CN113766724A - Circuit board and manufacturing method and tracing method thereof - Google Patents
Circuit board and manufacturing method and tracing method thereof Download PDFInfo
- Publication number
- CN113766724A CN113766724A CN202010485932.5A CN202010485932A CN113766724A CN 113766724 A CN113766724 A CN 113766724A CN 202010485932 A CN202010485932 A CN 202010485932A CN 113766724 A CN113766724 A CN 113766724A
- Authority
- CN
- China
- Prior art keywords
- identification code
- circuit board
- information
- sub
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 129
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000010030 laminating Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims 1
- 238000013024 troubleshooting Methods 0.000 abstract description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000004590 computer program Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09927—Machine readable code, e.g. bar code
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board and a manufacturing method and a tracing method thereof, wherein the manufacturing method of the circuit board comprises the following steps: providing a sub-circuit board; arranging a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer plate of the sub-circuit board and production batch information during production of the sub-circuit board. According to the circuit board manufactured by the method, the tracing can be realized, the quick and accurate mutual tracing from the sub-circuit board to the inner-layer board can be realized by identifying the first identification code, the other circuit boards of the inner-layer board with quality problems can be conveniently locked and used, and the troubleshooting efficiency and accuracy are improved.
Description
Technical Field
The invention relates to the technical field of PCB product manufacturing process tracing, in particular to a circuit board and a manufacturing method and a tracing method thereof.
Background
With the development of the electronic Circuit industry, the design and process of pcb (printed Circuit board) products become more and more complex, and the requirements on the aspect of product manufacturing quality control are continuously raised; manufacturing enterprises in the electronic circuit industry belong to high-end discrete manufacturing, have the characteristics of multiple varieties, small batch and single-production, have the conditions of coexistence of production and research, mixed line production, continuous change of technological process, continuous switching of main materials and auxiliary materials and the like, and need to quickly present factor information of each procedure in the manufacturing process of products through a tracing system after the products have abnormal quality and quickly and accurately position through changing factors. Manufacturers generally adopt a mode of firstly batching products and establishing serial numbers according to the batch numbers of the products to monitor and trace the inner layer plate, the outer layer plate and the circuit board, but when the products have quality problems, the method cannot quickly and accurately lock the abnormal range of abnormal products and cannot trace the serial numbers of the outer layer plate and the inner layer core plate according to the serial numbers of the circuit board.
Disclosure of Invention
The invention mainly solves the technical problem of providing a circuit board and a circuit board tracing method thereof, and solves the problem that the circuit board cannot be traced quickly and accurately in the prior art.
In order to solve the technical problems, the first technical scheme adopted by the invention is as follows: a manufacturing method of a circuit board is provided, which comprises the following steps: providing a sub-circuit board; arranging a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer plate of the sub-circuit board and production batch information during production of the sub-circuit board.
Wherein the providing sub-circuit board body includes: providing at least one inner layer plate and an outer layer plate covering the outer surface of the inner layer plate; generating a second identification code according to the information of each inner-layer plate, and arranging the second identification code on at least one surface of each inner-layer plate; laminating the inner layer board and the outer layer board and pressing to form a mother circuit board; arranging a third identification code on one surface of the outer plate, which is far away from the inner plate, wherein the third identification code comprises a production batch of the bus circuit board during production; and dividing the bus circuit board to form a plurality of sub circuit boards.
Wherein, the second identification code is generated according to the information of each inner plate, and the second identification code is arranged behind at least one surface of the inner plate, the method further comprises the following steps: storing the second identification code; the surface of the outer plate far away from the inner plate is provided with a third identification code, and the third identification code comprises a production batch when the circuit board is produced, and the third identification code also comprises the following components: storing the third identification code, and associating the third identification code with the second identification code; the method further comprises the following steps after the first identification code is arranged on at least one surface of the sub-circuit board: and storing the first identification code, and associating the first identification code with the third identification code.
The step of generating the second identification code according to the information of each inner layer plate specifically comprises the following steps: obtaining batch information of the inner-layer plate according to the worksheet, and numbering the inner-layer plate; and generating a second identification code of the inner plate according to the batch information and the number of the inner plate.
