CN1198327C - 半导体衬底夹具和半导体器件的制造方法 - Google Patents
半导体衬底夹具和半导体器件的制造方法 Download PDFInfo
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- CN1198327C CN1198327C CNB021059764A CN02105976A CN1198327C CN 1198327 C CN1198327 C CN 1198327C CN B021059764 A CNB021059764 A CN B021059764A CN 02105976 A CN02105976 A CN 02105976A CN 1198327 C CN1198327 C CN 1198327C
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- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Fluid Mechanics (AREA)
- Quality & Reliability (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2001322811A JP3892703B2 (ja) | 2001-10-19 | 2001-10-19 | 半導体基板用治具及びこれを用いた半導体装置の製造方法 |
JP322811/2001 | 2001-10-19 |
Publications (2)
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CN1412830A CN1412830A (zh) | 2003-04-23 |
CN1198327C true CN1198327C (zh) | 2005-04-20 |
Family
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CNB021059764A Expired - Fee Related CN1198327C (zh) | 2001-10-19 | 2002-04-12 | 半导体衬底夹具和半导体器件的制造方法 |
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US (5) | US6750074B2 (zh) |
EP (4) | EP1304728B1 (zh) |
JP (1) | JP3892703B2 (zh) |
KR (3) | KR100852655B1 (zh) |
CN (1) | CN1198327C (zh) |
DE (3) | DE60236470D1 (zh) |
TW (1) | TWI280630B (zh) |
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DE60236470D1 (de) | 2010-07-01 |
KR20070093929A (ko) | 2007-09-19 |
US6750074B2 (en) | 2004-06-15 |
US20050221589A1 (en) | 2005-10-06 |
EP2058853A1 (en) | 2009-05-13 |
JP3892703B2 (ja) | 2007-03-14 |
EP2058850B1 (en) | 2010-05-19 |
EP2058850A2 (en) | 2009-05-13 |
KR100852655B1 (ko) | 2008-08-18 |
US7109561B2 (en) | 2006-09-19 |
US20040161882A1 (en) | 2004-08-19 |
EP1304728A2 (en) | 2003-04-23 |
EP2053633A1 (en) | 2009-04-29 |
EP2058853B1 (en) | 2010-11-17 |
US7571538B2 (en) | 2009-08-11 |
CN1412830A (zh) | 2003-04-23 |
DE60234303D1 (de) | 2009-12-24 |
KR20030035775A (ko) | 2003-05-09 |
EP1304728A3 (en) | 2006-09-13 |
EP2058850A3 (en) | 2009-06-03 |
EP1304728B1 (en) | 2009-11-11 |
US20050221588A1 (en) | 2005-10-06 |
US6902944B2 (en) | 2005-06-07 |
US20030077854A1 (en) | 2003-04-24 |
US7395847B2 (en) | 2008-07-08 |
JP2003133395A (ja) | 2003-05-09 |
DE60238361D1 (de) | 2010-12-30 |
KR20070092935A (ko) | 2007-09-14 |
US20050221587A1 (en) | 2005-10-06 |
KR100830111B1 (ko) | 2008-05-20 |
TWI280630B (en) | 2007-05-01 |
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