DE602005005366D1 - Elektromagnetisches Abschirmgehäuse und Verfahren zur Herstellung - Google Patents
Elektromagnetisches Abschirmgehäuse und Verfahren zur HerstellungInfo
- Publication number
- DE602005005366D1 DE602005005366D1 DE602005005366T DE602005005366T DE602005005366D1 DE 602005005366 D1 DE602005005366 D1 DE 602005005366D1 DE 602005005366 T DE602005005366 T DE 602005005366T DE 602005005366 T DE602005005366 T DE 602005005366T DE 602005005366 D1 DE602005005366 D1 DE 602005005366D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- electromagnetic shielding
- shielding housing
- housing
- electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0069—Methods for measuring the shielding efficiency; Apparatus therefor; Isolation container for testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
- H01F1/153—Amorphous metallic alloys, e.g. glassy metals
- H01F1/15358—Making agglomerates therefrom, e.g. by pressing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004002995A JP4299152B2 (ja) | 2004-01-08 | 2004-01-08 | 電磁波シールドケースおよびその製造方法 |
JP2004002995 | 2004-01-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602005005366D1 true DE602005005366D1 (de) | 2008-04-30 |
DE602005005366T2 DE602005005366T2 (de) | 2009-04-16 |
Family
ID=34587703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005005366T Active DE602005005366T2 (de) | 2004-01-08 | 2005-01-05 | Elektromagnetisches Abschirmgehäuse und Verfahren zur Herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US7626832B2 (de) |
EP (1) | EP1553814B1 (de) |
JP (1) | JP4299152B2 (de) |
KR (1) | KR100648162B1 (de) |
CN (1) | CN100566531C (de) |
DE (1) | DE602005005366T2 (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10223170A1 (de) * | 2002-05-24 | 2003-12-18 | Siemens Ag | EMV-Abschirmung für elektronische Bauelemente und EMV-Gehäuse |
DE10309949A1 (de) * | 2003-03-07 | 2004-09-16 | Robert Bosch Gmbh | HF-Modul und Verfahren zu dessen Aufbau |
FI20035178A (fi) * | 2003-10-03 | 2005-04-04 | Nokia Corp | Häiriösuojattu matkaviestin sekä vastaava menetelmä ja järjestely matkaviestimen häiriösuojauksessa |
TWI283806B (en) * | 2005-06-07 | 2007-07-11 | Htc Corp | Portable electronic device |
KR100719478B1 (ko) * | 2005-08-08 | 2007-05-18 | 기가 바이트 테크놀러지 컴퍼니 리미티드 | 전자파 간섭 억제 모듈 |
JP2007299799A (ja) * | 2006-04-27 | 2007-11-15 | Kyocera Corp | 電子機器 |
US7310067B1 (en) * | 2006-05-23 | 2007-12-18 | Research In Motion Limited | Mobile wireless communications device with reduced interfering RF energy into RF metal shield secured on circuit board |
FR2904752B1 (fr) * | 2006-08-03 | 2014-07-11 | Johnson Controls Tech Co | Boitier de composants electroniques et procede de montage du boitier |
CN200947722Y (zh) * | 2006-08-29 | 2007-09-12 | 洪进富 | 防电磁干扰的遮蔽装置 |
KR100829754B1 (ko) * | 2007-03-02 | 2008-05-15 | 삼성에스디아이 주식회사 | 섀시 베이스와 회로기판의 체결구조 및 이를 구비한디스플레이 장치 |
US8218335B2 (en) * | 2007-07-11 | 2012-07-10 | Finisar Corporation | Spider clip for securing a circuit board within a communications module |
US8018734B2 (en) * | 2007-08-24 | 2011-09-13 | Novatel Wireless, Inc. | Electronic device and method of forming same |
US7751204B2 (en) * | 2007-08-24 | 2010-07-06 | Clint Wilber | Electromagnetic isolation shield |
JP5252264B2 (ja) * | 2007-10-12 | 2013-07-31 | Smc株式会社 | 流体用積層構造体 |
US20090231825A1 (en) * | 2008-03-14 | 2009-09-17 | Universal Scientific Industrial Co., Ltd. | Electromagnetic shielding device |
US20100019977A1 (en) * | 2008-07-28 | 2010-01-28 | Auden Techno Corporation | Antenna test apparatus |
