CN115460783B - Method for ink-jet printing solder mask of PCB (printed circuit board) - Google Patents

Method for ink-jet printing solder mask of PCB (printed circuit board) Download PDF

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Publication number
CN115460783B
CN115460783B CN202211401560.9A CN202211401560A CN115460783B CN 115460783 B CN115460783 B CN 115460783B CN 202211401560 A CN202211401560 A CN 202211401560A CN 115460783 B CN115460783 B CN 115460783B
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pcb
printing
solder mask
damming
ink
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CN115460783A (en
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黄双双
陈春
罗坚
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Huizhou King Brother Circuit Technology Co Ltd
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Huizhou King Brother Circuit Technology Co Ltd
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Priority to PCT/CN2022/139056 priority patent/WO2024098506A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a method for solder mask printing of a PCB (printed Circuit Board) by ink jet, which comprises a product coding design; adding a first two-dimensional code or a first bar code; making a former flow; scanning the code before pattern development to identify product information; generating a second two-dimensional code or a second bar code; AOI detection; printing a second two-dimensional code or a second bar code; judging the quality of the PCB; pre-treating; determining a solder mask printing method of a good PCB; ink-jet printing; post-curing; by adopting the technical scheme, the problems that the ink-jet printing resistance welding has the problem of offset or larger or smaller resistance welding windowing, the welding quality of devices at a client side is influenced, the problem that the ink-jet printing resistance welding has the disadvantage of red on the line side due to the difference of the actual line and the designed line width of the PCB can be solved, and the precision of the ink-jet printing resistance welding windowing is greatly improved.

Description

Method for ink-jet printing solder mask of PCB (printed circuit board)
Technical Field
The invention relates to the technical field of PCB boards, in particular to a method for ink-jet printing solder mask of a PCB board and a processing method thereof.
Background
Printed Circuit Boards (PCBs) are important electronic components. In the production process of the PCB, in order to improve the welding efficiency and avoid the damage of the parts which do not need to be welded, the parts need to be protected by solder resist ink. Using ink jet printing to apply solder resist ink to a Printed Circuit Board (PCB) surface has a number of significant advantages.
The existing ink-jet printing technology comprises the following specific steps:
the first step is as follows: pretreatment
The second step is that: ink jet printing
The third step: post-curing
And the second step of ink-jet printing is to perform ink-jet printing on the solder mask layer of the circuit board by using the design data of the solder mask layer of the printed circuit board and taking the positioning hole or the positioning pad on the grabbing board as positioning according to the design data of the solder mask layer of the printed circuit board.
In the actual production of the printed circuit board, the printed circuit board needs to go to a solder resist production procedure after production processes such as pressing, drilling, electroplating, pattern transfer, pattern etching and the like, the pattern precision of the printed circuit board is influenced by the difference of the copper thickness of the printed circuit board, the pattern transfer and the pattern etching precision, each produced printed circuit board has a certain difference on the circuit pattern, and the pattern transfer and the pattern etching can have the quality problem that a certain part of units are scrapped; the circuit board may have a certain expansion and shrinkage due to the influence of the production of the circuit board in the previous process. Under the influence of the factors, the existing ink-jet printing carries out ink-jet printing on the solder mask layer of the circuit board according to the design data of the solder mask layer of the printed circuit board to finish the solder mask production. The method does not consider that each actual production graph has certain difference with the design and has different position units to be scrapped, and carries out ink-jet printing on a solder mask layer of the circuit board according to design data to complete solder mask production, thereby having the following problems:
1) The solder mask window has the problems of offset, such as larger or smaller size;
2) The edge of the solder mask cover line is red;
3) The waste of jet printing ink caused by jet printing ink on a scrapped unit of the circuit board cannot be completely avoided.
Disclosure of Invention
Based on this, it is necessary to provide a method for ink-jet printing solder resist on a PCB.
A method for solder mask of PCB by ink-jet printing comprises
S1, product coding design, namely converting the PCB model and the process card batch number into a first two-dimensional code or a first bar code;
s2, adding a first two-dimensional code or a first bar code, adding the first two-dimensional code or the first bar code in a stream Cheng Kashang, and corresponding the process card to the PCB with the corresponding batch and model;
s3, manufacturing a previous flow, wherein the flow card synchronously flows along with the production flow of the PCB of the corresponding batch;
s4, before image development, code scanning is carried out to identify product information, before development, a code scanning device is used to identify a first two-dimensional code or a first bar code on a flow card of the PCB of the batch to be produced, and production information of the PCB is obtained and then is synchronously produced with AOI;
s5, generating a second two-dimensional code or a second bar code, and generating the second two-dimensional code or the second bar code with different serial numbers after AOI (automated optical inspection) of each PCB (printed Circuit Board) on the basis of the first two-dimensional code or the first bar code by using a code assigning system of two-dimensional code printing equipment;
s6, AOI detection, namely detecting a corresponding PCB by using the connection line AOI after pattern development, etching and film stripping according to the production information, storing detection data in the same position of the server as the production information, and forming a code corresponding to a corresponding second two-dimensional code or a second bar code;
s7, printing a second two-dimensional code or a second bar code, after the PCB is subjected to line AOI detection, entering two-dimensional code printing equipment for line connection one by one according to the detection sequence, and printing the second two-dimensional code of each PCB for AOI detection of different serial numbers on the edge preset position of the PCB;
s8, judging the quality of the PCB, judging whether the detected PCB is a defective product or not according to the AOI detection result, and otherwise, performing the next step;
s9, preprocessing, namely processing the surface of the PCB in a super-coarsening and anti-seepage mode;
s10, determining a solder resist printing method of a good PCB;
s11, ink-jet printing, namely acquiring a first solder mask printing program by adopting a solder mask ink-jet printer through recognizing the second two-dimensional code or the second bar code and completing ink-jet printing at a preset position of the PCB;
and S12, postcuring, wherein the postcuring is carried out by normally baking in a tunnel furnace connected with a solder resist ink-jet printer.
