CN107992918B - Whole-process quality tracing method for products - Google Patents
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Abstract
The invention discloses a product full-process quality tracing method which comprises the steps of respectively distributing unique two-dimensional codes for each component unit, converting the two-dimensional codes into hole array codes and drilling the hole array codes on the corresponding component units in a designation process, reading each hole array code in a second designation process, generating corresponding unique two-dimensional codes for all the hole array codes, converting the two-dimensional codes into the hole array codes and drilling the hole array codes on a combined structure formed by combining the component units, reading the hole array codes on the combined structure in a third designation process, converting the hole array codes into the two-dimensional codes and then arranging the two-dimensional codes on the combined structure, converting the two-dimensional codes into the hole array codes in a binary form, dividing the two-dimensional codes into at least two parts, respectively converting each part into a hole array code local graph, and combining all the hole array code local graphs to obtain complete hole array codes.
Description
Technical Field
The invention relates to the technical field of product production, in particular to a full-process quality tracing method for products.
Background
The reason for product problems is traced back to serious challenges facing manufacturers in each industry, from the automotive industry to the aerospace industry, and from the medical industry to the food industry, all the more so, in global times enterprises pursue relationship management to maximize customer satisfaction.
To achieve this goal, every steps in the overall manufacturing process must be monitored and a complete history stored.
At present, in order to realize quality tracing, manufacturers usually adopt two-dimensional codes as tracing marks on the surfaces of products in the whole manufacturing process of various products, and a scanning gun is used for reading the two-dimensional codes and adding new processing information into the two-dimensional codes in each process.
Disclosure of Invention
The invention aims to provide a full-flow quality tracing method for products, which overcomes the defects that identification is easily influenced by bad influence and inner layer information is easily lost when products in various industries adopt two-dimensional codes as tracing identifiers in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
product full-process quality tracing method, wherein the product is made by a plurality of component units according to a preset processing process, and the product full-process quality tracing method comprises the following steps:
the method comprises the following steps of respectively distributing unique two-dimensional codes for each composition unit, converting the two-dimensional codes into unique hole array codes and drilling the hole array codes on the corresponding composition units in a -th designated procedure in the processing flow, reading the hole array codes on each composition unit in a second designated procedure in the processing flow, combining the read hole array codes to generate corresponding unique two-dimensional codes, converting the two-dimensional codes into unique hole array codes and drilling the hole array codes on a combined structure formed by combining the composition units;
when the specification m multiplied by m of the two-dimensional code is larger than a preset threshold value, the conversion method from the two-dimensional code to the hole array code comprises the following steps: converting the m × m-standard two-dimensional code into an m × m-standard dot matrix code and then converting the m × m-standard dot matrix code into an m × m-standard binary table; dividing the m x m sized binary table from the whole into at least two binary table portions; converting each binary table part into a corresponding hole array code local graph respectively; and combining the obtained partial images of all the hole array codes to obtain the complete hole array code.
Optionally, at the server, creating a corresponding record item for each two-dimensional code;
and for each of the composition units and the composite structures, when the composition units and the composite structures pass through any procedure in the processing flow, reading the hole array codes or the two-dimensional codes on the current composition units and the composite structures, and synchronizing the current production related information into the corresponding record items of the server side.
Optionally, the method for dividing the m × m-sized binary table into at least two binary table parts from the whole includes:
obtaining the drilling precision of the machine
Size L of hole array code area1×L2And the specification m × m of the two-dimensional code; said L1Is length, L2Is the width;
according to the formula
Calculating to obtain a combined column number n;
obtaining an equal division number x according to a formula x ═ m/n ];
and dividing the binary table with the m x m specification into x parts according to the mode that each part of combined column is n.
Optionally, the method for converting each binary table portion into a corresponding hole array code partial graph respectively includes:
converting the data in each binary table portion to decimal data and dividing by 2nSo that each number in the table is smaller than 1, and a hole array code table with the specification of m multiplied by 1 is obtained;
and drawing a corresponding hole array code local graph according to the hole array code table with the m multiplied by 1 specification.
