JP2004001100A - 鉛フリーはんだ合金 - Google Patents
鉛フリーはんだ合金 Download PDFInfo
- Publication number
- JP2004001100A JP2004001100A JP2003301801A JP2003301801A JP2004001100A JP 2004001100 A JP2004001100 A JP 2004001100A JP 2003301801 A JP2003301801 A JP 2003301801A JP 2003301801 A JP2003301801 A JP 2003301801A JP 2004001100 A JP2004001100 A JP 2004001100A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- alloy
- wettability
- free
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】Sn-0.1〜3 質量%Cuの鉛フリーはんだ合金に、 0.001〜0.1 質量%のPを単独で、または 0.001〜0.1 質量%のGeと一緒に添加する。さらに強度改善元素として、Agおよび/またはSbを合計で4質量%以下を添加し、さらに必要によりNi、Co、Fe、Mn、CrおよびMoからなる群から選んだ1種以上を合計で0.5 質量%以下、添加してもよい。また、融点低下元素として、Bi、InおよびZnの少なくとも1種を合計で5質量%以下添加してもよい。
Description
Claims (6)
- Cu 0.1〜3質量%、P0.001 〜0.1 質量%、Agおよび/またはSbを合計で4質量%以下、残部Snからなることを特徴とする鉛フリーはんだ合金。
- Cu 0.1〜3質量%、P0.001 〜0.1 質量%、Ge 0.001〜0.1 質量%、Agおよび/またはSbを合計で4質量%以下、残部Snからなることを特徴とする鉛フリーはんだ合金。
- Ni、Co、Fe、Mn、CrおよびMoからなる群から選んだ1種または2種以上を合計で0.5 質量%以下を含有する、請求項1または2に記載の鉛フリーはんだ合金。
- Bi、InおよびZnの1種または2種以上を合計で5質量%以下含有する請求項1〜3のいずれかに記載の鉛フリーはんだ合金。
- Cu 0.1〜3質量%、P0.001 〜0.1 質量%、Bi、InおよびZnの1種または2種以上を合計で5質量%以下、残部Snからなることを特徴とする鉛フリーはんだ合金。
- Cu 0.1〜3質量%、P0.001 〜0.1 質量%、Ge 0.001〜0.1 質量%、Bi、InおよびZnの1種または2種以上を合計で5質量%以下、残部Snからなることを特徴とする鉛フリーはんだ合金。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003301801A JP4225165B2 (ja) | 2001-06-28 | 2003-08-26 | 鉛フリーはんだ合金 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001195903 | 2001-06-28 | ||
JP2003301801A JP4225165B2 (ja) | 2001-06-28 | 2003-08-26 | 鉛フリーはんだ合金 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002184931A Division JP3622788B2 (ja) | 2001-06-28 | 2002-06-25 | 鉛フリーはんだ合金 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006245929A Division JP4432946B2 (ja) | 2001-06-28 | 2006-09-11 | 鉛フリーはんだ合金 |
JP2007107100A Division JP2007260779A (ja) | 2001-06-28 | 2007-04-16 | 鉛フリーはんだ合金 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004001100A true JP2004001100A (ja) | 2004-01-08 |
JP2004001100A5 JP2004001100A5 (ja) | 2005-09-08 |
JP4225165B2 JP4225165B2 (ja) | 2009-02-18 |
Family
ID=19033808
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002184931A Expired - Lifetime JP3622788B2 (ja) | 2001-06-28 | 2002-06-25 | 鉛フリーはんだ合金 |
JP2003301801A Expired - Lifetime JP4225165B2 (ja) | 2001-06-28 | 2003-08-26 | 鉛フリーはんだ合金 |
JP2006245929A Expired - Lifetime JP4432946B2 (ja) | 2001-06-28 | 2006-09-11 | 鉛フリーはんだ合金 |
JP2007107100A Pending JP2007260779A (ja) | 2001-06-28 | 2007-04-16 | 鉛フリーはんだ合金 |
JP2009051984A Expired - Lifetime JP5099048B2 (ja) | 2001-06-28 | 2009-03-05 | 溶融はんだ用鉛フリーはんだ合金 |
JP2009249113A Expired - Lifetime JP5152150B2 (ja) | 2001-06-28 | 2009-10-29 | 鉛フリーはんだ合金 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002184931A Expired - Lifetime JP3622788B2 (ja) | 2001-06-28 | 2002-06-25 | 鉛フリーはんだ合金 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006245929A Expired - Lifetime JP4432946B2 (ja) | 2001-06-28 | 2006-09-11 | 鉛フリーはんだ合金 |
JP2007107100A Pending JP2007260779A (ja) | 2001-06-28 | 2007-04-16 | 鉛フリーはんだ合金 |
JP2009051984A Expired - Lifetime JP5099048B2 (ja) | 2001-06-28 | 2009-03-05 | 溶融はんだ用鉛フリーはんだ合金 |
JP2009249113A Expired - Lifetime JP5152150B2 (ja) | 2001-06-28 | 2009-10-29 | 鉛フリーはんだ合金 |
Country Status (7)
Country | Link |
---|---|
US (3) | US20030021718A1 (ja) |
EP (2) | EP1273384A1 (ja) |
JP (6) | JP3622788B2 (ja) |
KR (1) | KR100659890B1 (ja) |
CN (2) | CN101508062A (ja) |
MY (1) | MY136743A (ja) |
TW (1) | TW592872B (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006320955A (ja) * | 2005-05-20 | 2006-11-30 | Fuji Electric Device Technology Co Ltd | はんだ合金およびそれを用いた半導体装置 |
JP2008012576A (ja) * | 2006-07-07 | 2008-01-24 | Fuji Electric Holdings Co Ltd | ソルダーペースト組成物及びそれを用いたプリント配線基板への電子部品実装方法 |
JP2008043978A (ja) * | 2006-08-17 | 2008-02-28 | Nihon Almit Co Ltd | 鉛フリー半田合金 |
KR100885543B1 (ko) | 2004-10-22 | 2009-02-26 | 엠케이전자 주식회사 | 무연 솔더 합금 |
US7816249B2 (en) | 2005-05-20 | 2010-10-19 | Fuji Electric Systems Co., Ltd. | Method for producing a semiconductor device using a solder alloy |
WO2014192521A1 (ja) | 2013-05-29 | 2014-12-04 | 新日鉄住金マテリアルズ株式会社 | 半田ボールおよび電子部材 |
US9024442B2 (en) | 2010-08-18 | 2015-05-05 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder ball for semiconductor packaging and electronic member using the same |
Families Citing this family (139)
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TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
US8216395B2 (en) * | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
CN1318172C (zh) * | 2002-01-10 | 2007-05-30 | 千住金属工业株式会社 | 焊接方法 |
JP3991788B2 (ja) * | 2002-07-04 | 2007-10-17 | 日本電気株式会社 | はんだおよびそれを用いた実装品 |
US7029542B2 (en) * | 2002-07-09 | 2006-04-18 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
JP3724486B2 (ja) * | 2002-10-17 | 2005-12-07 | 千住金属工業株式会社 | 鉛フリーはんだボール用合金とはんだボール |
JP3974022B2 (ja) * | 2002-11-21 | 2007-09-12 | 富士通株式会社 | 半田付け検査の特徴量算出方法及び装置並びに前記方法を実行するためのプログラム |
US20040187976A1 (en) * | 2003-03-31 | 2004-09-30 | Fay Hua | Phase change lead-free super plastic solders |
WO2004113013A1 (ja) * | 2003-06-24 | 2004-12-29 | Kabushiki Kaisha Toshiba | はんだ部材、はんだ材料、はんだ付け方法、はんだ材料の製造方法およびはんだ接合部材 |
JP4329532B2 (ja) * | 2003-07-15 | 2009-09-09 | 日立電線株式会社 | 平角導体及びその製造方法並びにリード線 |
CN1295054C (zh) * | 2003-08-20 | 2007-01-17 | 中国科学院金属研究所 | 一种Sn-Ag-Cu-X共晶型合金无铅电子焊料 |
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US20080246164A1 (en) * | 2004-06-01 | 2008-10-09 | Minoru Ueshima | Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic Component |
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JP2006320955A (ja) * | 2005-05-20 | 2006-11-30 | Fuji Electric Device Technology Co Ltd | はんだ合金およびそれを用いた半導体装置 |
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JP4635715B2 (ja) * | 2005-05-20 | 2011-02-23 | 富士電機システムズ株式会社 | はんだ合金およびそれを用いた半導体装置 |
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JP2008043978A (ja) * | 2006-08-17 | 2008-02-28 | Nihon Almit Co Ltd | 鉛フリー半田合金 |
US9024442B2 (en) | 2010-08-18 | 2015-05-05 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder ball for semiconductor packaging and electronic member using the same |
WO2014192521A1 (ja) | 2013-05-29 | 2014-12-04 | 新日鉄住金マテリアルズ株式会社 | 半田ボールおよび電子部材 |
KR20160012878A (ko) | 2013-05-29 | 2016-02-03 | 신닛테츠스미킹 마테리알즈 가부시키가이샤 | 땜납 볼 및 전자 부재 |
US9320152B2 (en) | 2013-05-29 | 2016-04-19 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder ball and electronic member |
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US20080061117A1 (en) | 2008-03-13 |
CN101508062A (zh) | 2009-08-19 |
US20040062679A1 (en) | 2004-04-01 |
JP5152150B2 (ja) | 2013-02-27 |
JP4225165B2 (ja) | 2009-02-18 |
CN1400081A (zh) | 2003-03-05 |
JP5099048B2 (ja) | 2012-12-12 |
EP1273384A1 (en) | 2003-01-08 |
US7338567B2 (en) | 2008-03-04 |
MY136743A (en) | 2008-11-28 |
KR20030003030A (ko) | 2003-01-09 |
JP2003094195A (ja) | 2003-04-02 |
KR100659890B1 (ko) | 2006-12-20 |
US20030021718A1 (en) | 2003-01-30 |
JP4432946B2 (ja) | 2010-03-17 |
JP3622788B2 (ja) | 2005-02-23 |
JP2010029942A (ja) | 2010-02-12 |
EP1897649A1 (en) | 2008-03-12 |
TW592872B (en) | 2004-06-21 |
EP1897649B1 (en) | 2011-11-02 |
CN100534699C (zh) | 2009-09-02 |
JP2007007732A (ja) | 2007-01-18 |
US7682468B2 (en) | 2010-03-23 |
JP2009131903A (ja) | 2009-06-18 |
JP2007260779A (ja) | 2007-10-11 |
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