JP2003176461A - 高接着力３層構造のａｃａフィルム - Google Patents

高接着力３層構造のａｃａフィルム

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Publication number
JP2003176461A
JP2003176461A JP2002204194A JP2002204194A JP2003176461A JP 2003176461 A JP2003176461 A JP 2003176461A JP 2002204194 A JP2002204194 A JP 2002204194A JP 2002204194 A JP2002204194 A JP 2002204194A JP 2003176461 A JP2003176461 A JP 2003176461A
Authority
JP
Japan
Prior art keywords
film
aca
epoxy resin
layer structure
aca film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002204194A
Other languages
English (en)
Inventor
Kyung Wook Paik
ウォク パイク キュン
Jin Imu Myun
ジン イム ミュン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Advanced Institute of Science and Technology KAIST
Original Assignee
Korea Advanced Institute of Science and Technology KAIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Advanced Institute of Science and Technology KAIST filed Critical Korea Advanced Institute of Science and Technology KAIST
Publication of JP2003176461A publication Critical patent/JP2003176461A/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

(57)【要約】 （修正有） 【課題】 一般的な単層構造の異方導電性フ
ィルム（ＡＣＦ）の接着力を向上させるために、特にフ
リップチップボンディング時に接着力を増強させること
ができる３層構造の異方導電性接着性（ＡＣＡ）フィル
ムを提供する。 【解決手段】 エポキシ樹脂を基材にしてなり、
０．１乃至１μｍの大きさを有する非導電性粒子１６０
と３乃至１０μｍの大きさを有する導電性粒子１２０と
を含む主ＡＣＡフィルム１１２、または３乃至１０μｍ
の大きさを有する導電性粒子のみを含む主ＡＣＡフィル
ム、及び該主ＡＣＡフィルムの両面のそれぞれに形成さ
れたエポキシ樹脂を基材にする接着力増強層１１４ａ，
１１４ｂとを含むことを特徴とする。