Optionally, when the specification of the two-dimensional code is that mxm is not greater than a preset threshold, the method for converting the two-dimensional code into the hole array code includes:
converting the two-dimensional code with the m × m specification into a lattice code with the m × m specification, and then converting the lattice code with the m × m specification into a binary table with the m × m specification, wherein the m × m is smaller than a preset value;
converting the binary table with the m × m specification into a decimal table with the m × 1 specification;
and converting the decimal table with the m × 1 specification into a hole array code with the m × 1 specification.
product full-process quality tracing method, wherein the product is processed according to a preset processing flow, and the product full-process quality tracing method comprises the following steps:
the method comprises the steps of processing a product, distributing two-dimensional codes of only to the product, converting the two-dimensional codes into hole array codes of only and drilling the hole array codes on the product in a designated procedure in the processing flow, reading the hole array codes on the product, converting the hole array codes into corresponding two-dimensional codes and then arranging the two-dimensional codes on the product in a second designated procedure in the processing flow;
when the specification m multiplied by m of the two-dimensional code is larger than a preset threshold value, the conversion method from the two-dimensional code to the hole array code comprises the following steps: converting the m × m-standard two-dimensional code into an m × m-standard dot matrix code and then converting the m × m-standard dot matrix code into an m × m-standard binary table; dividing the m x m sized binary table from the whole into at least two binary table portions; converting each binary table part into a corresponding hole array code local graph respectively; and combining the obtained partial images of the at least two hole array codes to obtain a complete hole array code.
Optionally, at the server, creating a corresponding record item for the two-dimensional code;
when the product passes any procedure in the processing flow, reading the hole array code or the two-dimensional code on the product, and synchronizing the current production related information to the corresponding record item of the server side.
Optionally, the method for dividing the m × m-sized binary table into at least two binary table parts from the whole includes:
obtaining the drilling precision of the machine
Size L of hole array code area1×L2And the specification m × m of the two-dimensional code; said L1Is length, L2Is the width;
according to the formula
Calculating to obtain a combined column number n;
obtaining an equal division number x according to a formula x ═ m/n ];
and dividing the binary table with the m x m specification into x parts according to the mode that each part of combined column is n.
Optionally, the method for converting each binary table portion into a corresponding hole array code partial graph respectively includes:
converting the data in each binary table portion to decimal data and dividing by 2nSo that each number in the table is smaller than 1, and a hole array code table with the specification of m multiplied by 1 is obtained;
and drawing a corresponding hole array code local graph according to the hole array code table with the m multiplied by 1 specification.
Optionally, when the specification of the two-dimensional code is that mxm is not greater than a preset threshold, the method for converting the two-dimensional code into the hole array code includes:
converting the two-dimensional code with the m × m specification into a lattice code with the m × m specification, and then converting the lattice code with the m × m specification into a binary table with the m × m specification, wherein the m × m is smaller than a preset value;
converting the binary table with the m × m specification into a decimal table with the m × 1 specification;
and converting the decimal table with the m × 1 specification into a hole array code with the m × 1 specification.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
1) based on the advantages and disadvantages of the two-dimensional code, the two-dimensional code and the hole array code are combined, the two-dimensional code is used as the tracing identifier in parts of manufacturing procedures, and the hole array code corresponding to the two-dimensional code is used as the tracing identifier in parts of manufacturing procedures, so that the advantages of the two-dimensional code relative to other identifiers can be utilized, the disadvantages of the two-dimensional code can be overcome, and the tracing identifier can be easily and accurately read in the whole process.
2) For a product manufactured by processing a plurality of composition units, the transfer from inner layer information to an outer layer can be realized, the loss of the inner layer information is prevented, the integrity of quality data is ensured, the product whole life cycle tracing is realized, and the increasingly strict quality requirements on the market are met.
3) Can convert the two-dimensional code into the hole array code that has less hole number, the processing work load that significantly reduces the processing cost, improves work efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a flowchart of a full-process quality tracing method for a product according to an embodiment of the present invention;
fig. 2 is a flowchart of a quality tracing method for a multi-layer PCB according to an embodiment of the present invention;
fig. 3 is a flowchart of a method for converting a two-dimensional code with a specification not greater than a predetermined threshold into a hole array code according to embodiment of the present invention;
FIG. 4 is a diagram of a hole array code plotted according to the 4 × 1 hole array code table shown in Table 3;
fig. 5 is a flowchart of a method for converting a two-dimensional code with a specification greater than a preset threshold into a hole array code according to embodiment of the present invention;
FIG. 6 is a diagram of an array of 18 × 18 two-dimensional codes;
fig. 7 is a diagram of an aperture code converted from the 18 × 18 two-dimensional code shown in fig. 6;
FIG. 8 is a hole array code obtained from the hole array code diagram of FIG. 7;
FIG. 9 is a 21 × 21 bitmap generated from the binary table shown in Table 4;
FIG. 10 is a graph of the transformed aperture codes according to Table 5;
FIG. 11 is a hole array code obtained from the hole array code diagram of FIG. 10;
fig. 12 is a flowchart of a product full-process quality tracing method according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention will be described in detail and completely with reference to the accompanying drawings, it is obvious that the embodiments described below are only a part of the embodiments of the present invention, but not all embodiments.
