WO2024098506A1

WO2024098506A1 - Method for ink-jet printing of solder resist on pcb

Info

Publication number: WO2024098506A1
Application number: PCT/CN2022/139056
Authority: WO
Inventors: 黄双双; 陈春; 罗坚
Original assignee: 惠州市金百泽电路科技有限公司
Priority date: 2022-11-10
Filing date: 2022-12-14
Publication date: 2024-05-16
Also published as: CN115460783B; CN115460783A

Abstract

A method for ink-jet printing of a solder resist on a PCB. The method comprises: performing product code design; adding a first quick-response code or a first barcode; performing pre-flow manufacturing; identifying product information by means of code scanning before pattern development; generating a second quick-response code or a second barcode; performing AOI; printing the second quick-response code or the second barcode; determining the quality of a PCB; performing pre-treatment; determining a solder-resist printing method for a non-defective PCB; performing ink-jet printing; and performing post-curing. By means of the method, the problem of a solder resist window being offset, i.e. being overly large or small, during ink-jet printing of a solder resist can be effectively avoided, and the adverse problem of a line edge being red during ink-jet printing of the solder resist is also avoided, thereby greatly improving the accuracy of the solder resist window during ink-jet printing.

Description

一种PCB板喷墨打印阻焊的方法A method for inkjet printing solder mask on PCB

技术领域Technical Field

本发明涉及PCB板的技术领域，具体为一种PCB板喷墨打印阻焊的方法及其加工方法。The invention relates to the technical field of PCB boards, and in particular to a method for inkjet printing solder mask on a PCB board and a processing method thereof.

背景技术Background technique

印刷电路板(PCB)是重要的电子部件。在PCB板生产过程中，为了提高焊接效率、避免不需要焊接的部位受到破坏，需要对这些部位用阻焊油墨加以保护。利用喷墨打印将阻焊油墨打在印刷电路板(PCB)表面具有众多显著的优势。Printed circuit boards (PCBs) are important electronic components. In the production process of PCBs, in order to improve welding efficiency and avoid damage to parts that do not need welding, these parts need to be protected with solder mask ink. Using inkjet printing to apply solder mask ink on the surface of printed circuit boards (PCBs) has many significant advantages.

现有的喷墨打印技术的具体步骤如下：The specific steps of existing inkjet printing technology are as follows:

第一步：前处理Step 1: Pre-treatment

第二步：喷墨打印Step 2: Inkjet Printing

第三步：后固化Step 3: Post-curing

其中第二步喷墨打印，利用印刷电路板阻焊层设计资料，通过抓取板上定位孔或定位pad作为定位，按照印刷电路板阻焊层设计资料，对电路板进行喷墨打印阻焊层。The second step is inkjet printing, which uses the printed circuit board solder mask design information to grab the positioning holes or positioning pads on the board as positioning, and inkjet prints the solder mask on the circuit board according to the printed circuit board solder mask design information.

由于印刷电路板在实际生产中，需要经过压合、钻孔、电镀、图形转移、图形蚀刻等生产流程后再到阻焊生产工序，电路板图形精度受到电路板铜厚差异、图形转移、图形蚀刻精度的差异的影响，生产出的每块印刷电路板在电路图形上均存在一定差异，而且图形转移和图形蚀刻也可能存在一定的部分单位报废的质量问题；受到电路板前工序生产的影响，电路板也可能存在一定的涨缩。受到以上因素的影响，现有的喷墨打印按照印刷电路板阻焊层设计资料对电路板进行喷墨打印阻焊层完成阻焊生产。未考虑每块实际生产图形与设计存在一定的差异，且存在不同位置单元报废，按照设计资料对电路板进行喷墨打印阻焊层完成阻焊生产，存在如下问题：In actual production, printed circuit boards need to go through the production processes of pressing, drilling, electroplating, pattern transfer, pattern etching, and then to the solder mask production process. The accuracy of the circuit board pattern is affected by the difference in copper thickness of the circuit board, the difference in pattern transfer, and the difference in pattern etching accuracy. Each printed circuit board produced has certain differences in the circuit pattern, and the pattern transfer and pattern etching may also have certain quality problems that some units are scrapped; affected by the production of the previous process of the circuit board, the circuit board may also have certain expansion and contraction. Affected by the above factors, the existing inkjet printing completes the solder mask production by inkjet printing the solder mask layer of the circuit board according to the design data of the printed circuit board solder mask layer. It is not considered that there are certain differences between each actual production pattern and the design, and there are scrapped units at different positions. The solder mask production is completed by inkjet printing the solder mask layer of the circuit board according to the design data, which has the following problems:

1)阻焊开窗存在偏移，例如偏大或偏小的问题；1) The solder mask opening is offset, such as being too large or too small;

2)阻焊盖线线边发红；2) The edge of the solder mask line turns red;

3)无法完全避开在电路板的报废单元上喷印油墨，导致喷印油墨的浪费。3) It is impossible to completely avoid printing ink on the scrapped units of the circuit board, resulting in a waste of printing ink.

发明内容Summary of the invention

基于此，有必要提供一种PCB板喷墨打印阻焊的方法。Based on this, it is necessary to provide a method for inkjet printing solder mask on a PCB board.

一种PCB板喷墨打印阻焊的方法，包括A method for inkjet printing solder mask on a PCB, comprising:

S1、产品编码设计，将PCB板型号和流程卡批次号转化为第一二维码或第一条形码；S1. Product coding design, converting the PCB board model and process card batch number into the first QR code or the first barcode;

S2、添加第一二维码或第一条形码，在流程卡上添加所述第一二维码或第一条形码，并将流程卡与相应批次、型号的PCB板相对应；S2. Add the first QR code or the first barcode, add the first QR code or the first barcode to the process card, and correspond the process card to the PCB board of the corresponding batch and model;

S3、前流程制作，流程卡随相应批次的PCB板的生产流程同步流转；S3, pre-process production, process cards are circulated synchronously with the production process of the corresponding batch of PCB boards;

S4、图形显影前扫码识别产品信息，在显影前，使用扫码设备识别待生产批次的PCB板的流程卡上的第一二维码或第一条形码，并获取PCB板的生产信息后与AOI同步生产信息；S4, scanning the code to identify the product information before the graphic is developed. Before development, the code scanning device is used to identify the first QR code or the first bar code on the process card of the PCB board to be produced, and the production information of the PCB board is obtained and synchronized with the AOI;

S5、生成第二二维码或第二条形码，利用二维码打印设备的赋码***在所述第一二维码或第一条形码基础上生成带有每一片PCB板AOI检测后的不同的流水号的第二二维码或第二条形码；S5, generating a second two-dimensional code or a second barcode, using a coding system of a two-dimensional code printing device to generate a second two-dimensional code or a second barcode with different serial numbers of each PCB board after AOI inspection based on the first two-dimensional code or the first barcode;

S6、AOI检测，图形显影、蚀刻、退膜后连线AOI根据生产信息检测对应PCB板后，将检测资料存储在服务器与生产信息相同位置并形成与对应的第二二维码或第二条形码对应的编码；S6, AOI inspection, graphic development, etching, film stripping, after the line AOI detects the corresponding PCB board according to the production information, the inspection data is stored in the same position of the server as the production information and forms a code corresponding to the corresponding second QR code or second bar code;

S7.打印第二二维码或第二条形码，PCB板经过连线AOI检测后，按照检测先后顺序一一进入连线的二维码打印设备，将每一片PCB板AOI检测不同的流水号的第二二维码打印在PCB板板边预设位置；S7. Print the second QR code or the second barcode. After the PCB board passes the online AOI inspection, it enters the online QR code printing device one by one in the order of inspection, and prints the second QR code of each PCB board with different serial numbers detected by AOI at a preset position on the edge of the PCB board;

S8、PCB板品质判断，根据AOI检测结果判断被检测的PCB板是否为不良品，否则进行下一步骤；S8, PCB board quality judgment, judging whether the inspected PCB board is defective according to the AOI inspection result, otherwise proceed to the next step;

S9、前处理，采用超粗化+防渗的方式对PCB板表面进行处理；S9, pre-treatment, using super roughening + anti-seepage method to treat the surface of the PCB board;

S10、确定良品PCB板阻焊打印方法；S10, determining the solder mask printing method of good PCB board;

S11、喷墨打印，采用阻焊喷墨打印机通过识别第二二维码或第二条形码获取第一阻焊打印程序并在PCB板的预设位置完成喷墨打印；S11, inkjet printing, using a solder resist inkjet printer to obtain a first solder resist printing program by identifying a second two-dimensional code or a second barcode and completing inkjet printing at a preset position of the PCB board;

S12、后固化，采用与阻焊喷墨打印机连线的隧道炉正常烘烤后固化。S12, post-curing, normal baking and post-curing using a tunnel furnace connected to a solder mask inkjet printer.

