HK1041557B - 一種集成電路及其製造方法 - Google Patents

一種集成電路及其製造方法

Info

Publication number
HK1041557B
HK1041557B HK02102908.5A HK02102908A HK1041557B HK 1041557 B HK1041557 B HK 1041557B HK 02102908 A HK02102908 A HK 02102908A HK 1041557 B HK1041557 B HK 1041557B
Authority
HK
Hong Kong
Prior art keywords
preparation
integrated circuit
integrated
circuit
Prior art date
Application number
HK02102908.5A
Other languages
English (en)
Other versions
HK1041557A1 (en
Inventor
小R‧J‧扎夫里爾
D‧C‧鮑曼
Original Assignee
愛特梅爾股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 愛特梅爾股份有限公司 filed Critical 愛特梅爾股份有限公司
Publication of HK1041557A1 publication Critical patent/HK1041557A1/xx
Publication of HK1041557B publication Critical patent/HK1041557B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Filters And Equalizers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
HK02102908.5A 1999-03-11 2002-04-17 一種集成電路及其製造方法 HK1041557B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/267,889 US6218729B1 (en) 1999-03-11 1999-03-11 Apparatus and method for an integrated circuit having high Q reactive components
PCT/US1999/028626 WO2000054337A1 (en) 1999-03-11 1999-12-02 Apparatus and method for an integrated circuit having high q reactive components

Publications (2)

Publication Number Publication Date
HK1041557A1 HK1041557A1 (en) 2002-07-12
HK1041557B true HK1041557B (zh) 2005-05-27

Family

ID=23020561

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102908.5A HK1041557B (zh) 1999-03-11 2002-04-17 一種集成電路及其製造方法

Country Status (11)