Wherein, the step of setting up the third identification code at a surface of the outer plating far away from the inner plating specifically includes: acquiring batch information of the bus circuit board, and numbering the bus circuit board; generating a third identification code of the mother circuit board according to the batch information and the serial number; and arranging the third identification code on at least one surface of the mother circuit board.
The step of arranging the first identification code on at least one surface of the sub-circuit board specifically comprises the following steps: acquiring batch information of the sub-circuit boards, and numbering the sub-circuit boards; generating a first identification code of the sub-circuit board according to the batch information and the serial number; and arranging the first identification code on at least one surface of the sub-circuit board.
The step of storing the second identification code specifically includes: inputting a second identification code, and analyzing the information of each inner-layer plate according to the second identification code; and associating and storing the information of each inner layer board.
The step of storing the third identification code and associating the third identification code with the second identification code specifically includes: storing the third identification code and analyzing the information of the mother circuit board according to the third identification code; acquiring a second identification code of at least one inner-layer plate, and analyzing the information of the inner-layer plate according to the second identification code; and associating the information of the inner layer board with the information of the mother circuit board.
The step of storing the first identification code and associating the first identification code with the third identification code specifically includes: acquiring a first identification code, and analyzing the information of the sub-circuit board according to the first identification code; acquiring a third identification code of the mother circuit board forming the sub circuit board, and analyzing the information of the mother circuit board according to the third identification code; and associating the information of the daughter circuit board with the information of the mother circuit board.
The second identification code is fixed on the inner layer plate in a light painting manufacturing mode.
In order to solve the above technical problems, the second technical solution adopted by the present invention is: providing a circuit board, wherein the circuit board comprises at least one inner layer board and outer layer boards positioned on two sides of the inner layer board; the surface of the outer layer plate on at least one side is provided with a first identification code, and the first identification code comprises production information of the circuit board; the production information of the circuit board at least comprises the production batch when the circuit board is produced.
The first identification code is a two-dimensional code or a bar code.
In order to solve the above technical problems, the third technical solution adopted by the present invention is: providing a tracing method of a circuit board, wherein the circuit board comprises at least one inner layer board and outer layer boards positioned at two sides of the inner layer board; the surface of the outer layer plate on at least one side is provided with a first identification code, and the first identification code comprises production information of the circuit board; the production information of the circuit board at least comprises the production batch of the circuit board during production; the tracing method comprises the following steps: identifying a first identification code, and identifying a production batch during production of the circuit board according to the first identification code; and determining the rest circuit boards produced in the same batch with the circuit boards according to the production batch during the production of the circuit boards, and realizing the tracing from the circuit boards to the inner layer board.
The invention has the beneficial effects that: different from the situation of the prior art, the circuit board and the manufacturing method and the tracing method thereof are provided, and the manufacturing method of the circuit board comprises the following steps: providing a sub-circuit board; arranging a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer plate of the sub-circuit board and production batch information during production of the sub-circuit board. According to the circuit board manufactured by the method, the tracing can be realized, the quick and accurate mutual tracing from the sub-circuit board to the inner-layer board can be realized by identifying the first identification code, the circuit board of the inner-layer board with quality problems is conveniently locked and used, and the troubleshooting efficiency and accuracy are improved.
Drawings
FIG. 1 is a schematic flow chart of a first embodiment of a method for manufacturing a circuit board according to the present invention;
FIG. 2 is a schematic flow chart of a second embodiment of the circuit board manufacturing method of the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of a circuit board of the present invention;
fig. 4 is a schematic flow chart of an embodiment of a circuit board tracing method according to the present invention.
Detailed Description
The following describes in detail the embodiments of the present application with reference to the drawings attached hereto.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. Further, the term "plurality" herein means two or more than two.
In order to make those skilled in the art better understand the technical solution of the present invention, the following will describe a circuit board, a manufacturing method thereof, and a tracing method thereof in detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, fig. 1 is a schematic flow chart of a first embodiment of a method for manufacturing a circuit board according to the present invention. In this embodiment, a method for Manufacturing a circuit board is implemented by a computer program of an IMES (Intelligent Manufacturing Solutions, Intelligent Manufacturing) system, and includes the following steps:
s11: a daughter board is provided.
Specifically, a sub-circuit board is provided, which is a finished circuit board. The sub-circuit board comprises a plurality of inner layer boards and outer layer boards positioned on two sides of the inner layer boards.
S12: arranging a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer plate of the sub-circuit board and production batch information during production of the sub-circuit board.
Specifically, a first identification code is printed on one surface of the sub-circuit board, and the information of the inner layer board in the sub-circuit board and the production batch information during the production of the sub-circuit board are traced back through the first identification code, and the information of the rest of sub-circuit boards using the batch of inner layer boards can also be traced back from the information of the inner layer boards of the sub-circuit board.
The manufacturing method of the circuit board provided by the embodiment comprises the steps of providing a sub-circuit board; arranging a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer plate of the sub-circuit board and production batch information during production of the sub-circuit board. The circuit board manufactured by the method can be traced, the quick and accurate mutual tracing from the sub-circuit board to the inner-layer board can be realized by identifying the first identification code, the other circuit boards of the inner-layer board with quality problems can be conveniently locked and used, and the troubleshooting efficiency and accuracy are improved.
Referring to fig. 2, fig. 2 is a schematic flow chart of a circuit board manufacturing method according to a second embodiment of the invention. In this embodiment, a method for manufacturing a circuit board is implemented by a computer program of an IMES (intelligent manufacturing Solutions, intelligent manufacturing) system, and includes the following steps:
s21: at least one inner layer plate and an outer layer plate covering the outer surface of the inner layer plate are provided.
Specifically, a matched inner laminate and outer laminates covering both sides of the inner laminate are prepared according to the work order requirements provided by customers.
S22: and generating a second identification code according to the information of each inner layer plate, and arranging the second identification code on at least one surface of each inner layer plate.
Specifically, the batch information of each inner layer plate and each outer layer plate is obtained according to the work order, the inner layer plates and the outer layer plates are numbered, and the second identification codes are generated according to the batch information and the numbers of the inner layer plates and the outer layer plates. In this embodiment, the second identification code may be disposed at a predetermined position of the inner plate and the outer plate in a photo-drawing manner. The inner layer plate and the outer layer plate in the same batch have the same batch information and different numbers, the second identification codes generated by the different inner layer plates and the different outer layer plates in the same batch are different, and each inner layer plate and each outer layer plate have unique second identification codes. The second identification code may be a two-dimensional code or a bar code. The second identification code can comprise any one or any combination of a production sequence grade, a production year, a production month and a production day, a production work order serial number, a production work order quantity serial number and a production check code area of the inner plate or the outer plate. In another alternative embodiment, the second identification code may also be provided on one surface of the inner board or the outer board, or may also be provided on both surfaces of the inner board or the outer board, so as to facilitate the subsequent scanning and storage of the second identification code of the inner board.
S23: and laminating the inner layer board and the outer layer board and pressing to form the mother circuit board.
Specifically, the prepared inner-layer boards are sequentially stacked one by one according to a laminating structure specified by the process card, the second identification code of each inner-layer board is read by an X-Ray code reader, and the read second identification code is sent to the IMES system. And the IMES system identifies the acquired second identification code of each inner-layer plate and analyzes the second identification code to obtain batch information and serial numbers of each inner-layer plate. And associating the batch information and the number of each inner layer plate in the stack with the batch information and the number of the adjacent inner layer plate. The outer layer plate is placed on the upper surface of the stacked inner layer plate and the lower surface of the stacked inner layer plate, and the outer layer plate, the plurality of inner layer plates and the outer layer plate which are sequentially stacked from bottom to top are pressed by a press to form the mother circuit board.
S24: and arranging a third identification code on one surface of the outer plate, which is far away from the inner plate, wherein the third identification code comprises the production batch of the bus circuit board during production.
