HK1006604A1 - Reed switch and manufacturing process for suspended three-dimensional metallic microstructures - Google Patents

Reed switch and manufacturing process for suspended three-dimensional metallic microstructures

Info

Publication number
HK1006604A1
HK1006604A1 HK98105820A HK98105820A HK1006604A1 HK 1006604 A1 HK1006604 A1 HK 1006604A1 HK 98105820 A HK98105820 A HK 98105820A HK 98105820 A HK98105820 A HK 98105820A HK 1006604 A1 HK1006604 A1 HK 1006604A1
Authority
HK
Hong Kong
Prior art keywords
suspended
manufacturing process
reed switch
dimensional metallic
metallic microstructures
Prior art date
Application number
HK98105820A
Other languages
English (en)
Inventor
Etienne Bornand
Jean-Luc Simon
Original Assignee
Asulab Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR9215213A external-priority patent/FR2699323B1/fr
Application filed by Asulab Sa filed Critical Asulab Sa
Publication of HK1006604A1 publication Critical patent/HK1006604A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/64—Protective enclosures, baffle plates, or screens for contacts
    • H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0078—Switches making use of microelectromechanical systems [MEMS] with parallel movement of the movable contact relative to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
    • H01H2036/0093—Micromechanical switches actuated by a change of the magnetic field

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacture Of Switches (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
HK98105820A 1992-12-15 1998-06-20 Reed switch and manufacturing process for suspended three-dimensional metallic microstructures HK1006604A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9215213A FR2699323B1 (fr) 1992-12-15 1992-12-15 Contacteur "reed" et procédé de fabrication de microstructures métalliques tridimensionnelles suspendues.
CH199193 1993-07-02

Publications (1)

Publication Number Publication Date
HK1006604A1 true HK1006604A1 (en) 1999-03-05

Family

ID=25689202

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98105820A HK1006604A1 (en) 1992-12-15 1998-06-20 Reed switch and manufacturing process for suspended three-dimensional metallic microstructures

Country Status (7)

Country Link
US (1) US5430421A (xx)
EP (1) EP0602538B1 (xx)
JP (1) JPH06223686A (xx)
KR (1) KR100326129B1 (xx)
DE (1) DE69311277T2 (xx)
HK (1) HK1006604A1 (xx)
TW (1) TW264556B (xx)

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FR2721435B1 (fr) * 1994-06-17 1996-08-02 Asulab Sa Microcontacteur magnétique et son procédé de fabrication.
DE19648539C2 (de) * 1996-11-25 2000-04-13 Mannesmann Vdo Ag Passiver magnetischer Positionssensor
CH691559A5 (fr) * 1997-04-21 2001-08-15 Asulab Sa Micro-contacteur magnétique et son procédé de fabrication.
DE69714408T2 (de) * 1997-04-23 2003-04-24 Asulab S.A., Marin Magnetischer Mikroschalter und Herstellungsverfahren
DE19736674C1 (de) * 1997-08-22 1998-11-26 Siemens Ag Mikromechanisches elektrostatisches Relais und Verfahren zu dessen Herstellung
EP0951068A1 (en) 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
US6147790A (en) * 1998-06-02 2000-11-14 Texas Instruments Incorporated Spring-ring micromechanical device
KR100506073B1 (ko) * 1998-10-26 2005-09-26 삼성전자주식회사 고진공패키징마이크로자이로스코프및그제조방법
DE19854803A1 (de) * 1998-11-27 2000-05-31 Bosch Gmbh Robert Verfahren zur Herstellung einer lokal verstärkten metallischen Mikrostruktur
JP3379484B2 (ja) * 1999-07-09 2003-02-24 日本電気株式会社 高周波装置およびその製造方法
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6853067B1 (en) 1999-10-12 2005-02-08 Microassembly Technologies, Inc. Microelectromechanical systems using thermocompression bonding
DE10043549C1 (de) * 2000-09-01 2002-06-20 Little Things Factory Gmbh Mikroschalter und Verfahren zu dessen Herstellung
US6804552B2 (en) * 2000-11-03 2004-10-12 Medtronic, Inc. MEMs switching circuit and method for an implantable medical device
US20020096421A1 (en) * 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
US6711317B2 (en) * 2001-01-25 2004-03-23 Lucent Technologies Inc. Resiliently packaged MEMs device and method for making same
US20090163980A1 (en) * 2007-12-21 2009-06-25 Greatbatch Ltd. Switch for turning off therapy delivery of an active implantable medical device during mri scans
US7301334B2 (en) * 2001-09-17 2007-11-27 Schneider Electric Industries Sas Micro magnetic proximity sensor system
AUPR846701A0 (en) * 2001-10-25 2001-11-15 Microtechnology Centre Management Limited A method of fabrication of micro-devices
WO2004027799A2 (en) * 2002-09-18 2004-04-01 Magfusion, Inc. Method of assembling a laminated electro-mechanical structure
FR2849016B1 (fr) * 2002-12-18 2005-06-10 Commissariat Energie Atomique Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu
US7215229B2 (en) * 2003-09-17 2007-05-08 Schneider Electric Industries Sas Laminated relays with multiple flexible contacts
US7321282B2 (en) * 2005-02-17 2008-01-22 Honeywell International, Inc. MEM's reed switch array
US7692521B1 (en) 2005-05-12 2010-04-06 Microassembly Technologies, Inc. High force MEMS device
TWI395258B (zh) * 2005-11-11 2013-05-01 Semiconductor Energy Lab 微結構以及微機電系統的製造方法
US7463123B2 (en) * 2005-11-22 2008-12-09 University Of South Florida Nanometer electromechanical switch and fabrication process
JP2007207498A (ja) * 2006-01-31 2007-08-16 Oki Sensor Device Corp 機構デバイス
EP2269202A4 (en) * 2008-03-20 2014-01-22 Ht Microanalytical Inc INTEGRATED REED SWITCH
US8665041B2 (en) * 2008-03-20 2014-03-04 Ht Microanalytical, Inc. Integrated microminiature relay
US8451077B2 (en) 2008-04-22 2013-05-28 International Business Machines Corporation MEMS switches with reduced switching voltage and methods of manufacture
US8635765B2 (en) * 2011-06-15 2014-01-28 International Business Machines Corporation Method of forming micro-electrical-mechanical structure (MEMS)
DE102014210717A1 (de) * 2014-06-05 2015-12-17 Robert Bosch Gmbh Füllstandssensor für Kraftfahrzeugtank mit metallischem Abstandshalterelement
CN104217893B (zh) * 2014-09-26 2019-09-06 敬德强 大电流磁簧开关
JP2016177989A (ja) * 2015-03-20 2016-10-06 アルプス電気株式会社 磁気リードスイッチの製造方法
JP2017073229A (ja) * 2015-10-05 2017-04-13 アルプス電気株式会社 磁気リードスイッチ
JP2017073227A (ja) * 2015-10-05 2017-04-13 アルプス電気株式会社 磁気リードスイッチ
JP2017073230A (ja) * 2015-10-05 2017-04-13 アルプス電気株式会社 磁気リードスイッチ
JP2017073228A (ja) * 2015-10-05 2017-04-13 アルプス電気株式会社 磁気リードスイッチ
US10145906B2 (en) * 2015-12-17 2018-12-04 Analog Devices Global Devices, systems and methods including magnetic structures
JP6950613B2 (ja) * 2018-04-11 2021-10-13 Tdk株式会社 磁気作動型ｍｅｍｓスイッチ

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DE248454C (xx) *
JPS4928142U (xx) * 1972-06-16 1974-03-11
SE378475B (xx) * 1974-02-07 1975-09-01 Ygfors Trading Ab
JPS51121170A (en) * 1975-04-15 1976-10-22 Yaskawa Denki Seisakusho Kk Reed switch
JPS55115216A (en) * 1979-02-27 1980-09-05 Fujitsu Ltd Method of forming movable electrode on base
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
JPS6188417A (ja) * 1985-10-08 1986-05-06 オムロン株式会社 無接点スイッチの製造方法
DD248454B1 (de) * 1986-04-18 1988-11-02 Ilmenau Tech Hochschule Miniaturisiertes elektromagnetisches schaltelement
WO1988004877A1 (en) * 1986-12-17 1988-06-30 The Foxboro Company Multilayer circuit board fabrication process
JPH073553Y2 (ja) * 1987-10-26 1995-01-30 株式会社東海理化電機製作所 小型磁気スイッチ
DE3812414A1 (de) * 1988-04-14 1989-10-26 Standard Elektrik Lorenz Ag Verfahren zum herstellen einer allseitig geschirmten signalleitung
JPH081542Y2 (ja) * 1988-10-27 1996-01-17 株式会社東海理化電機製作所 磁気応動スイッチ
JPH0736295Y2 (ja) * 1988-10-28 1995-08-16 株式会社東海理化電機製作所 過電流検出センサ
JPH02148637A (ja) * 1988-11-30 1990-06-07 Tokai Rika Co Ltd 磁気応動スイッチ
US4899439A (en) * 1989-06-15 1990-02-13 Microelectronics And Computer Technology Corporation Method of fabricating a high density electrical interconnect
US4920639A (en) * 1989-08-04 1990-05-01 Microelectronics And Computer Technology Corporation Method of making a multilevel electrical airbridge interconnect
JPH0636472B2 (ja) * 1990-05-28 1994-05-11 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層配線基板の製造方法

Also Published As

Publication number Publication date
TW264556B (xx) 1995-12-01
EP0602538A1 (fr) 1994-06-22
KR100326129B1 (ko) 2002-11-13
DE69311277T2 (de) 1998-01-15
KR940016737A (ko) 1994-07-25
DE69311277D1 (de) 1997-07-10
US5430421A (en) 1995-07-04
EP0602538B1 (fr) 1997-06-04
JPH06223686A (ja) 1994-08-12

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Legal Events

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PF Patent in force
PE Patent expired

Effective date: 20131208