CN113573506B - PCB production process and PCB circuit board - Google Patents

PCB production process and PCB circuit board Download PDF

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Publication number
CN113573506B
CN113573506B CN202110642212.XA CN202110642212A CN113573506B CN 113573506 B CN113573506 B CN 113573506B CN 202110642212 A CN202110642212 A CN 202110642212A CN 113573506 B CN113573506 B CN 113573506B
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code
outer layer
inner layer
production process
reading
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CN113573506A (en
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韩飞
刘海峰
肖树才
曾鹏飞
彭洪霞
陈小勇
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Shenzhen Shengdakang Technology Co ltd
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Shenzhen Shengdakang Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Factory Administration (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a PCB production process and a PCB circuit board, wherein the process comprises marking an inner layer A code and a secondary outer layer B code for different layers of a PNL board, and uploading marking contents to a traceability system, wherein the inner layer A code and the secondary outer layer B code are identity information codes; reading the inner layer A code and the outer layer B code, and performing association binding on information contained in the inner layer A code and the outer layer B code in a traceability system; reading the secondary outer layer B code and uploading the contained information to a tracing system, wherein the tracing system codes according to a preset rule of the system to generate an outer layer C code and transmits the outer layer C code to a laser coding machine or a mechanical coding machine; and coding on a SET board or a PCS board, uploading the traceability system in a working procedure, and correlating with the outer layer C code.

Description

PCB production process and PCB circuit board
Technical Field
The invention relates to the field of PCB manufacturing, in particular to a PCB production process and a PCB circuit board.
Background
The information tracing of the PCB board is controlled according to a large batch, and the PCB board in the same batch uses a digital string, usually five digits. However, the existing PCB has the following drawbacks:
the cause of product problems is traced back to a serious challenge for manufacturers in every industry, from the automotive industry to the aerospace industry, and from the medical to food industry, and not so. In a globalized era, enterprises pursue efficient management to achieve maximization of customer satisfaction.
Manufacturers seek to maximize throughput at any time than ever before and want to reduce costs. To achieve this goal, each process in the overall manufacturing flow must be monitored and a complete history maintained. The problem of affecting product quality must be quickly identified and corrected to prevent defective products from continuing down the production line, with the ultimate goal of achieving as little product return as possible. In the electronics industry, the production of PCBs is also required to meet customer traceability requirements, and customers want to be able to quickly locate the cause of a problem and the range of products affected when the problem is found.
Earlier, in the whole production process, in order to check the batch, the number string must be identified by manual visual inspection, increasing the number of plate turning operations of the plate, generating redundant actions, and increasing the risks of scrapping and confusion of the plate. The equipment cannot be automatically identified after confusion, and can be checked only by manual work. Before manual detection, the confused production and quality information does not correspond to the ID number of the PCB, so that information tracing is difficult or information misleading is caused during tracing. In addition, the tracing data is not fine enough according to large batch management and control, the information of each specific unit block is not tracked, a large number of reports are recorded on paper files of production and quality data, the workload of operators and the storage space of the reports are increased, the paper record is time-consuming and labor-consuming to inquire, a certain timeliness is achieved when the paper is stored, and the paper is difficult to inquire after the storage life is exceeded.
At present, the basic process flow of the multilayer PCB is as follows: opening the inner layer line AOI (Automatic Optic Inspection, automatic optical inspection), pressing, drilling, copper deposition plating, outer layer line AOI, solder resist, text surface treatment, forming, electrical measurement, FQC/FQA packaging. In order to realize quality tracing, in the whole manufacturing process, a PCB factory is generally directly sprayed on a board surface by using a two-dimensional code as an information carrier, and in each process, two-dimensional code information is read by a scanning gun and new processing information is added to the two-dimensional code.
The prior art is therefore still in need of further development.
Disclosure of Invention
Aiming at the technical problems, the invention provides a PCB production process and a PCB circuit board.