Specifically, batch information of the bus circuit board is obtained, and the bus circuit board is numbered; and generating a third identification code of the mother circuit board according to the batch information and the serial number. In this embodiment, the third identification code may be set at a preset position of the mother board through the code printing device. The bus circuit boards in the same batch have the same batch information and different numbers, the third identification codes generated by different bus circuit boards in the same batch are different, and each bus circuit board has the unique third identification code. The third identification code may be a two-dimensional code or a bar code. The third identification code can comprise any one or any combination of a production sequence grade, a production year, a production month and a production day, a production work order serial number, a production work order quantity serial number and a production check code area of the mother circuit board. The third identification code comprises the production batch of the bus-bar road board during production. In another alternative embodiment, the third identification code may be disposed on one surface of the mother circuit board, that is, the third identification code may be disposed on one surface of the outer board away from the inner board, or the third identification code may be disposed on both surfaces of the mother circuit board.
The IMES system acquires and stores a third identification code of a mother circuit board manufactured by laminating an inner layer board and an outer layer board, analyzes batch information and a serial number of the mother circuit board according to the third identification code, reads a second identification code of the inner layer board in the mother circuit board by using an X-Ray code reader, and analyzes information of the inner layer board according to the second identification code, wherein the information of the mother circuit board can be batch information and the serial number. The IMES system associates the information of the mother circuit board with the information of the inner layer board pressed to form the mother circuit board.
S25: and dividing the bus circuit board to form a plurality of sub circuit boards, wherein the plurality of sub circuit boards do not comprise the second identification code and the third identification code.
Specifically, according to the patterns of the circuit board required by the customer, the bus circuit board is cut into a plurality of sub circuit boards, and the third identification code on the bus circuit board and the second identification code on the inner layer board are not included on the sub circuit boards.
S26: arranging a first identification code on at least one surface of the sub-circuit board; wherein the first identification code is associated with the second identification code and the third identification code.
Specifically, batch information of the sub-circuit boards is obtained, and the sub-circuit boards in the same batch are numbered; and generating a first identification code of the sub-circuit board according to the batch information and the serial number of the sub-circuit board, sending the first identification code to the circuit board coding equipment by the IMES system, and controlling the coding equipment to print the first identification code on a preset position of the sub-circuit board. The batch information of the sub circuit boards in the same batch is the same, the serial numbers are different, the first identification codes generated by different sub circuit boards in the same batch are different, and each circuit board has a unique first identification code. The first identification code may be a two-dimensional code or a bar code. The first identification code can comprise any one or any combination of a production sequence grade, a production year, a production month and a production day, a production work order serial number, a production work order quantity serial number and a production check code area of the sub-circuit board.
The IMES system calls a third identification code of the mother circuit board, reads a first identification code of the sub circuit board through an X-Ray code reading machine and sends the first identification code to the IMES system, the IMES system respectively identifies the third identification code of the mother circuit board and the first identification code of the sub circuit board, information corresponding to the third identification code of the mother circuit board and the first identification code of the sub circuit board is obtained through analysis, and the IMES system correlates the information of the mother circuit board and the information of the sub circuit board.
In another optional embodiment, the first identification code is preset identification information, the IMES system calls a third identification code of the mother circuit board, the IMES system identifies the third identification code of the mother circuit board to obtain batch information and a serial number of the mother circuit board, the IMES system associates the analyzed batch information and serial number of the mother circuit board with the preset identification information of the daughter circuit board, sends a first identification code corresponding to the preset identification information of the daughter circuit board to the code printing device, and the IMES system controls the code printing device to print the first identification code on the daughter circuit board.
