DE69207268T2 - Reinigungsvorrichtung für Plättchen-Halterungsplatte - Google Patents
Reinigungsvorrichtung für Plättchen-HalterungsplatteInfo
- Publication number
- DE69207268T2 DE69207268T2 DE69207268T DE69207268T DE69207268T2 DE 69207268 T2 DE69207268 T2 DE 69207268T2 DE 69207268 T DE69207268 T DE 69207268T DE 69207268 T DE69207268 T DE 69207268T DE 69207268 T2 DE69207268 T2 DE 69207268T2
- Authority
- DE
- Germany
- Prior art keywords
- plate
- cleaning device
- holder
- plate holder
- holder plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
- F26B11/18—Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3160904A JPH04363022A (ja) | 1991-06-06 | 1991-06-06 | 貼付板洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69207268D1 DE69207268D1 (de) | 1996-02-15 |
DE69207268T2 true DE69207268T2 (de) | 1996-05-15 |
Family
ID=15724859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69207268T Expired - Fee Related DE69207268T2 (de) | 1991-06-06 | 1992-05-20 | Reinigungsvorrichtung für Plättchen-Halterungsplatte |
Country Status (5)
Country | Link |
---|---|
US (1) | US5351360A (de) |
EP (1) | EP0517033B1 (de) |
JP (1) | JPH04363022A (de) |
KR (1) | KR960012623B1 (de) |
DE (1) | DE69207268T2 (de) |
Families Citing this family (95)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0589434B1 (de) * | 1992-09-24 | 1998-04-08 | Ebara Corporation | Poliergerät |
US5485644A (en) * | 1993-03-18 | 1996-01-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
US5885138A (en) * | 1993-09-21 | 1999-03-23 | Ebara Corporation | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
US5518542A (en) * | 1993-11-05 | 1996-05-21 | Tokyo Electron Limited | Double-sided substrate cleaning apparatus |
JP3036348B2 (ja) * | 1994-03-23 | 2000-04-24 | 三菱マテリアル株式会社 | ウェーハ研磨パッドのツルーイング装置 |
GB9405821D0 (en) * | 1994-03-24 | 1994-05-11 | Royal Doulton Ltd | Brushing or cleaning apparatus |
KR100284559B1 (ko) * | 1994-04-04 | 2001-04-02 | 다카시마 히로시 | 처리방법 및 처리장치 |
JP3328426B2 (ja) * | 1994-05-12 | 2002-09-24 | 東京エレクトロン株式会社 | 洗浄装置 |
JP3427111B2 (ja) * | 1994-05-13 | 2003-07-14 | 株式会社ニコン | 半導体製造装置、および、液晶表示素子製造用装置 |
KR0171491B1 (ko) * | 1994-09-20 | 1999-03-30 | 이시다 아키라 | 회전식 기판세정장치 |
TW316995B (de) * | 1995-01-19 | 1997-10-01 | Tokyo Electron Co Ltd | |
US5558111A (en) * | 1995-02-02 | 1996-09-24 | International Business Machines Corporation | Apparatus and method for carrier backing film reconditioning |
JP3452676B2 (ja) * | 1995-02-15 | 2003-09-29 | 宮崎沖電気株式会社 | 半導体ウエハ面のパーティクルの除去装置及びそれを用いた半導体ウエハ面のパーティクルの除去方法 |
US5551986A (en) * | 1995-02-15 | 1996-09-03 | Taxas Instruments Incorporated | Mechanical scrubbing for particle removal |
JPH08238463A (ja) * | 1995-03-03 | 1996-09-17 | Ebara Corp | 洗浄方法及び洗浄装置 |
JP2647050B2 (ja) * | 1995-03-31 | 1997-08-27 | 日本電気株式会社 | ウェハ研磨装置 |
JP3341872B2 (ja) * | 1995-04-03 | 2002-11-05 | 大日本スクリーン製造株式会社 | 回転式基板洗浄装置 |