Country Link
US (1) US6218729B1 (zh)
EP (1) EP1166361A4 (zh)
JP (1) JP2002539612A (zh)
KR (1) KR100703642B1 (zh)
CN (1) CN1185715C (zh)
CA (1) CA2362159A1 (zh)
HK (1) HK1041557B (zh)
MY (1) MY115514A (zh)
NO (1) NO20014371L (zh)
TW (1) TW475196B (zh)
WO (1) WO2000054337A1 (zh)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3681542B2 (ja) * 1998-07-01 2005-08-10 富士通株式会社 プリント回路基板および多段バンプ用中継基板
US6310386B1 (en) * 1998-12-17 2001-10-30 Philips Electronics North America Corp. High performance chip/package inductor integration
JP3792445B2 (ja) * 1999-03-30 2006-07-05 日本特殊陶業株式会社 コンデンサ付属配線基板
JP3425573B2 (ja) * 1999-05-19 2003-07-14 Ｎｅｃエレクトロニクス株式会社 半導体装置
US6362525B1 (en) * 1999-11-09 2002-03-26 Cypress Semiconductor Corp. Circuit structure including a passive element formed within a grid array substrate and method for making the same
SE515298C2 (sv) * 1999-11-19 2001-07-09 Ericsson Telefon Ab L M Testfixtur
US6546538B1 (en) * 2000-03-10 2003-04-08 Lsi Logic Corporation Integrated circuit having on-chip capacitors for supplying power to portions of the circuit requiring high-transient peak power
US6351391B1 (en) * 2000-05-15 2002-02-26 International Business Machines Corporation Signal busses on printed board structures mounting ASIC chips with signal termination resistor devices using planar signal terminating devices
US7247932B1 (en) * 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
US6970362B1 (en) 2000-07-31 2005-11-29 Intel Corporation Electronic assemblies and systems comprising interposer with embedded capacitors
US6611419B1 (en) * 2000-07-31 2003-08-26 Intel Corporation Electronic assembly comprising substrate with embedded capacitors
US6775150B1 (en) * 2000-08-30 2004-08-10 Intel Corporation Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
US6890829B2 (en) * 2000-10-24 2005-05-10 Intel Corporation Fabrication of on-package and on-chip structure using build-up layer process
US6710433B2 (en) * 2000-11-15 2004-03-23 Skyworks Solutions, Inc. Leadless chip carrier with embedded inductor
JP3666411B2 (ja) * 2001-05-07 2005-06-29 ソニー株式会社 高周波モジュール装置
US6800947B2 (en) * 2001-06-27 2004-10-05 Intel Corporation Flexible tape electronics packaging
JPWO2003007379A1 (ja) 2001-07-12 2004-11-04 株式会社日立製作所 電子回路部品
KR20030012238A (ko) * 2001-07-31 2003-02-12 주식회사 글로텍 수동소자 내장형 패키지
US7176506B2 (en) * 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US7310039B1 (en) 2001-11-30 2007-12-18 Silicon Laboratories Inc. Surface inductor
US6800944B2 (en) * 2001-12-19 2004-10-05 Texas Instruments Incorporated Power/ground ring substrate for integrated circuits
US6724079B2 (en) * 2002-01-04 2004-04-20 Motorola, Inc. Wire bond-less electronic component for use with an external circuit and method of manufacture
EP1369922B1 (en) * 2002-06-07 2011-03-09 STMicroelectronics Srl Multilayer metal structure of supply rings having large parasitic resistance
DE10228328A1 (de) 2002-06-25 2004-01-22 Epcos Ag Elektronisches Bauelement mit einem Mehrlagensubstrat und Herstellungsverfahren
JP2007019530A (ja) * 2002-07-18 2007-01-25 Hitachi Chem Co Ltd 半導体装置および無線電子装置
US6898846B2 (en) * 2002-08-21 2005-05-31 Potomac Photonics, Inc. Method and components for manufacturing multi-layer modular electrical circuits
US20040222511A1 (en) * 2002-10-15 2004-11-11 Silicon Laboratories, Inc. Method and apparatus for electromagnetic shielding of a circuit element
US7141883B2 (en) * 2002-10-15 2006-11-28 Silicon Laboratories Inc. Integrated circuit package configuration incorporating shielded circuit element structure
US6972965B2 (en) * 2003-02-04 2005-12-06 Intel Corporation Method for integrated high Q inductors in FCGBA packages
US7754537B2 (en) * 2003-02-25 2010-07-13 Tessera, Inc. Manufacture of mountable capped chips
US20040231885A1 (en) * 2003-03-07 2004-11-25 Borland William J. Printed wiring boards having capacitors and methods of making thereof
US7274100B2 (en) * 2003-06-23 2007-09-25 International Rectifier Corporation Battery protection circuit with integrated passive components
KR101078621B1 (ko) * 2003-07-03 2011-11-01 테쎄라 테크놀로지스 아일랜드 리미티드 집적회로 디바이스를 패키징하기 위한 방법 및 장치
JP2007535123A (ja) * 2003-07-14 2007-11-29 エイブイエックス コーポレイション モジュール式電子アッセンブリーおよび製造方法
US6928726B2 (en) * 2003-07-24 2005-08-16 Motorola, Inc. Circuit board with embedded components and method of manufacture
US20050067681A1 (en) * 2003-09-26 2005-03-31 Tessera, Inc. Package having integral lens and wafer-scale fabrication method therefor
US7224056B2 (en) * 2003-09-26 2007-05-29 Tessera, Inc. Back-face and edge interconnects for lidded package
US20050139984A1 (en) * 2003-12-19 2005-06-30 Tessera, Inc. Package element and packaged chip having severable electrically conductive ties
CN1560911B (zh) * 2004-02-23 2010-05-12 威盛电子股份有限公司 电路载板的制造方法
US20050189635A1 (en) * 2004-03-01 2005-09-01 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
US7375411B2 (en) * 2004-06-03 2008-05-20 Silicon Laboratories Inc. Method and structure for forming relatively dense conductive layers
JPWO2006001505A1 (ja) * 2004-06-25 2008-04-17 イビデン株式会社 プリント配線板及びその製造方法