Description

【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、ＡＣＡ（Ａｎｉｓ
ｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ａｄｈｅｓｉ
ｖｅ）フィルムに関し、更に詳しくは、一般的な単層Ａ
ＣＦの接着力を向上させるために、特にフリップチップ
の接続時にＡＣＡフィルムの接着力を増強させることが
できる３層構造のＡＣＡフィルムに関する。
【０００２】
【従来の技術】電子パッケージ技術は、半導体素子から
最終の完成品までのすべての段階を含む広範囲に渡り、
かつ多様なシステムの製造技術である。最近の急速に発
展する半導体技術は、既に百万個以上のセルが集積化さ
れており、非メモリ素子の場合は、Ｉ／Ｏピンの個数の
増加、ダイのサイズの拡大、熱の放出の増加、電気的高
性能等の傾向に発展している。しかし、このような素子
をパッケージするための電子パッケージング技術は、相
対的に劣り、急速な半導体産業の発展に歩調を合わせら
れない実情である。
【０００３】電子パッケージ技術は、最終の電子製品の
性能、サイズ、価額、信頼性等を決める非常に重要な技
術であって、特に、電気的高性能、極小型／高密度、低
消費電力、多機能、超高速の信号処理、永久的信頼性等
を追及する最近の電子製品においては、その要求が更に
高まりつつある。
【０００４】最近、かかる情勢に応え、チップを基板に
電気的に接続する技術の一つであるフリップチップボン
ディング技術が脚光を浴びている。しかし、従来のフリ
ップチップボンディング技術は、はんだを用いた複雑な
ボンディング工程、即ち、基板へのはんだフラックスコ
ート、はんだバンプが形成されたチップと表面電極が形
成された基板との整列、はんだバンプのリフロー、残余
フラックスの除去、及びアンダーフィルの充填及び硬化
等の工程を経るため、工程が複雑でかつ完成品が高価に
なるという短所を有している。
【０００５】これにより、最近では、かかる複雑な工程
を減少するためにウェハー状態でフラックスとアンダー
フィルの機能を有するポリマー材料を塗布して加工する
ウェハー次元のパッケージ技術に対する関心が高まって
いる。この他にも、一般的なはんだフリップチップに比
べて低価で、極細電極ピッチが可能であり、フラックス
及びろう成分を使用しないことで環境親和的であり、か
つ低温で工程を施す等といった長所を有する導電性接着
剤を用いたフリップチップボンディング技術に対する研
究も盛んに行われている。
【０００６】導電性接着剤は、異方性導電接着剤（ａｎ
ｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ａｄｈｅ
ｓｉｖｅ：ＡＣＡ）と等方性導電接着剤（Ｉｓｏｔｒｏ
ｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ａｄｈｅｓｉｖｅ）と
に大別され、基本的にＮｉ、Ａｕ／高分子、またはＡｇ
等の導電性粒子と、熱硬化性或いは熱可塑性、または両
方の特性を混合した混合型絶縁樹脂とからなる。
【０００７】図１（ａ）は、従来のＡＣＡフィルムを説
明するための断面図である。図１ａを参照すると、ＡＣ
Ａフィルム１０は、ポリマー樹脂を基材にしてなり、伝
導性を有するように導電性粒子２０が微細に分散された
構造を有する。ＡＣＡフィルム１０の両面には、離型剤
フィルム３０が貼り付けられている。
【０００８】図１（ｂ）は、図１（ａ）のＡＣＡフィル
ムを用いたフリップチップボンディングを説明するため
の断面図である。先ず、一方の面に貼り付けられている
離型剤フィルム３０を剥がし、露出したＡＣＡフィルム
１０を基板５０の上に熱圧着する。次に、もう一方の面
に貼り付けられている離型剤フィルム３０を剥がし、バ
ンプ４５が形成されているＩＣチップ４０と基板５０上
の電極５５とを整列させる。そして、これらを熱圧着す
ると、ＡＣＦの導電性粒子が塑性変形しながらバンプ４
５と電極５５とが機械的及び電気的に接続される。
【０００９】しかし、基板５０が、熱膨張係数が大きい
ＦＲ−４のような有機基板等であり、ＩＣチップ４０が
相対的に熱膨張係数が小さいＳｉチップの場合には、熱
膨張係数の差から生じる熱的応力のため、熱サイクルを
受ける場合、フリップチップパッケージの信頼性が低下
するという問題が発生する。
【００１０】かかる問題点を解決するために、非導電性
粒子を３０ｗｔ％以上包含させて熱膨張係数を小さくし
改良されたＡＣＡフィルムが提案されており、これを図
