CN113573506A

CN113573506A - PCB production process and PCB circuit board

Info

Publication number: CN113573506A
Application number: CN202110642212.XA
Authority: CN
Inventors: 韩飞; 刘海峰; 肖树才; 曾鹏飞; 彭洪霞; 陈小勇
Original assignee: Shenzhen Shengdakang Technology Co ltd
Current assignee: Shenzhen Shengdakang Technology Co ltd
Priority date: 2021-06-09
Filing date: 2021-06-09
Publication date: 2021-10-29
Anticipated expiration: 2041-06-09
Also published as: CN113573506B

Abstract

The invention discloses a PCB production process and a PCB circuit board, wherein the process comprises marking an inner layer A code and a secondary outer layer B code for different layers of a PNL board, and uploading marking contents to a tracing system, wherein the inner layer A code and the secondary outer layer B code are identity information codes; reading the inner layer A code and the outer layer B code, and performing associated binding on information contained in the inner layer A code and the outer layer B code in a tracing system; reading the secondary outer layer B code and uploading the contained information to a tracing system, wherein the tracing system carries out coding according to a preset rule of the system to generate an outer layer C code and sends the outer layer C code to a laser coding machine or a mechanical drilling machine; and printing codes on a SET board or a PCS board, uploading the procedures to the tracing system, and associating the codes with the outer layer C code.

Description

PCB production process and PCB circuit board

Technical Field

The invention relates to the field of PCB manufacturing, in particular to a PCB production process and a PCB circuit board.

Background

The information tracing of the PCB is managed and controlled according to a large batch, and the PCB of the same batch uses a number string, usually five digits. However, the existing PCB has the following disadvantages:

the reason for the product problem is traced back to a serious challenge for manufacturers in every industry, from the automobile manufacturing industry to the aerospace industry, and from the medical industry to the food industry. In a global era, enterprises pursue relationship management to maximize customer satisfaction. Consumer and environmental regulations are becoming more stringent and traceability is becoming more necessary.

Manufacturers seek to maximize production capacity and to reduce costs at all times. To achieve this goal, each process in the overall manufacturing flow must be monitored and a complete history maintained. Problems affecting product quality must be quickly identified and corrected to prevent defective products from continuing to flow down the production line with the ultimate goal of achieving a zero product return rate as much as possible. In the electronics industry, PCB production also needs to meet customer traceability requirements, and when finding a problem, customers want to be able to quickly locate the cause of the problem and the range of affected products.

Earlier, in the whole production process, in order to check batches, the numerical string must be identified through manual visual inspection, the plate turning operation times of the plate making are increased, redundant actions are generated, and the rejection and confusion risks of the plate making are increased. After confusion, the equipment cannot be automatically identified and can only be checked manually. Before manual detection, the confused production and quality information does not correspond to the ID number of the PCB, so that information tracing is difficult or information misleading is caused during tracing. In addition, the tracing data is not fine enough according to large-batch management and control, the information of each specific unit block cannot be tracked, a large amount of production and quality data paper file record reports are increased, the workload of operators and the report storage space are increased, the time and labor are wasted when the records of the paper sheets are inquired, the paper sheets are stored with certain timeliness, and the inquiry is difficult after the storage period.

At present, the basic process flow of the multilayer PCB is as follows: the method comprises the steps of cutting, inner layer circuit, inner layer AOI (Automatic optical Inspection), pressing, drilling, copper plating, outer layer circuit, outer layer AOI, solder welding, character processing, forming, electrical testing, FQC/FQA and packaging. In order to realize quality tracing, in the whole manufacturing process, a PCB factory generally directly uses a two-dimensional code as an information carrier to be sprayed on a board surface, and a scanning gun is used for reading information of the two-dimensional code and adding new processing information into the two-dimensional code in each process.

The prior art is therefore still subject to further development.

Disclosure of Invention

Aiming at the technical problem, the invention provides a PCB production process and a PCB circuit board.

