CN116190284A - 一种晶粒的全自动倒膜镭射一体设备及使用方法 - Google Patents
一种晶粒的全自动倒膜镭射一体设备及使用方法 Download PDFInfo
- Publication number
- CN116190284A CN116190284A CN202310467865.8A CN202310467865A CN116190284A CN 116190284 A CN116190284 A CN 116190284A CN 202310467865 A CN202310467865 A CN 202310467865A CN 116190284 A CN116190284 A CN 116190284A
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- Prior art keywords
- module
- iron ring
- film
- clamping
- wafer
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- 239000013078 crystal Substances 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 123
- 238000000605 extraction Methods 0.000 claims abstract description 48
- 238000003825 pressing Methods 0.000 claims abstract description 27
- 238000004080 punching Methods 0.000 claims abstract description 13
- 230000007306 turnover Effects 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 12
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 230000000007 visual effect Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000007689 inspection Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Laser Beam Processing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310467865.8A CN116190284B (zh) | 2023-04-27 | 2023-04-27 | 一种晶粒的全自动倒膜镭射一体设备及使用方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202310467865.8A CN116190284B (zh) | 2023-04-27 | 2023-04-27 | 一种晶粒的全自动倒膜镭射一体设备及使用方法 |
Publications (2)
Publication Number | Publication Date |
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CN116190284A true CN116190284A (zh) | 2023-05-30 |
CN116190284B CN116190284B (zh) | 2023-08-04 |
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CN202310467865.8A Active CN116190284B (zh) | 2023-04-27 | 2023-04-27 | 一种晶粒的全自动倒膜镭射一体设备及使用方法 |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN204946921U (zh) * | 2015-09-18 | 2016-01-06 | 安徽三安光电有限公司 | 一种具有倒膜、扩膜功能的一体机 |
CN205790042U (zh) * | 2016-06-02 | 2016-12-07 | 天津三安光电有限公司 | 一种具有倒膜、分片功能的一体机 |
CN109065482A (zh) * | 2018-08-09 | 2018-12-21 | 深圳市华腾半导体设备有限公司 | 一种芯片分选机构及其芯片分选方法 |
CN111785823A (zh) * | 2020-08-06 | 2020-10-16 | 湘能华磊光电股份有限公司 | 一种先进的led晶粒分选及倒膜装置 |
CN114435662A (zh) * | 2022-01-29 | 2022-05-06 | 苏州镭明激光科技有限公司 | 一种倒膜设备 |
KR20220160507A (ko) * | 2021-05-27 | 2022-12-06 | (주)한국바이오셀프 | 미소입자 분리장치 및 이를 이용한 미소입자 분리방법 |
CN218024148U (zh) * | 2022-07-04 | 2022-12-13 | 福建兆元光电有限公司 | 一种芯片自动倒膜装置 |
WO2023274207A1 (zh) * | 2021-06-29 | 2023-01-05 | 深圳中科四合科技有限公司 | 一种芯片倒膜方法和芯片倒膜设备 |
-
2023
- 2023-04-27 CN CN202310467865.8A patent/CN116190284B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN204946921U (zh) * | 2015-09-18 | 2016-01-06 | 安徽三安光电有限公司 | 一种具有倒膜、扩膜功能的一体机 |
CN205790042U (zh) * | 2016-06-02 | 2016-12-07 | 天津三安光电有限公司 | 一种具有倒膜、分片功能的一体机 |
CN109065482A (zh) * | 2018-08-09 | 2018-12-21 | 深圳市华腾半导体设备有限公司 | 一种芯片分选机构及其芯片分选方法 |
CN111785823A (zh) * | 2020-08-06 | 2020-10-16 | 湘能华磊光电股份有限公司 | 一种先进的led晶粒分选及倒膜装置 |
KR20220160507A (ko) * | 2021-05-27 | 2022-12-06 | (주)한국바이오셀프 | 미소입자 분리장치 및 이를 이용한 미소입자 분리방법 |
WO2023274207A1 (zh) * | 2021-06-29 | 2023-01-05 | 深圳中科四合科技有限公司 | 一种芯片倒膜方法和芯片倒膜设备 |
CN114435662A (zh) * | 2022-01-29 | 2022-05-06 | 苏州镭明激光科技有限公司 | 一种倒膜设备 |
CN218024148U (zh) * | 2022-07-04 | 2022-12-13 | 福建兆元光电有限公司 | 一种芯片自动倒膜装置 |
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CN116190284B (zh) | 2023-08-04 |
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Address after: Unit 1, 1st Floor, No. 670 Hong'an Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Applicant after: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Address before: Unit 1, 1st Floor, No. 670 Hong Road, Xiang'an Industrial Zone, Torch High tech Zone, Xiamen City, Fujian Province, 361000 Applicant before: COER AUTOMATION EQUIPMENT CO.,LTD. |
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CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A fully automatic film pouring laser integrated equipment for grains and its usage method Granted publication date: 20230804 Pledgee: Agricultural Bank of China Limited by Share Ltd. Xiamen Xiangan branch Pledgor: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Registration number: Y2024980005972 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |