JP2001172604A - 接着方法および電子部品 - Google Patents

接着方法および電子部品

Info

Publication number
JP2001172604A
JP2001172604A JP35864799A JP35864799A JP2001172604A JP 2001172604 A JP2001172604 A JP 2001172604A JP 35864799 A JP35864799 A JP 35864799A JP 35864799 A JP35864799 A JP 35864799A JP 2001172604 A JP2001172604 A JP 2001172604A
Authority
JP
Japan
Prior art keywords
boron nitride
conductive adhesive
heat
nitride powder
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP35864799A
Other languages
English (en)
Other versions
JP4528397B2 (ja
Inventor
Masayuki Hida
雅之 飛田
Shinya Tateda
伸哉 館田
Tsunehisa Kimura
恒久 木村
Masabumi Yamato
正文 山登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polymatech Co Ltd
Original Assignee
Polymatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymatech Co Ltd filed Critical Polymatech Co Ltd
Priority to JP35864799A priority Critical patent/JP4528397B2/ja
Priority to US09/733,560 priority patent/US6649012B2/en
Priority to DE60009646T priority patent/DE60009646T2/de
Priority to EP00311186A priority patent/EP1108766B1/en
Publication of JP2001172604A publication Critical patent/JP2001172604A/ja
Priority to US10/655,239 priority patent/US6918983B2/en
Application granted granted Critical
Publication of JP4528397B2 publication Critical patent/JP4528397B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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Abstract

(57)【要約】 【課題】電気製品に使用される半導体素子や電源、光源
などの部品から発生する熱を効果的に放散させる電気絶
縁性の熱伝導性接着剤の接着方法および放熱特性にすぐ
れる電子部品の提供 【解決手段】窒化ホウ素粉末と接着性高分子とを配合し
て作った熱伝導性接着剤を使用し、磁場雰囲気で熱伝導
性接着剤中の窒化ホウ素粉末を一定方向に配向させて接
着するようにした

Description

【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は高い熱伝導性が要求
される熱伝導性接着剤の接着方法および電子部品に関す
る。さらに詳しくは、電気製品に使用される半導体素子
や電源、光源などの部品から発生する熱を効果的に放散
させる熱伝導性接着剤の接着方法および放熱性にすぐれ
る電子部品に関する。
【０００２】
【従来の技術】従来より、発熱する半導体素子や電子部
品と放熱させる伝熱部材とを接合させる目的で接着性高
分子をマトリックスとした熱伝導性接着剤が使用されて
いる。これらの接着剤には、熱伝導性を高めるために、
銀、銅、金、アルミニウムなどの熱伝導率の大きい金属
や合金、あるいは酸化アルミニウム、酸化マグネシウ
ム、酸化ケイ素、窒化ホウ素、窒化アルミニウム、窒化
ケイ素、炭化ケイ素などのセラミックス、カーボンブラ
ック、グラファイト、ダイヤモンドなどの様々な熱伝導
性充填剤が配合されている。なかでも、熱伝導性と電気
絶縁性にすぐれている窒化ホウ素粉末を充填した電気絶
縁性の熱伝導性接着剤が広範囲に使用されている。一
方、特開昭６２−１９４６５３号公報、特開昭６３−６
２７６２号公報によれば、ニッケルなどの磁性体粉末を
含む接着剤を磁場中で厚み方向に配向させて熱伝導率を
向上させる接着方法が開示されている。
【０００３】
【発明が解決しようとする課題】しかしながら、窒化ホ
ウ素粉末は鱗片形状の厚さ方向の熱伝導率の方が面方向
の熱伝導率よりも小さいために、窒化ホウ素粉末を高分
子に単純に配合した接着剤の場合は、鱗片状の面方向が
接着後の接着剤層中の厚さ方向に平行に充填されてしま
うために十分な熱伝導性を発揮できなかった。
【０００４】また、上記の特開昭６２−１９４６５３号
公報、特開昭６３−６２７６２号公報などの接着方法
は、いずれも導電性の磁性体金属粉末などを配合するた
めに電気絶縁性を要求される用途には応用できなかっ
た。すなわち、電気絶縁性が良好で高い熱伝導特性を有
する接着方法が開発されていないために、半導体素子な
どの電子部品からの多大な発熱によって、電気化学的な
マイグレーションが加速されたり、配線やパッド部の腐
食が促進されたり、発生する熱応力によって構成材料に
クラックが生じたり、破壊したり、構成材料の接合部の
界面が剥離して電子部品の寿命を損なう様々なトラブル
が発生していた。
【０００５】一方、本出願人による特願平１１−８５１
０７号公報の熱伝導性接着剤では、熱伝導率が２０Ｗ／
ｍ・Ｋ以上の反磁性充填材を接着剤中に配合させている
けれども、反磁性充填材として窒化ホウ素粉末は対象と
して考えられていなかった。
【０００６】
【課題を解決するための手段】本発明は、上述の課題を
解決する目的で、電気製品に使用される半導体素子や電
源、光源などの部品から発生する熱を効果的に放散させ
る電気絶縁性の熱伝導性接着剤の接着方法および放熱特
性にすぐれる電子部品を提供するものである。そのため
に本発明は、窒化ホウ素粉末と接着性高分子とを配合し
て作った熱伝導性接着剤を使用し、磁場雰囲気で熱伝導
性接着剤中の窒化ホウ素粉末を一定方向に配向させて接
着する熱伝導を一定方向に良好にさせるようにした接着
方法および電子部品を提供するものである。
【０００７】
【発明の実施の形態】本発明は、被着体間に、窒化ホウ
素粉末と接着性高分子とを配合してなる熱伝導性接着剤
を介在させ、磁場雰囲気で熱伝導性接着剤中の窒化ホウ
素粉末を一定方向に配向させた状態で接着することを特
徴とする接着方法である。
【０００８】さらに本発明は、発熱する素子と伝熱部材
間に、窒化ホウ素粉末と接着性高分子とを配合してなる
熱伝導性接着剤を介在させ、磁場雰囲気で熱伝導性接着
剤中の窒化ホウ素粉末を一定方向に配向させた状態で接
着させた構造を特徴とする電子部品である。
【０００９】本発明で使用する窒化ホウ素粉末について
は、結晶系の種類、粉末粒子の形状や大きさ、粉末粒子
の凝集度合い、およびこれらの分布などについて特定す
るものではない。結晶系としては、六方晶系、立方晶
系、その他のいずれの構造の窒化ホウ素粉末でも使用で
きる。なかでも、六方晶系構造あるいは立方晶系構造の