在其中一个实施例中，在S6中，所述AOI检测的检测方法为：In one embodiment, in S6, the AOI detection method is:

S21、通过AOI检测PCB板并形成检测资料，所述检测资料包括良品PCB板实际图形资料和不良品PCB板实际图形资料；S21, inspecting the PCB board through AOI and generating inspection data, wherein the inspection data includes actual graphic data of good PCB board and actual graphic data of defective PCB board;

S22、对检测资料按照第二二维码或第二条形码对应的产品型号、批次号及流水号进行编码；S22, encoding the test data according to the product model, batch number and serial number corresponding to the second QR code or the second barcode;

S23、将检测资料存储在服务器的预设位置并以编码进行命名；S23, storing the test data in a preset location on the server and naming it with a code;

S24、使检测资料与被检测PCB板、第二二维码或第二条形码相互对应。S24, making the detection data correspond to the detected PCB board, the second two-dimensional code or the second bar code.

在其中一个实施例中，采用VSR检修机判断不良品PCB板是否可以检修，是则，将检修后的PCB板记录为检修良品，并使用AOI对PCB板进行重新检测并将检修良品PCB板实际图形资料存储在服务器的对应位置上。In one of the embodiments, a VSR repair machine is used to determine whether a defective PCB board can be repaired. If so, the repaired PCB board is recorded as a repaired good PCB board, and AOI is used to re-inspect the PCB board and store the actual graphic data of the repaired good PCB board in the corresponding position of the server.

在其中一个实施例中，在S10中，良品PCB板或检修良品PCB板阻焊打印方法；In one of the embodiments, in S10, a solder mask printing method for a good PCB board or a repaired good PCB board;

S41、通过访问服务器上预设位置获取检测资料对应的PCB板的第一实际图形信息；S41, obtaining first actual graphic information of the PCB board corresponding to the detection data by accessing a preset location on the server;

S42、按照第一实际图形信息生成对应PCB板的第一筑坝打印图像；S42, generating a first damming printing image corresponding to the PCB board according to the first actual graphic information;

S43、调取良品PCB板或检修良品PCB板阻焊层图像与第一筑坝打印图像进行叠加，删除叠加区域，生成第一非筑坝区阻焊打印图像；S43, retrieve the solder mask layer image of the good PCB board or the repaired good PCB board, superimpose it with the first damming print image, delete the superimposed area, and generate the first non-damming area solder mask print image;

S44、分别抓取第一筑坝打印图像和第一非筑坝区阻焊打印图像；S44, respectively capture the first damming area print image and the first non-damming area solder mask print image;

S45、分别生成第一筑坝打印程序和第一非筑坝区阻焊打印程序；S45, generating a first damming area printing program and a first non-damming area solder mask printing program respectively;

S46、按照第一筑坝打印程序在前，第一非筑坝区阻焊打印程序在后的顺序合并成第一阻焊打印程序；S46, merging the first damming area printing program into the first solder resist printing program in the order of the first damming area printing program first and the first non-damming area solder resist printing program later;

S47、使第一阻焊打印程序的名称与检测资料名称一致并存储在服务器的预设位置。S47, making the name of the first solder resist printing program consistent with the name of the inspection data and storing them in a preset location of the server.

在其中一个实施例中，采用VSR检修机判断不良品PCB板无法检修后，则将不良品PCB板记录为具有报废单元的不良品PCB板，并在报废单元的固定区域内打上报废专用标识，并使用AOI对PCB板进行重新检测并将具有报废单元的不良品PCB板实际图形资料存储在服务器的对应位置上。In one of the embodiments, after a VSR repair machine determines that a defective PCB board cannot be repaired, the defective PCB board is recorded as a defective PCB board with a scrap unit, and a special scrap mark is marked in a fixed area of the scrap unit. The PCB board is re-inspected using AOI and the actual graphic data of the defective PCB board with the scrap unit is stored in the corresponding position of the server.

在其中一个实施例中，所述具有报废单元的不良品PCB板阻焊打印方法为：In one embodiment, the method for printing solder mask on a defective PCB board with a scrap unit is as follows:

S61、通过访问服务器上预设位置获取检测资料对应的PCB板的第二实际图形信息；S61, obtaining second actual graphic information of the PCB board corresponding to the detection data by accessing a preset location on the server;

S62、删除第二实际图形信息上报废单元的第三实际图形信息；S62, deleting the third actual graphic information of the scrapped unit on the second actual graphic information;

S63、生成没有报废单元的第四实际图形信息；S63, generating fourth actual graphic information without scrapped units;

S64、按照第四实际图形信息生成对应PCB板的第二筑坝打印图像；S64, generating a second damming printing image corresponding to the PCB board according to the fourth actual graphic information;

S65、调取具有报废单元的不良品PCB板阻焊层图像与第二筑坝打印图像进行叠加，删除叠加区域，生成第二非筑坝区阻焊打印图像；S65, retrieving the solder mask layer image of the defective PCB board with the scrapped unit and superimposing it with the second damming print image, deleting the superimposed area, and generating a second non-damming area solder mask print image;

S66、分别抓取第二筑坝打印图像和第二非筑坝区阻焊打印图像；S66, capturing the second damming area print image and the second non-damming area solder resist print image respectively;

S67、分别生成第二筑坝打印程序和第二非筑坝区阻焊打印程序；S67, generating a second damming area printing program and a second non-damming area solder mask printing program respectively;

S68、按照第二筑坝打印程序在前，第二非筑坝区阻焊打印程序在后的顺序合并成第二阻焊打印程序；S68, merging the second damming area printing program into the second solder resist printing program in the order of the second damming area printing program first and the second non-damming area solder resist printing program later;

S69、使第二阻焊打印程序的名称与检测资料名称一致并存储在服务器的预设位置。在其中一个实施例中，所述检测资料至少包含对应检测PCB板的线宽、焊盘尺寸、涨缩、图形位置等实际图形信息。S69, making the name of the second solder mask printing program consistent with the name of the test data and storing them in a preset location of the server. In one embodiment, the test data at least includes actual graphic information such as line width, pad size, expansion and contraction, and graphic position of the corresponding test PCB board.

在其中一个实施例中，在S11中，喷墨打印的方法为：In one embodiment, in S11, the inkjet printing method is:

S81、采用阻焊喷墨打印机自带的高清CCD摄像头抓取PCB板上的第二二维码或第二条形码；S81, use the high-definition CCD camera of the solder mask inkjet printer to capture the second QR code or the second bar code on the PCB board;

S82、识别出PCB板对应的型号、批次和AOI检测的流水号，并抓取服务器的预设位置中的文件的对应编码的第一阻焊打印程序，导入阻焊喷墨打印机***；S82, identifying the model, batch and serial number of the AOI inspection corresponding to the PCB board, and grabbing the first solder mask printing program corresponding to the code of the file in the preset position of the server, and importing it into the solder mask inkjet printer system;

S83、抓取PCB板上的定位孔或图形做定位，按照对应编码的第一阻焊打印程序进行喷墨打印阻焊，第一阻焊打印程序结束后，即完成阻焊打印生产。S83, grab the positioning holes or patterns on the PCB board for positioning, and perform inkjet printing of solder mask according to the first solder mask printing program with the corresponding code. After the first solder mask printing program is completed, the solder mask printing production is completed.