The core idea of the invention is that based on the advantages (such as large information capacity, coding range, good confidentiality and anti-counterfeiting performance, easy manufacture, low cost and the like) and disadvantages (such as difficulty in identification caused by influence of manufacturing process) of the two-dimensional code, the invention adopts a mode of combining the two-dimensional code and the hole array code, the two-dimensional code is adopted as a tracing identifier to be formed on the surface of a product in part of manufacturing procedures, and the hole array code corresponding to the two-dimensional code is adopted as the tracing identifier to be formed on the product in the other part of manufacturing procedures, so that the advantages of the two-dimensional code relative to other tracing identifiers can be utilized, the disadvantages of the two-dimensional code can be overcome, the integrity of quality data can be ensured, and the quality of the whole process can be realized.
Example
Referring to fig. 1, for a product processed by a plurality of component units according to a preset processing flow (including a plurality of processes), the present embodiment provides full-process quality tracing methods, including the steps of:
and 101, respectively allocating unique two-dimensional codes to each component unit of the product in advance.
The two-dimensional code is a black-and-white geometric figure arranged according to the rule of , and the black and white positions in the figure are respectively corresponding to '1' and '0', so that binary character sequences are formed, and the binary characters can represent information such as numbers, characters and the like.
According to different quality tracing requirements and structural characteristics of different products, corresponding two-dimensional codes can be respectively distributed to all the constituent units of the products in the step, and partial constituent units needing quality tracing can be selected to be distributed with the two-dimensional codes.
And 102, when entering an -th specified procedure in the processing flow, converting the two-dimensional code of each component unit into a hole array code and drilling the hole array code on the component unit.
The hole array code is used for marking information to be recorded by combining position information of a plurality of small holes in a designated area, corresponds to the two-dimensional code and has only characters, and when the hole array code is formed, through holes can be drilled, and blind holes can also be drilled.
The th designated step may be any steps designated in the manufacturing flow, and is not limited to the th step in the manufacturing flow, and in a specific implementation, the earliest step in the manufacturing flow that may adversely affect the two-dimensional code recognition may be designated as the th designated step.
The second specifying step may be a step in which a plurality of constituent units are combined and integrated, and in this case, information of the inner layer needs to be transferred to the outer layer.
In the step, different hole array codes of all the constituent units in the inner layer can be read for times through X-Ray , so that the hole array codes can be transferred from the inner layer to the outer layer quickly, the process is simplified, and the efficiency is improved.
And 104, when entering a third designated procedure in the processing flow, reading the hole array code on the combined structure, converting the hole array code into a corresponding two-dimensional code, and then arranging the two-dimensional code on the combined structure.
In this step, the third appointed process can be any processes which do not have adverse effect on the two-dimensional code in the middle and later periods of the processing flow, the hole array code is converted back into the two-dimensional code and then is arranged on the outer layer of the product again, and the hole array code is more convenient to read compared with the hole array code.
This embodiment is directed at the product that is formed by a plurality of constitutional units according to the processing procedure processing of predetermineeing, traces back the appearance mode that the sign adopted interconversion's two-dimensional code or hole array code, can enough solve some processes and produce the problem of harmful effects to the two-dimensional code discernment, can solve the problem that inlayer information loses again.
In addition, the tracing method further comprises the steps of creating record items corresponding to the two-dimensional codes at the server end, wherein each two-dimensional code is used for binding various production related information of the corresponding component unit or the combined structure in the whole processing flow, and for each component unit and the combined structure, reading the hole array codes or the two-dimensional codes on the current component unit and the combined structure and synchronizing the current production related information to the corresponding record items at the server end when any process in the processing flow is carried out.