高結晶化した窒化ホウ素粉末が熱伝導率が大きいので好
ましい。
【００１０】窒化ホウ素粉末の粒子形状については、鱗
片状、偏平状に限定することなく、顆粒状、塊状、球
状、繊維状、ウィスカー状、あるいはこれらの粉砕品な
ど様々な粒子形状の窒化ホウ素粉末を使用できる。窒化
ホウ素粉末の粒子径についても特定するものではないけ
れども、個々の平均一次粒子径は０.０１〜１００μｍ
の範囲、さらに好ましくは０.１〜２０μｍの範囲のも
のが使用できる。０.０１μｍよりも細かいと接着剤中
に多量に充填することが困難になり、１００μｍよりも
大きい窒化ホウ素粉末は製造しにくく価格的にも不利に
なる。また、接着層が厚くなってしまう。鱗片状の窒化
ホウ素粉末の場合には、最大径として０．５〜５０μｍ
の範囲が接着剤に配合して磁場配向させやすいので実用
的である。さらに、一次粒子が凝集した構造の窒化ホウ
素粉末が用いられる。
【００１１】接着性高分子と配合させる窒化ホウ素粉末
の量は、接着性高分子１００重量部に対して１０〜４０
０重量部が好ましい。１０重量部よりも少ないと熱伝導
性の向上効果が小さく、４００重量部を越えて含有させ
ると接着剤の粘度が増大して流動性が損なわれて取扱い
性が困難になり、かつ気泡の混入が避けられないので不
適である。さらに好ましい窒化ホウ素粉末の添加量は２
０〜３００重量部、さらに好ましくは３０〜２００重量
部である。なお、異なる粉末粒子径の窒化ホウ素粉末を
併用したり、表面処理することによって高濃度化するこ
とも可能である。
【００１２】マトリックスとなる接着性高分子として
は、エポキシ系、ポリイミド系、アクリル系、ポリ酢酸
ビニルなどのビニル系、ウレタン系、シリコーン系、オ
レフィン系、ポリアミド系、ポリアミドイミド系、フェ
ノール系、アミノ系、ビスマレイミド系、ポリイミドシ
リコーン系、飽和および不飽和ポリエステル系、ジアリ
ルフタレート系、尿素系、メラミン系、アルキッド系、
ベンゾシクロブテン系、ポリブタジエンやクロロプレン
ゴム、ニトリルゴムなどの合成ゴム系、天然ゴム系、ス
チレン系熱可塑性エラストマーなどの公知の樹脂やゴム
からなる液体状あるいは固体状の材料が好ましい。
【００１３】硬化形態については、熱硬化性、熱可塑
性、紫外線や可視光硬化性、常温硬化性、湿気硬化性な
ど公知のあらゆる硬化形態の接着性高分子を使用でき
る。なかでも、電子部品を構成する材料の各種金属やセ
ラミックス、各種プラスチックやゴム、エラストマーと
の接着性が良好なエポキシ系、ポリイミド系、アクリル
系、ウレタン系あるいはシリコーン系より選ばれる少な
くとも１種の接着性高分子が好適である。
【００１４】また、窒化ホウ素粉末の表面処理を目的と
して、窒化ホウ素粉末の表面をあらかじめ脱脂や洗浄処
理したり、シラン系、チタン系あるいはアルミニウム系
などの公知のカップリング剤で表面処理することによっ
て接着剤高分子との濡れ性を向上させたり充填性を改良
することが可能である。さらに、本発明で使用する熱伝
導性接着剤には、チキソトロピー性付与剤、分散剤、硬
化剤、硬化促進剤、遅延剤、粘着付与剤、可塑剤、難燃
剤、酸化防止剤、安定剤、着色剤など公知の添加剤を配
合することができる。
【００１５】さらに、粉末形状の金属やセラミックス、
具体的には、銀、銅、金、白金、ニッケル、炭素、グラ
ファイト、ダイヤモンド、酸化アルミニウム、酸化マグ
ネシウム、窒化アルミニウム、窒化ケイ素、炭化ケイ素
などや金属被覆樹脂などの従来の熱伝導性接着剤に使用
されている充填剤などを適宜併用することも可能であ
る。しかしながら、本発明で用いる熱伝導性接着剤は電
気絶縁性にすぐれることも特徴のひとつであり、導電性
の高い金属などの充填剤はなるべく混在させない方が好
ましい。また、接着剤の粘度を低下させるためには、揮
発性の有機溶剤や反応性可塑剤を添加すると作業性が向
上して効果的である。
【００１６】本発明の接着方法は、被着体間に、窒化ホ
