KR930001331A - 부착판 세정장치 - Google Patents

부착판 세정장치 Download PDF

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Publication number
KR930001331A
KR930001331A KR1019920009628A KR920009628A KR930001331A KR 930001331 A KR930001331 A KR 930001331A KR 1019920009628 A KR1019920009628 A KR 1019920009628A KR 920009628 A KR920009628 A KR 920009628A KR 930001331 A KR930001331 A KR 930001331A
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KR
South Korea
Prior art keywords
attachment plate
cleaning device
brush
rotated
plate cleaning
Prior art date
Application number
KR1019920009628A
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English (en)
Other versions
KR960012623B1 (ko
Inventor
시즈오 수즈키
노리요시 요코수카
Original Assignee
엔야 료오조오
카부시키가이샤 엔야시스템
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 엔야 료오조오, 카부시키가이샤 엔야시스템 filed Critical 엔야 료오조오
Publication of KR930001331A publication Critical patent/KR930001331A/ko
Application granted granted Critical
Publication of KR960012623B1 publication Critical patent/KR960012623B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
    • F26B11/18—Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

요약 없음.

Description

부착판 세정장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는, 본 발명의 한 실시예를 개략적으로 표시한 구성도이다.
제 2 도는, 본체의 상부를 개방한 상태에서의 평면도이다.
제 3 도는, 본체의 측면도이다.
제 4 도는, 지지 로울러의 한 부분을 절단한 단면 정면도이다.
제 5 도는, 지지 로울러의 일부분의 측면도이다.
제 6 도는, 구동로울러부의 정면도이다.
제 7 도는, 레일부분을 확대한 단면 측면도이다.
제 8 도는, 상면 세정브러시부의 정면도이다.
제 9 도는, 하면 세정브러시부의 정면도이다.
제10도는, 측면 세정브러시부의 정면도이다.
제11도는, 상노즐부의 정면도이다.
제12도는, 상노즐부의 측면도이다.
제13도는, 하노즐부의 정면도이다.
*도면의 주요부분에 대한 부호의 설명
1 : 본체6 : 웨이퍼 부착판
7 : 지지 로울러8 : 가대
29 : 구동 로울러31 : 상면 세정브러시
32 : 하면 세정브러시33 : 측면 세정브러시

Claims (2)

  1. 부착판(6)의 하면을 지지 로울러(7) 위에서 지지하여 회전가능하도록 한 상태에서, 부착판(7)을 회전시키면서, 그 부착판(6)의 상면, 하면 및 외주 측면에 각각의 상면 세정브러시(31), 하면 세정브러시(32) 및 측면 세정브러시(33)를 동시에 접촉시켜서, 상기한 부착판의 각 면을 동시에 브러싱 세정한 후, 그 부착판에 기체를 분사하여 건조시키는 것을 특징으로 하는, 부착판 세정장치.
  2. 제 1 항에 있어서, 상기한 지지 로울러(7)위에 지지된 부착판(6)의 외주 측면에 구동 로울러(29)를 접촉시켜서, 부착판(6)을 회전시키는 것을 특징으로 하는, 부착판 세정장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920009628A 1991-06-06 1992-06-03 부착판 세정장치 KR960012623B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3160904A JPH04363022A (ja) 1991-06-06 1991-06-06 貼付板洗浄装置
JP91-0160904 1991-06-06
JP91-160904 1991-06-06

Publications (2)

Publication Number Publication Date
KR930001331A true KR930001331A (ko) 1993-01-16
KR960012623B1 KR960012623B1 (ko) 1996-09-23

Family

ID=15724859

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920009628A KR960012623B1 (ko) 1991-06-06 1992-06-03 부착판 세정장치

Country Status (5)

Country Link
US (1) US5351360A (ko)
EP (1) EP0517033B1 (ko)
JP (1) JPH04363022A (ko)
KR (1) KR960012623B1 (ko)
DE (1) DE69207268T2 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010037210A (ko) * 1999-10-14 2001-05-07 구본준, 론 위라하디락사 기판 세정 장치 및 기판 세정 방법
KR100417648B1 (ko) * 1996-12-28 2004-04-06 주식회사 하이닉스반도체 웨이퍼 세정방법

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EP0517033A1 (en) 1992-12-09
DE69207268D1 (de) 1996-02-15
EP0517033B1 (en) 1996-01-03
US5351360A (en) 1994-10-04
DE69207268T2 (de) 1996-05-15
JPH04363022A (ja) 1992-12-15
KR960012623B1 (ko) 1996-09-23

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