In one embodiment, in S6, the detection method of AOI detection is:
s21, detecting the PCB through AOI and forming detection data, wherein the detection data comprises real pattern data of a good PCB and real pattern data of a bad PCB;
s22, encoding the detection data according to the product model, the batch number and the serial number corresponding to the second two-dimensional code or the second bar code;
s23, storing the detection data at a preset position of the server and naming the detection data by using codes;
s24, enabling the detection data to correspond to the detected PCB, the second two-dimensional code or the second bar code.
In one embodiment, the VSR maintenance machine is adopted to judge whether the defective PCB can be maintained, if so, the maintained PCB is recorded as a maintenance good product, the AOI is used for re-detecting the PCB, and the actual graphic data of the maintenance good PCB is stored in the corresponding position of the server.
In one embodiment, in S10, a good PCB or a good PCB is inspected;
s41, acquiring first actual graphic information of the PCB corresponding to the detection data by accessing a preset position on the server;
s42, generating a first dam-building printing image corresponding to the PCB according to the first actual graphic information;
s43, blending a good-product PCB or overhauling the good-product PCB to superpose the solder mask layer image with the first damming printing image, deleting the superposed area, and generating a first non-damming area solder mask printing image;
s44, respectively capturing a first damming printing image and a first non-damming area solder mask printing image;
s45, respectively generating a first damming printing program and a first non-damming area solder mask printing program;
s46, combining the solder mask printing programs of the first non-damming area into a first solder mask printing program according to the sequence that the first damming printing program is in front of the first non-damming area;
and S47, enabling the name of the first solder mask printing program to be consistent with the name of the detection data and storing the name of the first solder mask printing program and the name of the detection data in a preset position of a server.
In one embodiment, after the VSR maintenance machine is adopted to judge that the defective PCB cannot be maintained, the defective PCB is recorded as a defective PCB with a scrapped unit, a special waste reporting identifier is printed in a fixed area of the scrapped unit, the PCB is re-detected by using AOI, and actual graphic data of the defective PCB with the scrapped unit is stored in a corresponding position of the server.
In one embodiment, the method for solder resist printing of the defective PCB with the scrapping unit comprises the following steps:
s61, second actual graphic information of the PCB corresponding to the detection data is obtained by accessing a preset position on the server;
s62, deleting the third actual graphic information of the second actual graphic information reporting waste unit;
s63, generating fourth actual graphic information without scrapped units;
s64, generating a second dam-building printing image corresponding to the PCB according to the fourth actual graphic information;
s65, calling a defective PCB solder mask layer image with a scrapped unit to be superposed with the second damming printing image, deleting a superposed area, and generating a second non-damming area solder mask printing image;
s66, respectively capturing a second damming printing image and a second non-damming area solder mask printing image;
s67, respectively generating a second damming printing program and a second non-damming area solder mask printing program;
s68, combining the solder mask printing programs of the second non-damming area into a second solder mask printing program according to the sequence that the second damming printing program is in front of the second non-damming area;
and S69, enabling the name of the second solder mask printing program to be consistent with the name of the detection data and storing the name of the detection data in a preset position of the server. In one embodiment, the inspection data at least includes actual pattern information corresponding to the line width, pad size, expansion and contraction, pattern position, etc. of the inspection PCB.
In one embodiment, in S11, the method of inkjet printing is:
s81, a high-definition CCD camera of the solder resist ink-jet printer is used for capturing a second two-dimensional code or a second bar code on the PCB;
s82, identifying the model and the batch corresponding to the PCB and the serial number of AOI detection, capturing a first solder mask printing program of a corresponding code of a file in a preset position of a server, and importing the first solder mask printing program into a solder mask ink-jet printer system;
s83, grabbing the positioning holes or the graphs on the PCB for positioning, performing ink-jet printing solder mask according to the first solder mask printing program corresponding to the codes, and finishing solder mask printing production after the first solder mask printing program is finished.
In one embodiment, the damming printing program comprises a line damming design and a window-resistance damming design, wherein the line damming design is tangent to two side edges of the line pattern, and the window-resistance damming design is tangent to the window-resistance pattern.
In one embodiment, the design of the dam width can be designed according to the characteristics of the solder resist printing ink and the solder resist thickness requirement, and the dam width is between 100 and 300 μm.
The method for the ink-jet printing solder mask of the PCB has the advantages that:
1. the method comprises the steps of printing a specific second two-dimensional code or a second bar code on a detected PCB through actual circuit pattern detection data of the PCB obtained through detection of a connecting line AOI and a connecting line two-dimensional code printer, enabling the PCB to correspond to the AOI detection data one by one, correspondingly designing a damming printing pattern and a non-damming area resistance welding printing pattern by taking actual pattern information output by the detection of the PCB AOI through a resistance welding printing program, respectively generating a damming printing program and a non-damming area resistance welding printing program through computer software according to the damming printing pattern and the non-damming area resistance welding printing pattern, enabling the damming printing program to be in front, enabling the non-damming area resistance welding printing program to be combined into a resistance welding printing program at the back, positioning a camera through an ink-jet printer, scanning the second two-dimensional code or the second two-dimensional code on a product to be subjected to ink-jet printing resistance welding, automatically calling the resistance welding program corresponding to the PCB, leading the ink-jet resistance welding printer to carry out ink-jet printing, and leading to the problem that the ink-jet printing is poor in the resistance welding printing process, and the problem that the ink-jet printing quality of the resistance welding printed on-welding window is poor, and the large-welding line width is caused by the offset of the ink-jet printing device exists, and the client side is effectively avoided, and the problem that the ink-jet printing of the printed on-jet printing system exist.
2. The good PCB is inspected, the good PCB is overhauled, the defective PCB with the scrapped units is partitioned, corresponding second two-dimensional codes or second bar codes on the defective PCB with the scrapped units are scanned to call the defective PCB detection data with the scrapped units, AOI detection data of the corresponding defective PCB with the scrapped units are called, second actual graphic information of the defective PCB with the scrapped units is obtained, third actual graphic information of the scrapped units is shielded, fourth actual graphic information without the scrapped units is generated, a second damming printing graph and a second non-damming area soldermask printing graph are correspondingly designed by taking the fourth actual graphic information as reference, the second damming printing graph and the second non-damming area soldermask printing graph are combined into a second damming printing graph and a second non-damming area soldermask printing graph through computer software, the second damming printing graph and the second non-damming area soldermask printing graph are generated respectively, the second damming printing program and the second non-damming area soldermask printing graph are combined into a second damming area soldermask printing program through computer software, ink-jet ink is effectively saved, and the ink jet ink is effectively reduced in production.