In another specific embodiment, a plurality of inner-layer plates and two outer-layer plates are prepared according to a work order, an IMES system generates a second identification code according to batch information and serial numbers of each inner-layer plate and each outer-layer plate, each inner-layer plate and each outer-layer plate respectively have a unique second identification code, the IMES system sends the second identification code to a coding device, the coding device fixes the second identification code on the corresponding preset positions of the inner-layer plates and the outer-layer plates in a photoplotting manufacturing mode, and the second identification code is reserved in an inner-layer etching process. The second identification code may be a two-dimensional code or a bar code. And sequentially stacking the inner layer plates and the outer layer plates one by one according to a laminating structure specified by the process card, reading the second identification codes of the inner layer plates and the outer layer plates by using an X-Ray code reader, and sending the read second identification codes to the IMES system. And the IMES system identifies the acquired second identification codes of the inner layer plate and the outer layer plate and analyzes the second identification codes to obtain batch information and serial numbers of the inner layer plate and the outer layer plate. The IMES system associates the lot information and number of the outer laminate with the lot information and number of the inner laminate. The IMES system controls the press to press the stacked outer laminates and the inner laminates to manufacture the bus boards, the IMES system generates a third identification code according to batch information and serial numbers of each bus board, each bus board has a unique third identification code, the IMES system sends the third identification code to the code printing equipment, and the code printing equipment prints the third identification code on the preset position of the corresponding bus board. The third identification code may be a two-dimensional code or a bar code. And after the edges of the bus circuit board manufactured by pressing are milled, reading a second identification code of an inner layer board in the bus circuit board by using an X-Ray code reader, and transmitting the second identification code to an IMES system, wherein the IMES system associates the obtained second identification code of the inner layer board with a stored third identification code of the bus circuit board formed by pressing. The bus circuit board is divided into a plurality of sub circuit boards, the IMES system generates a first identification code according to batch information and serial numbers of the sub circuit boards, the batch information and serial numbers corresponding to the first identification code are associated with the stored batch information and serial numbers corresponding to the third identification code of the bus circuit board, an association relation is established between the sub circuit boards and the bus circuit board, the printing equipment receives an instruction sent by the IMES system for printing the first identification code, the printing equipment prints the first identification code on the sub circuit boards, and meanwhile, the printing equipment can print related characters corresponding to the first identification code on preset positions of the corresponding sub circuit boards.
The manufacturing method of the circuit board provided by the embodiment comprises the steps of providing at least one inner layer board and an outer layer board covering the outer surface of the inner layer board; generating a second identification code according to the information of each inner-layer plate, and arranging the second identification code on at least one surface of each inner-layer plate; laminating the inner layer board and the outer layer board and pressing to form a mother circuit board; arranging a third identification code on one surface of the outer plate, which is far away from the inner plate, wherein the third identification code comprises a production batch during production of the circuit board; dividing the bus circuit board to form a plurality of sub circuit boards, wherein the plurality of sub circuit boards do not comprise a second identification code and a third identification code; arranging a first identification code on at least one surface of the sub-circuit board; wherein the first identification code is associated with the second identification code and the third identification code. According to the circuit board manufactured by the method, the tracing can be realized, the quick and accurate mutual tracing among the sub-circuit board, the mother circuit board and the inner layer board can be realized through the first identification code, the second identification code and the third identification code, the circuit board of the outer layer board or the inner layer board with quality problems is conveniently locked and used, and the troubleshooting efficiency and the accuracy are improved.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the invention. The circuit board 10 disclosed in the present embodiment is manufactured by the manufacturing method of the above embodiment, and the circuit board 10 includes an inner layer board 12 and outer layer boards 11 located on both sides of the inner layer board 12. Wherein, a first identification code 13 is arranged on one surface of the outer layer board 11 on at least one side, and the first identification code 13 contains the production information of the circuit board 10; the production information of the wiring board 10 includes a production lot at the time of production of the wiring board 10. Here, the first identification code 13 may be at least one of a two-dimensional code and a barcode.
The circuit board that this embodiment provided can realize that the circuit board traces back to the quick accuracy of inner plate, and the circuit board of the mother board or the inner plate that has the quality problem of convenient locking use improves investigation efficiency and rate of accuracy.
Referring to fig. 4, fig. 4 is a schematic flow chart of an embodiment of a circuit board tracing method according to the present invention. The circuit board tracing method provided by the embodiment is implemented based on the circuit board provided by the embodiment.
S31: and identifying the first identification code, and identifying the production batch during the production of the circuit board according to the first identification code.
Specifically, an X-Ray code scanner is used for scanning a first identification code on a circuit board, the first identification code is uploaded to an IMES system, and the IMES system identifies and analyzes the acquired first identification code to obtain a production batch corresponding to the first identification code of the circuit board during production, wherein the production batch can be batch information and a serial number.
S32: and determining the rest circuit boards produced in the same batch with the circuit boards according to the production batch during the production of the circuit boards, and realizing the tracing from the circuit boards to the inner layer board.
