JP5087009B2 - チップレベルの集積化高周波受動素子、その製造方法、および、それを含むシステム - Google Patents
チップレベルの集積化高周波受動素子、その製造方法、および、それを含むシステム Download PDFInfo
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Description
Claims (18)
- 活性表面および裏側表面を含むダイと、
前記裏側表面上に配置される誘電層と、
前記誘電層に隣接して配置された取付基板と、
前記取付基板内に配置される少なくとも1つの高周波受動素子(RF受動素子)と、
前記活性表面と前記少なくとも1つのRF受動素子との間の電気的接続と、
を備える装置。 - 前記電気的接続は、前記ダイを貫通するダイ貫通相互接続を含む、請求項1に記載の装置。
- 前記誘電層は、酸化物、オキシナイトライド、炭化物、硫化物、オキシサルファイド、ホウ化物、ボロナイトライド、有機物、および、それらの組み合わせから選択される、請求項1または請求項2に記載の装置。
- 前記RF受動素子は、スパイラルインダクタ、ヘリカルインダクタ、および、それらの組み合わせから選択されるインダクタを含む、請求項1から請求項3のいずれか1つに記載の装置。
- 前記RF受動素子は、二電極式薄膜コンデンサ、インターデジタルコンデンサ、および、それらの組み合わせから選択されるコンデンサを含む、請求項1から請求項3のいずれか1つに記載の装置。
- 前記RF受動素子は、金属抵抗器、ダイオード、および、それらの組み合わせから選択される抵抗器を含む、請求項1から請求項3のいずれか1つに記載の装置。
- 前記RF受動素子は、インダクタ、コンデンサ、および、抵抗器の少なくとも2つを含む、請求項1から請求項3のいずれか1つに記載の装置。
- 前記電気的接続は、ダイ貫通相互接続であり、前記ダイは、ダイ端部およびダイ中心部を有し、前記ダイ貫通相互接続は、前記ダイ中心部より前記ダイ端部の近くに配置される、請求項1から請求項7のいずれか1つに記載の装置。
- 前記電気的接続は、ダイ貫通相互接続であり、前記ダイは、ダイ端部およびダイ中心部を有し、前記ダイ貫通相互接続は、前記ダイ端部より前記ダイ中心部の近くに配置される、請求項1から請求項7のいずれか1つに記載の装置。
- 前記ダイは、ワイヤボンドおよびフリップチップから選択される構成により前記取付基板に配置される、請求項1から請求項9のいずれか1つに記載の装置。
- 活性表面および裏側表面を含むウェーハの前記裏側表面に誘電層を形成することと、
前記ウェーハをダイシングして少なくとも1つのダイを得ることと、
取付基板に前記ダイを結合すること
を含み、
前記取付基板は、前記活性表面と電気的に接続された高周波受動素子含有層(RF受動素子含有層)を含み、前記誘電層は、前記ダイの前記活性表面と前記RF受動素子含有層との間に配置される、
方法。 - 活性表面および裏側表面を含むウェーハの前記裏側表面に誘電層を形成することと、
前記ウェーハ内にダイ貫通ビアを形成することと、
前記ウェーハをダイシングして少なくとも1つのダイを得ることと、
高周波受動素子含有層(RF受動素子含有層)を含む取付基板に前記ダイを結合することと、
前記ダイ貫通ビアを介し、前記ウェーハの前記活性表面と前記RF受動素子含有層とを接続することと、
を含み、前記誘電層は、前記ダイの前記活性表面と前記RF受動素子含有層との間に配置される、方法。 - 前記取付基板は、前記RF受動素子含有層で前記ダイを受け入れる、請求項11または請求項12に記載の方法。
- 相互接続を用いてダイ貫通ビアを貫通して結合すること、ワイヤボンディングにより結合すること、および、それらの組み合わせにより結合することから選択される方法により、前記ダイを前記RF受動素子含有層に結合することと、
をさらに含む、請求項11から請求項13のいずれか1つに記載の方法。 - 前記ウェーハをダイシングすることにより少なくとも1つのダイを得ることは、ダイ端部およびダイ中心部を含む前記少なくとも1つのダイをもたらし、
前記方法は、相互接続およびダイ貫通ビアを用いることにより、前記ダイを前記RF受動素子含有層に結合させることをさらに含み、
前記ダイ貫通ビアは、前記ダイ端部より前記ダイ中心部の近くに配置される、
請求項11から請求項13のいずれか1つに記載の方法。 - 活性表面および裏側表面を含むダイと、
前記裏側表面に配置される誘電層と、
前記誘電層に隣接して配置される取付基板と、
前記取付基板内に配置される少なくとも1つの高周波受動素子(RF受動素子)と、
前記活性表面と前記少なくとも1つのRF受動素子との間の電気的接続と、
前記ダイに結合されるダイナミックRAMと、
を備えるシステム。 - 前記システムは、コンピュータ、無線通信機、ハンドヘルドデバイス、自動車、機関車、航空機、船、および、宇宙船の中の1つに配置される、請求項16に記載のシステム。
- 前記ダイは、データ記憶装置、デジタル信号プロセッサ、マイクロコントローラ、特定用途向けIC、および、マイクロプロセッサから選択される、請求項16または請求項17に記載のシステム。
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PCT/CN2006/000335 WO2007101364A1 (en) | 2006-03-06 | 2006-03-06 | Chip-level integrated radio frequency passive devices, methods of making same, and systems containing same |