3. The method has the advantages that the code scanning is adopted to obtain the information of the PCB, the customized design of the ink-jet printing program of the product is automatically processed, the ink-jet printing program of the product is automatically read and guided in, the time for the ink-jet printing to solder-resist and take the ink-jet printing program of the product is shortened, the ink-jet printing solder-resist production efficiency of the product is improved, and the problem that the ink-jet printing solder-resist quality is caused due to the fact that errors are easily generated in the manual transfer of the ink-jet printing program of the product is avoided.
Drawings
FIG. 1 is a flow chart of the method for ink-jet printing solder mask on PCB board according to the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected to" another element, there are no intervening elements present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in FIG. 1, a method for ink-jet printing solder mask on PCB comprises
S1, product coding design, namely converting the PCB model and the process card batch number into a first two-dimensional code or a first bar code;
s2, adding a first two-dimensional code or a first bar code, adding the first two-dimensional code or the first bar code in a stream Cheng Kashang, and corresponding the process card to the PCB with the corresponding batch and model;
s3, manufacturing a previous flow, wherein the flow card synchronously flows along with the production flow of the PCB of the corresponding batch;
s4, before image development, code scanning is carried out to identify product information, before development, a code scanning device is used to identify a first two-dimensional code or a first bar code on a flow card of the PCB of the batch to be produced, and production information of the PCB is obtained and then is synchronously produced with AOI;
s5, generating a second two-dimensional code or a second bar code, and generating the second two-dimensional code or the second bar code with different serial numbers of each PCB after AOI detection on the basis of the first two-dimensional code or the first bar code by using a code assigning system of two-dimensional code printing equipment;
s6, AOI detection, namely detecting a corresponding PCB by using a connecting line AOI after pattern development, etching and film stripping according to production information, storing detection data in the same position of a server as the production information, and forming a code corresponding to a corresponding second two-dimensional code or second bar code;
s7, printing a second two-dimensional code or a second bar code, after the PCB is subjected to line AOI detection, entering two-dimensional code printing equipment for line connection one by one according to the detection sequence, and printing the second two-dimensional code or the second bar code of each PCB for AOI detection of different serial numbers on a preset position of the edge of the PCB;
s8, judging the quality of the PCB, judging whether the detected PCB is a defective product or not according to the AOI detection result, and otherwise, performing the next step;
s9, preprocessing, namely processing the surface of the PCB in a super-roughening and anti-seepage mode;
s10, determining a solder resist printing method of a good PCB;
s11, ink-jet printing, namely acquiring a first solder mask printing program by adopting a solder mask ink-jet printer through recognizing the second two-dimensional code or the second bar code and completing ink-jet printing at a preset position of the PCB;
and S12, postcuring, wherein the postcuring is carried out by normally baking in a tunnel furnace connected with a solder resist ink-jet printer.
In one embodiment, in S6, the detection method of AOI detection is:
s21, detecting the PCB through AOI and forming detection data, wherein the detection data comprises real pattern data of a good PCB and real pattern data of a bad PCB;
s22, encoding the detection data according to the product model, the batch number and the serial number corresponding to the second two-dimensional code or the second bar code;
s23, storing the detection data at a preset position of the server and naming the detection data by using codes;
s24, enabling the detection data to correspond to the detected PCB, the second two-dimensional code or the second bar code.
In one embodiment, the VSR maintenance machine is adopted to judge whether the PCB with the defective products can be maintained, if so, the maintained PCB is recorded as a maintenance good product, the AOI is used for re-detecting the PCB, and the actual graphic data of the PCB with the maintenance good product is stored in the corresponding position of the server.
In one embodiment, in S10, a good PCB or a good PCB is inspected;
s41, acquiring first actual graphic information of the PCB corresponding to the detection data by accessing a preset position on the server;
s42, generating a first dam-building printing image corresponding to the PCB according to the first actual graphic information;
s43, blending a good-product PCB or overhauling the good-product PCB to superpose the solder mask layer image with the first damming printing image, deleting the superposed area, and generating a first non-damming area solder mask printing image;
s44, respectively capturing a first damming printing image and a first non-damming area solder mask printing image;
s45, respectively generating a first damming printing program and a first non-damming area solder mask printing program;
s46, combining the solder mask printing programs of the first non-damming area into a first solder mask printing program according to the sequence that the first damming printing program is in front of the first non-damming area;
and S47, enabling the name of the first solder mask printing program to be consistent with the name of the detection data and storing the name of the first solder mask printing program in a preset position of the server.
In one embodiment, after the VSR maintenance machine is adopted to judge that the defective PCB cannot be maintained, the defective PCB is recorded as a defective PCB with a scrapped unit, a special waste reporting identifier is printed in a fixed area of the scrapped unit, the PCB is re-detected by using AOI, and actual graphic data of the defective PCB with the scrapped unit is stored in a corresponding position of the server.
In one embodiment, the method for solder resist printing of the defective PCB with the scrapping unit comprises the following steps:
s61, second actual graphic information of the PCB corresponding to the detection data is obtained by accessing a preset position on the server;
s62, deleting the third actual graphic information of the second actual graphic information reporting waste unit;
s63, generating fourth actual graph information without scrapped units;
s64, generating a second dam-building printing image corresponding to the PCB according to the fourth actual graphic information;
s65, calling a defective PCB (printed Circuit Board) solder mask image with scrapped units to be superposed with the second damming printing image, deleting a superposed area, and generating a second non-damming area solder mask printing image;
s66, respectively capturing a second damming printing image and a second non-damming area solder mask printing image;
s67, respectively generating a second damming printing program and a second non-damming area solder mask printing program;
s68, combining the solder mask printing programs of the second non-damming area into a second solder mask printing program according to the sequence that the second damming printing program is in front of the second non-damming area;
and S69, enabling the name of the second solder mask printing program to be consistent with the name of the detection data and storing the name of the detection data in a preset position of the server. In one embodiment, the inspection data at least includes actual pattern information corresponding to the line width, pad size, expansion and contraction, pattern position, etc. of the inspection PCB.