US7365428B2 (en) * 2004-10-22 2008-04-29 Intel Corporation Array capacitor with resistive structure
US8143095B2 (en) * 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US7286366B2 (en) * 2005-03-24 2007-10-23 Motorola, Inc. Multilayer circuit board with embedded components and method of manufacture
US20060220167A1 (en) * 2005-03-31 2006-10-05 Intel Corporation IC package with prefabricated film capacitor
US7297613B1 (en) 2005-06-09 2007-11-20 The United States Of America As Represented By The National Security Agency Method of fabricating and integrating high quality decoupling capacitors
US20060289976A1 (en) * 2005-06-23 2006-12-28 Intel Corporation Pre-patterned thin film capacitor and method for embedding same in a package substrate
JP2007059878A (ja) * 2005-07-27 2007-03-08 Seiko Epson Corp 半導体装置、及び発振器
US7501924B2 (en) * 2005-09-30 2009-03-10 Silicon Laboratories Inc. Self-shielding inductor
KR20070048330A (ko) * 2005-11-04 2007-05-09 삼성전자주식회사 칩형 전기 소자 및 이를 포함하는 표시 장치
JP2007150202A (ja) * 2005-11-30 2007-06-14 Shinko Electric Ind Co Ltd 実装基板、実装基板の製造方法、および半導体装置の製造方法
US8258599B2 (en) 2005-12-15 2012-09-04 Atmel Corporation Electronics package with an integrated circuit device having post wafer fabrication integrated passive components
US20070138628A1 (en) 2005-12-15 2007-06-21 Lam Ken M Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package
US7296735B2 (en) * 2005-12-16 2007-11-20 Ncr Corporation Media thickness sensor assembly
US7852189B2 (en) 2005-12-30 2010-12-14 Intel Corporation Packaged spiral inductor structures, processes of making same, and systems containing same
US20070190747A1 (en) * 2006-01-23 2007-08-16 Tessera Technologies Hungary Kft. Wafer level packaging to lidded chips
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US20080002460A1 (en) * 2006-03-01 2008-01-03 Tessera, Inc. Structure and method of making lidded chips
JP5087009B2 (ja) * 2006-03-06 2012-11-28 インテル・コーポレーション チップレベルの集積化高周波受動素子、その製造方法、および、それを含むシステム
US8623737B2 (en) * 2006-03-31 2014-01-07 Intel Corporation Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same
US7572709B2 (en) * 2006-06-29 2009-08-11 Intel Corporation Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
US7932590B2 (en) 2006-07-13 2011-04-26 Atmel Corporation Stacked-die electronics package with planar and three-dimensional inductor elements
US7940148B2 (en) * 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
US7646255B2 (en) * 2006-11-17 2010-01-12 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
DE102007020288B4 (de) * 2007-04-30 2013-12-12 Epcos Ag Elektrisches Bauelement
JP4853455B2 (ja) * 2007-10-17 2012-01-11 株式会社デンソー 半導体装置及び半導体装置ユニット
KR100955948B1 (ko) 2007-12-21 2010-05-03 삼성전기주식회사 다중대역 송신단 모듈 및 이의 제조 방법
JP2009231445A (ja) * 2008-03-21 2009-10-08 Toshiba Corp 半導体記憶装置
US9324700B2 (en) 2008-09-05 2016-04-26 Stats Chippac, Ltd. Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels
US8187920B2 (en) * 2009-02-20 2012-05-29 Texas Instruments Incorporated Integrated circuit micro-module
US7898068B2 (en) 2009-02-20 2011-03-01 National Semiconductor Corporation Integrated circuit micro-module
US7901981B2 (en) 2009-02-20 2011-03-08 National Semiconductor Corporation Integrated circuit micro-module
US7902661B2 (en) * 2009-02-20 2011-03-08 National Semiconductor Corporation Integrated circuit micro-module
US7901984B2 (en) * 2009-02-20 2011-03-08 National Semiconductor Corporation Integrated circuit micro-module
TWI423407B (zh) * 2009-02-20 2014-01-11 Nat Semiconductor Corp 積體電路微模組
US8058934B2 (en) 2009-06-03 2011-11-15 Qualcomm Incorporated Apparatus and method for frequency generation
JP5481987B2 (ja) * 2009-07-17 2014-04-23 富士ゼロックス株式会社 画像読み取り装置
US9450556B2 (en) 2009-10-16 2016-09-20 Avx Corporation Thin film surface mount components
JP5352437B2 (ja) * 2009-11-30 2013-11-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
FR2961345A1 (fr) * 2010-06-10 2011-12-16 St Microelectronics Tours Sas Circuit integre passif
US8648664B2 (en) 2011-09-30 2014-02-11 Silicon Laboratories Inc. Mutual inductance circuits
US20130146345A1 (en) * 2011-12-12 2013-06-13 Kazuki KAJIHARA Printed wiring board and method for manufacturing the same
CN104520996B (zh) 2012-04-30 2018-02-09 维斯普瑞公司 可编程部件的混合技术组合件
US8941212B2 (en) * 2013-02-06 2015-01-27 Taiwan Semiconductor Manufacturing Co., Ltd. Helical spiral inductor between stacking die
US9949381B2 (en) * 2013-07-15 2018-04-17 Stmicroelectronics (Grenoble 2) Sas Electronic device with at least one impedance-compensating inductor and related methods
EP3050098B1 (en) * 2013-09-27 2021-05-19 Intel Corporation Die package with superposer substrate for passive components
CN104979333A (zh) * 2015-07-15 2015-10-14 宜确半导体（苏州）有限公司 一种半导体集成电感
US20170236790A1 (en) * 2016-02-12 2017-08-17 Semtech Corporation Semiconductor Device on Leadframe with Integrated Passive Component
US11240908B2 (en) * 2018-10-29 2022-02-01 Tdk Corporation Thin film capacitor and circuit board incorporating the same
US11832391B2 (en) * 2020-09-30 2023-11-28 Qualcomm Incorporated Terminal connection routing and method the same