在其中一个实施例中，筑坝打印程序包括线路筑坝设计和阻焊开窗筑坝设计，线路筑坝设计与线路图形两侧边缘相切，阻焊开窗筑坝设计与阻焊开窗图形相切。In one embodiment, the dam printing program includes a circuit dam design and a solder resist window dam design, the circuit dam design is tangent to the edges on both sides of the circuit pattern, and the solder resist window dam design is tangent to the solder resist window pattern.

在其中一个实施例中，筑坝宽度设计可根据阻焊打印油墨的特性和阻焊厚度要求设计，筑坝宽度为100μm至300μm之间。In one embodiment, the dam width design can be designed according to the characteristics of the solder resist printing ink and the solder resist thickness requirement, and the dam width is between 100 μm and 300 μm.

上述一种PCB板喷墨打印阻焊的方法的有益效果为：The beneficial effects of the above-mentioned method for inkjet printing solder mask on PCB are:

1、通过对连线AOI检测所获的PCB板的实际线路图形检测资料和连线二维码打印机对检测后的PCB板打印特定第二二维码或第二条形码，使得PCB板与AOI检测资料一一对应，阻焊打印程序以PCB板AOI检测输出的实际图形信息为参照，对应设计筑坝打印图形和非筑坝区域阻焊打印图形，通过计算机软件参照筑坝打印图形和非筑坝区域阻焊打印图形分别生成筑坝打印程序和非筑坝区域阻焊打印程序，筑坝打印程序在前，非筑坝区域阻焊打印程序在后合并成一个阻焊打印程序，再通过喷墨阻焊打印机高清定位摄像头，扫描待喷墨打印阻焊的产品上的第二二维码或第二条形码，自动调取该PCB板对应的阻焊打印程序，导入喷墨阻焊打印机***中进行喷墨打印阻焊生产，采用上述技术方案，可以有效避免采用固定设计阻焊打印程序，未考虑PCB板生产实际图形差异、涨缩等问题，导致喷墨打印阻焊存在阻焊开窗存在偏移或偏大或偏小的问题，影响客户端的器件焊接质量，以及PCB板实际线路和设计线宽存在差异，导致喷墨打印阻焊存在线边发红的不良问题，大幅度提高了喷墨打印阻焊开窗的精度。1. Through the actual circuit graphic detection data of the PCB board obtained by the online AOI detection and the online QR code printer printing a specific second QR code or a second bar code on the PCB board after the detection, the PCB board and the AOI detection data are made to correspond one to one. The solder mask printing program uses the actual graphic information output by the AOI detection of the PCB board as a reference, and the corresponding damming printing graphics and non-damming area solder mask printing graphics are designed. The damming printing program and the non-damming area solder mask printing program are respectively generated by referring to the damming printing graphics and the non-damming area solder mask printing graphics through computer software. The damming printing program is in front, and the non-damming area solder mask printing program is merged into one solder mask printing program in the back, and then the inkjet solder mask printing is used. The printer uses a high-definition positioning camera to scan the second QR code or the second barcode on the product to be inkjet printed with solder mask, automatically retrieves the solder mask printing program corresponding to the PCB board, and imports it into the inkjet solder mask printer system for inkjet printed solder mask production. The above technical solution can effectively avoid the use of a fixed design solder mask printing program, which does not take into account the actual graphic differences, expansion and shrinkage of PCB board production, resulting in the problem that the solder mask opening window of the inkjet printed solder mask is offset or too large or too small, affecting the client's device welding quality, and the difference between the actual line width of the PCB board and the designed line width, resulting in the undesirable problem of red line edges in the inkjet printed solder mask, which greatly improves the accuracy of the inkjet printed solder mask window.

2、通过对良品PCB板、检修良品PCB板、具有报废单元的不良品PCB板进行区隔，再扫描具有报废单元的不良品PCB板上对应的第二二维码或第二条形码调取该具有报废单元的不良品PCB板检测资料，调取相应具有报废单元的不良品PCB板的AOI检测资料，获取具有报废单元的不良品PCB板第二实际图形信息，屏蔽掉报废单元的第三实际图形信息，生成不含报废单元的第四实际图形信息，以第四实际图形信息为参照对应设计第二筑坝打印图形和第二非筑坝区域阻焊打印图形，通过计算机软件参照第二筑坝打印图形和第二非筑坝区域阻焊打印图形分别生成第二筑坝打印程序和第二非筑坝区域阻焊打印程序，第二筑坝打印程序在前，第二非筑坝区域阻焊打印程序在后合并成一个第二阻焊打印程序进行喷墨打印阻焊，可以有效避开产品报废的部分单元进行喷墨打印阻焊，有效节省了喷墨打印阻焊油墨的使用，降低了产品生产的成本。2. By separating the good PCB board, the repaired good PCB board, and the defective PCB board with scrapped units, scanning the corresponding second QR code or the second bar code on the defective PCB board with scrapped units to retrieve the inspection data of the defective PCB board with scrapped units, retrieving the corresponding AOI inspection data of the defective PCB board with scrapped units, obtaining the second actual graphic information of the defective PCB board with scrapped units, shielding the third actual graphic information of the scrapped units, generating the fourth actual graphic information without the scrapped units, and designing the second damming printing graphic and the second non-damming area solder resist printing graphic with reference to the fourth actual graphic information, and generating the second damming printing program and the second non-damming area solder resist printing program respectively with reference to the second damming printing graphic and the second non-damming area solder resist printing graphic by computer software, the second damming printing program is in front, and the second non-damming area solder resist printing program is merged into a second solder resist printing program for inkjet printing solder resist, which can effectively avoid the inkjet printing solder resist of the scrapped units of the product, effectively save the use of inkjet printing solder resist ink, and reduce the cost of product production.

3.采用扫码获取PCB板信息，自动处理进行产品喷墨打印程序定制化设计，自动读取及导入产品喷墨打印程序，缩短了喷墨打印阻焊调取产品喷墨打印程序的时间，提高产品喷墨打印阻焊生产效率，避免人工调取产品喷墨打印程序容易出现错误，导致喷墨打印阻焊的质量问题。3. Scan the code to obtain PCB board information, automatically process and customize the product inkjet printing program design, automatically read and import the product inkjet printing program, shorten the time of inkjet printing solder mask to call the product inkjet printing program, improve the production efficiency of product inkjet printing solder mask, avoid manual retrieval of product inkjet printing program, which is prone to errors and leads to quality problems of inkjet printing solder mask.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1为本发明的PCB板喷墨打印阻焊的方法的流程示意图。FIG. 1 is a schematic flow chart of a method for inkjet printing solder mask on a PCB board according to the present invention.

具体实施方式Detailed ways

为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似改进，因此本发明不受下面公开的具体实施例的限制。In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

需要说明的是，当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。相反，当元件被称作“直接”与另一元件连接时，不存在中间元件。It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. On the contrary, when an element is said to be "directly" connected to another element, there is no intermediate element.

除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and/or" used herein includes any and all combinations of one or more of the related listed items.