Specifically, according to the analyzed production batch during production of the circuit board, the production batches during production of all the mother circuit boards and the inner layer boards corresponding to the identified first identification codes are searched in the information corresponding to the first identification codes, the third identification codes of the mother circuit boards and the second identification codes of the inner layer boards, which are pre-stored in the IMES system and are related to each other, and the production batches are batch information and serial numbers.
In a specific embodiment, when a circuit board has a quality problem, a first identification code of the circuit board is scanned by an X-Ray code scanner and is uploaded to an IMES system, the IMES system analyzes the first identification code to obtain the production batch and the serial number of the circuit board, the IMES system searches the production batch of the circuit board corresponding to the first identification code and the batch signals and the serial number of a mother circuit board and an inner layer board related to the serial number in a pre-established incidence relation table among the sub circuit board, the bus circuit board and the inner layer board, and can also search the sub circuit board using the bus circuit board or the inner layer board, so that the tracing from the circuit board to the inner layer board is realized.
According to the circuit board tracing method provided by the embodiment, the information of the inner layer board and the production batch of the circuit board during production are identified according to the first identification code by identifying the first identification code; the other circuit boards produced in the same batch with the circuit board are determined according to the production batch during circuit board production, the circuit boards and the associated mother circuit boards can be traced quickly and accurately, the circuit boards with quality problems or the circuit boards of the inner layer board can be locked and used conveniently, and the inspection efficiency and accuracy are improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (13)
1. A method of making a circuit board, the method comprising:
providing a sub-circuit board;
arranging a first identification code on one surface of the sub-circuit board; the first identification code comprises information of an inner layer plate of the sub-circuit board and production batch information during production of the sub-circuit board.
2. The method of manufacturing according to claim 1, wherein the providing a sub-circuit board body includes:
providing at least one inner layer plate and an outer layer plate covering the outer surface of the inner layer plate;
generating a second identification code according to the information of each inner-layer plate, and arranging the second identification code on at least one surface of each inner-layer plate;
laminating the inner layer board and the outer layer board and pressing the inner layer board and the outer layer board to form a mother circuit board;
arranging a third identification code on one surface of the outer plate, which is far away from the inner plate, wherein the third identification code comprises a production batch of the bus circuit board during production;
and dividing the mother circuit board to form a plurality of sub circuit boards.
3. The method of claim 2, wherein generating a second identification code according to the information of each of the inner sheets and disposing the second identification code on at least one surface of the inner sheet further comprises:
storing the second identification code;
the method for manufacturing the circuit board comprises the following steps that a third identification code is arranged on one surface, far away from the inner layer board, of the outer layer board, and the third identification code comprises the following steps:
storing the third identification code, and associating the third identification code with the second identification code;
the method further comprises the following steps after the first identification code is arranged on at least one surface of the sub-circuit board:
and storing the first identification code, and associating the first identification code with the third identification code.
4. A tracing method for a circuit board according to claim 2, wherein the step of generating a second identification code according to information of each of the inner boards specifically includes:
obtaining batch information of the inner-layer plate according to the work order, and numbering the inner-layer plate;
and generating the second identification code according to the batch information and the serial number of the inner layer plate.
5. The method of claim 2, wherein the step of providing a third identification code on a surface of the outer laminate remote from the inner laminate comprises:
acquiring batch information of the mother circuit board, and numbering the mother circuit board;
generating a third identification code of the mother circuit board according to the batch information and the serial number;
and arranging the third identification code on at least one surface of the mother circuit board.
6. The method according to claim 1, wherein the step of providing the first identification code on at least one surface of the sub-circuit board specifically comprises:
acquiring batch information of the sub-circuit boards, and numbering the sub-circuit boards;
generating a first identification code of the sub-circuit board according to the batch information and the serial number;
and arranging the first identification code on at least one surface of the sub-circuit board.
7. The manufacturing method according to claim 3, wherein the step of storing the second identification code specifically includes:
inputting the second identification code, and analyzing the information of each inner-layer plate according to the second identification code;
and associating and storing the information of each inner layer plate.
