을 이용하여 연결한 다음, 적외선 차단용 필터를 하우징 내측에 부착하는 공정을 생략하여 곧바로 렌즈(130)를 구비한 렌즈홀더(140)를 설치한다.
따라서, 상기 적외선 차단용 필터를 하우징에 조립함으로써 소요되는 비용을 줄일 수 있다. 또한, 상기 적외선 차단용 필터를 하우징 내측에 조립할 경우 상기 이미지 센서와 상기 적외선 차단용 필터 간의 이격 거리가 작아서 발생되는 와이어(wire) 접촉에 따른 품질 저하 문제를 해결할 수 있다.
이상의 본 발명은 상기에 기술된 실시예들에 의해 한정되지 않고, 당업자들에 의해 다양한 변형 및 변경을 가져올 수 있으며, 이는 첨부된 특허청구범위에서 정의되는 본 발명의 취지와 범위에 포함되는 것으로 보아야 할 것이다.
이상에서 설명한 바와 같이, 본 발명에 의한 적외선 필터 및 윈도우 일체형 카메라 모듈 장치에 의하면, 적외선 필터와 윈도우의 일체화에 의해 투과율이 향상되어 광학적 성능을 개선 시킬 수 있고, 기존의 적외선 필터를 사용하지 않아도 됨 으로 원가를 절감시킬 수 있다.
또한, 이미지 센서 위에 적외선 필터를 장착하는 어태칭(attaching) 공정을 하지 않아도 되므로 생산성을 향상시킬 수 있고, 적외선 필터 관련 공정 불량율을 개선시킬 수 있다.
Claims (7)
- 카메라 모듈 장치에 있어서,하부 하우징;상기 하부 하우징 상에 설치되며, 이미지 센서를 구비한 인쇄회로기판;상기 인쇄회로기판상에 설치되며, 상기 이미지 센서의 위쪽에 렌즈를 구비한 렌즈 홀더;상기 렌즈의 위쪽에 설치되며, 적외선 컷 코팅(IR cut coating)된 윈도우 글라스; 및상기 윈도우 글라스의 위쪽에 개구부가 형성되어 있고, 상기 하부 하우징과 결합되는 상부 하우징;을 포함하는 적외선 필터 및 윈도우 일체형 카메라 모듈 장치.
- 제 1 항에 있어서, 상기 윈도우 글라스는:상기 적외선 컷 코팅이 일측면에만 실시된 것을 특징으로 하는 적외선 필터 및 윈도우 일체형 카메라 모듈 장치.
- 제 1 항에 있어서, 상기 윈도우 글라스는:상기 적외선 컷 코팅이 양측면에 모두 실시된 것을 특징으로 하는 적외선 필터 및 윈도우 일체형 카메라 모듈 장치.
- 제 1 항에 있어서, 상기 윈도우 글라스는:상기 적외선 컷 코팅이 일측면에 실시되고, 타측면에 저반사(Anti-Reflection) 코팅이 실시된 것을 특징으로 하는 적외선 필터 및 윈도우 일체형 카메라 모듈 장치.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 적외선 컷 코팅의 두께는, 대략 640 내지 660nm로 형성하는 것을 특징으로 하는 적외선 필터 및 윈도우 일체형 카메라 모듈 장치.
- 제 1 항에 있어서,상기 인쇄회로기판은, 연성 인쇄회로기판(F-PCB)인 것을 특징으로 하는 적외선 필터 및 윈도우 일체형 카메라 모듈 장치.
- 제 1 항에 있어서,상기 인쇄회로기판은, 경연성 인쇄회로기판(RF-PCB)인 것을 특징으로 하는 적외선 필터 및 윈도우 일체형 카메라 모듈 장치.
