KR940008663U - 웨이퍼의 배면세정장치 - Google Patents

웨이퍼의 배면세정장치

Info

Publication number
KR940008663U
KR940008663U KR2019920017658U KR920017658U KR940008663U KR 940008663 U KR940008663 U KR 940008663U KR 2019920017658 U KR2019920017658 U KR 2019920017658U KR 920017658 U KR920017658 U KR 920017658U KR 940008663 U KR940008663 U KR 940008663U
Authority
KR
South Korea
Prior art keywords
cleaning device
wafer back
back cleaning
wafer
cleaning
Prior art date
Application number
KR2019920017658U
Other languages
English (en)
Other versions
KR0127366Y1 (ko
Inventor
변석호
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019920017658U priority Critical patent/KR0127366Y1/ko
Publication of KR940008663U publication Critical patent/KR940008663U/ko
Application granted granted Critical
Publication of KR0127366Y1 publication Critical patent/KR0127366Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR2019920017658U 1992-09-17 1992-09-17 웨이퍼의 배면세정장치 KR0127366Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019920017658U KR0127366Y1 (ko) 1992-09-17 1992-09-17 웨이퍼의 배면세정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019920017658U KR0127366Y1 (ko) 1992-09-17 1992-09-17 웨이퍼의 배면세정장치

Publications (2)

Publication Number Publication Date
KR940008663U true KR940008663U (ko) 1994-04-21
KR0127366Y1 KR0127366Y1 (ko) 1998-12-01

Family

ID=19340213

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019920017658U KR0127366Y1 (ko) 1992-09-17 1992-09-17 웨이퍼의 배면세정장치

Country Status (1)

Country Link
KR (1) KR0127366Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100379998B1 (ko) * 2000-08-30 2003-04-14 한국디엔에스 주식회사 박판 처리 장치

Also Published As

Publication number Publication date
KR0127366Y1 (ko) 1998-12-01

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Legal Events

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E701 Decision to grant or registration of patent right
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