8. The manufacturing method according to claim 3, wherein the step of storing the third identification code and associating the third identification code with the second identification code specifically comprises:
storing the third identification code and analyzing the information of the mother circuit board according to the third identification code;
acquiring the second identification code of at least one inner-layer plate, and analyzing the information of the inner-layer plate according to the second identification code;
and associating the information of the inner layer board with the information of the mother circuit board.
9. The manufacturing method according to claim 3, wherein the step of storing the first identification code and associating the first identification code with the third identification code specifically comprises:
acquiring the first identification code, and analyzing the information of the sub-circuit board according to the first identification code;
acquiring the third identification code of a mother circuit board forming the sub circuit board, and analyzing the information of the mother circuit board according to the third identification code;
and associating the information of the sub circuit board with the information of the mother circuit board.
10. The method of claim 2, wherein the second identification code is fixed on the inner layer board by means of optical drawing.
11. The circuit board is characterized by comprising at least one inner layer board and outer layer boards positioned on two sides of the inner layer board;
the surface of the outer layer board on at least one side is provided with a first identification code, and the first identification code comprises production information of the circuit board;
the production information of the circuit board at least comprises the production batch of the circuit board during production.
12. The wiring board of claim 11, wherein the first identification code is a two-dimensional code or a bar code.
13. A tracing method of a circuit board is characterized in that the circuit board comprises at least one inner layer board and outer layer boards positioned on two sides of the inner layer board;
the surface of the outer layer board on at least one side is provided with a first identification code, and the first identification code comprises production information of the circuit board;
the production information of the circuit board at least comprises the production batch of the circuit board during production;
the tracing method comprises the following steps:
identifying the first identification code, and identifying the production batch when the circuit board is produced according to the first identification code;
and determining the rest circuit boards produced in the same batch with the circuit boards according to the production batch during the production of the circuit boards, and realizing the tracing from the circuit boards to the inner layer board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010485932.5A CN113766724B (en) | 2020-06-01 | 2020-06-01 | Circuit board, manufacturing method thereof and tracing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010485932.5A CN113766724B (en) | 2020-06-01 | 2020-06-01 | Circuit board, manufacturing method thereof and tracing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113766724A true CN113766724A (en) | 2021-12-07 |
| CN113766724B CN113766724B (en) | 2024-04-12 |
Family
ID=78782587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010485932.5A Active CN113766724B (en) | 2020-06-01 | 2020-06-01 | Circuit board, manufacturing method thereof and tracing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113766724B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116306748A (en) * | 2023-05-19 | 2023-06-23 | 苏州东山精密制造股份有限公司 | Circuit board quality updating method and AOI defective product tracing method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1886707A (en) * | 2003-11-28 | 2006-12-27 | 松下电器产业株式会社 | Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same |
| CN102271464A (en) * | 2010-06-07 | 2011-12-07 | 宏恒胜电子科技（淮安）有限公司 | Method for tracing quality of circuit board |
| KR20130143365A (en) * | 2012-06-21 | 2013-12-31 | 삼성전기주식회사 | Pcb array code traceability system and method for tracing and managing pcb array code |
| CN108012426A (en) * | 2017-12-13 | 2018-05-08 | 广东正业科技股份有限公司 | A kind of quality retroactive method of multi-layer PCB |
| CN109933033A (en) * | 2019-04-23 | 2019-06-25 | 深圳镭霆激光科技有限公司 | The process for pressing section retroactive method of PCB whole process retrospect |
| US20190320565A1 (en) * | 2018-04-17 | 2019-10-17 | Avary Holding (Shenzhen) Co., Limited. | System for tracing printed circuit boards through manufacturing stages |
