CN108012426B - Quality tracing method for multilayer PCB - Google Patents
Quality tracing method for multilayer PCB Download PDFInfo
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- CN108012426B CN108012426B CN201711329983.3A CN201711329983A CN108012426B CN 108012426 B CN108012426 B CN 108012426B CN 201711329983 A CN201711329983 A CN 201711329983A CN 108012426 B CN108012426 B CN 108012426B
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- hole array
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09927—Machine readable code, e.g. bar code
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
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Abstract
The invention relates to the field of PCBs (printed circuit boards), and discloses a quality tracing method of a multilayer PCB, which comprises the following steps: in the cutting process, a unique two-dimensional code is distributed for each core plate, and the two-dimensional code is converted into a unique hole array code and then is drilled on the corresponding core plate; in the pressing process, reading the hole array code on each core plate, combining all the read hole array codes to generate a corresponding unique two-dimensional code, converting the two-dimensional code into the unique hole array code, and drilling the unique hole array code on a multilayer plate formed by pressing; after the resistance welding process, reading the hole array code on the multilayer board, converting the hole array code into a corresponding two-dimensional code, and then coding the two-dimensional code on the multilayer board. In the manufacturing process of the multilayer PCB, the embodiment of the invention can ensure the accurate identification of the tracing mark in each process, and lays a foundation for realizing the quality monitoring of the whole process of the product; the transfer from the inner layer information to the outer layer is realized in the pressing process, the loss of the inner layer information is prevented, and the full life cycle tracing of the product can be realized.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a quality tracing method of a multilayer PCB.
Background
The reason for the product problem is traced back to a serious challenge for manufacturers in every industry, from the automobile manufacturing industry to the aerospace industry, and from the medical industry to the food industry. In a global era, enterprises pursue relationship management to maximize customer satisfaction. Consumer and environmental regulations are becoming more stringent and traceability is becoming more necessary.
Manufacturers seek to maximize production capacity and to reduce costs at all times. To achieve this goal, each process in the overall manufacturing flow must be monitored and a complete history maintained. Problems affecting product quality must be quickly identified and corrected to prevent defective products from continuing to flow down the production line with the ultimate goal of achieving a zero product return rate as much as possible. In the electronics industry, PCB production also needs to meet customer traceability requirements, and when finding a problem, customers want to be able to quickly locate the cause of the problem and the range of affected products.
At present, the basic process flow of the multilayer PCB is as follows: cutting material, inner layer circuit, inner layer AOI (automatic optical Inspection), pressing, drilling, copper plating, outer layer circuit, outer layer AOI, solder welding, character, surface processing, forming, electrical testing, FQC/FQA and packaging. In order to realize quality tracing, in the whole manufacturing process, a PCB factory generally directly uses a two-dimensional code as an information carrier to be sprayed on a board surface, and a scanning gun is used for reading information of the two-dimensional code and adding new processing information into the two-dimensional code in each process. However, the two-dimensional code is used as the tracing identifier, which has the following disadvantages:
1) in the pressing process, inner layer information is lost due to the fact that the inner layer two-dimensional code cannot be identified;
2) in a plurality of processes, such as inner layer circuit manufacturing, copper deposition electroplating, outer layer pattern manufacturing, solder resistance and the like, the two-dimensional code is easily covered or corroded, and the identification of the two-dimensional code is seriously influenced.
Disclosure of Invention
The invention aims to provide a quality tracing method of a multilayer PCB (printed circuit board), which overcomes the defects that data is easy to lose and identification is easy to be influenced badly in the prior art by adopting a two-dimensional code as a tracing identifier.
In order to achieve the purpose, the invention adopts the following technical scheme:
a quality tracing method of a multilayer PCB comprises the following steps:
in the cutting process, a unique two-dimensional code is distributed for each core plate, and the two-dimensional code is converted into a unique hole array code and then is drilled on the corresponding core plate;
in the pressing process, reading the hole array code on each core plate, combining all the read hole array codes to generate a corresponding unique two-dimensional code, converting the two-dimensional code into the unique hole array code, and drilling the unique hole array code on a multilayer plate formed by pressing;
and after the solder mask process, reading the hole array code on the multilayer board, converting the hole array code into a corresponding two-dimensional code, and then coding the two-dimensional code on the multilayer board.
Optionally, the method further includes:
at a server side, creating a corresponding record item for each two-dimensional code;
when the core board or the multilayer board passes through any processing equipment in the whole PCB manufacturing process, reading the hole array code or the two-dimensional code on the core board or the multilayer board, and synchronizing the current production related information to the corresponding record item of the server side.
Optionally, the production-related information includes: any one or any combination of factory name, process name, production material number, production batch number, operator name, production line identity, commissioning time, raw material name or supplier or batch number, inspection data, production parameters.
Optionally, in the cutting process of the quality tracing method, before the hole array code is drilled on each core board, different hole array code drilling areas are assigned to each core board according to the preset stacking level.