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0377360A (ja) * 1989-08-18 1991-04-02 Mitsubishi Electric Corp 半導体装置
JPH05335183A (ja) * 1992-05-28 1993-12-17 Murata Mfg Co Ltd 多層基板を備えた電子部品及びその製造方法
JP2960276B2 (ja) * 1992-07-30 1999-10-06 株式会社東芝 多層配線基板、この基板を用いた半導体装置及び多層配線基板の製造方法
JP3113089B2 (ja) * 1992-09-14 2000-11-27 株式会社東芝 配線基板
EP0613609A1 (en) * 1992-09-24 1994-09-07 Hughes Aircraft Company Dielectric vias within multilayer 3-dimensional structures/substrates
US5351163A (en) 1992-12-30 1994-09-27 Westinghouse Electric Corporation High Q monolithic MIM capacitor
JP3325351B2 (ja) * 1993-08-18 2002-09-17 株式会社東芝 半導体装置
DE69428181T2 (de) * 1993-12-13 2002-06-13 Matsushita Electric Ind Co Ltd Vorrichtung mit Chipgehäuse und Verfahren zu Ihrer Herstellung
JPH07193184A (ja) * 1993-12-27 1995-07-28 Fujitsu Ltd マルチチップモジュールの製造方法及びマルチチップモジュール
GB2288286A (en) * 1994-03-30 1995-10-11 Plessey Semiconductors Ltd Ball grid array arrangement
IL110431A (en) * 1994-07-25 2001-08-08 Microcomponents And Systems Lt A method of manufacturing a composite structure designed for use in electronic assemblies and the structure produced by this method
US5530288A (en) * 1994-10-12 1996-06-25 International Business Machines Corporation Passive interposer including at least one passive electronic component
US5497337A (en) 1994-10-21 1996-03-05 International Business Machines Corporation Method for designing high-Q inductors in silicon technology without expensive metalization
JPH08139269A (ja) * 1994-11-09 1996-05-31 Kyocera Corp 半導体素子収納用パッケージ
US5635761A (en) * 1994-12-14 1997-06-03 International Business Machines, Inc. Internal resistor termination in multi-chip module environments
JP3513333B2 (ja) * 1995-09-29 2004-03-31 キヤノン株式会社 多層プリント配線板およびそれを実装する電子機器
US5726485A (en) * 1996-03-13 1998-03-10 Micron Technology, Inc. Capacitor for a semiconductor device
US5811880A (en) 1996-03-28 1998-09-22 Intel Corporation Design for mounting discrete components inside an integrated circuit package for frequency governing of microprocessors
US5691568A (en) * 1996-05-31 1997-11-25 Lsi Logic Corporation Wire bondable package design with maxium electrical performance and minimum number of layers
US5861647A (en) 1996-10-02 1999-01-19 National Semiconductor Corporation VLSI capacitors and high Q VLSI inductors using metal-filled via plugs
US5805043A (en) 1996-10-02 1998-09-08 Itt Industries, Inc. High Q compact inductors for monolithic integrated circuit applications
US5811868A (en) 1996-12-20 1998-09-22 International Business Machines Corp. Integrated high-performance decoupling capacitor
US5839184A (en) 1997-07-10 1998-11-24 Vlsi Technology, Inc. Method for creating on-package inductors for use with integrated circuits

Also Published As

Publication number Publication date
EP1166361A4 (en) 2004-07-21
NO20014371D0 (no) 2001-09-07
KR20010108329A (ko) 2001-12-07
KR100703642B1 (ko) 2007-04-05
MY115514A (en) 2003-06-30
HK1041557A1 (en) 2002-07-12
CN1338119A (zh) 2002-02-27
NO20014371L (no) 2001-09-07
WO2000054337A1 (en) 2000-09-14
TW475196B (en) 2002-02-01
CN1185715C (zh) 2005-01-19
EP1166361A1 (en) 2002-01-02
CA2362159A1 (en) 2000-09-14
US6218729B1 (en) 2001-04-17
JP2002539612A (ja) 2002-11-19

Similar Documents

Publication Publication Date Title
HK1041557B (zh) 一種集成電路及其製造方法
IL147177A0 (en) Method of modifying an integrated circuit
EP1220503A4 (en) ACQUISITION PROCESS AND CIRCUIT
GB0005006D0 (en) Complementary integrated circuit and method of manufacture
EP1330151A4 (en) DEVICE AND METHOD FOR MOUNTING PARTS
HK1109248A1 (en) Semiconductor integrated circuit and method for designing semiconductor integrated circuit
EP1250663A4 (en) INDICATION SYSTEM AND METHOD
IL133453A0 (en) Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
HK1047488A1 (zh) 管理電子促銷的方法和系統
SG89341A1 (en) Interpolation method and circuit
EP1231829A4 (en) COMPONENT ASSEMBLY AND METHOD
EP1231828A4 (en) COMPONENT ASSEMBLY DEVICE AND METHOD
SG90177A1 (en) Apparatus and method for handling an integrated circuit
GB0304664D0 (en) System and method for testing integrated circuit devices
GB0110041D0 (en) Complementary integrated circuit and method of manufacture
HK1053012A1 (en) Semiconductor device and forming method thereof
EP1227711A4 (en) COMPONENT ASSEMBLY METHOD AND DEVICE
GB2339502B (en) An integrated circuit device
GB2350497B (en) Method and apparatus for interconnecting electrical circuits and components
SG88765A1 (en) Method for forming an integrated circuit
EP1194029A4 (en) COMPONENTS FITTING DEVICE AND METHOD
EP1089145A4 (en) ELECTRONIC DEVICE, DEVICE FOR EXTERNALLY ADJUSTING ELECTRONIC DEVICE AND METHOD FOR ADJUSTING ELECTRONIC DEVICE
EP1237099A4 (en) IP-BASED LSI DESIGN SYSTEM AND DESIGN METHOD THEREOF
EP1227668A4 (en) METHOD AND CIRCUIT FOR HIGHLIGHTING CONTOURS
AU2246901A (en) Method and apparatus for building an integrated circuit

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20081202