如图1所示，一种PCB板喷墨打印阻焊的方法，包括As shown in FIG. 1 , a method for inkjet printing solder mask on a PCB board includes:

S6、AOI检测，图形显影、蚀刻、退膜后连线AOI根据生产信息检测对应PCB板后，将检测资料存储在服务器与生产信息相同位置并形成与对应的第二二维码或第二条形码对应的编码；S6, AOI inspection, graphic development, etching, film stripping, after the AOI detects the corresponding PCB board according to the production information, the inspection data is stored in the same position of the server as the production information and forms a code corresponding to the corresponding second QR code or second bar code;

S7.打印第二二维码或第二条形码，PCB板经过连线AOI检测后，按照检测先后顺序一一进入连线的二维码打印设备，将每一片PCB板AOI检测不同的流水号的第二二维码或或第二条形码打印在PCB板板边预设位置；S7. Print the second QR code or the second bar code. After the PCBs are inspected by the online AOI, they enter the online QR code printing device one by one in the order of inspection. The second QR code or the second bar code with different serial numbers of each PCB board AOI inspection is printed at a preset position on the edge of the PCB board.

在其中一个实施例中，筑坝打印程序包括线路筑坝设计和阻焊开窗筑坝设计，线路筑坝设计与线路图形两侧边缘相切，阻焊开窗筑坝设计与阻焊开窗图形相切。In one embodiment, the dam printing procedure includes a circuit dam design and a solder resist window dam design, the circuit dam design is tangent to the edges of both sides of the circuit pattern, and the solder resist window dam design is tangent to the solder resist window pattern.

在其中一个实施例中，筑坝宽度设计可根据阻焊打印油墨的特性和阻焊厚度要求设计，筑坝宽度为100μm至300μm之间。In one embodiment, the dam width can be designed according to the characteristics of solder resist printing ink and the solder resist thickness requirement, and the dam width is between 100 μm and 300 μm.

实施例1：Embodiment 1:

S1、产品编码设计，将PCB板型号和流程卡批次号转化为第一二维码或第一条形码；按照一定规则对PCB板型号和流程卡批次号进行编码，利用二维码或条形码软件，将PCB板型号转化成代表PCB板型号和流程卡批次号的第一二维码或第一条形码；S1. Product coding design, converting the PCB board model and the process card batch number into a first QR code or a first bar code; encoding the PCB board model and the process card batch number according to certain rules, and using QR code or bar code software to convert the PCB board model into a first QR code or a first bar code representing the PCB board model and the process card batch number;

S2、添加第一二维码或第一条形码，在流程卡上添加所述第一二维码或第一条形码，并将流程卡与相应批次、型号的PCB板相对应；S2. Add a first QR code or a first barcode, add the first QR code or the first barcode to the process card, and correspond the process card to the PCB board of the corresponding batch and model;

S4、图形显影前扫码识别产品信息，在显影前，使用扫码设备识别待生产批次的PCB板的流程卡上的第一二维码或第一条形码，并获取PCB板的生产信息后与AOI同步生产信息；通过第一二维码或第一条形码识别的PCB板编号，调取相应PCB板的线路层设计资料；S4, scanning the code to identify the product information before the graphic is developed. Before the development, the scanning device is used to identify the first QR code or the first bar code on the process card of the PCB board to be produced, and the production information of the PCB board is obtained and synchronized with the AOI. The circuit layer design data of the corresponding PCB board is retrieved through the PCB board number identified by the first QR code or the first bar code;

S5、获取第二二维码或第二条形码，利用二维码打印机设备的赋码***在所述第一二维码或第一条形码基础上生成带有每一片PCB板AOI检测后的不同的流水号的第二二维码或第二条形码；S5, obtaining a second two-dimensional code or a second barcode, and using a coding system of a two-dimensional code printer device to generate a second two-dimensional code or a second barcode with different serial numbers of each PCB board after AOI inspection based on the first two-dimensional code or the first barcode;

步骤一：图形显影前使用扫码设备识别待生产批次的流程卡上的第一二维码或第一条形码，将第一二维码或第一条形码导入二维码或条形码打印机的赋码***；Step 1: Before the graphic is developed, a code scanning device is used to identify the first QR code or the first bar code on the process card of the batch to be produced, and the first QR code or the first bar code is imported into the coding system of the QR code or bar code printer;

步骤二：利用二维码打印机或条形码打印机的赋码***在第一二维码或第一条形码基础上生成每一片PCB板AOI检测后的不同的带有流水号的第二二维码或第二条形码；Step 2: Use the coding system of a QR code printer or bar code printer to generate a different second QR code or second bar code with a serial number for each PCB board after AOI inspection based on the first QR code or the first bar code;

S6、AOI检测，图形显影、蚀刻、退膜后AOI根据生产信息检测对应PCB板后，将检测资料存储在服务器与生产信息相同位置并形成对应的第二二维码或第二条形码对应的编码；AOI检测正常作业后输出PCB板对应的检测资料，并对检测资料按照第二二维码或第二条形码对应的PCB板的型号、批次号及流水号进行编码，以编码设定为检测资料名称，并存储在服务器上指定路径的文件1中，使检测资料与检测的PCB板一一对应；S6, AOI inspection, after pattern development, etching, and film stripping, AOI detects the corresponding PCB board according to the production information, and stores the inspection data in the same position on the server as the production information and forms a corresponding second two-dimensional code or a code corresponding to the second barcode; after the AOI inspection is normally operated, the inspection data corresponding to the PCB board is output, and the inspection data is encoded according to the model, batch number and serial number of the PCB board corresponding to the second two-dimensional code or the second barcode, and the code is set as the inspection data name, and stored in the file 1 of the specified path on the server, so that the inspection data corresponds to the inspected PCB board one by one;

S7.打印第二二维码，PCB板经过连线AOI检测后，按照检测先后顺序一一进入连线的二维码打印设备，将每一片PCB板AOI检测不同的流水号的第二二维码打印在PCB板板边预设位置；第二二维码或第二条形码打印区域要是AOI检测设备可以抓取的区域；S7. Print the second QR code. After the PCBs are inspected by the online AOI, they enter the online QR code printing device one by one in the order of inspection. The second QR code with different serial numbers for each PCB board AOI inspection is printed at a preset position on the edge of the PCB board; the second QR code or second barcode printing area should be an area that can be captured by the AOI inspection device;

S8、PCB板品质判断，根据AOI检测结果判断被检测的PCB板为良品，S8, PCB board quality judgment, according to the AOI test results, the PCB board being tested is judged to be good.

S9、前处理，采用超粗化+防渗的方式对PCB板表面进行处理；防渗透处理有效控制阻焊油墨渗透；S9, pre-treatment, using super roughening + anti-seepage method to treat the surface of the PCB board; anti-seepage treatment effectively controls the penetration of solder mask ink;

S11、喷墨打印，采用喷墨打印机通过识别第二二维码或第二条形码获取第一阻焊打印程序并在PCB板的预设位置完成喷墨打印；采用在常温(25℃)下粘度为15-25mPa.s，表面张力为30N/m-40mN/m的专用阻焊打印油墨；S11, inkjet printing, using an inkjet printer to obtain a first solder mask printing program by identifying a second two-dimensional code or a second barcode and complete inkjet printing at a preset position of the PCB board; using a special solder mask printing ink with a viscosity of 15-25mPa.s at room temperature (25°C) and a surface tension of 30N/m-40mN/m;

S12、后固化，采用与喷墨打印机连线的隧道炉正常烘烤后固化，固化参数：150±5℃/60min。S12, post-curing, using a tunnel furnace connected to an inkjet printer for normal baking and post-curing, curing parameters: 150±5℃/60min.

实施例2：Embodiment 2:

S7.打印第二二维码，PCB板经过连线AOI检测后，按照检测先后顺序一一进入连线的二维码打印设备，将每一片PCB板AOI检测不同的流水号的第二二维码打印在PCB板板边预设位置；第二二维码或第二条形码打印区域要是AOI检测设备可以抓取的区域；S7. Print the second QR code. After the PCBs are inspected by the online AOI, they enter the online QR code printing device one by one in the order of inspection. The second QR code with different serial numbers for each PCB board inspected by the AOI is printed at a preset position on the edge of the PCB board. The second QR code or second barcode printing area should be an area that can be captured by the AOI inspection device.