１（ｃ）に示した。図１（ｃ）を参照すると、ＡＣＡフ
ィルム１０の熱膨張係数を小さくするために、ＡＣＡフ
ィルム１０中に、図１（ａ）とは異なって、導電性粒子
２０よりその大きさが小さい非導電性粒子６０が多く含
まれている。
【００１１】ＡＣＡフィルム１０の接着力は、ポリマー
樹脂により生じる。ところが、このようにポリマー樹脂
中に導電性及び非導電性粒子２０、６０が多量含まれる
と、ポリマー樹脂の有効面積が減少して、ＩＣチップ４
０と基板５０との間の界面接着力及び界面靭性が劣化
し、フリップチップパッケージの信頼性が悪くなる。
【００１２】
【発明が解決しようとする課題】従って、本発明が解決
しようとする技術的課題は、一般的な単層ＡＣＦの接着
力を向上させるために、または熱膨張係数を小さくする
ために非導電性粒子を含ませてもフリップチップの接続
時に依然として大きな接着力を有する、３層構造のＡＣ
Ａフィルムを提供することにある。
【００１３】
【課題を解決するための手段】前記技術的課題を達成す
るための本発明による３層構造のＡＣＡフィルムは、エ
ポキシ樹脂を基材にしてなり、０．１乃至１μｍの大き
さを有する非導電性粒子と３乃至１０μｍの大きさを有
する導電性粒子とを含む主ＡＣＡフィルム、または３乃
至１０μｍの大きさを有する導電性粒子のみを含む主Ａ
ＣＡフィルム、及び前記主ＡＣＡフィルムの両面のそれ
ぞれに形成されたエポキシ樹脂を基材にする接着力増強
層とを含むことを特徴とする。
【００１４】ここで、前記主ＡＣＡフィルムとしては、
固状のエポキシ樹脂、液状のエポキシ樹脂、固状のフェ
ノキシ樹脂、メチルエチルケトンとトルエンとが混合さ
れたソルベント、液状のイミダゾル硬化剤、０．１乃至
１μｍの大きさを有し、前記ソルベントを除く総重量に
対し０乃至５０ｗｔ％を占める非導電性粒子、３乃至１
０μｍの大きさを有し、前記ソルベントを除く総重量に
対し５乃至２０ｗｔ％を占める導電性粒子を混合した
後、乾燥して形成されたものを使用することができる。
この時、前記乾燥は、８０乃至１００℃の温度範囲で１
乃至３分間行うことが好ましい。
【００１５】前記接着力増強層は、５乃至１０ｗｔ％を
占める導電性粒子を更に含むこともできる。前記接着力
増強層としては、固状のエポキシ樹脂、液状のエポキシ
樹脂、固状のフェノキシ樹脂、メチルエチルケトンとト
ルエンとが混合されたソルベント、液状のイミダゾル硬
化剤を混合した後、乾燥して形成されたものを使用する
ことができる。
【００１６】前記主ＡＣＡフィルムは、２５乃至５０μ
ｍの厚さを有することが好ましい。前記接着力増強層の
各々は、１乃至１０μｍの厚さを有することが好まし
い。前記接着力増強層には、熱可塑性樹脂が０乃至１０
ｗｔ％含まれ得る。
【００１７】以下で、本発明の好ましい実施例を添付し
た図面を参照して詳細に説明する。
【００１８】
【実施例】図２（ａ）は、本発明による３層構造のＡＣ
Ａフィルムを説明するための断面図である。
【００１９】図２ａを参照すると、３層構造のＡＣＡフ
ィルム１１０は、下部接着力増強層１１４ａ、主ＡＣＡ
フィルム（ｍａｉｎ ＡＣＡ ｆｌｉｍ）１１２及び上
部接着力増強層１１４ｂの３層構造を有する。
【００２０】主ＡＣＡフィルム１１２は、エポキシ樹脂
が基材であり、３乃至１０μｍの大きさを有する導電性
粒子１２０及び０．１乃至１μｍの大きさを有する非導
電性粒子１６０が微細に分散された構造を有する。
【００２１】主ＡＣＡフィルム１１２は、下部接着力増
強層１１４ａ及び上部接着力増強層１１４ｂとの間に介
在する。下部及び上部接着力増強力１１４ａ及び１１４
ｂは、エポキシ樹脂を基材にしてなり、１乃至１０μｍ
の厚さを有する。下部及び上部接着力増強層１１４ａ及
び１１４ｂも導電性を有するようにするために、下部及
び上部接着力増強層１１４ａ及び１１４ｂのそれぞれに
導電性粒子を５乃至１０ｗｔ％の範囲で含むことができ
る。３層構造のＡＣＡフィルム１１０の両面には、離型
剤フィルム１３０ａ及び１３０ｂが貼り付けられてい
る。
【００２２】３層構造のＡＣＡフィルム１１０は、次の
ようにして作製される。先ず、固状のエポキシ樹脂、液
状のエポキシ樹脂、固状のフェノキシ樹脂、メチルエチ
ルケトンとトルエンとが１：３の割合で混合されたソル
ベント及び液状のイミダゾル硬化剤が混合されたもの
を、コンマロールコーティング装置等でポリエチレンか
らなる下部離型剤フィルム１３０ａ上に塗布した後、こ
れを、Ｂ−ステージ硬化させて下部接着力増強層１１４
ａを形成する。
【００２３】次に、固状のエポキシ樹脂、液状のエポキ
シ樹脂、固状のフェノキシ樹脂、メチルエチルケトンと