When the method is applied to different products, the specific procedures indicated by the th specifying procedure, the second specifying procedure and the third specifying procedure can be set according to the actual processing flow of the current product.
application examples are provided below to further illustrate the technical solution of the present invention .
Referring to fig. 2, the present embodiment provides quality tracing methods for multi-layer PCBs, including the following steps:
step 201, in the cutting process, unique two-dimensional codes are distributed to each core board, the two-dimensional codes are converted into unique hole array codes and then are drilled on the corresponding core boards, meanwhile, records corresponding to the two-dimensional codes are created at the server end, and relevant production information related to the process is synchronized to the corresponding records at the server end.
In the step, after the edges of the cutting fillet are ground, a hole array code is drilled on each core plate through a laser coding machine. When the hole array code is formed, a through hole can be drilled, and a blind hole can also be drilled. Compared with the method of drilling through holes, the method of drilling blind holes has the advantages of small equipment investment, low cost, high efficiency, high automation degree and the like.
In addition, in order to ensure the normal manufacture of the core plate, the hole array codes can be arranged at the plate edges of the core plate. Meanwhile, in order to avoid mutual interference among the hole array codes of a plurality of core plates in the subsequent pressing process, different hole array code drilling areas need to be specified for each core plate in advance according to the preset stacking layers, so that the hole array codes of the core plates in different layers are strictly partitioned, and the core plates are convenient to recognize and read.
Step 202, inner layer circuit manufacturing and inner layer AOI are carried out, and when each core board passes through processing equipment, the hole array code of the current core board is read through the CCD, and the current production related information is synchronized into the corresponding record item of the server side.
Step 203, entering a pressing process, pressing a plurality of core boards to form a multilayer board, reading the hole array code of each core board before pressing and shipping, generating a corresponding -only two-dimensional code for the read hole array codes, converting the two-dimensional code into -only hole array codes, drilling the hole array codes on the edge of the multilayer board, creating a record item corresponding to the two-dimensional code at a server end, and synchronizing the related production information related to the process to the corresponding record item at the server end.
Because the two-dimensional code generated for the multilayer board in the laminating process corresponds to the plurality of hole array codes, namely corresponds to the two-dimensional codes of the plurality of inner-layer core boards, the recorded information of the two-dimensional code of the multilayer board is the sum of the recorded information of the two-dimensional codes of the plurality of inner-layer core boards.
In the step, different hole array codes of the core plates of the inner layers can be read for times through X-Ray , so that the transfer of the hole array codes from the inner layer to the outer layer can be realized quickly, the process is simplified, and the efficiency is improved.
When each core board/multilayer board passes through each processing device applied in the process, the hole array code is read through the CCD, and the current production related information is synchronized to the corresponding record item of the server side.
And 204, before entering the character printing process, performing operations such as drilling, copper deposition and electroplating, outer-layer circuit manufacturing, outer-layer AOI (automated optical inspection) and resistance welding according to a normal process flow, reading the hole array code of the multilayer board through a CCD (charge coupled device) when the multilayer board passes through processing equipment, and synchronizing the current production related information into a corresponding record item of a server side.
And step 205, entering a character printing process, reading the hole array codes on the multilayer board through a CCD (charge coupled device) after the characters are printed and baked or after solder mask development, converting the hole array codes into corresponding two-dimensional codes before the characters are delivered, and then printing the two-dimensional codes to the board edges of the multilayer board through a laser coding machine, and simultaneously reading the hole array codes of the multilayer board through the CCD when the multilayer board passes through processing equipment every time, and synchronizing the current production related information to the corresponding record items of the server side.
And step 206, entering other subsequent procedures including surface treatment, forming, electrical measurement, FQC/FQA, packaging and the like, reading the two-dimensional codes on the multilayer board by a scanning gun when the multilayer board passes through processing devices every time, and synchronizing the current production related information into corresponding record items of a server side.
In the above flow, since the two-dimensional code is not easily recognized due to being easily covered or etched in the character printing process and the processes before the character printing process, the two-dimensional code is converted into the hole array code and formed on the board in the meantime; and after the characters printing process, the factors which have adverse effects on the two-dimensional code disappear, so the hole array code is converted back to the two-dimensional code to be formed on the board after the characters are printed, and the two-dimensional code can be quickly read through a scanning gun in the subsequent processes. Moreover, in the pressing process, the information of each inner layer can be quickly transferred to the outer layer, so that the loss of the information of the inner layers is prevented, and the integrity of data is effectively ensured.