S8、PCB板品质判断，根据AOI检测结果判断被检测的PCB板为不良品PCB板；S8, PCB board quality judgment, judging the inspected PCB board as a defective PCB board according to the AOI inspection result;

S9、采用VSR检修机判断不良品PCB板是否可以检修，是则，将检修后的PCB板记录为检修良品PCB板，并使用AOI对检修良品PCB板进行重新检测并将检测资料存储在服务器的文件1中；S9, using the VSR repair machine to determine whether the defective PCB board can be repaired, if yes, record the repaired PCB board as a repaired good PCB board, and use AOI to re-test the repaired good PCB board and store the test data in file 1 of the server;

S10、前处理，采用超粗化+防渗的方式对PCB板表面进行处理；防渗透处理有效控制阻焊油墨渗透；S10, pre-treatment, using super roughening + anti-seepage method to treat the surface of the PCB board; anti-seepage treatment effectively controls the penetration of solder mask ink;

S11、确定检修良品PCB板阻焊打印方法；检修良品PCB板阻焊打印方法与良品PCB板阻焊打印方法采用相同的方法；S11, determining a method for printing solder mask on a repaired good PCB board; the method for printing solder mask on a repaired good PCB board is the same as the method for printing solder mask on a good PCB board;

S12、喷墨打印，采用喷墨打印机通过识别第二二维码或第二条形码获取第一阻焊打印程序并在PCB板的预设位置完成喷墨打印；采用在常温(25℃)下粘度为15-25mPa.s，表面张力为30N/m-40mN/m的专用阻焊打印油墨；S12, inkjet printing, using an inkjet printer to obtain a first solder mask printing program by identifying a second two-dimensional code or a second barcode and complete inkjet printing at a preset position of the PCB board; using a special solder mask printing ink with a viscosity of 15-25mPa.s at room temperature (25°C) and a surface tension of 30N/m-40mN/m;

S13、后固化，采用与喷墨打印机连线的隧道炉正常烘烤后固化，固化参数：150±5℃/60min。S13, post-curing, using a tunnel furnace connected to an inkjet printer for normal baking and post-curing, curing parameters: 150±5℃/60min.

实施例3：Embodiment 3:

S7.打印第二二维码，PCB板经过连线AOI检测后，按照检测先后顺序一一进入连线的二维码打印设备，将每一片PCB板AOI检测不同的流水号的第二二维码打印在PCB板板边预设位置；第二二维码或第二条形码打印区域要是AOI检测设备可以抓取的区域；S7. Print the second QR code. After the PCBs are inspected by the online AOI, they enter the online QR code printing device one by one in the order of inspection. The second QR code with different serial numbers of each PCB board inspected by AOI is printed at a preset position on the edge of the PCB board. The second QR code or second barcode printing area should be an area that can be captured by the AOI inspection device.

S8、采用VSR检修机判断不良品PCB板无法检修后，则将不良品PCB板记录为具有报废单元的不良品PCB板，并在报废单元的固定区域内打上报废专用标识，并使用AOI对PCB板进行重新检测并将具有报废单元的不良品PCB板实际图形资料存储在服务器的文件1中；S8. After the VSR repair machine determines that the defective PCB board cannot be repaired, the defective PCB board is recorded as a defective PCB board with a scrap unit, and a special scrap mark is marked in a fixed area of the scrap unit. The PCB board is re-inspected using AOI and the actual graphic data of the defective PCB board with the scrap unit is stored in the file 1 of the server;

S10、确定具有报废单元的不良品PCB板阻焊打印方法；S10, determining a solder mask printing method for a defective PCB board having a scrap unit;

这样，一种PCB板喷墨打印阻焊的方法的有益效果为：Thus, the beneficial effects of a method for inkjet printing solder mask on a PCB are as follows:

1、通过对连线AOI检测所获的PCB板的实际线路图形检测资料和连线二维码打印机对检测后的PCB板打印特定第二二维码或第二条形码，使得PCB板与AOI检测资料一一对应，阻焊打印程序以PCB板AOI检测输出的实际图形信息为参照，对应设计筑坝打印图形和非筑坝区域阻焊打印图形，通过计算机软件参照筑坝打印图形和非筑坝区域阻焊打印图形分别生成筑坝打印程序和非筑坝区域阻焊打印程序，筑坝打印程序在前，非筑坝区域阻焊打印程序在后合并成一个阻焊打印程序，再通过喷墨阻焊打印机高清定位摄像头，扫描待喷墨打印阻焊的产品上的第二二维码或第二条形码，自动调取该PCB板对应的阻焊打印程序，导入喷墨阻焊打印机***中进行喷墨打印阻焊生产，采用上述技术方案，可以有效避免采用固定设计阻焊打印程序，未考虑PCB板生产实际图形差异、涨缩等问题，导致喷墨打印阻焊存在阻焊开窗存在偏移或偏大或偏小的问题，影响客户端的器件焊接质量，以及PCB板实际线路和设计线宽存在差异，导致喷墨打印阻焊存在线边发红的不良问题，大幅度提高了喷墨打印阻焊开窗的精度。1. Through the actual circuit graphic detection data of the PCB board obtained by the online AOI detection and the online QR code printer printing a specific second QR code or a second bar code on the PCB board after the detection, the PCB board and the AOI detection data are made to correspond one to one. The solder mask printing program uses the actual graphic information output by the AOI detection of the PCB board as a reference, and the corresponding damming printing graphics and non-damming area solder mask printing graphics are designed. The damming printing program and the non-damming area solder mask printing program are respectively generated by referring to the damming printing graphics and the non-damming area solder mask printing graphics through computer software. The damming printing program is in front, and the non-damming area solder mask printing program is merged into a solder mask printing program in the back. Then, the high-definition positioning camera of the inkjet solder mask printer is used to scan the second QR code or the second bar code on the product to be inkjet printed with solder mask, and the solder mask printing program corresponding to the PCB board is automatically retrieved. The above technical scheme can effectively avoid the use of fixed design solder mask printing program, which does not consider the actual graphic differences, expansion and shrinkage of PCB board production, resulting in the problem that the solder mask opening of inkjet printing solder mask is offset or too large or too small, affecting the welding quality of the client's device, and the difference between the actual line width of PCB board and the designed line width, resulting in the problem that the line edge of inkjet printing solder mask is red, which greatly improves the accuracy of inkjet printing solder mask opening.

2、通过对良品PCB板、检修良品PCB板、具有报废单元的不良品PCB板进行区隔，再扫描具有报废单元的不良品PCB板上对应的第二二维码或第二条形码调取该具有报废单元的不良品PCB板检测资料，调取相应具有报废单元的不良品PCB板的AOI检测资料，获取具有报废单元的不良品PCB板第二实际图形信息，屏蔽掉报废单元的第三实际图形信息，生成不含报废单元的第四实际图形信息，以第四实际图形信息为参照对应设计第二筑坝打印图形和第二非筑坝区域阻焊打印图形，通过计算机软件参照第二筑坝打印图形和第二非筑坝区域阻焊打印图形分别生成第二筑坝打印程序和第二非筑坝区域阻焊打印程序，第二筑坝打印程序在前，第二非筑坝区域阻焊打印程序在后合并成一个第二阻焊打印程序进行喷墨打印阻焊，可以有效避开产品报废的部分单元进行喷墨打印阻焊，有效节省了喷墨打印阻焊油墨的使用，降低了产品生产的成本。2. By separating the good PCB board, the repaired good PCB board, and the defective PCB board with the scrapped unit, scanning the corresponding second QR code or the second bar code on the defective PCB board with the scrapped unit to retrieve the inspection data of the defective PCB board with the scrapped unit, retrieving the corresponding AOI inspection data of the defective PCB board with the scrapped unit, obtaining the second actual graphic information of the defective PCB board with the scrapped unit, shielding the third actual graphic information of the scrapped unit, generating the fourth actual graphic information without the scrapped unit, and designing the second damming printing graphic and the second non-damming area solder resist printing graphic with reference to the fourth actual graphic information, and generating the second damming printing program and the second non-damming area solder resist printing program respectively with reference to the second damming printing graphic and the second non-damming area solder resist printing graphic by computer software, the second damming printing program is in front, and the second non-damming area solder resist printing program is merged into a second solder resist printing program to perform inkjet printing solder resist, which can effectively avoid the inkjet printing solder resist of some units of the product that are scrapped, effectively save the use of inkjet printing solder resist ink, and reduce the cost of product production.