In one embodiment, in S11, the method of inkjet printing is:
s81, a high-definition CCD camera of the solder resist ink-jet printer is used for capturing a second two-dimensional code or a second bar code on the PCB;
s82, identifying the model and the batch corresponding to the PCB and the serial number of AOI detection, capturing a first solder mask printing program of a corresponding code of a file in a preset position of a server, and importing the first solder mask printing program into a solder mask ink jet printer system;
s83, grabbing the positioning holes or the graphs on the PCB for positioning, performing ink-jet printing solder mask according to the first solder mask printing program corresponding to the codes, and finishing solder mask printing production after the first solder mask printing program is finished.
In one embodiment, the damming printing program comprises a line damming design and a window-resistance damming design, wherein the line damming design is tangent to two side edges of the line pattern, and the window-resistance damming design is tangent to the window-resistance pattern.
In one embodiment, the design of the dam width can be designed according to the characteristics of the solder resist printing ink and the solder resist thickness requirement, and the dam width is between 100 and 300 μm.
Example 1:
s1, product coding design, namely converting the PCB model and the process card batch number into a first two-dimensional code or a first bar code; coding the PCB model and the process card batch number according to a certain rule, and converting the PCB model number into a first two-dimensional code or a first bar code representing the PCB model and the process card batch number by using two-dimensional code or bar code software;
s2, adding a first two-dimensional code or a first bar code, adding the first two-dimensional code or the first bar code in the stream Cheng Kashang, and corresponding the process card to the PCB of the corresponding batch and model;
s3, manufacturing a previous flow, wherein the flow card synchronously flows along with the production flow of the PCB of the corresponding batch;
s4, before image development, code scanning is carried out to identify product information, before development, a code scanning device is used to identify a first two-dimensional code or a first bar code on a flow card of the PCB of the batch to be produced, and production information of the PCB is obtained and then is synchronously produced with AOI; calling circuit layer design data of the corresponding PCB through the PCB serial number identified by the first two-dimensional code or the first bar code;
s5, acquiring a second two-dimensional code or a second bar code, and generating the second two-dimensional code or the second bar code with different serial numbers after AOI (automated optical inspection) of each PCB (printed Circuit Board) on the basis of the first two-dimensional code or the first bar code by using a code assigning system of two-dimensional code printer equipment;
the method comprises the following steps: before the graph is developed, a code scanning device is used for identifying a first two-dimensional code or a first bar code on a flow card of a batch to be produced, and the first two-dimensional code or the first bar code is led into a code assigning system of a two-dimensional code or bar code printer;
step two: generating different second two-dimensional codes or second bar codes with serial numbers after AOI (automated optical inspection) of each PCB (printed Circuit Board) by using a code assigning system of a two-dimensional code printer or a bar code printer on the basis of the first two-dimensional codes or the first bar codes;
s6, AOI detection, namely after the pattern development, etching and film stripping, AOI detects the corresponding PCB according to the production information, stores the detection data in the same position of the server as the production information and forms a corresponding second two-dimensional code or a code corresponding to a second bar code; after AOI detection is carried out normally, outputting detection data corresponding to the PCB, encoding the detection data according to the type number, batch number and serial number of the PCB corresponding to a second two-dimensional code or a second bar code, setting the codes as detection data names, and storing the detection data in a file 1 with a specified path on a server to enable the detection data to correspond to the detected PCB one by one;
s7, printing second two-dimensional codes, after the PCB is subjected to line connection AOI detection, entering two-dimensional code printing equipment for line connection one by one according to the detection sequence, and printing the second two-dimensional codes of different serial numbers detected by the AOI of each PCB at preset positions on the edge of the PCB; the second two-dimensional code or the second bar code printing area is an area which can be grabbed by the AOI detection equipment;
s8, judging the quality of the PCB, judging the detected PCB to be a good product according to the AOI detection result,
s9, preprocessing, namely processing the surface of the PCB in a super-roughening and anti-seepage mode; the anti-seepage treatment effectively controls the penetration of the solder resist ink;
s10, determining a solder resist printing method of a good PCB;
s11, ink-jet printing, namely, an ink-jet printer is adopted to obtain a first solder mask printing program by identifying the second two-dimensional code or the second bar code, and the ink-jet printing is completed at a preset position of the PCB; adopting special solder resist printing ink with viscosity of 15-25mPa.s and surface tension of 30N/m-40mN/m at normal temperature (25 ℃);
s12, post-curing, wherein a tunnel furnace connected with the ink-jet printer is adopted for normal baking and post-curing, and the curing parameters are as follows: 150 +/-5 ℃/60min.
