FR2742687B1 - Procede de fourniture de soudure, appareil de fourniture de soudure et procede de soudage - Google Patents
Procede de fourniture de soudure, appareil de fourniture de soudure et procede de soudageInfo
- Publication number
- FR2742687B1 FR2742687B1 FR9615900A FR9615900A FR2742687B1 FR 2742687 B1 FR2742687 B1 FR 2742687B1 FR 9615900 A FR9615900 A FR 9615900A FR 9615900 A FR9615900 A FR 9615900A FR 2742687 B1 FR2742687 B1 FR 2742687B1
- Authority
- FR
- France
- Prior art keywords
- welding
- solder paste
- holes
- supporting member
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33756395 | 1995-12-25 | ||
JP24582496A JP3385872B2 (ja) | 1995-12-25 | 1996-09-18 | はんだ供給法およびはんだ供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2742687A1 FR2742687A1 (fr) | 1997-06-27 |
FR2742687B1 true FR2742687B1 (fr) | 1999-03-05 |
Family
ID=26537424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9615900A Expired - Fee Related FR2742687B1 (fr) | 1995-12-25 | 1996-12-23 | Procede de fourniture de soudure, appareil de fourniture de soudure et procede de soudage |
Country Status (4)
Country | Link |
---|---|
US (1) | US5950908A (fr) |
JP (1) | JP3385872B2 (fr) |
DE (1) | DE19653499B4 (fr) |
FR (1) | FR2742687B1 (fr) |
Families Citing this family (54)
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WO1997012718A1 (fr) * | 1995-10-06 | 1997-04-10 | Brown University Research Foundation | Procedes et compositions pour brasage |
JP3401391B2 (ja) * | 1996-04-16 | 2003-04-28 | 日本特殊陶業株式会社 | 半田バンプを有する基板の製造方法 |
US5924622A (en) * | 1996-07-17 | 1999-07-20 | International Business Machines Corp. | Method and apparatus for soldering ball grid array modules to substrates |
US7819301B2 (en) | 1997-05-27 | 2010-10-26 | Wstp, Llc | Bumping electronic components using transfer substrates |
US6609652B2 (en) | 1997-05-27 | 2003-08-26 | Spheretek, Llc | Ball bumping substrates, particuarly wafers |
US7654432B2 (en) * | 1997-05-27 | 2010-02-02 | Wstp, Llc | Forming solder balls on substrates |
US7842599B2 (en) * | 1997-05-27 | 2010-11-30 | Wstp, Llc | Bumping electronic components using transfer substrates |
US6293456B1 (en) * | 1997-05-27 | 2001-09-25 | Spheretek, Llc | Methods for forming solder balls on substrates |
US7288471B2 (en) * | 1997-05-27 | 2007-10-30 | Mackay John | Bumping electronic components using transfer substrates |
US7007833B2 (en) | 1997-05-27 | 2006-03-07 | Mackay John | Forming solder balls on substrates |
US6105852A (en) * | 1998-02-05 | 2000-08-22 | International Business Machines Corporation | Etched glass solder bump transfer for flip chip integrated circuit devices |
JP3481117B2 (ja) * | 1998-02-25 | 2003-12-22 | 富士通株式会社 | 半導体装置及びその製造方法 |
US6406988B1 (en) * | 1998-04-24 | 2002-06-18 | Amerasia International Technology, Inc. | Method of forming fine pitch interconnections employing magnetic masks |
US6153505A (en) * | 1998-04-27 | 2000-11-28 | International Business Machines Corporation | Plastic solder array using injection molded solder |
US6189772B1 (en) * | 1998-08-31 | 2001-02-20 | Micron Technology, Inc. | Method of forming a solder ball |
JP3565047B2 (ja) * | 1998-10-07 | 2004-09-15 | 松下電器産業株式会社 | 半田バンプの形成方法および半田バンプの実装方法 |