ウ素粉末と接着性高分子とを配合してなる熱伝導性接着
剤を介在させ、磁場雰囲気で熱伝導性接着剤中の窒化ホ
ウ素粉末を一定方向に配向させた状態で接着させること
を特徴とする接着方法である。
【００１７】磁場雰囲気で、接着剤中の窒化ホウ素粉末
を磁力線に沿って配向させることによって、配向した窒
化ホウ素粉末の高い熱伝導性を生かして接着剤の熱伝導
性を向上させることができる。被着体の間隙方向すなわ
ち接着剤の厚み方向に鱗片状などの窒化ホウ素粉末を立
てるように揃えて配向させる場合には、厚み方向に永久
磁石や電磁石のＮ極とＳ極を対向させ磁力線の向きが所
望の窒化ホウ素粉末の配向方向に対応するように設置す
る。
【００１８】一方、接着剤の面内方向の熱伝導性を向上
させる場合には、厚み方向に対して垂直の方向に磁石の
Ｎ極とＳ極を対向させれば窒化ホウ素粉末を面内方向に
揃えて配向させることができる。あるいは、磁石のＮ極
とＮ極、またはＳ極とＳ極を厚み方向に対向させても窒
化ホウ素粉末を面内方向に揃えることができる。また、
磁石については必ずしも両側に対向させる必要はなく、
片側のみに配置した磁石によっても接着剤中の窒化ホウ
素粉末を配向させることが可能である。
【００１９】磁場発生手段としては永久磁石でも電磁石
でも差し支えないけれども、磁束密度としては０．０５
テスラ〜３０テスラの範囲が実用的な窒化ホウ素粉末の
配向が達成できる。また、本発明は磁性としては窒化ホ
ウ素粉末の非常に弱い反磁性の異方性磁化率を利用する
ので、１テスラ以上のより高磁場を用いて、窒化ホウ素
粉末を十分に配向させてから、熱硬化反応や冷却させて
マトリックスの接着性高分子を固化させて被着体を接着
させる必要がある。
【００２０】本発明で使用する熱伝導性接着剤は、接着
性高分子中に所定量の窒化ホウ素粉末を混合して均一に
分散させることによって製造することができる。混合あ
るいは混練して分散するときには、減圧あるいは加圧し
て混入した気泡を除去する公知の工程を加えることが好
ましい。
【００２１】発熱する素子と伝熱部材間に、窒化ホウ素
粉末と接着性高分子からなる熱伝導性接着剤を介在さ
せ、磁場雰囲気で熱伝導性接着剤中の窒化ホウ素粉末を
一定方向に配向させた状態で接着することによって図１
〜図４のような本発明の電子部品を製造することができ
る。
【００２２】図１はボールグリッドアレイ型半導体パッ
ケージ２と放熱器４の接着に使用したものを示す。図２
はチップサイズ型半導体パッケージ２とプリント基板１
の接着に使用したものを示す。図３はピングリッドアレ
イ型半導体パッケージ２とヒートシンク５の接着に使用
したものを示す。図４は半導体チップ８とダイパッド７
の接着に使用したものを示す。
【００２３】なお、熱伝導性接着剤は、スクリーン印
刷、パッド印刷、ディスペンサー塗布、ポッティング、
スプレー塗装などの公知の方法によって被着体間に介在
させることができる。発熱する素子としては、半導体素
子、電源あるいは光源など、伝熱部材としては、通常の
放熱器や冷却器、ヒートシンク、ヒートスプレッダー、
ダイパッド、プリント基板、冷却ファン、ヒートパイプ
あるいは筐体などが挙げられる。
【００２４】以下、実施例をあげて本発明をさらに詳細
に説明する。なお、下記の実施例、比較例の熱伝導性
は、熱抵抗値を測定することによって評価した。
【実施例１】アミノシラン系カップリング剤で処理した
六方晶系の鱗片状窒化ホウ素粉末（昭和電工株式会社製
ＵＨＰ−Ｓ１ 平均粒径１〜２μｍ）４０重量部と、
接着性高分子としてアミン系硬化剤を含むビスフェノー
ルＦ型エポキシ樹脂１００重量部を混合し、真空脱泡し
て熱伝導性接着剤Ａを調製した。
【００２５】図５（１）に記すプリント基板１に実装し
たボールグリッドアレイ型の半導体パッケージ２上に熱
伝導性接着剤Ａをディスペンサーで塗布した（図５
（２））。図５（３）のように熱伝導性接着剤Ａの上部