Example 2:
s1, product coding design, namely converting the PCB model and the process card batch number into a first two-dimensional code or a first bar code; coding the PCB model and the process card batch number according to a certain rule, and converting the PCB model number into a first two-dimensional code or a first bar code representing the PCB model and the process card batch number by using two-dimensional code or bar code software;
s2, adding a first two-dimensional code or a first bar code, adding the first two-dimensional code or the first bar code in a stream Cheng Kashang, and corresponding the process card to the PCB with the corresponding batch and model;
s3, manufacturing a previous flow, wherein the flow card synchronously flows along with the production flow of the PCB of the corresponding batch;
s4, before image development, code scanning is carried out to identify product information, before development, a code scanning device is used to identify a first two-dimensional code or a first bar code on a flow card of the PCB of the batch to be produced, and production information of the PCB is obtained and then is synchronously produced with AOI; calling circuit layer design data of the corresponding PCB through the PCB serial number identified by the first two-dimensional code or the first bar code;
s5, acquiring a second two-dimensional code or a second bar code, and generating the second two-dimensional code or the second bar code with different serial numbers of each PCB after AOI detection on the basis of the first two-dimensional code or the first bar code by using a code assigning system of two-dimensional code printer equipment;
the method comprises the following steps: before the graph is developed, a code scanning device is used for identifying a first two-dimensional code or a first bar code on a flow card of a batch to be produced, and the first two-dimensional code or the first bar code is led into a code assigning system of a two-dimensional code or bar code printer;
step two: generating different second two-dimensional codes or second bar codes with serial numbers after AOI (automated optical inspection) of each PCB (printed Circuit Board) by using a code assigning system of a two-dimensional code printer or a bar code printer on the basis of the first two-dimensional codes or the first bar codes;
s6, AOI detection, namely after the pattern development, etching and film stripping, AOI detects the corresponding PCB according to the production information, stores the detection data in the same position of the server as the production information and forms a corresponding second two-dimensional code or a code corresponding to a second bar code; after AOI detection is carried out on normal operation, detection data corresponding to the PCB are output, the detection data are coded according to the type, batch number and serial number of the PCB corresponding to the second two-dimensional code or the second bar code, the codes are set as detection data names, and the detection data are stored in a file 1 of a specified path on a server, so that the detection data correspond to the detected PCB one by one;
s7, printing second two-dimensional codes, after the PCB is subjected to line connection AOI detection, entering line connection two-dimensional code printing equipment one by one according to the detection sequence, and printing the second two-dimensional codes of different serial numbers detected by the AOI of each PCB at preset positions on the edge of the PCB; the second two-dimensional code or the second bar code printing area is an area which can be grabbed by the AOI detection equipment;
s8, judging the quality of the PCB, and judging the detected PCB to be a defective PCB according to the AOI detection result;
s9, judging whether the PCB with the defective products can be overhauled or not by adopting a VSR overhauling machine, if so, recording the overhauled PCB as the PCB with the defective products, re-detecting the PCB with the defective products by using AOI, and storing detection data in a file 1 of a server;
s10, preprocessing, namely processing the surface of the PCB in a super-roughening and anti-seepage mode; the anti-seepage treatment effectively controls the penetration of the solder resist ink;
s11, determining a solder mask printing method for the PCB with good overhaul quality; the method for maintaining the solder resist printing of the good PCB and the method for maintaining the solder resist printing of the good PCB adopt the same method;
s12, ink-jet printing, namely, an ink-jet printer is adopted to obtain a first solder mask printing program by identifying a second two-dimensional code or a second bar code, and the ink-jet printing is completed at a preset position of the PCB; adopting special solder resist printing ink with viscosity of 15-25mPa.s and surface tension of 30N/m-40mN/m at normal temperature (25 ℃);
s13, post-curing, wherein a tunnel furnace connected with the ink-jet printer is adopted for normal baking and post-curing, and the curing parameters are as follows: 150 +/-5 ℃/60min.
Example 3:
s1, designing product codes, namely converting the PCB type and the process card batch number into a first two-dimensional code or a first bar code; coding the PCB model and the process card batch number according to a certain rule, and converting the PCB model number into a first two-dimensional code or a first bar code representing the PCB model and the process card batch number by using two-dimensional code or bar code software;
s2, adding a first two-dimensional code or a first bar code, adding the first two-dimensional code or the first bar code in a stream Cheng Kashang, and corresponding the process card to the PCB with the corresponding batch and model;
s3, manufacturing a previous flow, wherein the flow card synchronously flows along with the production flow of the PCB of the corresponding batch;
s4, before image development, code scanning is carried out to identify product information, before development, a code scanning device is used to identify a first two-dimensional code or a first bar code on a flow card of the PCB of the batch to be produced, and production information of the PCB is obtained and then is synchronously produced with AOI; calling circuit layer design data of the corresponding PCB through the PCB serial number identified by the first two-dimensional code or the first bar code;
s5, acquiring a second two-dimensional code or a second bar code, and generating the second two-dimensional code or the second bar code with different serial numbers after AOI (automated optical inspection) of each PCB (printed Circuit Board) on the basis of the first two-dimensional code or the first bar code by using a code assigning system of two-dimensional code printer equipment;
the method comprises the following steps: before the graph is developed, a code scanning device is used for identifying a first two-dimensional code or a first bar code on a flow card of a batch to be produced, and the first two-dimensional code or the first bar code is led into a code assigning system of a two-dimensional code or bar code printer;
step two: generating different second two-dimensional codes or second bar codes with serial numbers after AOI (automated optical inspection) of each PCB (printed Circuit Board) by using a code assigning system of a two-dimensional code printer or a bar code printer on the basis of the first two-dimensional codes or the first bar codes;
s6, AOI detection, namely after the pattern development, etching and film stripping, AOI detects the corresponding PCB according to the production information, stores the detection data in the same position of the server as the production information and forms a corresponding second two-dimensional code or a code corresponding to a second bar code; after AOI detection is carried out on normal operation, detection data corresponding to the PCB are output, the detection data are coded according to the type, batch number and serial number of the PCB corresponding to the second two-dimensional code or the second bar code, the codes are set as detection data names, and the detection data are stored in a file 1 of a specified path on a server, so that the detection data correspond to the detected PCB one by one;
s7, printing second two-dimensional codes, after the PCB is subjected to line connection AOI detection, entering two-dimensional code printing equipment for line connection one by one according to the detection sequence, and printing the second two-dimensional codes of different serial numbers detected by the AOI of each PCB at preset positions on the edge of the PCB; the second two-dimensional code or the second bar code printing area is an area which can be grabbed by the AOI detection equipment;
s8, after the VSR maintenance machine is adopted to judge that the defective PCB cannot be maintained, recording the defective PCB as a defective PCB with a scrapped unit, printing a special waste reporting mark in a fixed area of the scrapped unit, re-detecting the PCB by using AOI, and storing actual graphic data of the defective PCB with the scrapped unit in a file 1 of the server;
s9, preprocessing, namely processing the surface of the PCB in a super-roughening and anti-seepage mode; the anti-seepage treatment effectively controls the penetration of the solder resist ink;
s10, determining a defective PCB solder mask printing method with scrapped units;
s11, ink-jet printing, namely, an ink-jet printer is adopted to obtain a first solder mask printing program by identifying a second two-dimensional code or a second bar code, and the ink-jet printing is completed at a preset position of the PCB; adopting special solder resist printing ink with viscosity of 15-25mPa.s and surface tension of 30N/m-40mN/m at normal temperature (25 ℃);
s12, post-curing, wherein a tunnel furnace connected with the ink-jet printer is adopted for normal baking and post-curing, and the curing parameters are as follows: 150 +/-5 ℃/60min.