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JP5087009B2 true JP5087009B2 (ja) | 2012-11-28 |
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CN (1) | CN101336477B (ja) |
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WO2011155946A1 (en) * | 2010-06-11 | 2011-12-15 | Premitec, Inc. | Flexible electronic devices and related methods |
KR102311084B1 (ko) * | 2014-08-07 | 2021-10-12 | 인텔 코포레이션 | 패시브 평면형 디바이스를 갖는 rf 회로 장치 및 패시브 평면형 디바이스를 갖는 rf 회로 시스템 |
US11264361B2 (en) * | 2019-06-05 | 2022-03-01 | Invensas Corporation | Network on layer enabled architectures |
CN113257808B (zh) * | 2021-05-17 | 2023-04-07 | 成都挚信电子技术有限责任公司 | 一种芯片衬底外延片 |
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JPS5645069A (en) | 1979-09-20 | 1981-04-24 | Nec Corp | Hybrid integrated circuit device |
JPH0621348A (ja) * | 1991-06-22 | 1994-01-28 | Nec Corp | 半導体素子 |
US5874770A (en) | 1996-10-10 | 1999-02-23 | General Electric Company | Flexible interconnect film including resistor and capacitor layers |
CN1166014C (zh) * | 1996-11-15 | 2004-09-08 | 凌沛清(音译) | 半导体芯片上的电感的结构及其制造方法 |
JPH10321757A (ja) * | 1997-05-22 | 1998-12-04 | Saitama Nippon Denki Kk | 電子回路モジュール |
US6303423B1 (en) * | 1998-12-21 | 2001-10-16 | Megic Corporation | Method for forming high performance system-on-chip using post passivation process |
US6377464B1 (en) * | 1999-01-29 | 2002-04-23 | Conexant Systems, Inc. | Multiple chip module with integrated RF capabilities |
US6218729B1 (en) * | 1999-03-11 | 2001-04-17 | Atmel Corporation | Apparatus and method for an integrated circuit having high Q reactive components |
JP3360655B2 (ja) * | 1999-07-08 | 2002-12-24 | 日本電気株式会社 | 半導体装置 |
JP2001185685A (ja) * | 1999-12-24 | 2001-07-06 | Toshiba Corp | 半導体装置 |
US6180445B1 (en) * | 2000-04-24 | 2001-01-30 | Taiwan Semiconductor Manufacturing Company | Method to fabricate high Q inductor by redistribution layer when flip-chip package is employed |
FR2832855A1 (fr) | 2001-11-27 | 2003-05-30 | St Microelectronics Sa | Circuit monolithique double face |
JP4016340B2 (ja) * | 2003-06-13 | 2007-12-05 | ソニー株式会社 | 半導体装置及びその実装構造、並びにその製造方法 |
JP4290158B2 (ja) * | 2004-12-20 | 2009-07-01 | 三洋電機株式会社 | 半導体装置 |
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DE112006003771T5 (de) | 2009-02-19 |
JP2009524917A (ja) | 2009-07-02 |
WO2007101364A1 (en) | 2007-09-13 |
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