In a first aspect of the embodiments of the present invention, a PCB production process is provided, including:

marking an inner layer A code and a secondary outer layer B code for different layers of the PNL board, and uploading marking contents to a tracing system, wherein the inner layer A code and the secondary outer layer B code are identity information codes;

reading the inner layer A code and the outer layer B code, and performing associated binding on information contained in the inner layer A code and the outer layer B code in a tracing system;

reading the secondary outer layer B code and uploading the contained information to a tracing system, wherein the tracing system carries out coding according to a preset rule of the system to generate an outer layer C code and sends the outer layer C code to a laser coding machine or a mechanical drilling machine;

and printing codes on a SET board or a PCS board, uploading the procedures to the tracing system, and associating the codes with the outer layer C code.

Optionally, the process further comprises:

and adding a code reader at the board placing and collecting sections of each production process, reading and uploading the code of each PNL board, and recording the processing process parameters.

Optionally, the step of punching the inner layer a code for the PNL plate is performed after the production processes of cutting, fillet edging and cleaning.

Optionally, the inner layer B code printing for the PNL plate is performed after the combined melting and riveting production process.

Optionally, in the production process of combined melting, riveting and pre-stacking sections, the procedures of code reading and code binding are added; and identifying an inner layer A code and a secondary outer layer B code through a code reader during pre-stacking, wherein the inner layer A code and information contained in the outer layer B code are associated and bound in a tracing system.

Optionally, in the processes of target drilling and milling and conversion from X-RAY code reading to outer layer laser code engraving, the X-RAY secondary outer layer B code reading is added, the content is uploaded to a tracing system, and the tracing system performs coding according to a preset rule of the system to generate an outer layer C code and sends the outer layer C code to a laser coding machine or a mechanical coding machine.

Optionally, a laser coding machine or a mechanical drilling machine is added at the development, character screen printing and post-curing stages, and codes are coded on the SET board or the PCS board and uploaded to the tracing system.

Optionally, the tracing system includes a data acquisition system module, a code reading identification module, and a data connection module.

Optionally, the outer layer C code includes a location code and a data code; the preset rule is as follows:

the method adopts a 4-row multi-column layout, the outer layer C code comprises a positioning code and a data code, the positioning code comprises a start symbol and an end symbol, the data code is positioned between the start symbol and the end symbol, and the positioning code adopts 8421 codes.

In a first aspect of the embodiments of the present invention, a PCB circuit board is provided, which includes a PNL board, where an inner layer a code, a sub-inner layer B code, and an outer layer C code are engraved on the PNL board, the inner layer a code and the sub-inner layer B code are used to bind processing parameters of the PNL board, the outer layer C code is formed by converting the inner layer a code and the sub-inner layer B code, the outer layer C code adopts a 4-row multi-column layout, the outer layer C code includes a positioning code and a data code, the positioning code includes a start symbol and an end symbol, the data code is located between the start symbol and the end symbol, and the positioning code adopts 8421 codes.

According to the technical scheme provided by the invention, the production process parameters can be collected in the process flow of the PCB board produced and manufactured in a carving coding mode, and subdivision management is carried out, so that factory-level, workshop-level and site-level production control is realized, and traceability management can be carried out on the process data of each PCB board.

Drawings

Fig. 1 is a schematic flow chart of a PCB production process according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of a process flow and a management system of a PCB production process according to an embodiment of the invention.

Fig. 3 is a schematic diagram of a trace back hole code on a PCB in an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The traditional production process flow of the PCB is as follows: cutting, fillet edging, cleaning, pretreatment, coating baking, exposure, developing, etching, stripping, PE punching and browning, PP cutting and punching, combined melting/riveting and pre-stacking, typesetting and pressing, target drilling and cutting and grinding, X-RAY code reading and outer layer laser code carving and PIN feeding, drilling, PIN removing, deburring, cleaning and hole checking, glue removing, copper deposition and VCP, outer layer pretreatment, exposure and DES, online AOI and VRS, resistance welding pretreatment, silk screen printing ink and pre-baking, development, silk screen printing text and post-curing, PNL surface treatment, gong and cleaning, plate checking and tilting, and testing and AVI packaging.