に放熱器１を配置して加圧し、図５（４）のように磁束
密度０．６テスラの永久磁石１１のＮ極とＳ極を対向さ
せた磁場雰囲気で３の熱伝導性接着剤Ａを加熱硬化させ
て電子部品（図５（５））を調製した。装置に通電して
６分後の熱抵抗を測定した結果、０.４８℃／Ｗであっ
た。
【００２６】
【比較例１】図５（１）に記すプリント基板１に実装し
たボールグリッドアレイ型の半導体パッケージ２上に実
施例１と同様の熱伝導性接着剤Ａをディスペンサーで塗
布した（図５（２））。図５（３）のように熱伝導性接
着剤Ａの上部に放熱器４を配置して加圧し磁場を印加せ
ずに熱伝導性接着剤Ａを加熱硬化させて電子部品（図５
（５））を調製した。装置に通電して６分後の熱抵抗を
測定した結果、０.６１℃／Ｗであった。
【００２７】
【実施例２】六方晶系の鱗片状窒化ホウ素粉末（昭和電
工株式会社製 ＵＨＰ−Ｓ１ 平均粒径１〜２μｍ）８
０重量部と、接着性高分子として付加型の液状シリコー
ンゴム（ＧＥ東芝シリコーン株式会社製 ＴＳＥ３３３
１）１００重量部を混合し、真空脱泡して熱伝導性接着
剤Ｂを調製した。実施例１と同様に図５（１）に記すプ
リント基板１に実装したボールグリッドアレイ型の半導
体パッケージ２上に熱伝導性接着剤Ｂをディスペンサー
で塗布した（図５（２））。図５（３）のように熱伝導
性接着剤Ｂの上部に放熱器１を配置して加圧し、図５
（４）のように磁束密度２テスラの電磁石１１のＮ極と
Ｓ極を対向させた磁場雰囲気で熱伝導性接着剤Ｂを加熱
硬化させて電子部品（図５（５））を調製した。装置に
通電して６分後の熱抵抗を測定した結果、０.３７℃／
Ｗであった。
【００２８】
【比較例２】図５（１）に記すプリント基板１に実装し
たボールグリッドアレイ型の半導体パッケージ２上に実
施例２と同様の熱伝導性接着剤Ｂをディスペンサーで塗
布した（図５（２））。図５（３）のように熱伝導性接
着剤Ｂの上部に放熱器１を配置して加圧し磁場を印加せ
ずに熱伝導性接着剤Ｂを加熱硬化させて電子部品（図５
（５））を調製した。装置に通電して６分後の熱抵抗を
測定した結果、０.４８℃／Ｗであった。
【００２９】
【実施例３】六方晶系の微粉状窒化ホウ素粉末（電気化
学工業株式会社製 ＳＰ−１ 平均粒径０．６μｍ）１
２０重量部と、接着性高分子として熱硬化性ポリイミド
（宇部興産株式会社製 ユピタイトＵＰＡ−８３）１０
０重量部を混合し、真空脱泡して熱伝導性接着剤Ｃを調
製した。
【００３０】図６（１）に記すリードフレーム６のダイ
パッド７上に、熱伝導性接着剤Ｃをスクリーン印刷した
（図６（１））。図６（２）のように熱伝導性接着剤Ｃ
の上部に半導体チップ８を配置して加圧し、図６（３）
のように磁束密度２テスラの電磁石１１のＮ極とＳ極を
対向させた磁場雰囲気で熱伝導性接着剤Ｃを加熱硬化さ
せた。さらにボンディングワイヤー９で半導体チップ８
の電極部とリードフレーム１１のリード部を電気的に接
続し（図６（４））、エポキシ系封止剤１０でトランス
ファーモールドして電子部品（図６（５））を製造し
た。装置に通電して６分後の熱抵抗を測定した結果、
０.２８℃／Ｗであった。
【００３１】
【比較例３】図６（１）に記すリードフレーム６のダイ
パッド７上に、実施例３と同様の熱伝導性接着剤Ｃをス
クリーン印刷した（図６（１））。図６（２）のように
熱伝導性接着剤Ｃの上部に半導体チップ８を配置して加
圧し磁場を印加せずに熱伝導性接着剤Ｃを加熱硬化させ
た。さらにボンディングワイヤー９で半導体チップ８の
電極部とリードフレーム１１のリード部を電気的に接続
し（図６（４））、エポキシ系封止剤１０でトランスフ
ァーモールドして電子部品（図６（５））を製造した。
装置に通電して６分後の熱抵抗を測定した結果、０.４
０℃／Ｗであった。
【００３２】
【発明の効果】比較例１〜比較例３に比べ、本発明の実
施例１〜実施例３の接着方法で製造される電子部品は、