Thus, the method for the ink-jet printing solder mask of the PCB has the beneficial effects that:
1. the method comprises the steps of printing a specific second two-dimensional code or a second bar code on a detected PCB through actual circuit pattern detection data of the PCB obtained through detection of a connecting line AOI and a connecting line two-dimensional code printer, enabling the PCB to correspond to the AOI detection data one by one, correspondingly designing a damming printing pattern and a non-damming area resistance welding printing pattern by taking actual pattern information output by the detection of the PCB AOI through a resistance welding printing program, respectively generating a damming printing program and a non-damming area resistance welding printing program through computer software according to the damming printing pattern and the non-damming area resistance welding printing pattern, enabling the damming printing program to be in front, enabling the non-damming area resistance welding printing program to be combined into a resistance welding printing program at the back, positioning a camera through an ink-jet printer, scanning the second two-dimensional code or the second two-dimensional code on a product to be subjected to ink-jet printing resistance welding, automatically calling the resistance welding program corresponding to the PCB, leading the ink-jet resistance welding printer to carry out ink-jet printing, and leading to the problem that the ink-jet printing is poor in the resistance welding printing process, and the problem that the ink-jet printing quality of the resistance welding printed on-welding window is poor, and the large-welding line width is caused by the offset of the ink-jet printing device exists, and the client side is effectively avoided, and the problem that the ink-jet printing of the printed on-jet printing system exist.
2. The good PCB, the overhaul good PCB and the defective PCB with the scrapped units are separated, then the corresponding second two-dimensional code or second bar code on the defective PCB with the scrapped units is scanned to call the detection data of the defective PCB with the scrapped units, the AOI detection data of the corresponding defective PCB with the scrapped units is called to obtain the second actual graphic information of the defective PCB with the scrapped units, the third actual graphic information of the scrapped units is shielded, and the fourth actual graphic information without the scrapped units is generated, and correspondingly designing a second damming printing graph and a second non-damming area solder mask printing graph by taking the fourth actual graph information as reference, and respectively generating a second damming printing program and a second non-damming area solder mask printing program by referring to the second damming printing graph and the second non-damming area solder mask printing graph through computer software, wherein the second damming printing program is in front, the second non-damming area solder mask printing programs are combined into a second solder mask printing program for ink-jet printing solder mask after the second non-damming area solder mask printing program is combined, so that ink-jet printing solder mask can be effectively avoided for scrapped parts of products, the use of ink-jet printing solder mask ink is effectively saved, and the production cost of products is reduced.
3. The method has the advantages that the code scanning is adopted to obtain the information of the PCB, the customized design of the ink-jet printing program of the product is automatically processed, the ink-jet printing program of the product is automatically read and guided in, the time for the ink-jet printing to solder-resist and take the ink-jet printing program of the product is shortened, the ink-jet printing solder-resist production efficiency of the product is improved, and the problem that the ink-jet printing solder-resist quality is caused due to the fact that errors are easily generated in the manual transfer of the ink-jet printing program of the product is avoided.
In one embodiment, in S10, a good PCB or a good PCB is inspected;
s41, acquiring first actual graphic information of the PCB corresponding to the detection data by accessing a preset position on the server;
s42, generating a first dam-building printing image corresponding to the PCB according to the first actual graphic information;
s43, blending the solder mask layer image of the PCB with good product and the first damming printing image for superposition, deleting the superposition area, and generating a first non-damming area solder mask printing image;
s44, respectively capturing a first damming printing image and a first non-damming area solder mask printing image;
s45, respectively generating a first damming printing program and a first non-damming area solder mask printing program;
s46, combining the solder mask printing programs of the first non-damming area into a first solder mask printing program according to the sequence that the first damming printing program is in front of the first non-damming area;
and S47, enabling the name of the first solder mask printing program to be consistent with the name of the detection data and storing the name of the first solder mask printing program in a preset position of the server.
The first actual graphic information of the good PCB is the actual graphic information of the good PCB in the detection data formed by detecting the PCB through AOI after graphic development, etching and film stripping; and the first actual graphic information of the repaired PCB is the actual graphic information of the repaired PCB obtained by re-detecting the repaired PCB by using AOI for the repaired PCB and acquiring the repaired PCB. Accessing a file 1 of a designated path on a server by scanning a corresponding second two-dimensional code or a second bar code on a good PCB or an overhaul good PCB, capturing a detection data name, acquiring first actual graphic information corresponding to the detected good PCB or the overhaul good PCB on the detection data, and generating a first dam-building printing image corresponding to the good PCB or the overhaul good PCB according to the first actual graphic information; transferring a good PCB or overhauling a solder mask layer image of the good PCB to be superposed with the first damming printing image, and deleting a superposed area to generate a first non-damming area solder mask printing image; respectively capturing a first damming printing image and a first non-damming area solder mask printing image through computer software, respectively generating a first damming printing program and a first non-damming area solder mask printing program, combining the first non-damming area solder mask printing programs into the first solder mask printing program in the sequence after the first damming printing program is in front, wherein the name of the first solder mask printing program is consistent with the name of detection data of a good PCB or a good PCB, and storing the first solder mask printing program in a file 2 of an appointed path of a server.
