FI70348C - Ledarram - Google Patents

Ledarram Download PDF

Info

Publication number
FI70348C
FI70348C FI800397A FI800397A FI70348C FI 70348 C FI70348 C FI 70348C FI 800397 A FI800397 A FI 800397A FI 800397 A FI800397 A FI 800397A FI 70348 C FI70348 C FI 70348C
Authority
FI
Finland
Prior art keywords
conductors
conductor
support part
chip
frame
Prior art date
Application number
FI800397A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI800397A (fi
FI70348B (fi
Inventor
Dimitry G Grabbe
Ronald Patterson
Original Assignee
Amp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Inc filed Critical Amp Inc
Publication of FI800397A publication Critical patent/FI800397A/fi
Application granted granted Critical
Publication of FI70348B publication Critical patent/FI70348B/fi
Publication of FI70348C publication Critical patent/FI70348C/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Transceivers (AREA)
FI800397A 1979-02-23 1980-02-08 Ledarram FI70348C (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/014,397 US4195193A (en) 1979-02-23 1979-02-23 Lead frame and chip carrier housing
US1439779 1979-02-23

Publications (3)

Publication Number Publication Date
FI800397A FI800397A (fi) 1980-08-24
FI70348B FI70348B (fi) 1986-02-28
FI70348C true FI70348C (fi) 1986-09-15

Family

ID=21765252

Family Applications (1)

Application Number Title Priority Date Filing Date
FI800397A FI70348C (fi) 1979-02-23 1980-02-08 Ledarram

Country Status (18)

Country Link
US (1) US4195193A (es)
EP (1) EP0015111B1 (es)
JP (1) JPS55117263A (es)
AR (1) AR220032A1 (es)
AT (1) ATE2034T1 (es)
AU (1) AU528043B2 (es)
BR (1) BR8000587A (es)
CA (1) CA1127319A (es)
DE (1) DE3061294D1 (es)
DK (1) DK155260C (es)
ES (1) ES8103478A1 (es)
FI (1) FI70348C (es)
HK (1) HK4685A (es)
IL (1) IL59455A (es)
MX (1) MX147540A (es)
NO (1) NO154363C (es)
NZ (1) NZ192695A (es)
SG (1) SG44684G (es)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3535863A (en) * 1968-01-15 1970-10-27 Hugh Albert Caughlin Swath separator
US4303934A (en) * 1979-08-30 1981-12-01 Burr-Brown Research Corp. Molded lead frame dual in line package including a hybrid circuit
US4338621A (en) * 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
WO1982001803A1 (en) * 1980-11-07 1982-05-27 Mulholland Wayne A Multiple terminal two conductor layer burn-in tape
US4330683A (en) * 1980-12-03 1982-05-18 Bell Telephone Laboratories, Incorporated Encapsulation for semiconductor device
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
WO1982002458A1 (en) * 1981-01-15 1982-07-22 Link Joseph Integrated circuit package
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
US4445271A (en) * 1981-08-14 1984-05-01 Amp Incorporated Ceramic chip carrier with removable lead frame support and preforated ground pad
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
US4465898A (en) * 1981-07-27 1984-08-14 Texas Instruments Incorporated Carrier for integrated circuit
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
US4463217A (en) * 1981-09-14 1984-07-31 Texas Instruments Incorporated Plastic surface mounted high pinout integrated circuit package
DE3303165C2 (de) * 1982-02-05 1993-12-09 Hitachi Ltd Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置
US4445736A (en) * 1982-03-31 1984-05-01 Amp Incorporated Method and apparatus for producing a premolded packaging
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4736520A (en) * 1983-11-04 1988-04-12 Control Data Corporation Process for assembling integrated circuit packages
US4560826A (en) * 1983-12-29 1985-12-24 Amp Incorporated Hermetically sealed chip carrier
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip
US4895536A (en) * 1984-05-11 1990-01-23 Amp Incorporated Lead frame assembly having severable electrical circuit sections
EP0164794B1 (en) * 1984-06-14 1990-07-25 Advanced Micro Devices, Inc. Multi-layer heat sinking integrated circuit package
US4654693A (en) * 1984-08-28 1987-03-31 Matsushita Electric Industrial Co., Ltd. Electronic parts carrier with a chip-supporting top tape
JPS628639U (es) * 1985-06-28 1987-01-19
JPH034045Y2 (es) * 1985-07-05 1991-02-01
JPS6212959U (es) * 1985-07-06 1987-01-26
EP0218796B1 (en) * 1985-08-16 1990-10-31 Dai-Ichi Seiko Co. Ltd. Semiconductor device comprising a plug-in-type package
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4657172A (en) * 1985-10-31 1987-04-14 American Microsystems, Inc. Apparatus and method of solder coating integrated circuit leads
JPS62122159A (ja) * 1985-11-21 1987-06-03 Yamada Seisakusho:Kk 外部リ−ドの成形方法
US4706811A (en) * 1986-03-03 1987-11-17 General Motors Corporation Surface mount package for encapsulated tape automated bonding integrated circuit modules
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
JPH0766952B2 (ja) * 1986-05-14 1995-07-19 三菱電機株式会社 混成集積回路装置
US5152057A (en) * 1987-11-17 1992-10-06 Mold-Pac Corporation Molded integrated circuit package
US5438481A (en) * 1987-11-17 1995-08-01 Advanced Interconnections Corporation Molded-in lead frames
US5184285A (en) * 1987-11-17 1993-02-02 Advanced Interconnections Corporation Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor
US5168432A (en) * 1987-11-17 1992-12-01 Advanced Interconnections Corporation Adapter for connection of an integrated circuit package to a circuit board
US4906802A (en) * 1988-02-18 1990-03-06 Neal Castleman Molded chip carrier
US4829669A (en) * 1988-04-28 1989-05-16 Nec Corporation Method of manufacturing a chip carrier
US4967260A (en) * 1988-05-04 1990-10-30 International Electronic Research Corp. Hermetic microminiature packages
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5168345A (en) * 1990-08-15 1992-12-01 Lsi Logic Corporation Semiconductor device having a universal die size inner lead layout
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5213748A (en) * 1991-06-27 1993-05-25 At&T Bell Laboratories Method of molding a thermoplastic ring onto a leadframe
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5177669A (en) * 1992-03-02 1993-01-05 Motorola, Inc. Molded ring integrated circuit package
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
JPH07176677A (ja) * 1993-08-31 1995-07-14 Texas Instr Inc <Ti> 低コストリードフレームの設計及び製造方法
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5827999A (en) * 1994-05-26 1998-10-27 Amkor Electronics, Inc. Homogeneous chip carrier package
US5650593A (en) * 1994-05-26 1997-07-22 Amkor Electronics, Inc. Thermally enhanced chip carrier package
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
JP3870301B2 (ja) * 1996-06-11 2007-01-17 ヤマハ株式会社 半導体装置の組立法、半導体装置及び半導体装置の連続組立システム
US5938038A (en) * 1996-08-02 1999-08-17 Dial Tool Industries, Inc. Parts carrier strip and apparatus for assembling parts in such a strip
US5892178A (en) * 1997-03-20 1999-04-06 Qualcomm Incorporated Support fixture for control panel assembly
US6016918A (en) * 1998-08-18 2000-01-25 Dial Tool Industries, Inc. Part carrier strip
JP3819728B2 (ja) * 2001-04-13 2006-09-13 三洋電機株式会社 リードフレームを具えた電子部品
US7090362B2 (en) * 2001-11-09 2006-08-15 Carl Zeiss Smt Ag Facet mirror having a number of mirror facets
ATE464585T1 (de) 2002-02-09 2010-04-15 Zeiss Carl Smt Ag Facettenspiegel mit mehreren spiegelfacetten
JP3867639B2 (ja) * 2002-07-31 2007-01-10 株式会社デンソー 混成集積回路装置
TW560755U (en) * 2002-11-27 2003-11-01 Hon Hai Prec Ind Co Ltd Hard tray for electrical connectors
US6907659B2 (en) * 2003-02-05 2005-06-21 Advanced Connection Technology Inc. Method for manufacturing and packaging integrated circuit
JP3938067B2 (ja) * 2003-02-18 2007-06-27 株式会社日立製作所 電子回路装置
DE102005035083B4 (de) * 2004-07-24 2007-08-23 Samsung Electronics Co., Ltd., Suwon Bondverbindungssystem, Halbleiterbauelementpackung und Drahtbondverfahren
KR100642748B1 (ko) 2004-07-24 2006-11-10 삼성전자주식회사 리드 프레임과 패키지 기판 및 이들을 이용한 패키지
US20080054490A1 (en) * 2006-08-31 2008-03-06 Ati Technologies Inc. Flip-Chip Ball Grid Array Strip and Package
US7993092B2 (en) * 2007-08-14 2011-08-09 Samsung Electronics Co., Ltd. Moving carrier for lead frame and method of moving lead frame using the moving carrier
US8946875B2 (en) 2012-01-20 2015-02-03 Intersil Americas LLC Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems
US8796052B2 (en) 2012-02-24 2014-08-05 Intersil Americas LLC Optoelectronic apparatuses with post-molded reflector cups and methods for manufacturing the same
US9754861B2 (en) 2014-10-10 2017-09-05 Stmicroelectronics Pte Ltd Patterned lead frame
TWM532101U (zh) * 2016-02-24 2016-11-11 英屬開曼群島商鴻騰精密科技股份有限公司 一種電連接器組合及其支撐件
US10109563B2 (en) 2017-01-05 2018-10-23 Stmicroelectronics, Inc. Modified leadframe design with adhesive overflow recesses

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676748A (en) * 1970-04-01 1972-07-11 Fuji Electrochemical Co Ltd Frame structures for electronic circuits
US3716761A (en) * 1972-05-03 1973-02-13 Microsystems Int Ltd Universal interconnection structure for microelectronic devices
US4012766A (en) * 1973-08-28 1977-03-15 Western Digital Corporation Semiconductor package and method of manufacture thereof
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4105861A (en) * 1975-09-29 1978-08-08 Semi-Alloys, Inc. Hermetically sealed container for semiconductor and other electronic devices
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4142287A (en) * 1976-12-27 1979-03-06 Amp Incorporated Electrical devices such as watches and method of construction thereof

Also Published As

Publication number Publication date
ES488758A0 (es) 1981-02-16
ES8103478A1 (es) 1981-02-16
EP0015111A1 (en) 1980-09-03
JPS55117263A (en) 1980-09-09
CA1127319A (en) 1982-07-06
MX147540A (es) 1982-12-13
FI800397A (fi) 1980-08-24
ATE2034T1 (de) 1982-12-15
US4195193A (en) 1980-03-25
JPH026225B2 (es) 1990-02-08
AR220032A1 (es) 1980-09-30
HK4685A (en) 1985-01-25
SG44684G (en) 1985-03-08
NO154363B (no) 1986-05-26
EP0015111B1 (en) 1982-12-15
DE3061294D1 (en) 1983-01-20
NO800226L (no) 1980-08-25
NZ192695A (en) 1982-08-17
AU528043B2 (en) 1983-04-14
IL59455A (en) 1982-07-30
BR8000587A (pt) 1980-10-21
AU5504780A (en) 1980-08-28
NO154363C (no) 1986-09-03
DK76580A (da) 1980-08-24
FI70348B (fi) 1986-02-28
DK155260C (da) 1989-07-24
DK155260B (da) 1989-03-13

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Legal Events

Date Code Title Description
MM Patent lapsed
MM Patent lapsed

Owner name: AMP INCORPORATED