Optionally, the method for reading the hole array code on each core plate in the laminating process includes: and after a plurality of core plates are stacked according to a preset sequence, reading the hole array code on each core plate through X-Ray.
Optionally, in the quality tracing method, in any one or more of a cutting process, an inner layer circuit manufacturing process, an inner layer AOI process, a drilling process, a copper deposition electroplating process, an outer layer circuit manufacturing process, an outer layer AOI process, a solder resist process, and a text printing process, the hole array code on each core board or multi-layer board is read by a visual identification method.
Optionally, the method for drilling the hole array code on the core plate or the multilayer plate is as follows: and drilling a through hole in the appointed area of the plate edge according to the hole array information of the hole array code.
Optionally, the method for drilling the hole array code on the core plate or the multilayer plate is as follows: and drilling blind holes in the appointed area of the plate edge according to the hole array information of the hole array code.
Optionally, in the quality tracing method, after solder mask development or baking after character printing, the hole array code on the multilayer board is read, and the hole array code is converted into a corresponding two-dimensional code and then printed on the multilayer board.
Optionally, in the quality tracing method, after the hole array code is converted into the corresponding two-dimensional code and then printed on the multilayer board, the two-dimensional code is identified by a scanning gun.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
1) in the manufacturing process of the multilayer PCB, the two-dimensional code is converted into the hole array code and formed on the board surface, and after the factors which have adverse effects on the two-dimensional code disappear, the hole array code is converted into the two-dimensional code and formed on the board surface, so that accurate identification of the tracing mark in each process can be effectively ensured, and a foundation is laid for realizing quality monitoring of the whole process of a product;
2) the hole array codes on the inner-layer core plates are combined firstly in the pressing process to generate the corresponding unique two-dimensional code, the two-dimensional code is converted into the hole array code to be formed in the outer layer, the transfer of the inner-layer information to the outer layer is realized, the loss of the inner-layer information is prevented, the product whole life cycle tracing can be realized, and the more and more strict quality requirements on the market are met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a quality tracing method for a multilayer PCB according to an embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core idea of the invention is as follows: aiming at the defects of the two-dimensional code in certain procedures, in the whole manufacturing process of the multilayer PCB, the corresponding two-dimensional code is generated for each core board, the two-dimensional code is converted into the hole array code to be formed on the board in the process from the material cutting procedure to the solder resisting procedure, and the hole array code is converted into the two-dimensional code to be formed on the board after entering the character printing procedure, so that the tracing mark is easy to identify and read, and the integrity of quality data is ensured.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Referring to fig. 1, the present embodiment provides a quality tracing method for a multilayer PCB, including the following steps:
The two-dimensional code is an information identification technology developed by combining three technologies of computer, communication and photoelectric sensing. The character is a black-white geometric figure arranged according to a certain rule, and black and white positions in the figure respectively correspond to '1' and '0', so that a binary character sequence is formed, and the binary character can represent information such as numbers, characters and the like.
The hole array code is used for marking information to be recorded by combining position information of a plurality of small holes in a specified area. The hole array code and the two-dimensional code correspond to each other one by one and have uniqueness.
In the step, after the edges of the cutting fillet are ground, a hole array code is drilled on each core plate through a laser coding machine. When the hole array code is formed, a through hole can be drilled, and a blind hole can also be drilled. Compared with the method of drilling through holes, the method of drilling blind holes has the advantages of small equipment investment, low cost, high efficiency, high automation degree and the like.
In addition, in order to ensure the normal manufacture of the core plate, the hole array codes can be arranged at the plate edges of the core plate. Meanwhile, in order to avoid mutual interference among the hole array codes of a plurality of core plates in the subsequent pressing process, different hole array code drilling areas need to be specified for each core plate in advance according to the preset stacking layers, so that the hole array codes of the core plates in different layers are strictly partitioned, and the core plates are convenient to recognize and read.
And 102, making an inner layer circuit and an inner layer AOI, reading a hole array code of the current core board through a CCD (charge coupled device) when each core board passes through one processing device, and synchronizing the current production related information into a corresponding record item of a server.
Because the two-dimensional code generated for the multilayer board in the laminating process corresponds to the plurality of hole array codes, namely corresponds to the two-dimensional codes of the plurality of inner-layer core boards, the recorded information of the two-dimensional code of the multilayer board is the sum of the recorded information of the two-dimensional codes of the plurality of inner-layer core boards.
In the step, different hole array codes of the core plates of the inner layers can be read at one time through the X-Ray, so that the hole array codes can be transferred from the inner layer to the outer layer quickly, the process is simplified, and the efficiency is improved.
When each core board or multilayer board passes through each processing device applied in the process, the hole array code is read through the CCD, and the current production related information is synchronized to the corresponding record item of the server side.
And step 104, before entering the character printing process, performing operations such as drilling, copper deposition and electroplating, outer-layer circuit manufacturing, outer-layer AOI (automated optical inspection) and resistance welding according to a normal process flow, reading the hole array code of the multilayer board through a CCD (charge coupled device) when the multilayer board passes through one processing device, and synchronizing the current production related information into a corresponding record item of a server side.