In the whole process, every time the processing equipment passes, the hole array code/two-dimensional code on the board is read and the production related information is synchronized to the server side, and the production related information can comprise various related information such as a factory name, a process name, a production material number, a production batch number, an operator name, a production line identity, production time, a raw material name/supplier/batch number, detection data, any items or any combination of multiple items in production parameters and the like, so that comprehensive and complete data can be obtained at the server side, full life cycle tracing (including forward tracing and reverse tracing) of a product can be realized, quality monitoring of the full process of the product is enhanced, real-time monitoring of the processing equipment can be realized, and more strict quality requirements on the market are met.
The method for converting the two-dimensional code and the hole array code in the above process will be described in detail below.
Referring to fig. 3, the method for converting a two-dimensional code with a specification not greater than a preset threshold into a hole array code in this embodiment includes:
And step 304, drawing a hole array code graph according to the hole array code table with the m multiplied by 1 specification.
The following description will be made of a specific conversion method by taking a two-dimensional code of 4 × 4 standard as an example:
for the 4 × 4 two-dimensional code, it can be converted into the 4 × 4 binary table shown in table 1 and then into the 4 × 1 decimal table shown in table 2:
thus, the 4 × 4 two-dimensional code is converted into a 4 × 1 decimal table, and in order to convert the information into the required achievable hole array code, the following conversion is continued: divide each data in a 4 x 1 decimal table by 24This gives table 3, each number in table 3 being less than 1.
For table 3, it can be converted into the hole pattern code diagram as shown in fig. 4, that is, converting each data into the ratio of rows of dot positions can convert 4 columns into columns of dot storage information, and if the number of columns is increased, the efficiency of describing the two-dimensional code can be greatly improved.
Referring to fig. 5, the method for converting a two-dimensional code with a specification greater than a preset threshold into a hole array code in this embodiment includes:
And step 504, combining the obtained partial images of the at least two hole array codes into a complete hole array code image.
And 505, forming a hole array code on a processing object (such as a core plate and a multilayer plate) according to the hole array code graph.
In order to minimize the number of holes of the finally formed hole array code, the method for dividing the m × m binary table in step 502 includes:
firstly, obtaining the punching precision of the machine
Size L of hole array code area1×L2(L1Is a length, L2Width) and a two-dimensional code specification of m multiplied by m, wherein the size of the hole array code area is 5mm multiplied by 5mm or 4mm multiplied by 4 mm;
then, according to the formula
Calculating to obtain an available value of the number n of the combined columns;
finally, according to the formula x ═ m/n ], the bisector number x of the binary table division with the m × m specification is obtained.
In the above-described division method, n may have a plurality of values, so that the bisector x may also have a plurality of values, that is, there are a plurality of division methods. However, the larger the bisector x, the more holes need to be processed, and thus the optimum bisector x is [ m/n ]max]。
In step 503, the method for converting each binary table portion into a corresponding hole array code partial graph respectively comprises:
the data in each binary table portion is first converted to decimal data and divided by 2nSo that each number in the table is smaller than 1, and a hole array code table with the specification of m multiplied by 1 is obtained;
and drawing a hole array code picture according to the hole array code table with the m multiplied by 1 specification.
The following description will take two-dimensional codes of 18 × 18 and 21 × 21 specifications commonly used in the PCB industry as an example.
① 18 two-dimensional code of 18 x 18 specification changes hole array code
Taking the 18 × 18 two-dimensional code array diagram shown in fig. 6 as an example, it can be understood that the requirement for converting 18 × 18 into 18 × 1 hole array diagrams is very high before conversion, and if the 18 × 1 hole array diagram is converted into the 18 × 1 hole array diagram, the precision of processing holes by a machine should be less than or equal to that of 238nm, which is far beyond the level that can be achieved by the actual processing of the machine currently, for this reason, the present embodiment converts the hole array diagram into 18 × 18, which can be considered to be divided into 18 × 4 or 18 × 5 small parts, and then converts the small parts into the hole array diagram respectively.
First, the following parameters are obtained:
a. machine drilling precision
b. Size L of hole array code area1×L2；
c. The two-dimensional code specification m × m is 18 × 18.
For the punching accuracy, the calculation method can be that for n columns of data converted into columns of data, the minimum measurement unit e*The method comprises the following steps:
then the drilling precision of the machine should satisfy:
thus, when the punching precision of the machine is given, the area width L of the two-dimensional code is determined2N can be obtained from formula 2maxFinally according to nmaxThe best scheme is obtained. The calculation process is as follows:
assuming a given machine accuracy
L1×L24mm × 4 mm. Since n is an integerThe inverse solution is difficult, n can be substituted into the formula 2 from small to large, the maximum value meeting the condition is taken, and n can be obtainedmaxThen the two-dimensional code data can be divided into x-18/4]Equal to 5 equal parts. The larger the halving number x is, the number of holes to be processed is correspondingly increased, for example, if the halving number x is 6, 18 holes are required to be added, so that under the constraint condition that the requirement on accuracy is as small as possible and the number of holes is as small as possible, the optimal scheme can be obtained, namely 18 × 18 is divided into 18 × 4, 18 × 4, 18 × 4, 18 × 4 and 18 × 2.
Then, the hole array code graph shown in fig. 7 can be obtained after conversion processing and merging, and the final hole array code can be obtained by removing line modification in the hole array code graph, as shown in fig. 8, the graph has a total of 93 holes, including 90 data holes and 3 positioning holes; and the original two-dimensional code data totally count 414 holes, which obviously greatly reduces the processing amount.
② 21 x 21 standard two-dimensional code rotary hole array code
First, two-dimensional codes are randomly generated, and the binary table of the 21 × 21 standard is shown in table 4 below.
| 0 | 0 | 0 | 0 | 1 | 0 | 0 | 0 | 1 | 1 | 0 | 0 | 0 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 0 | 0 | 0 | 1 | 0 | 1 | 1 | 0 | 1 | 0 | 1 | 0 | 0 | 0 | 0 | 0 | 1 | 1 | 1 | 1 | 0 |
| 1 | 0 | 0 | 1 | 1 | 1 | 1 | 0 | 0 | 0 | 1 | 0 | 0 | 1 | 0 | 1 | 0 | 1 | 0 | 0 | 1 |
| 0 | 0 | 0 | 0 | 1 | 0 | 1 | 0 | 1 | 0 | 1 | 0 | 1 | 0 | 1 | 1 | 0 | 1 | 0 | 1 | 1 |
| 0 | 1 | 0 | 0 | 0 | 0 | 0 | 1 | 1 | 0 | 0 | 0 | 1 | 1 | 0 | 1 | 1 | 0 | 1 | 1 | 1 |
| 0 | 0 | 1 | 1 | 0 | 1 | 1 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 0 | 0 | 0 | 1 | 1 | 1 | 0 |
| 1 | 0 | 1 | 0 | 0 | 0 | 0 | 1 | 0 | 1 | 0 | 0 | 1 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 |
| 1 | 1 | 1 | 0 | 0 | 1 | 1 | 1 | 1 | 1 | 0 | 0 | 1 | 1 | 0 | 1 | 1 | 0 | 0 | 1 | 1 |
| 1 | 1 | 1 | 0 | 1 | 0 | 1 | 0 | 1 | 0 | 1 | 1 | 0 | 0 | 1 | 0 | 0 | 0 | 1 | 1 | 0 |
| 1 | 1 | 1 | 0 | 1 | 1 | 0 | 0 | 0 | 1 | 0 | 1 | 0 | 0 | 0 | 1 | 0 | 0 | 0 | 1 | 1 |
| 0 | 0 | 0 | 0 | 1 | 0 | 1 | 1 | 0 | 1 | 0 | 0 | 1 | 1 | 1 | 1 | 1 | 0 | 1 | 1 | 1 |
| 0 | 0 | 1 | 1 | 1 | 0 | 1 | 0 | 1 | 1 | 0 | 1 | 0 | 1 | 1 | 1 | 1 | 0 | 0 | 1 | 0 |
| 1 | 0 | 0 | 0 | 1 | 0 | 1 | 0 | 1 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 0 | 1 | 0 | 1 | 1 |
| 0 | 0 | 1 | 1 | 1 | 0 | 1 | 0 | 0 | 0 | 1 | 0 | 1 | 0 | 0 | 1 | 0 | 0 | 0 | 1 | 0 |
