EP1550912A4 - METHOD FOR REMOVING PHOTORESIST - Google Patents

METHOD FOR REMOVING PHOTORESIST

Info

Publication number
EP1550912A4
EP1550912A4 EP03720958A EP03720958A EP1550912A4 EP 1550912 A4 EP1550912 A4 EP 1550912A4 EP 03720958 A EP03720958 A EP 03720958A EP 03720958 A EP03720958 A EP 03720958A EP 1550912 A4 EP1550912 A4 EP 1550912A4
Authority
EP
European Patent Office
Prior art keywords
removing photoresist
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03720958A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1550912A1 (en
Inventor
Shigeru Yokoi
Kazumasa Wakiya
Takayuki Haraguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of EP1550912A1 publication Critical patent/EP1550912A1/en
Publication of EP1550912A4 publication Critical patent/EP1550912A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
EP03720958A 2002-04-26 2003-04-25 METHOD FOR REMOVING PHOTORESIST Withdrawn EP1550912A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002125471 2002-04-26
JP2002125471 2002-04-26
JP2002308993 2002-10-23
JP2002308993A JP3516446B2 (ja) 2002-04-26 2002-10-23 ホトレジスト剥離方法
PCT/JP2003/005336 WO2003091806A1 (fr) 2002-04-26 2003-04-25 Procede de retrait de photoresist

Publications (2)

Publication Number Publication Date
EP1550912A1 EP1550912A1 (en) 2005-07-06
EP1550912A4 true EP1550912A4 (en) 2006-09-06

Family

ID=29272357

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03720958A Withdrawn EP1550912A4 (en) 2002-04-26 2003-04-25 METHOD FOR REMOVING PHOTORESIST

Country Status (8)

Country Link
US (5) US20050176259A1 (zh)
EP (1) EP1550912A4 (zh)
JP (1) JP3516446B2 (zh)
KR (1) KR100781925B1 (zh)
CN (1) CN1650235A (zh)
AU (1) AU2003235130A1 (zh)
TW (1) TW200307186A (zh)
WO (1) WO2003091806A1 (zh)

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JP5057647B2 (ja) 2004-07-02 2012-10-24 東京エレクトロン株式会社 半導体装置の製造方法および半導体装置の製造装置
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CN113589662B (zh) * 2021-07-30 2022-07-12 浙江奥首材料科技有限公司 一种组合物、剥离液及其在剥离光刻胶或光刻胶残余物中的应用和剥离方法
CN115469516B (zh) * 2022-11-03 2023-03-24 江苏奥首材料科技有限公司 一种用于三五族半导体化合物光刻胶的剥离剂、其制备方法及用途

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Also Published As

Publication number Publication date
KR20050006191A (ko) 2005-01-15
JP2004029696A (ja) 2004-01-29
US20050176259A1 (en) 2005-08-11
US8354215B2 (en) 2013-01-15
WO2003091806A1 (fr) 2003-11-06
KR100781925B1 (ko) 2007-12-04
US20110000874A1 (en) 2011-01-06
TWI304525B (zh) 2008-12-21
AU2003235130A1 (en) 2003-11-10
US20070298619A1 (en) 2007-12-27
US20090291565A1 (en) 2009-11-26
JP3516446B2 (ja) 2004-04-05
EP1550912A1 (en) 2005-07-06
US20080280452A1 (en) 2008-11-13
CN1650235A (zh) 2005-08-03
TW200307186A (en) 2003-12-01

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