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DE102006038986A DE102006038986A1 (de) | 2005-08-30 | 2006-08-21 | Kameramodul-Vorrichtung mit reflexionsbeschichtetem Fensterglas |
US11/508,914 US20070045551A1 (en) | 2005-08-30 | 2006-08-24 | Camera module apparatus with IR-cut-coated window glass |
JP2006227615A JP2007065650A (ja) | 2005-08-30 | 2006-08-24 | 赤外線フィルタ及びウィンドウ一体型カメラモジュール装置 |
CNB2006101122849A CN100466687C (zh) | 2005-08-30 | 2006-08-30 | 具有ir-截止涂覆窗口玻璃的照相机组件装置 |
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KR1020050080143A KR100708940B1 (ko) | 2005-08-30 | 2005-08-30 | 적외선 필터 및 윈도우 일체형 카메라 모듈 장치 |
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KR20070028643A true KR20070028643A (ko) | 2007-03-13 |
KR100708940B1 KR100708940B1 (ko) | 2007-04-17 |
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US (1) | US20070045551A1 (ko) |
JP (1) | JP2007065650A (ko) |
KR (1) | KR100708940B1 (ko) |
CN (1) | CN100466687C (ko) |
DE (1) | DE102006038986A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20110001559A (ko) * | 2009-06-30 | 2011-01-06 | 엘지이노텍 주식회사 | 적층 필름을 이용한 카메라 모듈 |
CN112770039A (zh) * | 2021-03-04 | 2021-05-07 | 四川先美电子有限公司 | 一种制冷型sCMOS科学相机的真空密封舱 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20150118591A (ko) * | 2012-03-30 | 2015-10-23 | 삼성전기주식회사 | 카메라 모듈 |
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KR970024928A (ko) * | 1995-10-30 | 1997-05-30 | 배순훈 | 적외선 차단필터를 제거한 캠코더 |
JP3918320B2 (ja) | 1998-09-29 | 2007-05-23 | 富士フイルム株式会社 | 固体撮像素子 |
JP4849703B2 (ja) * | 1999-09-03 | 2012-01-11 | ソニー株式会社 | 光学モジュール |
KR100297880B1 (ko) * | 1999-11-09 | 2001-11-02 | 이종진 | Cmos/ccd용 카메라 렌즈 |
JP3543747B2 (ja) * | 2000-09-25 | 2004-07-21 | 日本ビクター株式会社 | 静止画撮影装置 |
JP2002139662A (ja) * | 2000-11-06 | 2002-05-17 | Konica Corp | 撮像装置 |
JP2002182270A (ja) * | 2000-12-15 | 2002-06-26 | Toshiba Corp | カメラモジュール及びその製造方法 |
KR100386647B1 (ko) * | 2001-03-20 | 2003-06-02 | 카스크테크놀러지 주식회사 | 화상 전송 장치에 사용되는 소형 광학계 |
JP3918500B2 (ja) * | 2001-10-24 | 2007-05-23 | ソニー株式会社 | 撮像装置 |
JP2003298888A (ja) * | 2002-04-02 | 2003-10-17 | Konica Corp | 撮像装置の製造方法 |
US7583309B2 (en) * | 2002-06-28 | 2009-09-01 | Kyocera Coproration | Imaging device package camera module and camera module producing method |
WO2004003618A1 (ja) * | 2002-07-01 | 2004-01-08 | Rohm Co., Ltd. | イメージセンサモジュール |
JP3989330B2 (ja) * | 2002-08-08 | 2007-10-10 | 日立マクセル株式会社 | カメラモジュール及びカメラシステム |
JP2004088181A (ja) * | 2002-08-23 | 2004-03-18 | Kawaguchiko Seimitsu Co Ltd | 小型撮像モジュール |
JP4269334B2 (ja) * | 2002-10-28 | 2009-05-27 | コニカミノルタホールディングス株式会社 | 撮像レンズ、撮像ユニット及び携帯端末 |
JP2004200965A (ja) * | 2002-12-18 | 2004-07-15 | Sanyo Electric Co Ltd | カメラモジュール及びその製造方法 |
JP2004235834A (ja) * | 2003-01-29 | 2004-08-19 | Konica Minolta Holdings Inc | 撮像装置及び携帯端末 |
JP2004297398A (ja) * | 2003-03-26 | 2004-10-21 | Kyocera Corp | 撮像光学系及びこれを用いた撮像装置 |
JP4404568B2 (ja) * | 2003-04-10 | 2010-01-27 | 株式会社エルモ社 | 赤外線カットフィルタおよびその製造方法 |
JP3981348B2 (ja) * | 2003-05-30 | 2007-09-26 | 松下電器産業株式会社 | 撮像装置およびその製造方法 |
JP2005109903A (ja) * | 2003-09-30 | 2005-04-21 | Casio Comput Co Ltd | 携帯型電子機器 |
US7329856B2 (en) * | 2004-08-24 | 2008-02-12 | Micron Technology, Inc. | Image sensor having integrated infrared-filtering optical device and related method |
KR200395227Y1 (ko) * | 2005-06-28 | 2005-09-07 | 나노광학(주) | 소형화된 카메라 모듈 |
-
2005
- 2005-08-30 KR KR1020050080143A patent/KR100708940B1/ko not_active IP Right Cessation
-
2006
- 2006-08-21 DE DE102006038986A patent/DE102006038986A1/de not_active Ceased
- 2006-08-24 US US11/508,914 patent/US20070045551A1/en not_active Abandoned
- 2006-08-24 JP JP2006227615A patent/JP2007065650A/ja active Pending
- 2006-08-30 CN CNB2006101122849A patent/CN100466687C/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110001559A (ko) * | 2009-06-30 | 2011-01-06 | 엘지이노텍 주식회사 | 적층 필름을 이용한 카메라 모듈 |
CN112770039A (zh) * | 2021-03-04 | 2021-05-07 | 四川先美电子有限公司 | 一种制冷型sCMOS科学相机的真空密封舱 |
CN112770039B (zh) * | 2021-03-04 | 2024-05-24 | 四川先美电子有限公司 | 一种制冷型sCMOS科学相机的真空密封舱 |
Also Published As
Publication number | Publication date |
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CN1925561A (zh) | 2007-03-07 |
DE102006038986A1 (de) | 2007-04-05 |
JP2007065650A (ja) | 2007-03-15 |
KR100708940B1 (ko) | 2007-04-17 |
US20070045551A1 (en) | 2007-03-01 |
CN100466687C (zh) | 2009-03-04 |
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