CN101729087A (zh) * | 2008-10-21 | 2010-06-09 | 深圳富泰宏精密工业有限公司 | 无线通信装置 |
JP5442990B2 (ja) * | 2008-12-24 | 2014-03-19 | 京セラ株式会社 | 回路装置の製造方法及び電子機器の製造方法 |
JP5593714B2 (ja) * | 2010-01-29 | 2014-09-24 | 富士通株式会社 | 電子素子のシールド構造及びこれを備えた電子装置 |
JP2011209683A (ja) * | 2010-03-12 | 2011-10-20 | Sumitomo Electric Device Innovations Inc | 光トランシーバ |
KR101483811B1 (ko) * | 2010-03-19 | 2015-01-16 | 주식회사 엘지화학 | 고강도의 벌크 비정질 합금 셀 커버 및 이를 포함하는 전지팩 |
US8638568B2 (en) * | 2010-08-27 | 2014-01-28 | Steering Solutions Ip Holding Corporation | Mounted circuit card assembly |
TW201225752A (en) * | 2010-12-10 | 2012-06-16 | Askey Computer Corp | Printed circuit board grounding structure for use with communication apparatus |
JP5830858B2 (ja) * | 2010-12-24 | 2015-12-09 | 株式会社豊田自動織機 | 電子機器 |
KR20130025118A (ko) * | 2011-09-01 | 2013-03-11 | 현대자동차주식회사 | 전자파 차단 케이스 |
US9155188B2 (en) * | 2011-11-04 | 2015-10-06 | Apple Inc. | Electromagnetic interference shielding techniques |
US9531058B2 (en) * | 2011-12-20 | 2016-12-27 | Pulse Finland Oy | Loosely-coupled radio antenna apparatus and methods |
JP6083317B2 (ja) * | 2013-05-15 | 2017-02-22 | 富士通株式会社 | シールドケースおよび電子機器 |
KR20140142600A (ko) * | 2013-06-04 | 2014-12-12 | 삼성전자주식회사 | 전자 기기의 보호 장치 및 그를 구비하는 전자 기기 |
TWI572150B (zh) * | 2014-10-20 | 2017-02-21 | 財團法人資訊工業策進會 | 信號發射裝置、訊息產生系統與信號功率調整方法 |
EP3307036B1 (de) * | 2015-06-04 | 2021-08-11 | Huawei Technologies Co., Ltd. | Mobiles endgerät und wärmeableitungsabschirmstruktur |
KR20170012960A (ko) | 2015-07-27 | 2017-02-06 | 삼성전자주식회사 | 전자파 차폐 박막 및 그 형성방법 |
CN108140773B (zh) * | 2015-12-09 | 2020-09-18 | 株式会社Lg化学 | 电池组和包括电池组的车辆 |
KR102452781B1 (ko) * | 2015-12-15 | 2022-10-12 | 삼성전자주식회사 | 차폐 구조를 포함하는 전자 장치 |
CN205430760U (zh) * | 2016-02-02 | 2016-08-03 | 京东方科技集团股份有限公司 | 一种印刷线路板的支撑结构 |
CN105704273B (zh) * | 2016-03-31 | 2019-05-21 | 努比亚技术有限公司 | 一种屏蔽框及终端 |
DE102016211018A1 (de) | 2016-06-21 | 2017-12-21 | Continental Teves Ag & Co. Ohg | Verfahren zur Herstellung eines Behälters |
CN106170199B (zh) * | 2016-08-31 | 2023-01-20 | 广东虹勤通讯技术有限公司 | 一种散热屏蔽***及通信产品 |
JP7197274B2 (ja) * | 2018-02-16 | 2022-12-27 | トヨタ自動車株式会社 | 放熱筐体構造 |
IT201800007357A1 (it) * | 2018-07-19 | 2020-01-19 | Dispositivo individuale di schermatura | |
KR102553021B1 (ko) * | 2018-12-18 | 2023-07-07 | 삼성전자주식회사 | 전자장치 하우징 및 이를 구비하는 전자 시스템 |
JP7425432B2 (ja) * | 2019-01-28 | 2024-01-31 | 国立研究開発法人宇宙航空研究開発機構 | メッシュ構造体およびその製造方法、アンテナ反射鏡、電磁シールド材、導波管 |
JP7381219B2 (ja) * | 2019-04-23 | 2023-11-15 | 日立Astemo株式会社 | 電子制御装置 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4340770A (en) * | 1979-09-21 | 1982-07-20 | Allied Corporation | Enhancement of the magnetic permeability in glassy metal shielding |
DE3364158D1 (en) | 1982-04-15 | 1986-07-24 | Allied Corp | Apparatus for the production of magnetic powder |
US5045637A (en) * | 1988-01-14 | 1991-09-03 | Nippon Steel Corp. | Magnetic shielding material |
US5536905A (en) * | 1994-04-04 | 1996-07-16 | Motorola, Inc. | Self secured housing for electronics |
EP0727932B1 (de) * | 1994-11-28 | 1999-04-07 | Kabushiki Kaisha Toshiba | Gehäuse mit elektromagnetischer Abschirmung |
US5521609A (en) * | 1995-01-13 | 1996-05-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Magnetic antenna using metallic glass |
FR2737068B1 (fr) * | 1995-07-18 | 1997-10-03 | Alcatel Mobile Comm France | Appareil de communication avec protection electrostatique |
US5748455A (en) * | 1996-04-23 | 1998-05-05 | Ericsson, Inc. | Electromagnetic shield for a radiotelephone |
DE69706850T2 (de) * | 1996-06-13 | 2002-05-16 | Siemens Ag | Artikel mit schutzschicht, enthaltend eine verbesserte verankerungsschicht und seine herstellung |