| 1 | 1 | 1 | 1 | 1 | 1 | 1 | 0 | 0 | 0 | 0 | 1 | 1 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 |
| 0 | 0 | 0 | 0 | 0 | 1 | 1 | 1 | 1 | 0 | 0 | 1 | 0 | 1 | 1 | 1 | 0 | 0 | 1 | 1 | 1 |
| 1 | 0 | 0 | 0 | 1 | 0 | 1 | 1 | 1 | 0 | 0 | 0 | 1 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 0 |
| 0 | 1 | 0 | 1 | 1 | 0 | 1 | 0 | 1 | 0 | 1 | 1 | 1 | 0 | 1 | 1 | 1 | 0 | 1 | 0 | 1 |
| 1 | 0 | 1 | 0 | 0 | 1 | 0 | 1 | 1 | 0 | 1 | 1 | 0 | 1 | 0 | 1 | 0 | 1 | 1 | 1 | 1 |
| 1 | 0 | 0 | 1 | 1 | 0 | 0 | 1 | 0 | 0 | 0 | 0 | 1 | 1 | 0 | 0 | 0 | 0 | 0 | 1 | 1 |
| 0 | 1 | 0 | 0 | 0 | 0 | 1 | 1 | 0 | 1 | 1 | 1 | 0 | 1 | 0 | 0 | 0 | 0 | 1 | 0 | 0 |
TABLE 4
Next, a 21 × 21-standard dot matrix chart as shown in fig. 9 is generated from table 4, which is unrealistic if it is converted into a 21 × 1-standard hole matrix code chart, so this example is calculated by the 18 × 18-standard calculation method as follows:
assuming the drilling precision of the machine
I.e. 15.625um, L2 ═ 5mm, then n can be calculated using steps instead of equation 2max5. Therefore, for a 21 × 21 two-dimensional code, it is minimally necessary to divide the 21-column data into [21/5 ]]Equal to 5 parts, the 21 × 21 two-dimensional code can be divided into the following parts:
(1)21×5，21×5，21×5，21×5，21×1；
or, (2)21 × 5, 21 × 4, 21 × 4, 21 × 4, 21 × 4;
or, (3)21 × 5, 21 × 5, 21 × 4, 21 × 4, 21 × 3;
and so on.
It is clear that the required accuracy of the machining of 21 × 5, 21 × 4 and 21 × 3 decreases in order. In actual operation, firstly, the number of the processing holes needs to be reduced as far as possible on the premise of meeting the punching precision of a machine, secondly, the number of the holes with high precision requirements needs to be reduced as far as possible, and at the moment, the optimal scheme can be determined according to the judgment principle that the sum of the equal-division values and the inverse sequence is minimum. Among the three partitioning schemes, the distribution of the number of holes required for precision can be evaluated by using the inverse number (every two numbers in the sequence are compared, the number of sequences with unequal numbers is added with 1), the sequence inverse numbers of the above schemes (5,5,5,5,1), (5,4,4, 4), (5,5,4,4,3) are respectively 4,4 and 8, but the number of 21 × 5 in the scheme (1) is greater than that in the scheme (2), so the scheme (2) is the best scheme among the three partitioning schemes.
For the data of columns only, which is 21 × 1, the data can be represented by 5 holes in the left column, and according to the above rule, the two-dimensional code data of 21 × 21 size can be converted into the following table 5:
| 0 | 6 | 13 | 23 | 11 |
| 21 | 1 | 11 | 31 | |
| 11 | 1 | 16 | 20 | |
| 1 | 6 | 23 | 1 | |
| 10 | 10 | 4 | 24 | 23 |
| 1 | 15 | 13 | 1 | |
| 29 | 15 | 31 | 24 | |
| 14 | 6 | 30 | 25 | |
| 12 | 18 | 6 | 29 | |
| 11 | 2 | 24 | 4 | |
| 1 | 9 | 22 | 12 | 19 |
| 14 | 16 | 27 | 24 | |
| 10 | 12 | 20 | 18 | |
| 18 | 25 | 2 | 5 | 11 |
| 0 | 0 | 19 | 29 | |
| 2 | 8 | 9 | 17 | |
| 31 | 0 | 3 | 26 | |
| 21 | 4 | 17 | 20 | |
| 19 | 7 | 3 | 14 | 8 |
| 26 | 3 | 13 | 14 | |
| 18 | 15 | 4 | 6 |
TABLE 5
The data is divided by 25 according to table 5 and finally converted into a hole pattern code pattern as shown in fig. 10. After the lines are removed, the final hole array code can be obtained, as shown in fig. 11.