The traditional production process uses laser engraving codes and PIN codes, so that the tracing of production process parameters cannot be well completed, and the flow of the whole production process needs to be realized by combining intelligent production.

Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a PCB production process according to an embodiment of the present invention. The production process of the PCB comprises the following steps:

s100: marking an inner layer A code and a secondary outer layer B code for different layers of the PNL board, and uploading marking contents to a tracing system, wherein the inner layer A code and the secondary outer layer B code are identity information codes.

Specifically, the inner layer code A can be manufactured by the laser of the laser marking machine on the inner layer in a laser mode of the laser marking machine, and the content is uploaded to a tracing system. The definition of the inner layer code A code in the tracing system is as follows: the standard two-dimensional code contains factory identification codes, work order codes, year cycle, serial numbers and the like. The inner layer A code is equivalent to an identity number assigned to each PNL board and is unique, and the processing technological parameters of the PNL board can be inquired in a tracing system only by scanning the inner layer A code in the pre-stacking process. According to the core boards with different layers, the inner layer A code and the A codes of other layers need to be printed at two different positions, namely the inner layer A code and the secondary outer layer B code, and the secondary outer layer B code is also an identity information code.

S200: and reading the inner layer A code and the outer layer B code, and performing association binding on information contained in the inner layer A code and the outer layer B code in a tracing system.

In the production and manufacturing process of the tracing system, the code reader can be used for reading the inner layer A code and the outer layer B code, the two codes are bound, the inner layer A code is bound to the secondary outer layer B code, the transcoding step is carried out, namely the fusion of all process steps of production process parameters is completed, and the tracing is convenient.

And S300, reading the secondary outer layer B code and uploading the contained information to a tracing system, wherein the tracing system carries out coding according to a preset rule of the system to generate an outer layer C code and sends the outer layer C code to a laser coding machine or a mechanical drilling machine.

And (3) cutting and grinding the drilling target, converting X-RAY code reading into outer layer laser code engraving, adding X-RAY secondary outer layer B code reading, uploading the content to a tracing system, coding by the tracing system according to a rule formulated by the system to generate an outer layer two-dimensional code C code, and issuing the outer layer two-dimensional code C code to a laser coding machine or a mechanical coding machine to drill an outer layer C code. The outer C code has two realization modes: one is laser two-dimensional code printing, and the other is mechanical drill two-dimensional code or 8421 code.

Taking a drilling 8421 code of a mechanical drilling machine as an example, the outer layer C code comprises a positioning code and a data code; the method adopts a 4-row multi-column layout, the positioning code comprises a start symbol and an end symbol, the positioning code is positioned between the start symbol and the end symbol, and the positioning code adopts 8421 codes.

Of course, the C code may be generated by a two-dimensional code method.

S400: and printing codes on a SET board or a PCS board, uploading the procedures to the tracing system, and associating the codes with the outer layer C code.

Then, the code printing can be carried out in the process stages of developing, silk-screen printing of characters and post-curing by using a code printing machine, for example, the code printing is carried out on an SET board or a PCS board. And finally, the PCB is associated with the outer layer C code, and the PCB can be traced by utilizing the outer layer C code in the tracing system.

In the technical scheme provided by the invention, by using the engraving code: the mode of A code, B code and C code can be used for collecting production process parameters in the PCB production process flow, and performing subdivision management, so that factory-level, workshop-level and site-level production control is realized, and traceability management can be performed on process data of each PCB.

As an embodiment, as shown in fig. 2, the whole process of PCB production is described; each module is a processing technology step, and each flow process is added with a code reader at the board placing and collecting technology section of each production process, reads and uploads each PNL board, and records the processing technology parameters (the code reader is not shown in the figure, but the existence of the code reader is understood).

Specifically, firstly, through a production process of cutting, round corner edging and cleaning, an inner layer A code is manufactured on a laser PNL plate by using a laser marking machine, and the code is displayed in a two-dimensional code marking mode. The contents of the code include factory identification code, work order code, year period, serial number, etc. Namely, the inner layer A code punching of the PNL plate is carried out after the production processes of cutting, fillet edge grinding and cleaning.

Then, the production process of pretreatment, coating and baking and exposure is carried out, and the production process of developing, etching and film removing, PE punching and browning is carried out, and PP cutting and punching are carried out.

Specifically, in the production process of combination melting/riveting + pre-stacking, typesetting + pressing, the binding of the inner layer A code to the secondary outer layer B code is realized for the PNL board, the step is carried out after the production process of combination melting and riveting, then the production process of pre-stacking is carried out, and then the production process of typesetting + pressing is carried out.

In the production process of combined fusion, riveting and pre-stacking sections, the procedures of code reading and code binding are added; and identifying an inner layer A code and a secondary outer layer B code through a code reader during pre-stacking, wherein the information contained in the inner layer A code and the secondary outer layer B code is associated and bound in a tracing system and converted into the B code.

And then, performing drilling target cutting and grinding, converting X-RAY code reading into outer layer laser code carving and PIN adding, in the process of converting the drilling target cutting and grinding and the X-RAY code reading into the outer layer laser code carving, increasing X-RAY code reading times and outer layer B codes and uploading the content to a tracing system, wherein the tracing system performs coding according to a preset rule of the system to generate an outer layer C code and transmits the outer layer C code to a mechanical code drilling machine.

Then, drilling by using the mechanical code drilling machine, and sequentially executing the process flows of PIN removing, deburring, cleaning and hole checking: removing glue, depositing copper and VCP, performing outer layer pretreatment, exposing, DES, performing on-line AOI and VRS, performing resistance welding pretreatment, printing ink screen, prebaking, developing, printing characters screen and post-curing.

And in the process stages of developing, silk-screen printing of characters and post-curing, a laser coding machine or a mechanical drilling machine is added, and codes are coded on the SET board or the PCS board and uploaded to a tracing system. In this step, the conventional process is as follows: the inner-layer two-dimensional code is identified and analyzed by an X-RAY identification machine, then the content is uploaded to an MES or a server, the MES or the server associates the inner-layer two-dimensional code with the outer-layer two-dimensional code and issues the content of the outer-layer two-dimensional code to a mechanical drilling machine, the mechanical drilling machine mechanically drills the two-dimensional code according to the received content of the outer-layer two-dimensional code, and the capacity of drilling the two-dimensional code (the approximate hole number is 90) of 10-bit digital content is approximately 4 PNL/min.

The C code shown in FIG. 3 can be used to improve the productivity. The drilling holes are arranged in 4 rows and multiple columns, the drilling holes are drilled in different rows of each column, and different numbers of the holes in each column represent different numbers. The drilling processing of the traceable hole code with the new special definition is adopted during mechanical drilling of the two-dimensional code, and when the mechanical drilling code is used, the hole number is reduced by 60%, so that the efficiency of drilling the code is improved, the productivity is greater than 6 PNL/min, and the matching with the productivity of the existing production line is realized.

And then carrying out PNL surface treatment, routing boards, cleaning, inspecting board warping, electrically testing a laser stamping machine, laser scrapping, testing, AVI and packaging.

As shown in fig. 2, the tracing system includes a data acquisition system module, a code reading identification module, and a data connection module. And in each flow step, a code reader is adopted for scanning to acquire data (matched with a code reading identification module) to form a data acquisition system module in the PCB tracing system, and then the data acquisition system module can be connected with an EAP system and an MES system (matched with a data connection module), so that the platform tracing management of the incoming material production, the batch production, the processing process, the chatting consumption and the like can be realized in the PCB production process. The ERP product work order can be managed, data link from bomb throwing to goods delivery is achieved, delivery schedule and quality scrapping information are gathered, and early warning management is achieved. Further, a basic platform and data are provided for deep industrial data acquisition of enterprises, construction of industrial big data, development and deployment of edge calculation and big data analysis and development of industrial APP.

