EP0602538B1 - Schutzrohrschalter und Herstellungsverfahren für aufgehängte dreidimensionale metallische Mikrostrukturen - Google Patents

Schutzrohrschalter und Herstellungsverfahren für aufgehängte dreidimensionale metallische Mikrostrukturen Download PDF

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Publication number
EP0602538B1
EP0602538B1 EP93119829A EP93119829A EP0602538B1 EP 0602538 B1 EP0602538 B1 EP 0602538B1 EP 93119829 A EP93119829 A EP 93119829A EP 93119829 A EP93119829 A EP 93119829A EP 0602538 B1 EP0602538 B1 EP 0602538B1
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EP
European Patent Office
Prior art keywords
photoresist
layer
contactor
beams
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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EP93119829A
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English (en)
French (fr)
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EP0602538A1 (de
Inventor
Etienne Bornand
Jean-Luc Simon
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Asulab AG
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Asulab AG
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Priority claimed from FR9215213A external-priority patent/FR2699323B1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/64—Protective enclosures, baffle plates, or screens for contacts
    • H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0078—Switches making use of microelectromechanical systems [MEMS] with parallel movement of the movable contact relative to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
    • H01H2036/0093—Micromechanical switches actuated by a change of the magnetic field

Definitions

  • the present invention relates to a contactor called “rod” or “reed”, that is to say a contactor comprising a closed enclosure inside which are mounted two rods or conductive beams respectively connected to two electrical connection means accessible from outside said enclosure, and return means for, in the absence of a magnetic field, return the rods to a rest position in which their distal parts are separated from one another by a space.
  • the rods or beams being also at least partially made of a material having a high magnetic susceptibility so that in the presence of an external magnetic field of sufficient intensity, their distal parts are brought into contact with one another. other thus establishing an electrical contact between said two connection means.
  • the invention also relates to two methods of fabrication by galvanic method of three-dimensional metallic microstructures suspended above a substrate, and in particular of the above "reed” contactor.
  • Known contactors are most often made up of two small diameter ferromagnetic steel rods arranged in the extension of one another and held integral with one another by fixing each in one of the two ends of a hollow glass bulb of generally cylindrical shape.
  • the two steel rods pass through the two walls in which they are respectively fixed and their ends emerge from the interior wall and extend opposite one another in overhang inside the glass enclosure.
  • the ends of the steel rods are further laminated in the form of two flexible blades whose ends intersect.
  • a space of a few tenths of a millimeter separates the two blades from one another.
  • an external magnetic field of sufficient intensity having a component parallel to the orientation of the two rods, they will magnetize.
  • the two rods being arranged substantially in the extension of one another, they will magnetize in the same direction and the free ends of the two rods will become respectively a north pole and a south pole. This will cause the appearance of an attractive magnetic force between these two ends which will consequently be brought and kept in contact with each other as long as the external magnetic field remains.
  • the distal ends of the two rods could either touch each other permanently or be separated by a space too large to allow the contact to be closed even in the presence of a high magnetic field.
  • the two rods are, as we have said, kept integral with one another by fixing in the wall of the enclosure in which they are enclosed and it is this fixing which determines their relative position.
  • the glass bulb serving as enclosure being produced by shaping the glass, the manufacturing tolerances are too large and it is almost impossible to obtain a relative positioning of the two rods whose precision would be better than a few tenths of a millimeter.
  • patent DD 248 454 (which describes a contactor according to the preamble of claim 1), it is proposed to manufacture an electromagnetic contactor of small dimensions by creating a fixed contact by micro-machining of a silicon wafer, the movable contact in a ferromagnetic material then being assembled above the wafer. This assembly operation necessarily constitutes a limitation to the reduction of the dimensions of the contactor.
  • the present invention therefore aims to overcome the drawbacks which have just been described by providing a very small reed contactor which is at least as reliable as known reed contactors.
  • the invention also aims to provide a method for manufacturing such a contactor.
  • the subject of the invention is a contactor according to claim 1.
  • the two beams or contact blades being, according to the present invention, secured to a base plane and no longer to the wall of a bulb, their relative positioning is much more precise.
  • the construction according to the invention which has just been described lends itself to manufacture by micro-machining using sacrificial layers and more particularly by a technique using galvanic deposition operations, and in particular to using the process which is the subject of the present invention.