熱伝導性接着剤中の窒化ホウ素粉末を磁場配向させるこ
とによって熱抵抗値が小さく熱伝導性にすぐれているこ
とがわかる。従って、本発明の接着方法によれば、発熱
量が大きい半導体パッケージとヒートシンクなどの放熱
器との接着、あるいは発熱量が大きい半導体チップとダ
イパッド部との接着などに広範囲に応用することが可能
になり、熱抵抗が小さく放熱特性にすぐれる有用な電子
部品を提供することができる。
【図面の簡単な説明】
【図１】本発明の接着方法で作製した電子部品の例
【図２】本発明の接着方法で作製した電子部品の例
【図３】本発明の接着方法で作製した電子部品の例
【図４】本発明の接着方法で作製した電子部品の例
【図５】本発明の接着方法および電子部品を示す概略図
【図６】本発明の接着方法および電子部品を示す概略図
【符号の説明】
１ プリント基板 ２ 電子部品 ３ 熱伝導性接着剤 ４ 放熱器 ５ ヒートシンク ６ リードフレーム ７ ダイパッド ８ 半導体チップ ９ ボンディングワイヤー １０ 封止剤 １１ 磁石
───────────────────────────────────────────────────── フロントページの続き (72)発明者 木村 恒久 東京都調布市柴崎２丁目18番12号エクセル ハイツ301号 (72)発明者 山登 正文 東京都八王子市南大沢５丁目７番10−302 号 Ｆターム(参考） 4J040 DF041 EC001 EF001 EH031 EK031 HA326 KA03 KA09 NA19 NA20 PA32 5F036 AA01 BC05 BD14 BD21

Claims (4)

    【特許請求の範囲】
  1. 【請求項１】被着体間に、窒化ホウ素粉末と接着性高分
    子とを配合してなる熱伝導性接着剤を介在させ、磁場雰
    囲気で熱伝導性接着剤中の窒化ホウ素粉末を一定方向に
    配向させて接着することを特徴とする接着方法
  2. 【請求項２】熱伝導性接着剤が、接着性高分子１００重
    量部に対して窒化ホウ素粉末１０〜４００重量部である
    請求項１に記載の接着方法
  3. 【請求項３】接着性高分子がエポキシ系、ポリイミド
    系、アクリル系、ウレタン系あるいはシリコーン系より
    選ばれる少なくとも１種である請求項１あるいは２に記
    載の接着方法
  4. 【請求項４】発熱する素子と伝熱部材間に、窒化ホウ素
    粉末と接着性高分子とを配合してなる熱伝導性接着剤を
    介在させ、磁場雰囲気で熱伝導性接着剤中の窒化ホウ素
    粉末を一定方向に配向させた状態で接着させた構造を特
    徴とする電子部品
JP35864799A 1999-12-17 1999-12-17 接着方法および電子部品 Expired - Fee Related JP4528397B2 (ja)

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US09/733,560 US6649012B2 (en) 1999-12-17 2000-12-08 Adhesion method and electronic component
DE60009646T DE60009646T2 (de) 1999-12-17 2000-12-14 Klebeverfahren und elektronisches Bauteil
EP00311186A EP1108766B1 (en) 1999-12-17 2000-12-14 Adhesion method and electronic component
US10/655,239 US6918983B2 (en) 1999-12-17 2003-09-04 Adhesion method and electronic component

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