S43、调取良品PCB板阻焊层图像与第一筑坝打印图像进行叠加，删除叠加区域，生成第一非筑坝区阻焊打印图像；S43, retrieve the solder mask layer image of the good PCB board and superimpose it with the first damming print image, delete the superimposed area, and generate a first non-damming area solder mask print image;

良品PCB板的第一实际图形信息为图形显影、蚀刻、退膜后通过AOI检测PCB板并形成检测资料中的良品PCB板实际图形资料；检修良品PCB板的第一实际图形信息为检修后的PCB板使用AOI对检修后的PCB板进行重新检测并获取的检修良品PCB板实际图形资料。通过扫描良品PCB板或检修良品PCB板上对应的第二二维码或第二条形码访问服务器上指定路径的文件1，抓取检测资料名称，获取检测资料上对应检测良品PCB板或检修良品PCB板的第一实际图形信息，按照第一实际图形信息生成对应良品PCB板或检修良品PCB板的第一筑坝打印图像；调取良品PCB板或检修良品PCB板阻焊层图像与第一筑坝打印图像进行叠加，删除叠加区域，生成第一非筑坝区阻焊打印图像；通过计算机软件，分别抓取第一筑坝打印图像和第一非筑坝区阻焊打印图像，分别生成第一筑坝打印程序和第一非筑坝区阻焊打印程序，按照第一筑坝打印程序在前，第一非筑坝区阻焊打印程序在后的顺序合并成第一阻焊打印程序，第一阻焊打印程序的名称与良品PCB板或检修良品PCB板的检测资料名称一致，存储在服务器的指定路径的文件2中。The first actual graphic information of the good PCB board is the actual graphic data of the good PCB board formed in the inspection data after the PCB board is inspected by AOI after graphic development, etching and film stripping; the first actual graphic information of the repaired good PCB board is the actual graphic data of the repaired good PCB board obtained by re-inspecting the repaired PCB board using AOI. Access the file 1 of the specified path on the server by scanning the corresponding second QR code or second barcode on the good PCB board or the repaired good PCB board, grab the name of the inspection data, obtain the first actual graphic information corresponding to the inspected good PCB board or the repaired good PCB board on the inspection data, and generate the first damming print image of the corresponding good PCB board or the repaired good PCB board according to the first actual graphic information; retrieve the solder mask layer image of the good PCB board or the repaired good PCB board and superimpose it with the first damming print image, delete the superimposed area, and generate the first non-damming area solder mask print image; through computer software, grab the first damming print image and the first non-damming area solder mask print image respectively, generate the first damming print program and the first non-damming area solder mask print program respectively, and merge them into the first solder mask print program in the order of the first damming print program first and the first non-damming area solder mask print program later, the name of the first solder mask print program is consistent with the inspection data name of the good PCB board or the repaired good PCB board, and is stored in the file 2 of the specified path on the server.

S65、调取检修良品PCB板阻焊层图像与第二筑坝打印图像进行叠加，删除叠加区域，生成第二非筑坝区阻焊打印图像；S65, retrieve the solder mask layer image of the repaired good PCB board and superimpose it with the second damming print image, delete the superimposed area, and generate a second non-damming area solder mask print image;

S69、使第二阻焊打印程序的名称与检测资料名称一致并存储在服务器的预设位置。S69, making the name of the second solder mask printing program consistent with the name of the inspection data and storing them in a preset location of the server.

第二实际图形信息为图形显影、蚀刻、退膜后通过AOI检测PCB板并形成检测资料中的不良品PCB板实际图形资料中具有报废单元的不良品PCB板的实际图形资料。The second actual graphic information is actual graphic data of a defective PCB board having a scrap unit in actual graphic data of a defective PCB board formed in the inspection data after the PCB board is inspected by AOI after graphic development, etching and film stripping.

通过扫描PCB板上对应第二二维码或第二条形码访问服务器上指定路径的文件1，抓取检测资料名称，获取检测资料上对应检测产品的第二实际图形信息，删除该产品报废单位的第三实际图形信息，生成没有报废单元的第四实际图形信息，按照第四实际图形信息生成对应PCB板的第二筑坝打印图像；调取具有报废单元的不良品PCB板阻焊层图像与第二筑坝打印图像进行叠加，删除叠加区域，生成第二非筑坝区阻焊打印图像；通过计算机软件，分别抓取第二筑坝打印图像和第二非筑坝区阻焊打印图像，分别生成第二筑坝打印程序和第二非筑坝区阻焊打印程序，按照第二筑坝打印程序在前，第二非筑坝区阻焊打印程序在后的顺序合并成第二阻焊打印程序，第二阻焊打印程序的名称与检测资料名称一致，存储在服务器的指定路径的文件2中。Access the file 1 of the specified path on the server by scanning the corresponding second QR code or second barcode on the PCB board, grab the name of the inspection data, obtain the second actual graphic information of the corresponding inspection product on the inspection data, delete the third actual graphic information of the scrapped unit of the product, generate the fourth actual graphic information without the scrapped unit, and generate the second damming print image of the corresponding PCB board according to the fourth actual graphic information; retrieve the solder mask layer image of the defective PCB board with the scrapped unit and superimpose it with the second damming print image, delete the superimposed area, and generate the second non-damming area solder mask print image; through computer software, grab the second damming print image and the second non-damming area solder mask print image respectively, generate the second damming print program and the second non-damming area solder mask print program respectively, and merge them into the second solder mask print program in the order of the second damming print program first and the second non-damming area solder mask print program later. The name of the second solder mask print program is consistent with the name of the inspection data and is stored in the file 2 of the specified path of the server.

例如，图形显影、蚀刻后AOI检测对应PCB板后将生成了检测资料，此时的检测资料中包括第二实际图形资料，第二实际图形信息就是检测后的实际图形资料，如果此时根据PCB板检测后的结果为不可以检修的不良品中具有报废单元的不良品PCB板，例如，现在的PCB板通常由多块板拼板而成，其中的一块小拼板损坏，那么就将这块损坏的小拼板标记为报废单元，报废单元就是第三实际图形信息，那将报废单元删除，就形成了第四实际图形信息，再将第四实际图形信息进行进一步地操作，就可以得出第二阻焊打印程序。这样，可以有效避开产品报废的部分单元进行喷墨打印阻焊，有效节省了喷墨打印阻焊油墨的使用，降低了产品生产的成本。For example, after the graphics are developed and etched, the AOI detection of the corresponding PCB board will generate the detection data. The detection data at this time includes the second actual graphics data. The second actual graphics information is the actual graphics data after the detection. If the result after the PCB board detection is that the defective PCB board has a scrap unit in the defective product that cannot be repaired, for example, the current PCB board is usually made up of multiple boards, and one of the small boards is damaged, then the damaged small board is marked as a scrap unit, and the scrap unit is the third actual graphics information. Then the scrap unit is deleted to form the fourth actual graphics information. The fourth actual graphics information is further operated to obtain the second solder mask printing program. In this way, the scrapped units of the product can be effectively avoided for inkjet printing solder mask, which effectively saves the use of inkjet printing solder mask ink and reduces the cost of product production.