JPH1112490A (ja) | 1997-06-27 | 1999-01-19 | Nittetsu Mining Co Ltd | グリーン色系顔料及びその製造方法 |
JPH1171656A (ja) | 1997-08-29 | 1999-03-16 | Alps Electric Co Ltd | 電磁シールド用網および電磁シールド用シート |
JP3852809B2 (ja) | 1998-10-30 | 2006-12-06 | 独立行政法人科学技術振興機構 | 高強度・高靭性Zr系非晶質合金 |
JP3916332B2 (ja) | 1998-12-15 | 2007-05-16 | 独立行政法人科学技術振興機構 | 高耐食性Zr系非晶質合金 |
SE515448C2 (sv) | 1999-02-09 | 2001-08-06 | Ericsson Telefon Ab L M | Anordning för elektromagnetisk skärmning i en elektrisk enhet |
US6292373B1 (en) * | 1999-07-23 | 2001-09-18 | 3Com Corporation | Electromagnetic interference (EMI) shield for a disk drive |
US6271465B1 (en) * | 1999-08-31 | 2001-08-07 | Nokia Mobile Phones Limited | Low cost conformal EMI/RFI shield |
FR2806019B1 (fr) | 2000-03-10 | 2002-06-14 | Inst Nat Polytech Grenoble | Procede de moulage-formage d'au moins une piece en un verre metallique |
AU2001268480A1 (en) | 2000-06-20 | 2002-01-02 | Laird Technologies, Inc. | Shielding cover with integral resilient ribs |
WO2002052916A1 (en) | 2000-12-21 | 2002-07-04 | Shielding For Electronics, Inc. | Emi and rfi containment enclosure for electronic devices |
US20020113380A1 (en) * | 2001-02-02 | 2002-08-22 | Clark Cary R. | Hybrid superelastic shape memory alloy seal |
US6524120B2 (en) * | 2001-03-22 | 2003-02-25 | Mobicom Corp. | Article comprising EMI shielding |
EP1410707A1 (de) | 2001-07-26 | 2004-04-21 | Rosti, A/S | Shields für komponenten auf leiterplatten |
JP2003179379A (ja) | 2001-12-11 | 2003-06-27 | Ngk Insulators Ltd | 筐体付き回路基板におけるシールドケースの設置構造 |
JP2003179378A (ja) | 2001-12-11 | 2003-06-27 | Ngk Insulators Ltd | シールドケースの回路基板における設置構造 |
US6683796B2 (en) * | 2002-01-09 | 2004-01-27 | Sun Microsystems, Inc. | Apparatus for containing electromagnetic interference |
JP3960156B2 (ja) * | 2002-07-19 | 2007-08-15 | 千住金属工業株式会社 | 板状基板封止用リッドの製造方法 |
US7090733B2 (en) * | 2003-06-17 | 2006-08-15 | The Regents Of The University Of California | Metallic glasses with crystalline dispersions formed by electric currents |
US7507078B2 (en) * | 2006-12-21 | 2009-03-24 | The Goodyear Tire & Rubber Company | Flexible molding device for molding a sunk groove, a sunk blade, and a large keyhole sipe in tire tread |
-
2004
- 2004-01-08 JP JP2004002995A patent/JP4299152B2/ja not_active Expired - Fee Related
- 2004-12-29 US US11/025,794 patent/US7626832B2/en not_active Expired - Fee Related
-
2005
- 2005-01-05 EP EP05000119A patent/EP1553814B1/de not_active Expired - Fee Related
- 2005-01-05 DE DE602005005366T patent/DE602005005366T2/de active Active
- 2005-01-07 KR KR1020050001461A patent/KR100648162B1/ko not_active IP Right Cessation
- 2005-01-10 CN CNB2005100038086A patent/CN100566531C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE602005005366T2 (de) | 2009-04-16 |
CN100566531C (zh) | 2009-12-02 |
JP2005197510A (ja) | 2005-07-21 |
JP4299152B2 (ja) | 2009-07-22 |
EP1553814A1 (de) | 2005-07-13 |
KR100648162B1 (ko) | 2006-11-27 |
EP1553814B1 (de) | 2008-03-19 |
KR20050073407A (ko) | 2005-07-13 |
CN1658747A (zh) | 2005-08-24 |
US20050162842A1 (en) | 2005-07-28 |
US7626832B2 (en) | 2009-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8381 | Inventor (new situation) |
Inventor name: KIMURA, HISAMICHI, WATARI-GUN MIYAGI-KEN 989-2, JP Inventor name: ZHANG, TAO, 37, XUEYUANLU BEIJING-CITY 100083, CN Inventor name: INOUE, AKIHISA, AOBA-KU SENDAI-CITY MIYAGI-KEN, JP Inventor name: MURAMATSU, NAOKUNI, NAGOYA-SHI AICHI-KEN, JP |
|
8364 | No opposition during term of opposition |