トルエンとが１：３の割合で混合されたソルベント、３
乃至１０μｍの大きさを有する導電性粒子、０．１乃至
１μｍの大きさを有する非導電性粒子、液状のイミダゾ
ル硬化剤を混合した後、これを下部接着力増強層１１４
ａ上に塗布する。導電性粒子は、ソルベントを除く総重
量に対し５乃至２０ｗｔ％、非導電性粒子は、ソルベン
トを除く総重量に対し０乃至５０ｗｔ％を占めるように
混合する。そして、ソルベントが十分に蒸発し消えるよ
うに、８０乃至１００℃の温度範囲で１乃至３分間乾燥
させ、３０乃至４０μｍの厚さを有する主ＡＣＡフィル
ム１１２を形成する。
【００２４】続けて、固状のエポキシ樹脂、液状のエポ
キシ樹脂、固状のフェノキシ樹脂、メチルエチルケトン
とトルエンとが１：３の割合で混合されたソルベント及
び液状のイミダゾル硬化剤が混合されたものを、コンマ
ロールコーティング装置等で主ＡＣＡフィルム１１２上
に塗布した後、これを、熱圧着ラミネートして上部接着
力増強層１１４ｂを形成する。そして最後に、上部接着
力増強層１１４ｂに上部離型剤フィルム１３０ｂを貼り
付ける。
【００２５】図２（ｂ）は、図２（ａ）の３層構造のＡ
ＣＡフィルム１１０を用いてフリップチップボンディン
グしたものを示す断面図である。図１（ｂ）と同一の図
面符号は、同一機能を遂行する構成要素を示す。下部離
型剤フィルム１３０ａを剥がし、露出した下部接着力増
強層１１４ａを基板５０に８０℃で１〜３ｋｇｆ／ｃｍ
２に熱圧着する。次に、上部離型剤フィルム１３０ｂを
剥がした後、ＩＣチップ４０と基板５０とを整列し、こ
れらを熱圧着する。
【００２６】下部及び上部接着力増強層１１４ａ及び１
１４ｂに、ポリウレタン、アクリル樹脂等の熱可塑性樹
脂を０乃至１０ｗｔ％含有させることもできる。この場
合には、熱を若干加えると、ＩＣチップ４０と基板５０
とが分離し易くなるため、ＩＣチップ４０の修理が必要
な場合に非常に有効である。
【００２７】
【発明の効果】上述したような本発明の３層構造のＡＣ
Ａフィルムによると、一般的な単層ＡＣＦの接着力を向
上させるために、または熱膨張係数を小さくするために
非導電性粒子をＡＣＡフィルム内に微細分散させてもエ
ポキシ樹脂を基材とする接着力増強層によりＡＣＡフィ
ルムの接着力が増強するため、ＩＣチップと基板とが強
く接着されるようになる。
【００２８】本発明は、前記実施例に限定されることで
はなく、本発明の技術的思想内で当分野における通常の
知識を有する者により多くの変形が可能であることは明
白である。
【図面の簡単な説明】
【図１】図１（ａ）は、従来のＡＣＡフィルムを説明す
るための断面図であり、図１（ｂ）は、図１（ａ）のＡ
ＣＡフィルムを用いたフリップチップボンディングを説
明するための断面図であり、図１（ｃ）は、改良された
従来のＡＣＡフィルムを説明するための断面図である。
【図２】図２（ａ）は、本発明によるＡＣＡフィルムを
説明するための断面図であり、図２（ｂ）は、図２
（ａ）のＡＣＡフィルムを用いてフリップチップボンデ
ィングしたものを示す断面図である。
【符号の説明】
１１０ ＡＣＡフィルム １１４ａ 下部接着力増強層 １１４ｂ 上部接着力増強層 １１２ 主ＡＣＡフィルム １３０ａ 下部離型剤フィルム １３０ｂ 上部離型剤フィルム
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｒ 11/01 ５０１ Ｈ０１Ｒ 11/01 ５０１Ｃ // Ｃ０９Ｊ 163/00 Ｃ０９Ｊ 163/00 (72)発明者 キュン ウォク パイク 大韓民国 305−701 デジョン，ユソン− ク，クサン−ドン 373−１，コリア ア ドバンスト インスティテュート オブ サイエンス アンド テクノロジー，デパ ートメント オブ マテリアルズ サイエ ンス アンド エンジニアリング (72)発明者 ミュン ジン イム 大韓民国 305−335 デジョン，ユソン− ク，クン−ドン 393−３，ジャ−ユン アパートメント ナンバー 1107 Ｆターム(参考） 4F100 AK53A AK53B AK53C AL05A AT00A AT00B AT00C BA03 BA06 BA10B BA10C DE01A GB41 JA02 JG01A YY00A 4J004 AA02 AA11 AA13 AA18 AB04 BA03 FA05 FA08 4J040 DF032 EC001 EE061 EF002 HC23 HC24 JA09 KA16 KA32 LA09 NA19 NA20 5G307 HA02 HC01