JP3504023B2 (ja) * | 1995-05-26 | 2004-03-08 | 株式会社ルネサステクノロジ | 洗浄装置および洗浄方法 |
US5624501A (en) * | 1995-09-26 | 1997-04-29 | Gill, Jr.; Gerald L. | Apparatus for cleaning semiconductor wafers |
US5693148A (en) * | 1995-11-08 | 1997-12-02 | Ontrak Systems, Incorporated | Process for brush cleaning |
US5927305A (en) * | 1996-02-20 | 1999-07-27 | Pre-Tech Co., Ltd. | Cleaning apparatus |
JP3393016B2 (ja) * | 1996-04-15 | 2003-04-07 | 大日本スクリーン製造株式会社 | 基板洗浄装置および方法 |
US5861066A (en) * | 1996-05-01 | 1999-01-19 | Ontrak Systems, Inc. | Method and apparatus for cleaning edges of contaminated substrates |
JPH09320999A (ja) * | 1996-05-31 | 1997-12-12 | Komatsu Electron Metals Co Ltd | 半導体ウェハ貼付プレートの付着物除去装置 |
KR100187445B1 (ko) * | 1996-06-05 | 1999-04-15 | 김광호 | 웨이퍼 세정 방법 및 장치 |
US5675856A (en) * | 1996-06-14 | 1997-10-14 | Solid State Equipment Corp. | Wafer scrubbing device |
DE19623766A1 (de) * | 1996-06-14 | 1997-12-18 | Itt Ind Gmbh Deutsche | Vorrichtung zum Trockenreinigen von staubverschmutzten Hilfsgegenständen zur Handhabung und Aufbewahrung von Halbleiterwafern |
US5875507A (en) | 1996-07-15 | 1999-03-02 | Oliver Design, Inc. | Wafer cleaning apparatus |
US6230753B1 (en) * | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
TW357406B (en) * | 1996-10-07 | 1999-05-01 | Tokyo Electron Ltd | Method and apparatus for cleaning and drying a substrate |
EP0837493B8 (de) * | 1996-10-21 | 2007-11-07 | Ebara Corporation | Reinigungsvorrichtung |
GB2319888A (en) * | 1996-11-30 | 1998-06-03 | Ibm | Brushes for cleaning substrates |
US5937469A (en) * | 1996-12-03 | 1999-08-17 | Intel Corporation | Apparatus for mechanically cleaning the edges of wafers |
KR100417648B1 (ko) * | 1996-12-28 | 2004-04-06 | 주식회사 하이닉스반도체 | 웨이퍼 세정방법 |
US5868857A (en) * | 1996-12-30 | 1999-02-09 | Intel Corporation | Rotating belt wafer edge cleaning apparatus |
US5901399A (en) * | 1996-12-30 | 1999-05-11 | Intel Corporation | Flexible-leaf substrate edge cleaning apparatus |
US5725414A (en) * | 1996-12-30 | 1998-03-10 | Intel Corporation | Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer |
JP3330300B2 (ja) * | 1997-02-28 | 2002-09-30 | 東京エレクトロン株式会社 | 基板洗浄装置 |
JP3549141B2 (ja) * | 1997-04-21 | 2004-08-04 | 大日本スクリーン製造株式会社 | 基板処理装置および基板保持装置 |
JPH10314684A (ja) * | 1997-05-21 | 1998-12-02 | Speedfam Co Ltd | ディスク形ワークの洗浄方法及び装置 |
TW402737B (en) * | 1997-05-27 | 2000-08-21 | Tokyo Electron Ltd | Cleaning/drying device and method |
US6336845B1 (en) | 1997-11-12 | 2002-01-08 | Lam Research Corporation | Method and apparatus for polishing semiconductor wafers |
US6062240A (en) * | 1998-03-06 | 2000-05-16 | Tokyo Electron Limited | Treatment device |
JP3563605B2 (ja) * | 1998-03-16 | 2004-09-08 | 東京エレクトロン株式会社 | 処理装置 |
US6261378B1 (en) * | 1998-03-23 | 2001-07-17 | Tokyo Electron Limited | Substrate cleaning unit and cleaning method |
JP3314032B2 (ja) * | 1998-04-28 | 2002-08-12 | 東京エレクトロン株式会社 | 処理装置 |
JP2000180469A (ja) * | 1998-12-18 | 2000-06-30 | Fujitsu Ltd | 半導体装置用コンタクタ及び半導体装置用コンタクタを用いた試験装置及び半導体装置用コンタクタを用いた試験方法及び半導体装置用コンタクタのクリーニング方法 |
DE19859466C2 (de) * | 1998-12-22 | 2002-04-25 | Steag Micro Tech Gmbh | Vorrichtung und Verfahren zum Behandeln von Substraten |
US6290780B1 (en) * | 1999-03-19 | 2001-09-18 | Lam Research Corporation | Method and apparatus for processing a wafer |
US6711775B2 (en) * | 1999-06-10 | 2004-03-30 | Lam Research Corporation | System for cleaning a semiconductor wafer |
JP3990073B2 (ja) * | 1999-06-17 | 2007-10-10 | 株式会社荏原製作所 | 基板洗浄装置及び基板洗浄方法 |
US6620257B1 (en) * | 1999-06-30 | 2003-09-16 | Hoya Corporation | Scrub cleaning method for substrate and manufacturing method for information recording medium |
EP1192642A1 (de) * | 1999-07-01 | 2002-04-03 | Lam Research Corporation | Spül-, schleuder-, trocknungsstation mit einer verstellbaren düsenanordnung zum spülen von halbleiterwaferrückseiten |
US6516815B1 (en) * | 1999-07-09 | 2003-02-11 | Applied Materials, Inc. | Edge bead removal/spin rinse dry (EBR/SRD) module |
KR20010037210A (ko) * | 1999-10-14 | 2001-05-07 | 구본준, 론 위라하디락사 | 기판 세정 장치 및 기판 세정 방법 |
US6676757B2 (en) * | 1999-12-17 | 2004-01-13 | Tokyo Electron Limited | Coating film forming apparatus and coating unit |
US6431959B1 (en) * | 1999-12-20 | 2002-08-13 | Lam Research Corporation | System and method of defect optimization for chemical mechanical planarization of polysilicon |
US6659116B1 (en) | 2000-06-26 | 2003-12-09 | Lam Research Corporation | System for wafer carrier in-process clean and rinse |
US6505636B1 (en) | 2000-06-26 | 2003-01-14 | Lam Research Corporation | Apparatus for wafer carrier in-process clean and rinse |
TW564200B (en) * | 2000-11-09 | 2003-12-01 | Fujikoshi Machinery Corp | Method of cleaning abrasive plates of abrasive machine and cleaning device |
US6725868B2 (en) * | 2000-11-14 | 2004-04-27 | Tokyo Electron Limited | Liquid processing apparatus |
KR100887360B1 (ko) * | 2001-01-23 | 2009-03-06 | 도쿄엘렉트론가부시키가이샤 | 기판처리장치 및 기판처리방법 |
JP4101609B2 (ja) * | 2001-12-07 | 2008-06-18 | 大日本スクリーン製造株式会社 | 基板処理方法 |
US6824612B2 (en) | 2001-12-26 | 2004-11-30 | Applied Materials, Inc. | Electroless plating system |
US6770565B2 (en) | 2002-01-08 | 2004-08-03 | Applied Materials Inc. | System for planarizing metal conductive layers |
CN1303652C (zh) * | 2002-09-04 | 2007-03-07 | 旺宏电子股份有限公司 | 半导体晶圆的清洗方法 |
KR100562502B1 (ko) * | 2003-07-02 | 2006-03-21 | 삼성전자주식회사 | 반도체 기판의 가장자리부 처리 장치 및 방법 |
CN100447942C (zh) * | 2004-11-03 | 2008-12-31 | 力晶半导体股份有限公司 | 半导体机器的晶片载台清洁夹具 |
US20060266793A1 (en) * | 2005-05-24 | 2006-11-30 | Caterpillar Inc. | Purging system having workpiece movement device |
JP4861016B2 (ja) * | 2006-01-23 | 2012-01-25 | 株式会社東芝 | 処理装置 |
JP5034262B2 (ja) * | 2006-02-24 | 2012-09-26 | 富士通セミコンダクター株式会社 | 研磨装置および研磨方法 |
KR100892809B1 (ko) * | 2006-03-30 | 2009-04-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
US9514972B2 (en) * | 2008-05-28 | 2016-12-06 | Air Products And Chemicals, Inc. | Fixture drying apparatus and method |
JP2010114123A (ja) * | 2008-11-04 | 2010-05-20 | Tokyo Electron Ltd | 基板処理装置及び基板洗浄方法 |
US20100163078A1 (en) * | 2008-12-31 | 2010-07-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Spinner and method of cleaning substrate using the spinner |
JP2011023618A (ja) * | 2009-07-17 | 2011-02-03 | Disco Abrasive Syst Ltd | ウエーハ洗浄装置 |
CN102198447B (zh) * | 2011-03-01 | 2013-03-27 | 银邦金属复合材料股份有限公司 | 新型的串动式刷辊结构 |
JP6113960B2 (ja) * | 2012-02-21 | 2017-04-12 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
MY160764A (en) * | 2012-02-21 | 2017-03-15 | Invenpro (M) Sdn Bhd | An apparatus for cleaning a substrate |
JP5886224B2 (ja) * | 2012-05-23 | 2016-03-16 | 株式会社荏原製作所 | 基板洗浄方法 |
KR20140061691A (ko) * | 2012-11-14 | 2014-05-22 | 삼성전자주식회사 | 웨이퍼 홀더 클리닝 장치 및 이를 구비하는 성막 시스템 |
CN106216286B (zh) * | 2016-08-26 | 2018-07-10 | 无锡市新达轻工机械有限公司 | 一种具有可调节毛刷位置功能的皮革除尘器 |
JP7041011B2 (ja) * | 2018-06-22 | 2022-03-23 | 株式会社スギノマシン | 乾燥機 |
CN109731825A (zh) * | 2018-12-29 | 2019-05-10 | 天长市龙亨电子有限公司 | 一种电动车控制器原料清洁设备 |
US11633833B2 (en) | 2019-05-29 | 2023-04-25 | Applied Materials, Inc. | Use of steam for pre-heating of CMP components |
US11628478B2 (en) * | 2019-05-29 | 2023-04-18 | Applied Materials, Inc. | Steam cleaning of CMP components |
TW202110575A (zh) | 2019-05-29 | 2021-03-16 | 美商應用材料股份有限公司 | 用於化學機械研磨系統的蒸氣處置站 |
CN110369371B (zh) * | 2019-07-23 | 2024-05-07 | 天津中环领先材料技术有限公司 | 一种大尺寸硅圆片清洗装置及其清洗工艺 |
CN110813908A (zh) * | 2019-11-08 | 2020-02-21 | 上海华力微电子有限公司 | 清扫装置及清扫方法 |
CN111765745A (zh) * | 2020-07-10 | 2020-10-13 | 李峰 | 一种用于芯片覆晶的恒温烘烤装置 |
CN112161450A (zh) * | 2020-09-14 | 2021-01-01 | 江苏晶品新能源科技有限公司 | 一种单晶硅片干燥用烘干均匀的烘箱 |
CN112405174A (zh) * | 2020-11-11 | 2021-02-26 | 王汀芷 | 一种用于阀门的阀门清理装置 |
CN112742770A (zh) * | 2020-12-29 | 2021-05-04 | 苏州诺亚智造科技有限公司 | 一种过炉模具自动清洁装置 |
CN114111281B (zh) * | 2021-11-26 | 2023-05-12 | 盐城矽润半导体有限公司 | 一种半导体晶片加工用氮气烘干设备 |
CN114799622B (zh) * | 2022-03-10 | 2024-04-05 | 徐州华达融达信息科技有限公司 | 一种石英晶体谐振器晶片的封焊装置 |
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-
1991
- 1991-06-06 JP JP3160904A patent/JPH04363022A/ja active Pending
-
1992
- 1992-05-20 DE DE69207268T patent/DE69207268T2/de not_active Expired - Fee Related
- 1992-05-20 EP EP92108511A patent/EP0517033B1/de not_active Expired - Lifetime
- 1992-06-03 KR KR1019920009628A patent/KR960012623B1/ko not_active IP Right Cessation
- 1992-06-05 US US07/893,775 patent/US5351360A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69207268D1 (de) | 1996-02-15 |
EP0517033A1 (de) | 1992-12-09 |
JPH04363022A (ja) | 1992-12-15 |
KR960012623B1 (ko) | 1996-09-23 |
US5351360A (en) | 1994-10-04 |
KR930001331A (ko) | 1993-01-16 |
EP0517033B1 (de) | 1996-01-03 |
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