WO2009051181A1 - 無鉛はんだ合金 - Google Patents

無鉛はんだ合金 Download PDF

Info

Publication number
WO2009051181A1
WO2009051181A1 PCT/JP2008/068756 JP2008068756W WO2009051181A1 WO 2009051181 A1 WO2009051181 A1 WO 2009051181A1 JP 2008068756 W JP2008068756 W JP 2008068756W WO 2009051181 A1 WO2009051181 A1 WO 2009051181A1
Authority
WO
WIPO (PCT)
Prior art keywords
content
lead
free solder
solder alloy
upper limit
Prior art date
Application number
PCT/JP2008/068756
Other languages
English (en)
French (fr)
Inventor
Tetsuro Nishimura
Original Assignee
Nihon Superior Sha Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co., Ltd. filed Critical Nihon Superior Sha Co., Ltd.
Priority to TW097145346A priority Critical patent/TW201016373A/zh
Publication of WO2009051181A1 publication Critical patent/WO2009051181A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

　クラックの発生を抑制するはんだ接合物を提供する。 　Ｃｕ０．０１～７．６重量％、Ｎｉ０．００１～６重量％、残部Ｓｎからなる無鉛はんだ合金を採用した。ＣｕとＮｉの含有量はそれぞれ最大限の幅を持たせているが、Ｎｉの下限値として、０．０１重量％、さらに好ましくは０．０３重量％に特定した。Ｎｉの上限値としては、０．３重量％、さらに好ましくは０．１重量％に特定した。Ｃｕの下限値としては、０．１重量％、さらに好ましくは０．２重量％に特定した。Ｃｕの上限値としては、７重量％、さらに好ましくは０．９２重量％に特定した。
PCT/JP2008/068756 2007-10-19 2008-10-16 無鉛はんだ合金 WO2009051181A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097145346A TW201016373A (en) 2008-10-16 2008-11-24 Lead-free solder alloy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007272810 2007-10-19
JP2007-272810 2007-10-19

Publications (1)

Publication Number Publication Date
WO2009051181A1 true WO2009051181A1 (ja) 2009-04-23

Family

ID=40567443

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2008/068756 WO2009051181A1 (ja) 2007-10-19 2008-10-16 無鉛はんだ合金
PCT/JP2008/068956 WO2009051255A1 (ja) 2007-10-19 2008-10-20 はんだ継手

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068956 WO2009051255A1 (ja) 2007-10-19 2008-10-20 はんだ継手

Country Status (6)

Country Link
US (1) US8999519B2 (ja)
EP (1) EP2218540B1 (ja)
JP (2) JP5924852B2 (ja)
CN (1) CN101896310B (ja)
TW (1) TWI457192B (ja)
WO (2) WO2009051181A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012020331A (ja) * 2010-07-16 2012-02-02 Nihon Superior Co Ltd 接合構造
WO2013002112A1 (ja) * 2011-06-29 2013-01-03 株式会社日本スペリア社 信頼性が向上したはんだ接合部の製造方法
CN103153528A (zh) * 2010-11-19 2013-06-12 株式会社村田制作所 导电性材料、使用它的连接方法和连接结构
CN103167926A (zh) * 2010-12-24 2013-06-19 株式会社村田制作所 接合方法、接合结构、电子装置、电子装置的制造方法及电子部件
JPWO2015053114A1 (ja) * 2013-10-10 2017-03-09 株式会社日本スペリア社 低融点ろう材
JP2020066041A (ja) * 2018-10-26 2020-04-30 株式会社日本スペリア社 はんだ接合部の製造方法