Claims (6)

    【特許請求の範囲】
  1. 【請求項１】 エポキシ樹脂を基材にしてなり、０．１
    乃至１μｍの大きさを有する非導電性粒子と３乃至１０
    μｍの大きさを有する導電性粒子とを含む主ＡＣＡフィ
    ルム、または３乃至１０μｍの大きさを有する導電性粒
    子のみを含む主ＡＣＡフィルム；及び該主ＡＣＡフィル
    ムの両面のそれぞれに形成されたエポキシ樹脂を基材に
    する接着力増強層と；を含むことを特徴とする３層構造
    のＡＣＡフィルム。
  2. 【請求項２】 前記主ＡＣＡフィルムが、固状のエポキ
    シ樹脂、液状のエポキシ樹脂、固状のフェノキシ樹脂、
    メチルエチルケトンとトルエンとが混合されたソルベン
    ト、液状のイミダゾル硬化剤、０．１乃至１μｍの大き
    さを有し、該ソルベントを除く総重量に対し０乃至５０
    ｗｔ％を占める非導電性粒子、３乃至１０μｍの大きさ
    を有し、該ソルベントを除く総重量に対し５乃至２０ｗ
    ｔ％を占める導電性粒子を混合した後、乾燥して形成さ
    れることを特徴とする請求項１に記載の３層構造のＡＣ
    Ａフィルム。
  3. 【請求項３】 更に、前記接着力増強層が、５乃至１０
    ｗｔ％を占める導電性粒子を含むことを特徴とする請求
    項１または２に記載の３層構造のＡＣＡフィルム。
  4. 【請求項４】 前記接着力増強層が、固状のエポキシ樹
    脂、液状のエポキシ樹脂、固状のフェノキシ樹脂、メチ
    ルエチルケトンとトルエンとが混合されたソルベント、
    液状のイミダゾル硬化剤を混合した後、乾燥して形成さ
    れることを特徴とする請求項１または２に記載の３層構
    造のＡＣＡフィルム。
  5. 【請求項５】 前記主ＡＣＡフィルムが、２５乃至５０
    μｍの厚さを有するとともに、前記接着力増強層の各々
    が、１乃至１０μｍの厚さを有することを特徴とする請
    求項１または２に記載の３層構造のＡＣＡフィルム。
  6. 【請求項６】 前記接着力増強層が、熱可塑性樹脂を０
    乃至１０ｗｔ％含むことを特徴とする請求項１または２
    に記載の３層構造のＡＣＡフィルム。
JP2002204194A 2001-07-19 2002-07-12 高接着力３層構造のａｃａフィルム Pending JP2003176461A (ja)

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KR20030008607A (ko) 2003-01-29

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