进一步地，筑坝打印程序含线路筑坝设计和阻焊开窗筑坝设计，线路筑坝设计与线路图形两侧边缘相切；阻焊开窗筑坝设计与阻焊开窗位图形的相切；筑坝宽度设计可根据阻焊打印油墨的特性和阻焊厚度要求设计，筑坝宽度50μm至100μm之间；非筑坝区阻焊设计为产品阻焊层图像挖去筑坝阻焊图形。Furthermore, the dam printing program includes circuit dam design and solder mask window dam design. The circuit dam design is tangent to the edges on both sides of the circuit pattern; the solder mask window dam design is tangent to the solder mask window position pattern; the dam width design can be designed according to the characteristics of the solder mask printing ink and the solder mask thickness requirements, and the dam width is between 50μm and 100μm; the non-dam area solder mask design is to dig out the dam solder mask pattern from the product solder mask layer image.

喷墨打印，采用在常温(25℃)下粘度为15Pa.s-25mPa.s，表面张力为30N/m-40mN/m的专用阻焊打印油墨进行喷墨打印。采用波长为395nm LED灯，能量参数为100mJ/cm ₂-300mJ/cm ₂或采用汞灯，能量参数为1000mJ/cm ₂-1500mJ/cm ₂,在阻焊打印后实时进行光照，实现与打印的阻焊同步固化。 Inkjet printing uses a special solder resist printing ink with a viscosity of 15Pa.s-25mPa.s and a surface tension of 30N/m-40mN/m at room temperature (25°C). Use a 395nm LED lamp with an energy parameter of 100mJ/ _cm2-300mJ / _cm2 or a mercury lamp with an energy parameter of 1000mJ/ _cm2-1500mJ / _cm2 , and perform light irradiation in real time after solder resist printing to achieve synchronous curing with the printed solder resist.

筑坝打印，含线路筑坝和开窗筑坝，开窗筑坝是指在阻焊开窗区域周围先用阻焊打印方式筑起一道阻焊堤坝，避免因阻焊油墨流动性，而流入阻焊开窗区域，形成对阻焊开窗区域的保护；线路筑坝是指在线路两侧先用阻焊打印方式筑起一道阻焊堤坝，避免因阻焊油墨流动性，线路边缘油墨流失，线路边缘油墨过薄，出现线路边缘发红问题；非筑坝区域，指除筑坝区外的其他阻焊区域。Dam printing includes line damming and window damming. Window damming refers to building a solder resist dam around the solder resist window area by solder resist printing to prevent the solder resist ink from flowing into the solder resist window area due to the fluidity of the solder resist ink, thereby forming a protection for the solder resist window area; line damming refers to building a solder resist dam on both sides of the line by solder resist printing to prevent the ink from flowing out of the line edge due to the fluidity of the solder resist ink, and the ink at the line edge is too thin, resulting in the redness of the line edge; non-damming area refers to other solder resist areas except the damming area.

以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

一种PCB板喷墨打印阻焊的方法，其特征在于：包括A method for inkjet printing solder mask on a PCB, characterized by comprising:

S1、产品编码设计，将PCB板型号和流程卡批次号转化为第一二维码或第一条形码；S1. Product coding design, converting the PCB board model and process card batch number into the first QR code or the first barcode;

S2、添加第一二维码或第一条形码，在流程卡上添加所述第一二维码或第一条形码，并将流程卡与相应批次、型号的PCB板相对应；S2. Add the first QR code or the first barcode, add the first QR code or the first barcode to the process card, and correspond the process card to the PCB board of the corresponding batch and model;

S3、前流程制作，流程卡随相应批次的PCB板的生产流程同步流转；S3, pre-process production, process cards are circulated synchronously with the production process of the corresponding batch of PCB boards;

S4、图形显影前扫码识别产品信息，在显影前，使用扫码设备识别待生产批次的PCB板的流程卡上的第一二维码或第一条形码，并获取PCB板的生产信息后与AOI同步生产信息；S4, scanning the code to identify the product information before the graphic is developed. Before development, the code scanning device is used to identify the first QR code or the first bar code on the process card of the PCB board to be produced, and the production information of the PCB board is obtained and synchronized with the AOI;

S5、生成第二二维码或第二条形码，利用二维码打印设备的赋码***在所述第一二维码或第一条形码基础上生成带有每一片PCB板AOI检测后的不同的流水号的第二二维码或第二条形码；S5, generating a second two-dimensional code or a second barcode, using a coding system of a two-dimensional code printing device to generate a second two-dimensional code or a second barcode with different serial numbers of each PCB board after AOI inspection based on the first two-dimensional code or the first barcode;

S6、AOI检测，图形显影、蚀刻、退膜后连线AOI根据生产信息检测对应PCB板后，将检测资料存储在服务器与生产信息相同位置并形成与对应的第二二维码或第二条形码对应的编码；S6, AOI inspection, graphic development, etching, film stripping, after the AOI detects the corresponding PCB board according to the production information, the inspection data is stored in the same position on the server as the production information and forms a code corresponding to the corresponding second QR code or second bar code;

S7、打印第二二维码或第二条形码，PCB板经过连线AOI检测后，按照检测先后顺序一一进入连线的二维码打印设备，将每一片PCB板AOI检测不同的流水号的第二二维码打印在PCB板板边预设位置；S7, printing the second QR code or the second bar code. After the PCBs are inspected by the online AOI, they enter the online QR code printing device one by one in the order of inspection. The second QR code with different serial numbers inspected by the AOI for each PCB is printed at a preset position on the edge of the PCB.

S8、PCB板品质判断，根据AOI检测结果判断被检测的PCB板是否为不良品，否则进行下一步骤；S8, PCB board quality judgment, judging whether the inspected PCB board is defective according to the AOI inspection result, otherwise proceed to the next step;

S9、前处理，采用超粗化+防渗的方式对PCB板表面进行处理；S9, pre-treatment, using super roughening + anti-seepage method to treat the surface of the PCB board;

S10、确定良品PCB板阻焊打印方法；S10, determining the solder mask printing method of good PCB board;

S11、喷墨打印，采用阻焊喷墨打印机通过识别第二二维码或第二条形码获取第一阻焊打印程序并在PCB板的预设位置完成喷墨打印；S11, inkjet printing, using a solder resist inkjet printer to obtain a first solder resist printing program by identifying a second two-dimensional code or a second barcode and completing inkjet printing at a preset position of the PCB board;

S12、后固化，采用与阻焊喷墨打印机连线的隧道炉正常烘烤后固化。S12, post-curing, normal baking and post-curing using a tunnel furnace connected to a solder mask inkjet printer.
根据权利要求1所述的PCB板喷墨打印阻焊的方法，其特征在于：在S6中，所述AOI检测的检测方法为：The method for inkjet printing solder mask on a PCB according to claim 1, characterized in that: in S6, the AOI detection method is:

S21、通过AOI检测PCB板并形成检测资料，所述检测资料包括良品PCB板实际图形资料和不良品PCB板实际图形资料；S21, inspecting the PCB board through AOI and generating inspection data, wherein the inspection data includes actual graphic data of good PCB boards and actual graphic data of defective PCB boards;

S22、对检测资料按照第二二维码或第二条形码对应的产品型号、批次号及流水号进行编码；S22, encoding the test data according to the product model, batch number and serial number corresponding to the second QR code or the second barcode;

S23、将检测资料存储在服务器的预设位置并以编码进行命名；S23, storing the test data in a preset location on the server and naming it with a code;

S24、使检测资料与被检测PCB板、第二二维码或第二条形码相互对应。S24, making the detection data correspond to the detected PCB board, the second two-dimensional code or the second bar code.
根据权利要求2所述的一种PCB板喷墨打印阻焊的方法，其特征在于：The method for inkjet printing solder mask on a PCB according to claim 2, characterized in that:

采用VSR检修机判断不良品PCB板是否可以检修，是则，将检修后的PCB板记录为检修良品，并使用AOI对PCB板进行重新检测并将检修良品PCB板实际图形资料存储在服务器的对应位置上。The VSR repair machine is used to determine whether the defective PCB board can be repaired. If so, the repaired PCB board is recorded as a repaired good product, and the AOI is used to re-inspect the PCB board and the actual graphic data of the repaired good PCB board is stored in the corresponding position of the server.
根据权利要求1所述的一种PCB板喷墨打印阻焊的方法，其特征在于：The method for inkjet printing solder mask on a PCB according to claim 1, characterized in that:

在S10中，良品PCB板或检修良品PCB板阻焊打印方法；In S10, a solder mask printing method for a good PCB board or a repaired good PCB board;

S41、通过访问服务器上预设位置获取检测资料对应的PCB板的第一实际图形信息；S41, obtaining first actual graphic information of the PCB board corresponding to the detection data by accessing a preset location on the server;

S42、按照第一实际图形信息生成对应PCB板的第一筑坝打印图像；S42, generating a first damming printing image corresponding to the PCB board according to the first actual graphic information;

S43、调取良品PCB板或检修良品PCB板阻焊层图像与第一筑坝打印图像进行叠加，删除叠加区域，生成第一非筑坝区阻焊打印图像；S43, retrieve the solder mask layer image of the good PCB board or the repaired good PCB board, superimpose it with the first damming print image, delete the superimposed area, and generate the first non-damming area solder mask print image;

S44、分别抓取第一筑坝打印图像和第一非筑坝区阻焊打印图像；S44, respectively capture the first damming area print image and the first non-damming area solder mask print image;

S45、分别生成第一筑坝打印程序和第一非筑坝区阻焊打印程序；S45, generating a first damming area printing program and a first non-damming area solder mask printing program respectively;

S46、按照第一筑坝打印程序在前，第一非筑坝区阻焊打印程序在后的顺序合并成第一阻焊打印程序；S46, merging the first damming area printing program into the first solder resist printing program in the order of the first damming area printing program first and the first non-damming area solder resist printing program later;

S47、使第一阻焊打印程序的名称与检测资料名称一致并存储在服务器的预设位置。S47, making the name of the first solder resist printing program consistent with the name of the inspection data and storing them in a preset location of the server.
根据权利要求3所述的一种PCB板喷墨打印阻焊的方法，其特征在于：采用VSR检修机判断不良品PCB板无法检修后，则将不良品PCB板记录为具有报废单元的不良品PCB板，并在报废单元的固定区域内打上报废专用标识，并使用AOI对PCB板进行重新检测并将具有报废单元的不良品PCB板实际图形资料存储在服务器的对应位置上。According to the method of inkjet printing solder mask on a PCB board as described in claim 3, it is characterized in that: after the VSR repair machine is used to determine that the defective PCB board cannot be repaired, the defective PCB board is recorded as a defective PCB board with a scrap unit, and a special scrap mark is marked in a fixed area of the scrap unit, and the PCB board is re-inspected using AOI and the actual graphic data of the defective PCB board with the scrap unit is stored in the corresponding position of the server.
根据权利要求5所述的一种PCB板喷墨打印阻焊的方法，其特征在于：The method for inkjet printing solder mask on a PCB according to claim 5 is characterized in that:

所述具有报废单元的不良品PCB板阻焊打印方法为：The method for printing solder mask on a defective PCB board with a scrap unit is as follows:

S61、通过访问服务器上预设位置获取检测资料对应的PCB板的第二实际图形信息；S61, obtaining second actual graphic information of the PCB board corresponding to the detection data by accessing a preset location on the server;

S62、删除第二实际图形信息上报废单元的第三实际图形信息；S62, deleting the third actual graphic information of the scrapped unit on the second actual graphic information;

S63、生成没有报废单元的第四实际图形信息；S63, generating fourth actual graphic information without scrapped units;

S64、按照第四实际图形信息生成对应PCB板的第二筑坝打印图像；S64, generating a second damming printing image corresponding to the PCB board according to the fourth actual graphic information;

S65、调取具有报废单元的不良品PCB板阻焊层图像与第二筑坝打印图像进行叠加，删除叠加区域，生成第二非筑坝区阻焊打印图像；S65, retrieving the solder mask layer image of the defective PCB board with the scrapped unit and superimposing it with the second damming print image, deleting the superimposed area, and generating a second non-damming area solder mask print image;

S66、分别抓取第二筑坝打印图像和第二非筑坝区阻焊打印图像；S66, capturing the second damming area print image and the second non-damming area solder resist print image respectively;

S67、分别生成第二筑坝打印程序和第二非筑坝区阻焊打印程序；S67, generating a second damming area printing program and a second non-damming area solder mask printing program respectively;

S68、按照第二筑坝打印程序在前，第二非筑坝区阻焊打印程序在后的顺序合并成第二阻焊打印程序；S68, merging the second damming area printing program into the second solder resist printing program in the order of the second damming area printing program first and the second non-damming area solder resist printing program later;

S69、使第二阻焊打印程序的名称与检测资料名称一致并存储在服务器的预设位置。S69, making the name of the second solder resist printing program consistent with the name of the inspection data and storing them in a preset location of the server.
根据权利要求1所述的一种PCB板喷墨打印阻焊的方法，其特征在于：所述检测资料至少包含对应检测PCB板的线宽、焊盘尺寸、涨缩、图形位置等实际图形信息。The method for inkjet printing solder mask on a PCB according to claim 1 is characterized in that the detection data at least includes actual graphic information such as line width, pad size, expansion and contraction, and graphic position of the corresponding detected PCB board.
根据权利要求1所述的一种PCB板喷墨打印阻焊的方法，其特征在于：The method for inkjet printing solder mask on a PCB according to claim 1, characterized in that:

在S11中，喷墨打印的方法为：In S11, the inkjet printing method is:

S81、采用阻焊喷墨打印机自带的高清CCD摄像头抓取PCB板上的第二二维码或第二条形码；S81, use the high-definition CCD camera of the solder mask inkjet printer to capture the second QR code or the second bar code on the PCB board;

S82、识别出PCB板对应的型号、批次和AOI检测的流水号，并抓取服务器的预设位置中的文件的对应编码的第一阻焊打印程序，导入阻焊喷墨打印机***；S82, identifying the model, batch and serial number of the AOI inspection corresponding to the PCB board, and grabbing the first solder mask printing program corresponding to the code of the file in the preset position of the server, and importing it into the solder mask inkjet printer system;

S83、抓取PCB板上的定位孔或图形做定位，按照对应编码的第一阻焊打印程序进行喷墨打印阻焊，第一阻焊打印程序结束后，即完成阻焊打印生产。S83, grab the positioning holes or patterns on the PCB board for positioning, and perform inkjet printing of solder mask according to the first solder mask printing program with the corresponding code. After the first solder mask printing program is completed, the solder mask printing production is completed.
根据权利要求4所述的一种PCB板喷墨打印阻焊的方法，其特征在于：筑坝打印程序包括线路筑坝设计和阻焊开窗筑坝设计，线路筑坝设计与线路图形两侧边缘相切，阻焊开窗筑坝设计与阻焊开窗图形相切。According to a method for inkjet printing solder mask on a PCB board as described in claim 4, it is characterized in that the dam printing program includes a circuit dam design and a solder mask window dam design, the circuit dam design is tangent to the edges on both sides of the circuit pattern, and the solder mask window dam design is tangent to the solder mask window pattern.
根据权利要求4所述的一种PCB板喷墨打印阻焊的方法，其特征在于：筑坝宽度设计可根据阻焊打印油墨的特性和阻焊厚度要求设计，筑坝宽度为100μm至300μm之间。According to a method for inkjet printing solder mask on a PCB board as described in claim 4, it is characterized in that the dam width design can be designed according to the characteristics of the solder mask printing ink and the solder mask thickness requirements, and the dam width is between 100μm and 300μm.