| CN110399937A (en) * | 2018-04-17 | 2019-11-01 | 鹏鼎控股(深圳)股份有限公司 | Information detecting method for printed circuit board |
| CN110991588A (en) * | 2019-12-05 | 2020-04-10 | 南京品微智能科技有限公司 | Method for realizing PCB product manufacturing whole-process tracing based on hexadecimal lattice hole codes |
-
2020
- 2020-06-01 CN CN202010485932.5A patent/CN113766724B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1886707A (en) * | 2003-11-28 | 2006-12-27 | 松下电器产业株式会社 | Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same |
| CN102271464A (en) * | 2010-06-07 | 2011-12-07 | 宏恒胜电子科技（淮安）有限公司 | Method for tracing quality of circuit board |
| KR20130143365A (en) * | 2012-06-21 | 2013-12-31 | 삼성전기주식회사 | Pcb array code traceability system and method for tracing and managing pcb array code |
| CN108012426A (en) * | 2017-12-13 | 2018-05-08 | 广东正业科技股份有限公司 | A kind of quality retroactive method of multi-layer PCB |
| US20190320565A1 (en) * | 2018-04-17 | 2019-10-17 | Avary Holding (Shenzhen) Co., Limited. | System for tracing printed circuit boards through manufacturing stages |
| CN110399937A (en) * | 2018-04-17 | 2019-11-01 | 鹏鼎控股(深圳)股份有限公司 | Information detecting method for printed circuit board |
| CN109933033A (en) * | 2019-04-23 | 2019-06-25 | 深圳镭霆激光科技有限公司 | The process for pressing section retroactive method of PCB whole process retrospect |
| CN110991588A (en) * | 2019-12-05 | 2020-04-10 | 南京品微智能科技有限公司 | Method for realizing PCB product manufacturing whole-process tracing based on hexadecimal lattice hole codes |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116306748A (en) * | 2023-05-19 | 2023-06-23 | 苏州东山精密制造股份有限公司 | Circuit board quality updating method and AOI defective product tracing method |
| CN116306748B (en) * | 2023-05-19 | 2023-10-13 | 苏州东山精密制造股份有限公司 | Circuit board quality updating method and AOI defective product tracing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113766724B (en) | 2024-04-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109933033B (en) | PCB whole-process tracing laminating process segment tracing method | |
| CN106851990B (en) | Drilling control method and drilling control system for circuit board | |
| DE69731151T2 (en) | METHOD AND DEVICE FOR PRODUCING MOUNTING DATA, SAVINGS THEREFOR, METHOD AND DEVICE FOR COMPONENT MOUNTING THEREOF WITH THIS MEANS | |
| JP5182122B2 (en) | Information display system and information display method for quality control of component mounting board | |
| CN102271464B (en) | Method for tracing quality of circuit board | |
| CN104582328A (en) | PCB manufacturing technology capable of preventing board arrangement errors | |
| DE212019000246U1 (en) | System for producing a flexo plate, flexo plate computer-readable medium, flexo plate processing machine and reading device for use in a method for producing a flexo plate | |
| DE112009002425T5 (en) | Assembly machine for electrical components and operation instruction method therefor | |
| CN107992918B (en) | Whole-process quality tracing method for products | |
| CN113766724B (en) | Circuit board, manufacturing method thereof and tracing method | |
| US9579883B2 (en) | System for determining suitability of printing component set in screen printing device and method for determining suitability of set printing component | |
| CN110991588A (en) | Method for realizing PCB product manufacturing whole-process tracing based on hexadecimal lattice hole codes | |
| DE202019105236U1 (en) | Cutting device for mirror PCBs | |
| CN113573506B (en) | PCB production process and PCB circuit board | |
| CN105291602A (en) | Method and equipment for recognizing bar codes of inner layers of circuit boards and printing codes on outer layers of circuit boards | |
| CN103366208A (en) | Code marking system and product thereof | |
| CN108681757A (en) | A kind of machining steel management method based on Quick Response Code | |
| CN105196709A (en) | Laser code printing device for circuit boards | |
| CN110399937A (en) | Information detecting method for printed circuit board | |
| CN115135041A (en) | Process for improving forming efficiency of circuit board | |
| CN112784620B (en) | Product manufacturing tracing method and tracing system thereof | |
| CN104494313A (en) | Method for manufacturing IC (Integrated Circuit) carrier identifier and marking device thereof | |
| CN112454493B (en) | Circuit board identification system, method and storage medium | |
| CN113119622B (en) | Digital die cutting material piece, digital die cutting machine and working control method thereof | |
| KR101138465B1 (en) | Automatic stacking method of ceramic green sheet and automatic stacking apparatus thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |