FR2849016B1 - Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu - Google Patents
Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenuInfo
- Publication number
- FR2849016B1 FR2849016B1 FR0216088A FR0216088A FR2849016B1 FR 2849016 B1 FR2849016 B1 FR 2849016B1 FR 0216088 A FR0216088 A FR 0216088A FR 0216088 A FR0216088 A FR 0216088A FR 2849016 B1 FR2849016 B1 FR 2849016B1
- Authority
- FR
- France
- Prior art keywords
- making
- polymeric material
- sacrificial layer
- component obtained
- suspended micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
- B81C1/00611—Processes for the planarisation of structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0102—Surface micromachining
- B81C2201/0105—Sacrificial layer
- B81C2201/0108—Sacrificial polymer, ashing of organics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0118—Processes for the planarization of structures
- B81C2201/0125—Blanket removal, e.g. polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0216088A FR2849016B1 (fr) | 2002-12-18 | 2002-12-18 | Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu |
EP03799623A EP1572578A2 (fr) | 2002-12-18 | 2003-12-18 | Procede de realisation d une micro-structure suspendue plane , utilisant une couche sacrificielle en materiau polymere et composant obtenu |
AU2003299341A AU2003299341A1 (en) | 2002-12-18 | 2003-12-18 | Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component |
PCT/FR2003/003789 WO2004056698A2 (fr) | 2002-12-18 | 2003-12-18 | Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0216088A FR2849016B1 (fr) | 2002-12-18 | 2002-12-18 | Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2849016A1 FR2849016A1 (fr) | 2004-06-25 |
FR2849016B1 true FR2849016B1 (fr) | 2005-06-10 |
Family
ID=32406154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0216088A Expired - Fee Related FR2849016B1 (fr) | 2002-12-18 | 2002-12-18 | Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1572578A2 (fr) |
AU (1) | AU2003299341A1 (fr) |
FR (1) | FR2849016B1 (fr) |
WO (1) | WO2004056698A2 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2874213B1 (fr) * | 2004-08-13 | 2007-03-02 | Commissariat Energie Atomique | Dispositif comprenant un microsysteme encapsule et procede de fabrication |
US7271022B2 (en) * | 2004-12-21 | 2007-09-18 | Touchdown Technologies, Inc. | Process for forming microstructures |
US7264984B2 (en) | 2004-12-21 | 2007-09-04 | Touchdown Technologies, Inc. | Process for forming MEMS |
US7362119B2 (en) | 2005-08-01 | 2008-04-22 | Touchdown Technologies, Inc | Torsion spring probe contactor design |
US7245135B2 (en) | 2005-08-01 | 2007-07-17 | Touchdown Technologies, Inc. | Post and tip design for a probe contact |
US7365553B2 (en) | 2005-12-22 | 2008-04-29 | Touchdown Technologies, Inc. | Probe card assembly |
US7180316B1 (en) | 2006-02-03 | 2007-02-20 | Touchdown Technologies, Inc. | Probe head with machined mounting pads and method of forming same |
GB2588891B (en) * | 2019-10-23 | 2024-04-24 | Smart Photonics Holding B V | Manufacturing a semiconductor structure |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63102948A (ja) * | 1986-10-20 | 1988-05-07 | Canon Inc | インクジエツト記録ヘツドの製造方法 |
DE69311277T2 (de) * | 1992-12-15 | 1998-01-15 | Asulab Sa | Schutzrohrschalter und Herstellungsverfahren für aufgehängte dreidimensionale metallische Mikrostrukturen |
CN1064135C (zh) | 1994-04-30 | 2001-04-04 | 大宇电子株式会社 | 薄膜可驱动反射镜阵列 |
KR20090038040A (ko) * | 1998-12-02 | 2009-04-17 | 폼팩터, 인크. | 전기 접촉 구조체의 제조 방법 |
US6780001B2 (en) * | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
US7057246B2 (en) * | 2000-08-23 | 2006-06-06 | Reflectivity, Inc | Transition metal dielectric alloy materials for MEMS |
-
2002
- 2002-12-18 FR FR0216088A patent/FR2849016B1/fr not_active Expired - Fee Related
-
2003
- 2003-12-18 EP EP03799623A patent/EP1572578A2/fr not_active Withdrawn
- 2003-12-18 AU AU2003299341A patent/AU2003299341A1/en not_active Abandoned
- 2003-12-18 WO PCT/FR2003/003789 patent/WO2004056698A2/fr not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1572578A2 (fr) | 2005-09-14 |
WO2004056698A3 (fr) | 2004-11-11 |
AU2003299341A1 (en) | 2004-07-14 |
WO2004056698A2 (fr) | 2004-07-08 |
FR2849016A1 (fr) | 2004-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20160831 |