  • the present invention indeed also relates to methods of manufacturing a contactor according to the invention, as defined in claims 3 to 6.
  • a given photoresist layer first fulfills a "mold” or “mask” function for galvanic growth and then in the second step in the event that a new photoresist layer is deposited on the first, it fulfills the role of sacrificial layer.
  • the same photoresist layer can play both, on the one hand, the role of mold or mask for galvanic growth and, on the other hand , the role of sacrificial layer.
  • the metallization covering a configured photoresist layer being, according to this latter method, in direct contact with an exposed conductive area (see point C), this metallization is in electrical contact with the lower conductive area without it being necessary to provide a metal block to connect it to it. This last characteristic makes it possible to eliminate at least one step of galvanic deposition, compared with what is necessary with the first method.
  • FIGS 1 and 2 show a "reed” contactor 1 according to the invention, it can be seen that it is formed of a base plane 2 on which two beams 19, 21 bear. sees more precisely that the two beams 19, 21 are integral with the base plane 2 by means of two feet referenced respectively 15 and 17. Each of the beams 19, 21 forms with the foot to which it is fixed an electrode structure ( referenced 4 and 6 respectively). A cap 8 covers these two electrodes and forms with the base plane, an airtight enclosure for them.
  • the "reed" contactors in accordance with this embodiment of the invention are preferably produced in batches or "batch” on silicon wafers or "wafers" and are, at the end of the process, separated from each other by cutting.
  • the base plane 2 of the contactor 1 therefore consists of a silicon rectangle cut out of the wafer that was used to manufacture the set of contactors. According to another embodiment of the present invention, the silicon wafer could be replaced by a glass plate.
  • the base plane 2 comprises a surface layer (the presence of which is indicated by a thickening of the hatching in the drawings, and which is referenced 10) formed of silicon dioxide and therefore electrically insulating. It can also be seen in FIG. 1 that the base plane comprises on its upper face, two separate electrically conductive zones 12 and 13 constituted by metallization areas. As will be explained in more detail below, these metallization zones are, according to the preferred embodiment of the present invention, made up of two distinct metal layers deposited on the substrate successively. We still see in Figure 1 that, as we have already said, the two beams 19, 21 are each fixed on a foot 15, 17 and that moreover these two feet are fixed on the base plane 2 at the level respectively of the two metallization areas 12 and 13.
  • the two beams 19, 21 extend horizontally in cantilever from the tops of the two feet 15, 17 and constitute therewith two electrode structures 4, 6 produced each in one piece. Still in this present embodiment, the two electrodes are oriented so that the distal parts of the beams extend in the direction of one another, or more precisely that the beams 19, 21 both extend in the vertical plane which contains the feet 15, 17 of the electrodes.
  • the electrodes 4, 6 are, as we will see later, produced by growth galvanic of a ferromagnetic alloy preferably iron and nickel.
  • the "reed" contactors according to the invention can be of considerably smaller dimensions than those which have been given above in relation to the contactors of the prior art.
  • the first electrode 6 could have a height typically between 20 and 35 ⁇ m, while the second electrode 4 would have a height between 40 and 70 ⁇ m .
  • Each of the electrodes could typically have a length of 500 ⁇ m (for the flexible part) and a width of 100 ⁇ m.
  • the overlap of the two electrodes would typically extend over a length of 40 ⁇ m and the space separating in height the two distal ends of the electrodes would typically be between 10 and 15 ⁇ m in the rest position, that is to say more precisely in the absence of magnetic field.
  • the thickness of the beams 19 and 21 would also be between 10 and 15 ⁇ m so as to allow a certain flexibility of these.
  • the beams that we have just described therefore have the form of elongated and flexible rectangular blades which are arranged substantially in the extension of one another. In the presence of an external magnetic field oriented parallel to these blades, they will magnetize and an attractive magnetic force will appear between the two ends of the blades which are close to each other. The blades being thin compared to their length and therefore relatively flexible, the attractive force will bring the two ends into contact with each other. Under these conditions the two metallization areas 12 and 13 will be electrically connected to each other and the contactor will therefore be closed.