105, entering a character printing process, reading the hole array codes on the multilayer board through a CCD (charge coupled device) after the characters are printed and baked or after solder mask development, converting the hole array codes into corresponding two-dimensional codes before the characters are delivered, and then printing the two-dimensional codes on the edges of the multilayer board through a laser coding machine; meanwhile, when the multilayer board passes through one processing device every time, the hole array code of the multilayer board is read through the CCD, and the current production related information is synchronized to the corresponding record item of the server side.
And step 106, entering other subsequent procedures including surface treatment, forming, electrical measurement, FQC/FQA, packaging and the like, reading the two-dimensional code on the multilayer board through a scanning gun when the multilayer board passes through one processing device every time, and synchronizing the current production related information into a corresponding record item of a server side.
In the above flow, since the two-dimensional code is not easily recognized due to being easily covered or etched in the character printing process and the processes before the character printing process, the two-dimensional code is converted into the hole array code and formed on the board in the meantime; and after the characters printing process, the factors which have adverse effects on the two-dimensional code disappear, so the hole array code is converted back to the two-dimensional code to be formed on the board after the characters are printed, and the two-dimensional code can be quickly read through a scanning gun in the subsequent processes. Moreover, in the pressing process, the information of each inner layer can be quickly transferred to the outer layer, so that the loss of the information of the inner layers is prevented, and the integrity of data is effectively ensured.
In the whole process, each time the processing equipment passes through, the hole array code/two-dimensional code on the board is read, and the production related information is synchronized to the server side, and the production related information can comprise any one or any combination of a factory name, a process name, a production material number, a production batch number, an operator name, a production line name, production time, a name or supplier or batch number of raw materials, detection data and production parameters, so that comprehensive and complete data can be obtained at the server side, full life cycle tracing (including forward tracing and reverse tracing) of the product can be realized, quality monitoring of the full process of the product is enhanced, real-time monitoring of the processing equipment can be realized, and increasingly strict quality requirements on the market are met.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A quality tracing method of a multilayer PCB is characterized by comprising the following steps:
in the cutting process, a unique two-dimensional code is distributed for each core plate, and the two-dimensional code is converted into a unique hole array code and then is drilled on the corresponding core plate;
in the pressing process, reading the hole array code on each core plate, combining all the read hole array codes to generate a corresponding unique two-dimensional code, converting the two-dimensional code into the unique hole array code, and drilling the unique hole array code on a multilayer plate formed by pressing;
after the solder mask process, reading the hole array code on the multilayer board, converting the hole array code into a corresponding two-dimensional code, and then printing the code on the multilayer board;
the method further comprises the following steps:
at a server side, creating a corresponding record item for each two-dimensional code;
when the core board or the multilayer board passes through any processing equipment in the whole PCB manufacturing process, reading the hole array code or the two-dimensional code on the core board or the multilayer board, and synchronizing the current production related information to the corresponding record item of the server side.
2. A quality tracing method of a multi-layer PCB according to claim 1, wherein the production related information comprises: any one or any combination of factory name, process name, production material number, production batch number, operator name, production line identity, commissioning time, raw material name or supplier or batch number, inspection data, production parameters.
3. A quality tracing method for a multi-layer PCB according to claim 1, wherein in the cutting process of the quality tracing method, before the hole pattern is drilled on each core board, different hole pattern drilling areas are assigned to each core board according to the predetermined stacking levels.
4. A quality tracing method for a multi-layer PCB according to claim 3, wherein the method for reading the hole array code on each core board in the lamination process comprises: and after a plurality of core plates are stacked according to a preset sequence, reading the hole array code on each core plate through X-Ray.
5. A quality tracing method of a multilayer PCB according to claim 1, wherein in the quality tracing method, the hole array code on each core board or multilayer board is read by a visual recognition method in any one or more of a cutting process, an inner layer circuit making process, an inner layer AOI process, a drilling process, a copper deposition plating process, an outer layer circuit making process, an outer layer AOI process, a solder resist process and a character printing process.
6. A quality tracing method for a multi-layer PCB according to claim 1, wherein the method of drilling a hole array code on the core board or multi-layer board comprises: and drilling a through hole in the appointed area of the plate edge according to the hole array information of the hole array code.
7. A quality tracing method for a multi-layer PCB according to claim 1, wherein the method of drilling a hole array code on the core board or multi-layer board comprises: and drilling blind holes in the appointed area of the plate edge according to the hole array information of the hole array code.
8. A quality tracing method for a multilayer PCB according to claim 1, wherein the method reads a hole array code on the multilayer board after solder resist development or baking after text printing, converts the hole array code into a corresponding two-dimensional code, and prints the two-dimensional code on the multilayer board.
9. A quality tracing method for a multilayer PCB according to claim 1, wherein in the quality tracing method, after converting a hole array code into a corresponding two-dimensional code and printing the code on a multilayer board, the two-dimensional code is identified by a scanning gun.
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