In one embodiment, the method for solder resist printing of the defective PCB with the scrapping unit comprises the following steps:
s61, second actual graphic information of the PCB corresponding to the detection data is obtained by accessing a preset position on the server;
s62, deleting the third actual graphic information of the second actual graphic information reporting waste unit;
s63, generating fourth actual graphic information without scrapped units;
s64, generating a second dam-building printing image corresponding to the PCB according to the fourth actual graphic information;
s65, transferring and overhauling a solder mask layer image of the PCB to be inspected and good products to be superposed with the second damming printing image, deleting a superposed area, and generating a second non-damming area solder mask printing image;
s66, respectively capturing a second damming printing image and a second non-damming area solder mask printing image;
s67, respectively generating a second damming printing program and a second non-damming area solder mask printing program;
s68, combining the solder mask printing programs of the second non-damming area into a second solder mask printing program according to the sequence that the second dam printing program is in front of the second dam printing program and the second non-damming area is behind the first dam printing program;
and S69, enabling the name of the second solder mask printing program to be consistent with the name of the detection data and storing the name of the detection data in a preset position of the server.
And the second actual graph information is the actual graph information of the defective PCB with the scrapped units in the actual graph information of the defective PCB in the detection information, which is formed by detecting the PCB through AOI after graph development, etching and film stripping.
Accessing a file 1 on a server in a designated path by scanning a second two-dimensional code or a second bar code corresponding to a PCB, capturing a detection data name, acquiring second actual graphic information of a product corresponding to detection on the detection data, deleting third actual graphic information of a scrapped unit of the product, generating fourth actual graphic information without scrapped units, and generating a second dam-building printing image corresponding to the PCB according to the fourth actual graphic information; calling a defective PCB solder mask layer image with scrapped units to be superposed with the second damming printing image, deleting the superposed area, and generating a second non-damming area solder mask printing image; and respectively capturing a second damming printing image and a second non-damming area solder mask printing image through computer software, respectively generating a second damming printing program and a second non-damming area solder mask printing program, merging the second non-damming area solder mask printing programs into the second solder mask printing program according to the sequence that the second damming printing program is in front and the second non-damming area solder mask printing program is behind, wherein the name of the second solder mask printing program is consistent with the name of the detection data, and storing the second solder mask printing program in a file 2 of the designated path of the server.
For example, after the pattern is developed and etched, detection data is generated after AOI detection corresponds to a PCB, the detection data at the moment comprises second actual pattern data, the second actual pattern information is the detected actual pattern data, if the PCB is a defective PCB with a scrapped unit in defective products which cannot be overhauled according to the detection result of the PCB at the moment, for example, the existing PCB is generally formed by a plurality of jointed boards, one of the jointed boards is damaged, the damaged jointed board is marked as the scrapped unit, the scrapped unit is third actual pattern information, the scrapped unit is deleted, fourth actual pattern information is formed, the fourth actual pattern information is further operated, and a second solder mask printing program can be obtained. Therefore, the scrapped part of the product can be effectively avoided for ink-jet printing solder mask, the use of ink-jet printing solder mask ink is effectively saved, and the production cost of the product is reduced.
Furthermore, the damming printing program comprises a line damming design and a resistance welding windowing damming design, wherein the line damming design is tangent to the edges of the two sides of the line graph; the design of the solder mask windowing dam is tangent to the solder mask windowing position graph; the design of the damming width can be designed according to the characteristics of solder resist printing ink and the requirement of solder resist thickness, and the damming width is between 50 and 100 mu m; and the non-damming area solder mask is designed to dig out a damming solder mask pattern for the solder mask image of the product.
In one embodiment, in S11, the method of inkjet printing is:
s81, a high-definition CCD camera of the solder resist ink-jet printer is used for capturing a second two-dimensional code or a second bar code on the PCB;
s82, identifying the model and the batch corresponding to the PCB and the serial number of AOI detection, capturing a first solder mask printing program of a corresponding code of a file in a preset position of a server, and importing the first solder mask printing program into a solder mask ink jet printer system;
s83, grabbing the positioning holes or the graphs on the PCB for positioning, performing ink-jet printing solder mask according to the first solder mask printing program corresponding to the codes, and finishing solder mask printing production after the first solder mask printing program is finished.
The ink-jet printing is carried out by using a special solder resist printing ink with the viscosity of 15Pa.s-25mPa.s and the surface tension of 30N/m-40mN/m at normal temperature (25 ℃). An LED lamp with the wavelength of 395nm is adopted, and the energy parameter is 100 mJ/cm 2 -300mJ/cm 2 Or a mercury lamp with an energy parameter of 1000 mJ/cm 2 -1500mJ/cm 2 And after solder mask printing, illumination is carried out in real time, and the solder mask and the printed solder mask are solidified synchronously.