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8013444B2 (en) * 2008-12-24 2011-09-06 Intel Corporation Solder joints with enhanced electromigration resistance
US8493746B2 (en) * 2009-02-12 2013-07-23 International Business Machines Corporation Additives for grain fragmentation in Pb-free Sn-based solder
JP2011054892A (ja) * 2009-09-04 2011-03-17 Nihon Superior Co Ltd 導電性ペーストを用いたはんだ接合
TWI436710B (zh) * 2011-02-09 2014-05-01 Murata Manufacturing Co Connection structure
JP2012182379A (ja) * 2011-03-02 2012-09-20 Murata Mfg Co Ltd 多層チップ部品およびその製造方法
KR101370264B1 (ko) * 2011-06-17 2014-03-04 주식회사 엘지화학 솔더링 커넥터와, 이를 포함하는 배터리 모듈 및 배터리 팩
WO2014013632A1 (ja) 2012-07-19 2014-01-23 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP5598592B2 (ja) 2012-12-25 2014-10-01 三菱マテリアル株式会社 パワーモジュール
WO2014103955A1 (ja) 2012-12-25 2014-07-03 三菱マテリアル株式会社 パワーモジュール
JP6247819B2 (ja) * 2013-01-15 2017-12-13 株式会社日本スペリア社 アルミニウム用はんだ及びはんだ継手
WO2014142153A1 (ja) * 2013-03-13 2014-09-18 株式会社日本スペリア社 はんだ接合物及びはんだ接合方法
JP6369085B2 (ja) * 2013-03-29 2018-08-08 三菱マテリアル株式会社 パワーモジュール
US9320152B2 (en) 2013-05-29 2016-04-19 Nippon Steel & Sumikin Materials Co., Ltd. Solder ball and electronic member
JP6172573B2 (ja) 2013-11-29 2017-08-02 日立金属株式会社 はんだ接合材料とその製造方法、及びはんだ接合用部材、並びに太陽電池モジュール
CN103737193A (zh) * 2013-12-23 2014-04-23 苏州宏泉高压电容器有限公司 一种铁镍锡焊接材料的制备方法
CN104923951A (zh) * 2014-03-17 2015-09-23 广西民族大学 一种新型抗氧化无铅焊料
JP6288284B2 (ja) * 2014-09-10 2018-03-07 株式会社村田製作所 金属間化合物の生成方法
CN105040106B (zh) * 2015-06-10 2019-02-01 哈尔滨工业大学深圳研究生院 一种Cu6Sn5金属间化合物单晶种籽的制备方法
US20170095891A1 (en) * 2015-10-01 2017-04-06 Iowa State University Research Foundation, Inc. Lead-free composite solder
CN105397328A (zh) * 2015-12-15 2016-03-16 瑞声光电科技(常州)有限公司 Sn-Cu系无铅钎料及其制备方法
JP6659950B2 (ja) 2016-01-15 2020-03-04 富士通株式会社 電子装置及び電子機器
DE112017000184T5 (de) * 2016-06-16 2018-08-02 Fuji Electric Co., Ltd. Lotverbindung
JP6621068B2 (ja) 2016-12-08 2019-12-18 パナソニックＩｐマネジメント株式会社 実装構造体
JP7041477B2 (ja) * 2017-07-05 2022-03-24 新光電気工業株式会社 導電性ボール及び電子装置とそれらの製造方法
JP7014535B2 (ja) * 2017-07-07 2022-02-01 新光電気工業株式会社 導電性ボール及び電子装置とそれらの製造方法
CN107538149B (zh) * 2017-10-25 2019-09-24 郑州轻工业学院 一种Sn-Cu-Co-Ni无铅焊料及其制备方法
TWI820277B (zh) * 2018-12-27 2023-11-01 美商阿爾發金屬化工公司 無鉛焊料組成物
JP6799649B1 (ja) * 2019-08-27 2020-12-16 有限会社 ナプラ 金属粒子
JP6744972B1 (ja) * 2019-10-04 2020-08-19 有限会社 ナプラ 接合構造部
JP6799701B1 (ja) * 2020-03-12 2020-12-16 有限会社 ナプラ 金属粒子

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999048639A1 (fr) * 1998-03-26 1999-09-30 Nihon Superior Sha Co., Ltd. Soudure sans plomb
JP2000197988A (ja) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
JP2005014076A (ja) * 2003-06-27 2005-01-20 Toshiba Corp 耐酸化性はんだ、耐酸化性はんだの製造方法およびはんだ付け方法
JP2005103645A (ja) * 2004-10-29 2005-04-21 Hitachi Metals Ltd はんだボールおよびその製造方法
JP2005254298A (ja) * 2004-03-12 2005-09-22 Nippon Steel Corp 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材
JP2006289434A (ja) * 2005-04-11 2006-10-26 Nihon Superior Co Ltd はんだ合金
WO2007010927A1 (ja) * 2005-07-19 2007-01-25 Nihon Superior Sha Co., Ltd. 追加供給用鉛フリーはんだ及びはんだ浴中のＣｕ濃度及びＮｉ濃度調整方法
JP2007105750A (ja) * 2005-10-12 2007-04-26 Senju Metal Ind Co Ltd Ｓｎ−Ｉｎ系はんだ合金
JP2007175776A (ja) * 2000-04-17 2007-07-12 Fujitsu Ltd はんだ接合方法およびはんだ接合部
JP2007196289A (ja) * 2005-12-27 2007-08-09 Toshiba Corp 電子部品用無鉛金属材料
JP2007260779A (ja) * 2001-06-28 2007-10-11 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP2008043978A (ja) * 2006-08-17 2008-02-28 Nihon Almit Co Ltd 鉛フリー半田合金

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643875A (en) * 1985-07-24 1987-02-17 Gte Products Corporation Tin based ductile brazing alloys
US5127969A (en) * 1990-03-22 1992-07-07 University Of Cincinnati Reinforced solder, brazing and welding compositions and methods for preparation thereof
CA2214130C (en) 1996-09-19 2003-12-02 Northern Telecom Limited Assemblies of substrates and electronic components
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3036636B1 (ja) * 1999-02-08 2000-04-24 日本アルミット株式会社 無鉛半田合金
EP1225001A1 (en) * 2000-03-17 2002-07-24 Tokyo First Trading Company Lead-free solder alloy
WO2001078931A1 (fr) 2000-04-17 2001-10-25 Fujitsu Limited Assemblage par brasure
US20030091463A1 (en) * 2001-02-27 2003-05-15 Koichi Izumida Unleaded solder alloy and electronic components using it
JP2003326386A (ja) * 2002-05-13 2003-11-18 Matsushita Electric Ind Co Ltd 無鉛はんだ合金
JP2005288544A (ja) * 2004-03-09 2005-10-20 Toshiba Corp 無鉛はんだ、はんだ付け方法および電子部品
CA2607286A1 (en) * 2005-05-11 2006-11-16 American Iron & Metal Company, Inc. Tin alloy solder compositions
US20070062679A1 (en) * 2005-06-30 2007-03-22 Agee Keith D Heat exchanger with modified diffuser surface
US7233074B2 (en) * 2005-08-11 2007-06-19 Texas Instruments Incorporated Semiconductor device with improved contacts
JP2008130697A (ja) * 2006-11-17 2008-06-05 Sharp Corp はんだ接合構造、及びはんだ接合構造の製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999048639A1 (fr) * 1998-03-26 1999-09-30 Nihon Superior Sha Co., Ltd. Soudure sans plomb
JP2000197988A (ja) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
JP2007175776A (ja) * 2000-04-17 2007-07-12 Fujitsu Ltd はんだ接合方法およびはんだ接合部
JP2007260779A (ja) * 2001-06-28 2007-10-11 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP2005014076A (ja) * 2003-06-27 2005-01-20 Toshiba Corp 耐酸化性はんだ、耐酸化性はんだの製造方法およびはんだ付け方法
JP2005254298A (ja) * 2004-03-12 2005-09-22 Nippon Steel Corp 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材
JP2005103645A (ja) * 2004-10-29 2005-04-21 Hitachi Metals Ltd はんだボールおよびその製造方法
JP2006289434A (ja) * 2005-04-11 2006-10-26 Nihon Superior Co Ltd はんだ合金
WO2007010927A1 (ja) * 2005-07-19 2007-01-25 Nihon Superior Sha Co., Ltd. 追加供給用鉛フリーはんだ及びはんだ浴中のＣｕ濃度及びＮｉ濃度調整方法
JP2007105750A (ja) * 2005-10-12 2007-04-26 Senju Metal Ind Co Ltd Ｓｎ−Ｉｎ系はんだ合金
JP2007196289A (ja) * 2005-12-27 2007-08-09 Toshiba Corp 電子部品用無鉛金属材料
JP2008043978A (ja) * 2006-08-17 2008-02-28 Nihon Almit Co Ltd 鉛フリー半田合金

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012020331A (ja) * 2010-07-16 2012-02-02 Nihon Superior Co Ltd 接合構造
CN103153528A (zh) * 2010-11-19 2013-06-12 株式会社村田制作所 导电性材料、使用它的连接方法和连接结构
US10050355B2 (en) 2010-11-19 2018-08-14 Murata Manufacturing Co., Ltd. Conductive material, bonding method using the same, and bonded structure
CN103167926A (zh) * 2010-12-24 2013-06-19 株式会社村田制作所 接合方法、接合结构、电子装置、电子装置的制造方法及电子部件
US9209527B2 (en) 2010-12-24 2015-12-08 Murata Manufacturing Co., Ltd. Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part
US9614295B2 (en) 2010-12-24 2017-04-04 Murata Manufacturing Co., Ltd. Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part
WO2013002112A1 (ja) * 2011-06-29 2013-01-03 株式会社日本スペリア社 信頼性が向上したはんだ接合部の製造方法
JPWO2013002112A1 (ja) * 2011-06-29 2015-02-23 株式会社日本スペリア社 信頼性が向上したはんだ接合部の製造方法
JPWO2015053114A1 (ja) * 2013-10-10 2017-03-09 株式会社日本スペリア社 低融点ろう材
JP2020066041A (ja) * 2018-10-26 2020-04-30 株式会社日本スペリア社 はんだ接合部の製造方法
JP7291320B2 (ja) 2018-10-26 2023-06-15 株式会社日本スペリア社 はんだ接合部の製造方法

Also Published As

Publication number Publication date
EP2218540A1 (en) 2010-08-18
CN101896310A (zh) 2010-11-24
JP2016106033A (ja) 2016-06-16
JP5924852B2 (ja) 2016-05-25
EP2218540B1 (en) 2017-12-13
CN101896310B (zh) 2014-03-05
US8999519B2 (en) 2015-04-07
US20100266870A1 (en) 2010-10-21
TW201016374A (en) 2010-05-01
WO2009051255A1 (ja) 2009-04-23
EP2218540A4 (en) 2013-02-20
JPWO2009051255A1 (ja) 2011-03-03
TWI457192B (zh) 2014-10-21

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