In a first aspect of an embodiment of the present invention, a process for producing a PCB is provided, including:
marking an inner layer A code and a secondary outer layer B code for different layers of the PNL board, and uploading marking contents to a traceability system, wherein the inner layer A code and the secondary outer layer B code are identity information codes;
reading the inner layer A code and the outer layer B code, and performing association binding on information contained in the inner layer A code and the outer layer B code in a traceability system;
reading the secondary outer layer B code and uploading the contained information to a tracing system, wherein the tracing system codes according to a preset rule of the system to generate an outer layer C code and transmits the outer layer C code to a laser coding machine or a mechanical coding machine;
and coding and uploading the traceability system on the SET board or the PCS board, and correlating with the outer layer C code.
Optionally, the process further comprises:
and adding a code reader at the plate placing and collecting section of each production process, reading and uploading each PNL plate, and recording the processing process parameters.
Optionally, the inner layer A code is formed on the PNL plate after the production process of cutting, round corner edging and cleaning.
Optionally, the outer layer B-coding of PNL panels is performed after the combination fusion and riveting process.
Optionally, the procedures of code reading and code binding are added in the combined fusion and riveting production process and the prestack production process; and identifying an inner layer A code and a secondary outer layer B code through a code reader during prestack, wherein the inner layer A code and the information contained in the outer layer B code are associated and bound in a traceability system.
Optionally, in the processes of cutting and grinding the drilling target, reading the code by the X-RAY, converting the code into the outer layer, adding the outer layer B code read by the X-RAY, uploading the content to a tracing system, and encoding by the tracing system according to a preset rule of the system to generate the outer layer C code and transmitting the outer layer C code to a laser coding machine or a mechanical coding machine.
Optionally, a laser coding machine or a mechanical coding machine is added in a development, silk-screen text printing and post-curing section, and codes are coded on a SET board or a PCS board and uploaded to a traceability system.
Optionally, the traceability system comprises a data acquisition system module, a code reading identification module and a data connection module.
Optionally, the outer layer C code includes a positioning code and a data code; the preset rule is as follows:
the outer layer C code comprises a positioning code and a data code, wherein the positioning code comprises a start symbol and an end symbol, the data code is positioned between the start symbol and the end symbol, and the positioning code adopts 8421 codes.
In a first aspect of the embodiment of the present invention, a PCB circuit board is provided, including a PNL board, on which an inner layer a code, a secondary outer layer B code, and an outer layer C code are engraved, where the inner layer a code and the secondary outer layer B code are used to bind processing parameters of the PNL board, the outer layer C code is formed by converting the inner layer a code and the secondary outer layer B code, the outer layer C code adopts a 4-row multi-column layout, the outer layer C code includes a positioning code and a data code, the positioning code includes a start symbol and an end symbol, the data code is located between the start symbol and the end symbol, and the positioning code adopts a 8421 code.
According to the technical scheme provided by the invention, the production process parameters can be acquired and subdivided and managed in the process flow of producing and manufacturing the PCB circuit boards by using the engraving coding mode, so that production management and control at the factory level, the workshop level and the site level are realized, and the process data of each PCB circuit board can be traced and managed.
Drawings
Fig. 1 is a schematic flow chart of a PCB production process according to an embodiment of the invention.
Fig. 2 is a schematic diagram of a process flow and management system of a PCB production process according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a traceback hole code on a PCB in an embodiment of the present invention.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The traditional production process flow of the PCB is as follows: cutting, round corner edging, cleaning, pretreatment, coating baking, exposure, development etching film removal, PE punching, browning, PP cutting and punching, combination melting/riveting, prestack, typesetting, pressing, drilling target cutting and grinding, X-RAY code reading, outer laser coding, PIN loading, drilling, PIN removal, deburring, cleaning, hole inspection, photoresist removal, copper deposition, VCP, outer pretreatment, exposure, DES, online AOI, VRS, solder mask pretreatment, silk screen printing ink, presintering, development, silk screen printing characters, post curing, PNL surface treatment, routing, cleaning and plate inspection, testing, AVI and packaging.
The conventional production process uses laser codes and PIN codes, and cannot well finish the traceability of production process parameters, so that the process of realizing the full production process by combining intelligent production is required.
Referring to fig. 1, fig. 1 is a flow chart of an embodiment of a PCB production process according to an embodiment of the invention. The production process of the PCB comprises the following steps:
s100: marking an inner layer A code and a secondary outer layer B code for different layers of the PNL board, and uploading marked contents to a traceability system, wherein the inner layer A code and the secondary outer layer B code are identity information codes.
Specifically, the process of manufacturing an inner layer code A by using the laser of the laser marking machine on the inner layer and uploading the content to the traceability system can be realized in a laser mode of the laser marking machine. The definition of the inner layer code A code in the traceability system is as follows: the standard two-dimensional code contains the contents of a factory code, a work order code, a year period, a serial number and the like. The inner layer A code is equivalent to an identification number which is assigned to each PNL board and is unique, and the processing technological parameters of the PNL board can be queried in a traceability system by only scanning the inner layer A code in the pre-stack process. According to the core boards with different layers, the inner layer A code and the other layer A code need to be printed at two different positions, namely an inner layer A code and/or a secondary outer layer B code, and the secondary outer layer B code is also an identity information code.
S200: and reading the inner layer A code and the secondary outer layer B code, and performing association binding on information contained in the inner layer A code and the secondary outer layer B code in a traceability system.
In the production and manufacturing process, the traceability system can adopt a code reader to read the inner layer A code and the secondary outer layer B code, bind the two codes, bind the inner layer A code to the secondary outer layer B code, and perform transcoding steps, namely, the fusion of all process steps of production process parameters is completed, and the traceability is facilitated.
And S300, reading the secondary outer layer B code and uploading the contained information to a tracing system, wherein the tracing system codes according to a preset rule of the system to generate an outer layer C code and transmits the outer layer C code to a laser coding machine or a mechanical coding machine.
The method comprises the steps of cutting and grinding a drilling target, reading and converting an X-RAY code into an outer laser code, adding an X-RAY reading secondary outer B code, uploading content to a tracing system, encoding by the tracing system according to rules formulated by the system to generate an outer two-dimensional code C code, and transmitting the outer two-dimensional code C code to a laser coding machine or a mechanical coding machine to drill the outer C code. The outer layer C code has two implementation modes: one is laser two-dimensional code printing, and the other is mechanical drilling two-dimensional code or 8421 code.
Taking a mechanical drilling machine drilling 8421 code as an example, the outer layer C code comprises a positioning code and a data code; the positioning code comprises a start symbol and an end symbol, the positioning code is positioned between the start symbol and the end symbol, and the positioning code adopts 8421 codes.
Of course, the C code may be generated by using a two-dimensional code.
S400: and coding and uploading the traceability system on the SET board or the PCS board, and correlating with the outer layer C code.
The coding machine can be used for coding in the development, silk-screen text and post-curing process sections, for example, the SET board or the PCS board. Finally, the PCB circuit board is associated with the outer layer C code, and the outer layer C code can be utilized in the tracing system to trace the PCB circuit board.
In the technical scheme provided by the invention, the engraving codes are used: the mode of the A code, the B code and the C code can collect production process parameters in the process flow of producing and manufacturing the PCB circuit boards and carry out subdivision management, so that production management and control at the factory level, the workshop level and the site level are realized, and the process data of each PCB circuit board can be traced and managed.
As an implementation manner, as shown in fig. 2, a full-flow process for producing the PCB circuit board is provided; each module is a processing step, and a code reader is added to the board placing and collecting process section of each production process in each flow process, the code is read and uploaded to each PNL board, and the processing parameters are recorded (the code reader is not illustrated in the figure, but the existence of the code reader should be understood).
Specifically, firstly, a production process of cutting, round corner edging and cleaning is carried out, and then a laser PNL plate of a laser marking machine is used for manufacturing an inner layer A code, wherein the code is presented in a mode of marking a two-dimensional code. The content of the system comprises a factory code, a work order code, a year period, a serial number and the like. The PNL board is provided with an inner layer A code after the production process of cutting, round corner edging and cleaning.
Then the production processes of pretreatment, coating baking and exposure are carried out, and then the production processes of developing, etching, film removing, PE punching and browning are carried out, and PP cutting and punching are carried out.
Specifically, in the production process of combination fusion/riveting, prestack, typesetting and lamination, the binding of an inner layer A code to a secondary outer layer B code is realized for the PNL plate, the steps are carried out after the production process of combination fusion and riveting, then the production process of prestack is carried out, and then the production process of typesetting and lamination is carried out.
In the combined fusion and riveting production process and the prestack production process, the procedures of code reading and binding are added; and identifying an inner layer A code and a secondary outer layer B code through a code reader during prestack, and performing association binding on information contained in the inner layer A code and the secondary outer layer B code in a traceability system to convert the information into the B code.
And then, performing drilling and grinding, X-RAY code reading, outer laser code conversion and PIN loading, wherein in the process of drilling and grinding, X-RAY code reading, outer laser code conversion, the X-RAY code reading secondary outer B code is added, the content is uploaded to a tracing system, and the tracing system codes according to a preset rule of the system to generate an outer C code and transmits the outer C code to a mechanical drilling machine.
Then, drilling holes by using the mechanical code drilling machine, and sequentially executing the process flows of PIN removal, deburring, cleaning and hole inspection: removing glue, depositing copper, VCP, performing outer layer pretreatment, exposing, DES, online AOI, VRS, performing solder mask pretreatment, screen printing ink, pre-baking, developing, screen printing characters and post-curing.
In the development, silk screen printing text and post-curing process section, a laser coding machine or a mechanical coding machine is added, and codes are printed on a SET board or a PCS board and uploaded to a traceability system. In this step, the traditional process is: and identifying and analyzing the inner layer two-dimensional code through an X-RAY identifier, uploading the content to an MES or a server, and after correlating the inner layer two-dimensional code with the outer layer two-dimensional code, transmitting the outer layer two-dimensional code content to a mechanical drilling machine, wherein the mechanical drilling machine performs mechanical drilling of the two-dimensional code according to the received outer layer two-dimensional code content, and the capacity of drilling the two-dimensional code (approximately 90 holes) of the 10-bit digital content is approximately 4 PNL/min.
The capacity can be increased by using the C code shown in fig. 3. The holes are drilled in a 4-row multi-column layout, holes are drilled in different rows in each column, and different numbers of holes in each column represent different numbers. When the two-dimensional code is mechanically drilled, the novel specially defined tracing hole code is adopted for drilling, and when the mechanical drilling code is used, the number of holes is reduced by 60%, so that the efficiency of drilling codes is improved, the productivity is more than 6 PNL/min, and the productivity matching with the existing production line is realized.
And then PNL surface treatment, routing, cleaning, inspecting, raising, electrically measuring a laser stamping machine, laser waste board stamping, testing, AVI and packaging are carried out.
As shown in fig. 2, the tracing system includes a data acquisition system module, a code reading identification module, and a data connection module. Each flow step adopts a code reader to scan for data acquisition (matched with a code reading identification module) to form a data acquisition system module in a PCB circuit board tracing system, and then the data acquisition system module can be connected with an EAP system and an MES system (matched with a data connection module), so that the realization of platform tracing management on the production process of the PCB circuit board is more convenient, and the production of new materials, batches, processing processes, boring consumption and the like is realized. And the ERP product work order can be managed, the data from the projection to the shipment are linked, the schedule of the delivery period and the quality scrapping information are summarized, and the early warning management is carried out. The method can further provide a basic platform and data for deep industrial data acquisition, industrial big data construction, edge calculation, big data analysis development and deployment and industrial APP development of enterprises.
The invention further provides a PCB, which comprises a PNL board, wherein an inner layer A code, a secondary outer layer B code and an outer layer C code are carved on the PNL board, the inner layer A code and the secondary outer layer B code are used for binding processing technological parameters of the PNL board, the outer layer C code is formed by converting the inner layer A code and the secondary outer layer B code, the outer layer C code adopts a 4-row multi-column layout, the outer layer C code comprises a positioning code and a data code, the positioning code comprises a start symbol and an end symbol, the data code is positioned between the start symbol and the end symbol, and the positioning code adopts a 8421 code.
As shown in fig. 3, the C code adopts a 4-row multi-column layout, holes are drilled on different rows in each column, and different numbers of holes in each column represent different numbers. When the two-dimensional code is mechanically drilled, the novel specially defined tracing hole code is adopted for drilling, and when the mechanical drilling code is used, the number of holes is reduced by 60%, so that the efficiency of drilling codes is improved, the productivity is more than 6 PNL/min, and the productivity matching with the existing production line is realized.
In fig. 3, the first four columns are positioning holes, 10 in total, the first column is a start symbol, the last 2 columns are end symbols, and the middle 15 columns are data holes, corresponding to the representation of the data. Since the decimal code of 8421 is adopted, each row is 8421 in turn from top to bottom. The dashed line box in the figure is selected as the actual coding effect, and the rest is marks which are easy to understand and are not present on the PCB circuit board. For convenience of illustration, the positioning holes and the data holes are divided into two colors for display, for example, the positioning holes are black, and the data holes are red. The positioning holes of the first 1-4 columns and the last 1 columns are fixed and are divided into a start symbol and an end symbol. The number of wells per column of the data well region represents a 1-bit number, and a total of 15 columns represent 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 in sequence.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps described in connection with the embodiments disclosed herein may be embodied in electronic hardware, in computer software, or in a combination of the two, and that the elements and steps of the examples have been generally described in terms of function in the foregoing description to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the several embodiments provided by the present invention, it should be understood that the disclosed systems and methods may be implemented in other ways. For example, the system embodiments described above are merely illustrative. For example, the division of each unit is only one logic function division, and there may be another division manner in actual implementation. For example, multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (3)

1. A process for producing a PCB, comprising:
marking an inner layer A code and a secondary outer layer B code for different layers of the PNL board, and uploading marked contents to a traceability system, wherein the inner layer A code and the secondary outer layer B code are identity information codes;
reading the inner layer A code and the secondary outer layer B code, and performing association binding on information contained in the inner layer A code and the secondary outer layer B code in a traceability system;
reading the secondary outer layer B code and uploading the contained information to a tracing system, wherein the tracing system codes according to a preset rule of the system to generate an outer layer C code and transmits the outer layer C code to a laser coding machine or a mechanical coding machine;
coding on a SET board or a PCS board, uploading the traceability system, and correlating with the outer layer C code;
the process further comprises:
adding a code reader to the plate placing and collecting sections of each production process, reading and uploading each PNL plate, and recording the processing process parameters;
wherein, the inner layer A code of the PNL plate is formed after the production process of cutting, round corner edging and cleaning;
wherein, the outer layer B code of the PNL plate is printed after the combined fusion and riveting production process;
in the combined fusion and riveting production process and the prestack production process, the procedures of code reading and binding are added; during prestack, identifying an inner layer A code and a secondary outer layer B code by a code reader, wherein the inner layer A code and the information contained in the secondary outer layer B code are associated and bound in a traceability system;
in the processes of drilling and grinding, X-RAY code reading and outer layer code-carving, adding an X-RAY secondary outer layer B code reading and uploading contents to a tracing system, and coding by the tracing system according to a preset rule of the system to generate an outer layer C code and transmitting the outer layer C code to a laser code printer or a mechanical code printer;
the outer layer C code comprises a positioning code and a data code; the preset rule is as follows:
the outer layer C code comprises a positioning code and a data code, wherein the positioning code comprises a start symbol and an end symbol, the data code is positioned between the start symbol and the end symbol, and the positioning code adopts 8421 codes.
2. The process of claim 1, wherein a laser or mechanical code printer is added to the development, silk screen text, post-curing section, and the SET or PCS board is coded and uploaded with a traceability system.
3. The PCB production process of claim 1, wherein the trace back system includes a data acquisition system module, a code reading identification module, a data connection module.
CN202110642212.XA 2021-06-09 2021-06-09 PCB production process and PCB circuit board Active CN113573506B (en)

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CN110446334A (en) * 2019-09-06 2019-11-12 深圳市升达康科技有限公司 X-RAY technology is in the PCB application method traced and system
CN111587066B (en) * 2020-05-27 2021-01-26 江苏泰治科技股份有限公司 Method for tracing information of each layer of core board after PCB manufacturing and laminating

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