The invention further provides a PCB circuit board which comprises a PNL board, wherein an inner layer A code, a secondary inner layer B code and an outer layer C code are engraved on the PNL board, the inner layer A code and the secondary inner layer B code are used for binding processing technological parameters of the PNL board, the outer layer C code is formed by converting the inner layer A code and the secondary inner layer B code, the outer layer C code adopts 4-row multi-column layout, the outer layer C code comprises a positioning code and a data code, the positioning code comprises a start symbol and an end symbol, the data code is positioned between the start symbol and the end symbol, and the positioning code adopts 8421 codes.

As shown in fig. 3, the C code adopts a 4-row multi-column layout, holes are drilled in different rows of each column, and different numbers of holes in each column represent different numbers. The drilling processing of the traceable hole code with the new special definition is adopted during mechanical drilling of the two-dimensional code, and when the mechanical drilling code is used, the hole number is reduced by 60%, so that the efficiency of drilling the code is improved, the productivity is greater than 6 PNL/min, and the matching with the productivity of the existing production line is realized.

In fig. 3, the first four columns are 10 positioning holes as start symbols, the last 2 columns are end symbols, and the middle 15 columns are data holes corresponding to data representations. Because of the decimal code 8421, the rows are 8421 in sequence from top to bottom. The dotted line box in the figure is selected as the actual coding effect, and the rest marks are convenient for understanding and are not present on the PCB. For convenience, the positioning holes and the data holes are displayed in two colors, for example, the positioning holes are black, and the data holes are red. The positioning holes in the first 1-4 rows and the last 1 row are fixed and are divided into start symbols and end symbols. The number of wells in each column of the data well region represents 1 digit, and 15 columns are provided, which sequentially represent 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 and 15.

Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the examples described in connection with the embodiments disclosed herein may be embodied in electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described in a functional general in the foregoing description for the purpose of illustrating clearly the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

In the embodiments provided in the present invention, it should be understood that the disclosed system and method can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For example, the division of each unit is only one logic function division, and there may be another division manner in actual implementation. For example, various elements or components may be combined or may be integrated into another system, or some features may be omitted, or not implemented.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A process for producing a PCB, comprising:

2. The process for the production of a PCB according to claim 1, wherein the process further comprises:

3. The PCB production process of claim 1, wherein the opening of the inner layer A code for the PNL board is performed after the production processes of cutting, fillet edging and cleaning.

4. The process for manufacturing a PCB as claimed in claim 1, wherein the step of printing the inner layer B code on the PNL board is performed after the combined fusing and riveting process.

5. The PCB production process according to claim 1, characterized in that in the combined melting, riveting and pre-stacking section production process, the procedures of reading and binding codes are added; and identifying an inner layer A code and a secondary outer layer B code through a code reader during pre-stacking, wherein the inner layer A code and information contained in the outer layer B code are associated and bound in a tracing system.

6. The PCB production process of claim 1, wherein in the drilling target cutting and grinding process, the X-RAY code reading and outer layer laser code carving process is additionally provided with an X-RAY secondary outer layer B code reading process and uploads the content to a tracing system, and the tracing system performs coding according to a preset rule of the system to generate an outer layer C code and sends the outer layer C code to a laser coding machine or a mechanical coding machine.

7. The PCB production process of claim 1, wherein a laser coding machine or a mechanical drilling machine is added at the development, character screen printing and post-curing stages, and codes are coded on a SET board or a PCS board and uploaded to a tracing system.

8. The PCB production process of claim 1, wherein the traceability system comprises a data acquisition system module, a code reading identification module and a data connection module.

9. The PCB production process of claim 1, wherein the outer C code comprises a positioning code and a data code; the preset rule is as follows:

10. A PCB circuit board is manufactured by the production process of any one of claims 1 to 9 and is characterized by comprising a PNL board, wherein an inner layer A code, a secondary inner layer B code and an outer layer C code are engraved on the PNL board and used for binding processing process parameters of the PNL board, the outer layer C code is formed by converting the inner layer A code and the secondary inner layer B code, the outer layer C code adopts 4-row multi-column layout, the outer layer C code comprises a positioning code and a data code, the positioning code comprises a start symbol and an end symbol, the data code is positioned between the start symbol and the end symbol, and the positioning code adopts 8421 codes.