US6426564B1 (en) * | 1999-02-24 | 2002-07-30 | Micron Technology, Inc. | Recessed tape and method for forming a BGA assembly |
DE19923805C2 (de) * | 1999-05-19 | 2002-04-04 | Siemens Ag | Verfahren zum Erzeugen von Lotkontakten für elektrische Bauelemente |
JP3303849B2 (ja) | 1999-06-10 | 2002-07-22 | 日本電気株式会社 | バンプ転写基板の製造方法、並びに半導体装置の製造方法及び半導体装置 |
JP2001044607A (ja) * | 1999-07-30 | 2001-02-16 | Fuji Mach Mfg Co Ltd | 半田バンプ形成方法および装置 |
JP3239335B2 (ja) * | 1999-08-18 | 2001-12-17 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 電気的接続用構造体の形成方法およびはんだ転写用基板 |
US6295730B1 (en) * | 1999-09-02 | 2001-10-02 | Micron Technology, Inc. | Method and apparatus for forming metal contacts on a substrate |
US7156361B1 (en) | 1999-09-02 | 2007-01-02 | Micron Technology, Inc. | Method and apparatus for forming metal contacts on a substrate |
US6329631B1 (en) * | 1999-09-07 | 2001-12-11 | Ray Yueh | Solder strip exclusively for semiconductor packaging |
DE10084996T1 (de) * | 1999-09-20 | 2002-11-07 | Nas Interplex Ind Inc | Lottragender Wafer zur Verwendung bei Lötvorgängen |
US6142361A (en) * | 1999-12-09 | 2000-11-07 | International Business Machines Corporation | Chip C4 assembly improvement using magnetic force and adhesive |
US6659334B2 (en) * | 2000-09-21 | 2003-12-09 | Murata Manufacturing Co., Ltd. | Method for forming end-face electrode |
JP3859963B2 (ja) * | 2000-11-29 | 2006-12-20 | シャープ株式会社 | 半導体装置及びその製造方法 |
WO2002090502A2 (fr) * | 2001-05-08 | 2002-11-14 | The Texas A & M University System | Proteines de surface issues de bacteries gram positif comportant des motifs fortement conserves et anticorps reconnaissant ces motifs |
US20040134976A1 (en) * | 2003-01-14 | 2004-07-15 | Frank Keyser | Method and system for solder connecting electrical devices |
DE10332573B4 (de) * | 2003-07-14 | 2007-08-16 | Siemens Ag | Verfahren zum Erzeugen von Lotkontakten auf Bauelementen |
KR100642746B1 (ko) * | 2004-02-06 | 2006-11-10 | 삼성전자주식회사 | 멀티 스택 패키지의 제조방법 |
DE102004017772A1 (de) * | 2004-04-13 | 2005-11-03 | Seho Systemtechnik Gmbh | Verfahren zum Reflow-Löten |
DE102004041026A1 (de) * | 2004-08-25 | 2005-11-03 | Infineon Technologies Ag | Verfahren zur Herstellung eines oder mehrerer Kontakthügel auf einer Substratscheibe |
US20070175562A1 (en) * | 2006-02-01 | 2007-08-02 | Sierra Madre Marketing Group | Lock and key bonding system |
CN100438008C (zh) * | 2006-03-01 | 2008-11-26 | 南茂科技股份有限公司 | 高频集成电路封装构造及其制造方法 |
JP5002587B2 (ja) * | 2006-03-28 | 2012-08-15 | パナソニック株式会社 | バンプ形成方法およびバンプ形成装置 |
DE102006024213A1 (de) * | 2006-05-23 | 2007-11-29 | Infineon Technologies Ag | Verfahren zum Herstellen eines Bausteins mit einer elektrischen Kontaktierung |
CN101512723A (zh) * | 2006-09-01 | 2009-08-19 | 欧瑞康封装设备有限公司施泰因豪森 | 以液体物质润湿半导体芯片凸块的装置 |
US7348270B1 (en) * | 2007-01-22 | 2008-03-25 | International Business Machines Corporation | Techniques for forming interconnects |
KR100871034B1 (ko) * | 2007-06-12 | 2008-11-27 | 삼성전기주식회사 | 인쇄회로기판의 페이스트 범프 형성 방법 |
KR101408731B1 (ko) * | 2008-01-07 | 2014-06-17 | 세메스 주식회사 | 솔더 범퍼 형성용 템플레이트 및 솔더 범퍼 형성 방법 |
US9498837B2 (en) | 2009-09-01 | 2016-11-22 | International Business Machines Corporation | Vacuum transition for solder bump mold filling |
JP2012164855A (ja) * | 2011-02-08 | 2012-08-30 | Denso Corp | 電子装置の製造方法 |
CN202277943U (zh) * | 2011-10-31 | 2012-06-20 | 华为终端有限公司 | 芯片凸块的蘸涂送料装置 |
US8534533B2 (en) * | 2012-01-19 | 2013-09-17 | Raytheon Company | Solder paste transfer process |
US8770462B2 (en) | 2012-03-14 | 2014-07-08 | Raytheon Company | Solder paste transfer process |
JP6051437B2 (ja) * | 2012-06-12 | 2016-12-27 | 株式会社弘輝 | レーザー加熱工法による電子デバイスの製造方法 |
US9790598B2 (en) * | 2013-08-22 | 2017-10-17 | Sikorsky Aircraft Corporation | Removable mask for coating a substrate |
TW201508848A (zh) * | 2013-08-23 | 2015-03-01 | Chipmos Technologies Inc | 一種植球裝置及其植球方法 |
JP6225193B2 (ja) * | 2013-10-08 | 2017-11-01 | リンテック株式会社 | 電子部品実装体の製造方法 |
US9679862B2 (en) * | 2014-11-28 | 2017-06-13 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device having conductive bumps of varying heights |
EP3499554A1 (fr) * | 2017-12-13 | 2019-06-19 | Heraeus Deutschland GmbH & Co. KG | Procédé de fabrication d'un agencement en sandwich de deux composants avec de la soudure placée entre lesdits composants par thermocompression au-dessous de la température de fusion de la soudure d'une préforme de soudure |
DE102021117131A1 (de) | 2021-07-02 | 2023-01-05 | Lisa Dräxlmaier GmbH | Leiterplatte und verfahren zum prozesssicheren auflöten eines chipgehäuses |
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US4720402A (en) * | 1987-01-30 | 1988-01-19 | American Telephone And Telegraph Company | Method for dispensing viscous material |
JPH01200641A (ja) * | 1988-02-05 | 1989-08-11 | Hitachi Ltd | はんだキヤリア |
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JPH0429338A (ja) * | 1990-05-24 | 1992-01-31 | Nippon Mektron Ltd | Icの搭載用回路基板及びその搭載方法 |
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JPH0779116B2 (ja) * | 1993-03-16 | 1995-08-23 | 日本電気株式会社 | ベアチップ型半導体装置の実装方法 |
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JPH07221104A (ja) * | 1994-01-28 | 1995-08-18 | Fujitsu Ltd | 半導体装置の製造方法及び半導体装置及び電極ピン形成用マスク及び電極ピン形成用マスクを用いた試験方法 |
JP3173547B2 (ja) * | 1994-03-18 | 2001-06-04 | 松下電器産業株式会社 | 半田バンプの形成方法 |
JPH07297196A (ja) * | 1994-04-25 | 1995-11-10 | Sony Corp | バンプ電極の形成方法 |
TW336371B (en) * | 1995-07-13 | 1998-07-11 | Motorola Inc | Method for forming bumps on a substrate the invention relates to a method for forming bumps on a substrate |
US5775569A (en) * | 1996-10-31 | 1998-07-07 | Ibm Corporation | Method for building interconnect structures by injection molded solder and structures built |
-
1996
- 1996-09-18 JP JP24582496A patent/JP3385872B2/ja not_active Expired - Lifetime
- 1996-12-18 US US08/768,395 patent/US5950908A/en not_active Expired - Lifetime
- 1996-12-20 DE DE19653499A patent/DE19653499B4/de not_active Expired - Fee Related
- 1996-12-23 FR FR9615900A patent/FR2742687B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5950908A (en) | 1999-09-14 |
DE19653499B4 (de) | 2010-04-29 |
DE19653499A1 (de) | 1997-06-26 |
FR2742687A1 (fr) | 1997-06-27 |
JPH09237963A (ja) | 1997-09-09 |
JP3385872B2 (ja) | 2003-03-10 |
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Effective date: 20120831 |