Performing damming printing, namely, performing damming including line damming and windowing damming, wherein the windowing damming means that a solder resist dam is built around a solder resist windowing area by a solder resist printing mode, so that the solder resist ink is prevented from flowing into the solder resist windowing area due to fluidity of the solder resist ink, and the solder resist windowing area is protected; the line damming means that a solder resist dam is built on two sides of a line in a solder resist printing mode, so that the problem that the line edge turns red due to the fact that solder resist ink fluidity, ink at the line edge is lost and the ink at the line edge is too thin is avoided; the non-damming area refers to the other solder resisting area except the damming area.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (8)

1. A method for solder mask of ink-jet printing of a PCB is characterized by comprising the following steps: comprises that
S1, product coding design, namely converting the PCB model and the process card batch number into a first two-dimensional code or a first bar code;
s2, adding a first two-dimensional code or a first bar code, adding the first two-dimensional code or the first bar code in the stream Cheng Kashang, and corresponding the process card to the PCB of the corresponding batch and model;
s3, manufacturing a previous flow, wherein the flow card synchronously flows along with the production flow of the PCB of the corresponding batch;
s4, before image development, code scanning is carried out to identify product information, before development, a code scanning device is used to identify a first two-dimensional code or a first bar code on a flow card of the PCB of the batch to be produced, and production information of the PCB is obtained and then is synchronously produced with AOI;
s5, generating a second two-dimensional code or a second bar code, and generating the second two-dimensional code or the second bar code with different serial numbers after AOI (automated optical inspection) of each PCB (printed Circuit Board) on the basis of the first two-dimensional code or the first bar code by using a code assigning system of two-dimensional code printing equipment;
s6, AOI detection, namely detecting a corresponding PCB by using a connecting line AOI after pattern development, etching and film stripping according to production information, storing detection data in the same position of a server as the production information, and forming a code corresponding to a corresponding second two-dimensional code or second bar code;
s7, printing a second two-dimensional code or a second bar code, after the PCB is subjected to line AOI detection, entering two-dimensional code printing equipment for line connection one by one according to the detection sequence, and printing the second two-dimensional code of each PCB for AOI detection of different serial numbers on the edge preset position of the PCB;
s8, judging the quality of the PCB, judging whether the detected PCB is a defective product or not according to the AOI detection result, and otherwise, performing the next step;
s9, preprocessing, namely processing the surface of the PCB in a super-coarsening and anti-seepage mode;
s10, determining a solder mask printing method of a good PCB;
s11, ink-jet printing, namely, adopting a solder mask ink-jet printer to obtain a first solder mask printing program by identifying a second two-dimensional code or a second bar code and completing ink-jet printing at a preset position of the PCB;
s12, post-curing, namely, normally baking and curing by adopting a tunnel furnace connected with a solder resist ink-jet printer;
in S6, the detection method of AOI detection is:
s21, detecting the PCB through AOI and forming detection data, wherein the detection data comprises real pattern data of a good PCB and real pattern data of a bad PCB;
s22, encoding the detection data according to the product model, the batch number and the serial number corresponding to the second two-dimensional code or the second bar code;
s23, storing the detection data at a preset position of the server and naming the detection data by using codes;
s24, enabling the detection data to correspond to the detected PCB, the second two-dimensional code or the second bar code;
in S10, a good PCB or a good PCB is repaired to form a solder resist printing method;
s41, acquiring first actual graphic information of the PCB corresponding to the detection data by accessing a preset position on the server;
s42, generating a first dam-building printing image corresponding to the PCB according to the first actual graphic information;
s43, blending a good-product PCB or overhauling the good-product PCB to superpose the solder mask layer image with the first damming printing image, deleting the superposed area, and generating a first non-damming area solder mask printing image;
s44, respectively capturing a first damming printing image and a first non-damming area solder mask printing image;
s45, respectively generating a first damming printing program and a first non-damming area solder mask printing program;
s46, combining the solder mask printing programs of the first non-damming area into a first solder mask printing program according to the sequence that the first damming printing program is in front of the first non-damming area;
and S47, enabling the name of the first solder mask printing program to be consistent with the name of the detection data and storing the name of the first solder mask printing program and the name of the detection data in a preset position of a server.
2. The method for ink-jet printing solder mask of PCB board according to claim 1, characterized in that:
and judging whether the defective PCB can be overhauled or not by adopting a VSR overhauling machine, if so, recording the overhauled PCB as an overhauled good product, and re-detecting the PCB by using AOI and storing actual graphic data of the overhauled good product PCB in a corresponding position of a server.
3. The method for ink-jet printing solder mask of PCB board according to claim 2, characterized in that:
after the VSR maintenance machine is adopted to judge that the defective PCB cannot be maintained, the defective PCB is recorded as a defective PCB with a scrapped unit, a reporting waste special mark is printed in a fixed area of the scrapped unit, the AOI is used for re-detecting the PCB, and actual graphic data of the defective PCB with the scrapped unit is stored in a corresponding position of the server.
4. The method for ink-jet printing solder mask of PCB board according to claim 3, characterized in that:
the method for solder resist printing of the defective PCB with the scrapped units comprises the following steps:
s61, second actual graphic information of the PCB corresponding to the detection data is obtained by accessing a preset position on the server;
s62, deleting the third actual graphic information of the second actual graphic information reporting waste unit;
s63, generating fourth actual graphic information without scrapped units;
s64, generating a second dam-building printing image corresponding to the PCB according to the fourth actual graphic information;
s65, calling a defective PCB (printed Circuit Board) solder mask image with scrapped units to be superposed with the second damming printing image, deleting a superposed area, and generating a second non-damming area solder mask printing image;
s66, respectively capturing a second damming printing image and a second non-damming area solder mask printing image;
s67, respectively generating a second damming printing program and a second non-damming area solder mask printing program;
s68, combining the solder mask printing programs of the second non-damming area into a second solder mask printing program according to the sequence that the second dam printing program is in front of the second dam printing program and the second non-damming area is behind the first dam printing program;
and S69, enabling the name of the second solder mask printing program to be consistent with the name of the detection data and storing the name of the detection data in a preset position of the server.
5. The method for ink-jet printing solder mask of PCB board according to claim 1, characterized in that: the detection data at least comprises actual graphic information such as line width, bonding pad size, expansion and contraction, graphic position and the like of the corresponding detection PCB.
6. The method for ink-jet printing solder mask of PCB board according to claim 1, characterized in that:
in S11, the method of inkjet printing is:
s81, a high-definition CCD camera of the solder resist ink-jet printer is used for capturing a second two-dimensional code or a second bar code on the PCB;
s82, identifying the model and the batch corresponding to the PCB and the serial number of AOI detection, capturing a first solder mask printing program of a corresponding code of a file in a preset position of a server, and importing the first solder mask printing program into a solder mask ink jet printer system;
s83, grabbing the positioning holes or the graphs on the PCB for positioning, performing ink-jet printing solder mask according to the first solder mask printing program corresponding to the codes, and finishing solder mask printing production after the first solder mask printing program is finished.
7. The method for ink-jet printing solder mask of PCB board according to claim 1, characterized in that: the damming printing program comprises a circuit damming design and a resistance welding windowing damming design, wherein the circuit damming design is tangent to the edges of two sides of a circuit graph, and the resistance welding windowing damming design is tangent to the resistance welding windowing graph.
8. The method for ink-jet printing solder mask of PCB board according to claim 1, wherein: the design of the damming width can be designed according to the characteristics of the solder resist printing ink and the requirement of the solder resist thickness, and the damming width is between 100 and 300 mu m.
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