  • the mixture of iron and nickel used for the production of the electrodes preferably has a low magnetic hysteresis so that at the time of the disappearance of the external magnetic field, the magnetization of the two beams 19, 21 also disappears and their two distal ends cease to attract each other. Under these conditions, the elasticity of the metal recalls the beams towards their rest position in which the two metallization areas 12, 13 are no longer electrically connected.
  • the present mode of implementation of the method allows the manufacture of a "reed” contactor in batches or "batch” on a silicon wafer which is finally cut to separate the contactors produced from each other.
  • Figures 3 to 18 which describe the stages of the manufacturing process each show only one contactor, but it is obvious that these figures are in fact partial views of a wafer on which numerous contactors are arranged one at a time. next to the others, only one of them being visible in the partial view.
  • a layer of silicon dioxide 10 is first created on the surface of silicon 2 by oxidation of the wafer in an oven in the presence of oxygen.
  • This first operation provides an insulating substrate on which we will then create during a second step, separate conductive areas 12, 13.
  • the insulating substrate on which we will create conductive areas could also be a glass plate.
  • the conductive areas created on the glass or on the silicon oxide are configured so that they are isolated from each other once the contactors formed on the wafer will have been separated from each other. These conductive zones are produced by creating on the oxidized silicon metallization areas 12, 13 in accordance with what is shown in FIG. 3.
  • a thin layer, said bonding layer of approximately 40 nm thick, made of titanium 12a and 13a is first deposited on the entire surface of the wafer by thermal evaporation.
  • the use of titanium is particularly advantageous because this metal adheres well to silicon dioxide.
  • a metallization of gold 12b and 13b is preferably then deposited on the titanium to improve the efficiency of the galvanic deposition.
  • This last metallization layer deposited by thermal evaporation is extremely thin approximately (200 nm).
  • the two metallization layers thus produced are then etched using a conventional technique to produce a network of conductive pads 12, 13. At this point in the manufacturing process, the contactor is similar to what is shown in FIG. 3.
  • the conductive pads are preferably connected on the insulating plate not yet cut.
  • dehydration will typically last thirty minutes at a temperature of 220 ° C.
  • a first layer of photoresist 23 is deposited on the surface of the brochure.
  • This photoresist is preferably deposited by centrifugation.
  • this photoresist layer is intended in particular, as will be seen below, to play the role of sacrificial layer extending between the substrate and the first suspended level of the structure to be produced, that is to say ie the electrode 6 of the future contactor.
  • the thickness of the first photoresist layer may for example be 2 ⁇ m.
  • the photoresist layer which has just been deposited is then cured.
  • the cooking is carried out in two stages, a first stage of 30 minutes at 65 ° C., followed by a second stage of 15 minutes at 80 ° C.
  • the photoresist is then configured using a second mask (not shown) to clear above the metallization areas 12, 13 of the openings 25, 26, 27 and 28 called molding holes at the places where the galvanic growth.
  • the metal blocks which will thus be formed in the molding holes 25 and 28 will constitute the two contact pads 56 making it possible to connect the "reed" contactor to an external electronic circuit, while the two metal blocks which will be formed in the molding holes 26, 27 respectively constitute the base of the foot 15 and the foot 17.
  • the future contactor is similar to what is shown in FIG. 4.
  • Metal blocks 31, 32, 33 and 34 are then grown in an alloy of iron and nickel or in gold for example, by galvanic deposition in the orifices 25, 26, 27 and 28 formed in the thick photoresist.
  • the photoresist therefore plays the role of mold at this stage.
  • the substrate is similar to what is shown in Figure 5.
  • a new extremely thin double metallization 36a, 36b formed of a bonding layer in Titanium covered by a layer of gold is then deposited by thermal evaporation over the entire surface of the wafer in accordance with what is shown in FIG. 6.
  • a new thick photoresist 38 is then deposited on the second metallization and configured to form a mold intended to receive a second galvanic deposit.
  • the second configured thick photoresist layer is shown in Figure 7.
  • the mold holes 40, 41 formed in the thick photoresist 38 do not extend exactly vertically to the metal blocks 32, 33 which have been formed in the first layer of photoresist 23. It will be noted more particularly that the molding hole 41 extends far beyond the metal block 33, the first layer of photoresist 23 therefore now plays the role of sacrificial layer allowing the production of suspended structures.
  • Galvanic deposition of a ferromagnetic material of iron-nickel is then carried out, for example, in the orifices 40, 41 formed in the second photoresist layer 38 to constitute, on the one hand, a second stage 43 for the base 15 of the second electrode. 4 and on the other hand the beam forming the first electrode 6.
  • the galvanic growth is stopped before the iron-nickel alloy has reached the level of the surface of the photoresist 38.
  • FIG. 8 represents the wafer at this stage of the process. Note that, quite generally, according to the method of the present invention, it is not necessary that there is even partial superposition between the metal blocks formed by galvanic growth in a layer of photoresist and those formed in the next layer.
  • the metal structures formed in the upper layer can, if necessary, be entirely suspended or free.
  • a third layer of thick photoresist 47 is then produced over the entire surface of the wafer.
  • the thickness of the photoresist deposited during this step is equal to the difference separating the two beams 19, 21 in the direction of the height in the finished contactor 1.
  • This third layer of photoresist 47 is also configured to produce a molding hole 48 provided for receiving in the next step the third level of the foot 15 of the second electrode 4.
  • the third level of photoresist 47 configured is visible in FIG. 10.
  • a third galvanic deposition of iron-nickel or gold, for example, is then carried out inside the orifice made in the photoresist in accordance with what is shown in FIG. 11.
  • a new thin double layer of titanium and gold 50a, 50b is then produced over the entire extent of the wafer by thermal evaporation in accordance with what is shown in FIG. 12.
  • a fourth layer of thick photoresist 52 is then produced over the entire extent of the wafer. This photoresist is then configured to produce an orifice 54 for molding the beam 19 forming the second electrode 4 which will also be produced by galvanic deposition in a subsequent step. The fourth configured photoresist layer 52 is also visible in FIG. 13.
  • a layer of gold 53 is first formed by galvanic deposition in the bottom of the molding hole 54 made in the photoresist 52.
  • This layer of gold 53 constitutes a fattening on the beam 19 forming the second electrode 4 which will serve as the 45 gold fattening was previously made on the beam 21 forming the first electrode 6 to promote electrical contact between them.
  • FIG. 14 represents the contactor at the end of the stage of depositing this second gold fattening.
  • FIG. 15 represents the "reed" contactor 1 according to the invention once all the steps of galvanic deposition have been completed.
  • the spacing between the two electrodes 4, 6 being in this embodiment determined solely by the thickness of the third layer of thick photoresist, it will be possible to produce contactors with extremely fine tolerances in the positioning of the electrodes.
  • FIG. 16 shows the two electrodes 4, 6 of the contactor finished. Since the electrodes 4, 6 are essentially made of an iron-nickel alloy, they are ferromagnetic and therefore highly magnetizable.
  • the production of the beams 19, 21 according to the method by successive layers which has just been described makes it possible to give them a determined thickness. This thickness being chosen so as to provide the flexibility necessary to allow the distal ends of the two beams to come into contact in the presence of a relatively weak magnetic field.
  • the electrodes are then placed in a hermetic enclosure filled with an inert gas.
  • a honeycomb cover 8 made for example from micro-machined glass is glued to the wafer which, once glued to the wafer will enclose each pair of electrodes 4,6 in an individual cell (the thickness of glue joining the cover to the substrate is referenced 60 in FIG. 17).
  • FIG. 17 partially shows the plate on which the honeycomb cover 8 has been glued.
  • a single plate covered with a cover 8 comprising a multiplicity of cells (only a fragment of this assembly being shown in FIG. 17) groups together a whole batch of contactors.
  • the assembly of the plate and the cover therefore defines a multiplicity of cavities of which approximately half encloses the pair of electrodes of a contactor, while the other cavities enclose contact pads 56.
  • contactors and contact pads 56 in the different cells naturally depends on the particular shape of the masks used for the configuration of the photoresist layers.
  • the assembled set of contactors must now be sawn to separate the contactors from each other.
  • This operation is preferably carried out in two stages.
  • a first step the cover material is cut to a depth sufficient to make it easily breakable. This operation produces the notches 58 visible in FIG. 18.
  • the wafer is, in a second step, cut to separate all of the individual contactors from one another. Once the separation of the different contactors has been made, it is easy to break the cover fragments which are situated above each of the contact pads 56 since these fragments have already been cut during the first sawing step. Once these cover fragments have been removed, the contact pads 56 are easily accessible for making the connections of the finished contactor with an external electrical circuit.
  • the cutting step which has just been described provides typically several thousand contactors from a 10 cm diameter plate.
  • Figures 19 and 20 show a "reed" contactor according to a second embodiment of the present invention.
  • the beam 121 forming the first electrode 106 is fixed directly to the conductive pad 113 of the substrate 102, unlike the second electrode 104, the electrode 106 therefore does not include a foot.
  • only three layers of thick photoresist are used for the manufacture of the contactor instead of four in the embodiment described above.
  • the first electrode 106 is obviously not flexible in the present embodiment, the beam 119 of the second electrode 104 will alone have to show sufficient deflection in the presence of an external magnetic field to close the contactor.
  • FIG. 21 represents a "reed" contactor according to a third embodiment of the present invention.
  • the beam 219 of the electrode 204 and the beam 221 of the electrode 206 are arranged in the same plane parallel to the base plane 202.
  • the bending of the beams which produces the contactor is opened or closed here laterally, that is to say parallel to the base plane 202.
  • This variant of the invention has the advantage of requiring less deposition and configuration step for its production.
  • the steps of the present second method can be carried out in an identical manner to those described above in relation to the example of implementation of the first method.
  • Each photoresist manufacturer supplies with its product recommended exposure values for the configuration. These recommended values are intended to obtain the highest possible aspect ratios for the reliefs of the photoresist once it has been configured. If on the contrary one wishes to obtain relatively weak aspect ratios, one will not necessarily follow the manufacturer's recommendations.
  • the authors of the present invention it has been observed in particular that with the photoresist known under the name shipley Microposit R S1400-27, the fact of considerably exceeding the recommended exposure values makes it possible to obtain relatively low aspect ratios in accordance with which is necessary for the implementation of the present second method.
  • the photoresist is therefore first exposed and then developed using a chemical attack agent, for example that known under the name Shipley Microposit® 351 diluted in a proportion of (1: 3).
  • the substrate is then rinsed and then annealed, to provide the structure shown in Figure 22.
  • the reliefs configured in the layer 23 have relatively low aspect ratios.
  • the edges of the four openings 25, 26, 27, and 28 are clearly inclined and not vertical.
  • the low aspect ratio is due to the overexposure of the photoresist but it is quite clear that many other means are possible to obtain this low aspect ratio (underexposure, special photoresist, etc.).
  • a new metallization of gold 36 is formed on its surface.
  • this metallization can, as is the case give an account in FIG. 23, extending without interruption between the bottom of said openings and the top of photoresist 23.
  • This configuration allows the new metallization 36 to be fully in electrical contact with the metallization areas 12 and 13 formed on the substrate. This characteristic is necessary to allow subsequent galvanic deposition on the metallization 36.
  • the next step is the coating of a first thick photoresist 38.
  • this layer 38 has been formed on the metallization 36, the wafer is similar to what is shown in FIG. 24.
  • a new configuration step is then carried out to make molding holes 37, 39, 40 and 41 inside which the galvanic growth will be carried out subsequently.
  • the walls of these mold holes will preferably have, unlike the walls of the openings 25, 26, 27 and 28 described in a previous step, a high aspect ratio.
  • the thick photoresist has been configured, the future contactor is similar to what is shown in FIG. 25. It is then grown, by galvanic deposition, from the metallization zones forming the bottom of the mold holes 37, 39, 40 and 41, a first series of metal blocks 21, 42, 43 and 44.
  • the photoresist therefore plays the role of mold at this stage.
  • the substrate is similar to what is represented in FIG. 26.
  • the metal block 21 extends over a certain length above the first layer of photoresist 23 which therefore plays now the role of sacrificial layer allowing the realization of the first suspended structure which constitutes, in the present example, the electrode 6 of the future contactor.
  • a gold fattening 45 intended to improve the electrical contact between the two electrodes 4, 6 when their distal parts 19, 21 will touch during the operation of the contactor.
  • This gold fattening may have a thickness of 0.5 ⁇ n.
  • a third layer of photoresist 47 is then produced over the entire surface of the wafer.
  • the thickness of the photoresist deposited during this step is equal to the difference which will separate the two beams 19, 21 in the direction of the height in the finished contactor 1.
  • This third layer of photoresist 47 is also configured to produce an opening 48 vertically in the metal block 43 constituting the base of the foot 15 of the future electrode 4 of the reed contactor. As can be seen in FIG. 29, the walls of the opening 48 which has just been produced also have a low aspect ratio.
  • a fourth layer of thick photoresist 52 is then produced over the entire extent of the wafer. This photoresist is then configured to produce an orifice 54 provided for the subsequent molding of the beam 19 forming the second electrode 4 of the contactor.
  • the fourth photoresist layer 52 configured is visible in FIG. 31.
  • a layer of gold 53 is first formed by galvanic deposition in the bottom of the molding hole 54.
  • FIG. 32 represents the "reed" contactor 1 according to the invention once all the steps of galvanic deposition have been completed.
  • the gold layer 53 which was deposited before the iron-nickel mixture now forms a contact layer under the electrode 4 of the "reed” contactor.
  • the spacing between the two electrodes 4, 6 is in the present embodiment determined solely by the thickness of the third layer of thick photoresist. It will therefore be possible to produce contactors with extremely fine tolerances in the positioning of the electrodes.
  • the contactor is then subjected to an attack reagent to release either in a single operation or in stages, the two electrodes 4,6 and therefore eliminate both the photoresist layers 23, 38, 47 and 52 as well as the gold metallizations. and of titanium 36 and 50. Once the electrodes have been completely released, the contactor has the appearance of that shown in FIG. 33.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacture Of Switches (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)

Claims (6)

  1. Kontaktgeber, der mittels eines Herstellverfahrens durch galvanische Methode ausgehend von einem Substrat (2; 102) mit zwei elektrisch leitenden getrennten Zonen (12, 13; 112, 113) mikrobearbeitet ist, welcher Kontaktgeber zwei leitende Zungen (19, 21; 119, 121) umfaßt, welche Zungen jede ein distales Ende umfassen, welche distalen Enden einander benachbart sind und von denen mindestens eines relativ zu dem anderen zwischen einer ersten, als offen bezeichneten Position, in der sie voneinander durch einen Zwischenraum getrennt sind, und einer zweiten, als Schließposition bezeichneten Position beweglich ist, in der sie miteinander in Kontakt sind, welcher Kontaktgeber ferner Rückstellmittel für das Vorspannen der distalen Enden in Richtung der offenen Position umfaßt, welche Zungen (19, 21; 119, 121) ferner mindestens teilweise aus einem magnetisierbaren Material hergestellt sind, derart, daß, wenn sie einem magnetischen Induktionsfeld hinreichender Intensität unterworfen werden, die distalen Enden in die Schließposition gebracht werden, welcher Kontaktgeber dadurch gekennzeichnet ist, daß die Zungen (19, 21; 119, 121) mit dem Substrat in Höhe der beiden leitenden Zonen verbunden sind, daß die Zungen (19, 21; 119, 121) jeweils mit elektrischen Anschlußmitteln (56) verbunden sind und daß mindestens eine (19, 21; 119) der Zungen sich an dem Substrat über einem Pfosten (15, 17; 115) abstützt, der aus einem Metallblock gebildet ist, auf dem sie montiert ist.
  2. Kontaktgeber nach Anspruch 1, dadurch gekennzeichnet, daß er eine Haube (8; 108) umfaßt, welche die Zungen (19, 21; 119, 121) überdeckt und die an dem Substrat (2; 102) befestigt ist, um mit diesem einen geschlossenen Raum zu bilden, und daß die Anschlußmittel (56) außerhalb des Raumes angeordnet sind.
  3. Verfahren zum Herstellen eines mikrobearbeiteten Kontaktgebers nach Anspruch 1, dadurch gekennzeichnet, daß jede Zunge (21, 19) durch zweimaliges Reproduzieren der Schritte a) bis g) erhalten wird, wonach mindestens ein distales Ende der Zungen in einem Schritt h) freigesetzt wird, welche Schritte sind:
    a) Erzeugen einer ersten Schicht (23, 47) aus Photoresist auf einer Seite des Substrats;
    b) Konfigurieren der ersten Schicht aus Photoresist derart, daß in der Dicke derselben mindestens ein aufwachsfreier Raum (25, 27, 28, 29) gebildet wird, der die Fläche des Substrats oder die Oberfläche eines bereits erhaltenen Pfostens freimacht;
    c) Aufwachsenlassen mittels galvanischem Auftrag eines Metallpfostens (31, 32, 33, 34) im Inneren des Freiraums, bis das Metall mit der Photoresistoberfläche bündig ist;
    d) Erzeugen eines Metallisationsniveaus (36) auf der Oberfläche der ersten Photoresistschicht;
    e) Aufbringen einer neuen Schicht (38) aus Photoresist auf dem Metallisationsniveau;
    f) Konfigurieren der neuen Photoresistschicht derart, daß in der Dicke derselben mindestens ein aufwachsfreier Raum (40, 41, 54) gebildet wird, der das Metallisationsniveau freilegt;
    g) Aufwachsenlassen mittels galvanischem Auftrag eines Metallpfostens (43, 21, 19) im Inneren des in der neuen Photoresistschicht hergestellten Freiraums;
    h) Eliminieren der Photoresistschichten und der nicht funktionellen Partien des Metallisationsniveaus.
  4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß die erste Zungen (21) durch Ausführen nur der Schritte d) bis f) des Verfahrens erhalten wird und mit dem Substrat verbunden ist.
  5. Verfahren zum Herstellen eines mikrobearbeiteten Kontaktgebers nach Anspruch 1, dadurch gekennzeichnet, daß jede Zunge (21, 19) durch zweimaliges Reproduzieren der Abfolge der Schritte a) bis f) erhalten wird und nachfolgendes Freisetzen der distalen Enden der Zungen in einem Schritt g), welche Schritte sind:
    a) Aufbringen einer ersten im wesentlichen gleichförmigen Photoresistschicht (23) auf die Substratoberfläche, wobei das Substrat mindestens eine leitende Zone aufweist;
    b) Konfigurieren der ersten Photoresistschicht derart, daß in der Dicke derselben mindestens ein Freiraum (25, 27, 28, 29) gebildet wird, der mindestens teilweise die leitende Zone freilegt, welcher Freiraum deutlich schrägverlaufende Ränder besitzt;
    c) Beschichten der konfigurierten Schicht mit einer durchgehenden Metallisierung (36), die sich sowohl über die freigelegte leitende Zone als auch über die Photoresistschicht erstreckt;
    d) Deponieren einer neuen Photoresistschicht (38), die im wesentlichen gleichförmig ist;
    e) Konfigurieren der neuen Photoresistschicht derart, daß in der Dicke derselben mindestens ein aufwachsfreier Raum (40, 41) gebildet wird, der die Metallisierung freilegt;
    f) Aufwachsenlassen mittels galvanischem Auftrag eines Metallpfostens (43, 21) im Inneren des Freiraums, der in der neuen Photoresistschicht gebildet worden ist;
    g) Eliminieren der Photoresistschichten und der nichtfunktionellen Partien der Metallisierung.
  6. Verfahren nach Anspruch 3 oder 5, dadurch gekennzeichnet, daß die Anfangsetappe die folgenden Operationen umfaßt:
    - Herstellen einer metallischen Verankerungsschicht (12a, 13a; 112a, 113a) auf bestimmten Zonen des Substrats;
    - Herstellen einer Sekundärmetallisierungsschicht (12b, 13b; 112b, 113b) aus einem nicht oxidierbaren Metall auf der metallischen Verankerungsschicht.
EP93119829A 1992-12-15 1993-12-09 Schutzrohrschalter und Herstellungsverfahren für aufgehängte dreidimensionale metallische Mikrostrukturen Expired - Lifetime EP0602538B1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
FR9215213 1992-12-15
FR9215213A FR2699323B1 (fr) 1992-12-15 1992-12-15 Contacteur "reed" et procédé de fabrication de microstructures métalliques tridimensionnelles suspendues.
CH199193 1993-07-02
CH1991/93 1993-07-02

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EP0602538B1 true EP0602538B1 (de) 1997-06-04

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EP0602538A1 (de) 1994-06-22
KR100326129B1 (ko) 2002-11-13
DE69311277T2 (de) 1998-01-15
KR940016737A (ko) 1994-07-25
HK1006604A1 (en) 1999-03-05
DE69311277D1 (de) 1997-07-10
US5430421A (en) 1995-07-04
JPH06223686A (ja) 1994-08-12

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