Compared with 441 holes of a 21 x 21-specification two-dimensional graph, only 113 holes are needed in the graph 11, wherein 110 data holes and 3 positioning holes are needed, and the production efficiency is greatly improved.
In summary, the following information is required before conversion: machine drilling precision
Size L of hole array code area1×L2(L1Is a length, L2Width) and two-dimensional code specification m × m;
then, calculating according to the formula 2 to obtain a combined column number n, calculating an equant number x by using the combined column number n, and finally obtaining various combinations meeting the conditions; the optimal solution should be among these: to ensure a minimum number of holes, this requires that the number of halves x be equal to [ m/n ]max]On the basis of minimum number of processed holes, the number of holes required for ensuring high precision is as small as possible, so that the sum of reverse orders of equal values (such as 5,5,1, 1) is required to be minimum, and in addition, if the equal value has 1, rows of holes can be reduced by punching through a left row line.
Example two
Referring to fig. 12, for a non-combined product processed according to a predetermined process flow (including multiple steps), since the product does not involve multiple constituent units and the information is transferred from the inner layer to the outer layer, the embodiment provides another methods for tracing the quality of the product in the whole process flow, which includes the steps of:
The th designated step may be any steps designated in the manufacturing flow, and is not limited to the th step in the manufacturing flow, and in a specific implementation, the earliest step in the manufacturing flow that may adversely affect the two-dimensional code recognition may be designated as the th designated step.
And 1203, when entering a second designated procedure in the processing flow, reading the hole array code on the product, converting the hole array code into a corresponding two-dimensional code, and then arranging the two-dimensional code on the product.
At this moment, the second specified process can be any processes which do not have adverse effects on the two-dimensional code in the middle and later periods of the processing flow, the hole array code is converted back into the two-dimensional code and then is arranged on the outer layer of the product again, and the hole array code is more convenient to read relative to the hole array code.
In addition, the quality tracing method of the embodiment further comprises the steps of creating record items corresponding to the two-dimensional codes at the server end, wherein each two-dimensional code is used for binding various production related information of a corresponding product in the whole processing flow, and for each product, reading the hole array code or the two-dimensional code on the current product and synchronizing the current production related information to the corresponding record item at the server end when the product passes through any process in the processing flow.
This embodiment is directed at by the non-combination product that forms according to predetermined processing procedure processing, traces back the presentation mode that the sign adopted interconversion's two-dimensional code or hole array code, can effectively solve some processes and produce the problem of harmful effects to the two-dimensional code discernment, guarantees to trace back the accurate discernment of sign.
When the method is applied to different products, the specific procedures indicated by the th specifying procedure and the second specifying procedure can be set according to the actual processing flow of the current product.
In this embodiment, the specific conversion method of the two-dimensional code and the hole array code is completely the same as that in embodiment , and is not described herein again.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
- The method for tracing the quality of the whole product flow of is characterized in that the method for tracing the quality of the whole product flow comprises the following steps:the method comprises the following steps of respectively distributing unique two-dimensional codes for each composition unit, converting the two-dimensional codes into unique hole array codes and drilling the hole array codes on the corresponding composition units in a -th designated procedure in the processing flow, reading the hole array codes on each composition unit in a second designated procedure in the processing flow, combining the read hole array codes to generate corresponding unique two-dimensional codes, converting the two-dimensional codes into unique hole array codes and drilling the hole array codes on a combined structure formed by combining the composition units;when the specification m multiplied by m of the two-dimensional code is larger than a preset threshold value, the conversion method from the two-dimensional code to the hole array code comprises the following steps: converting the m × m-standard two-dimensional code into an m × m-standard dot matrix code and then converting the m × m-standard dot matrix code into an m × m-standard binary table; dividing the m x m sized binary table from the whole into at least two binary table portions; converting each binary table part into a corresponding hole array code local graph respectively; and combining the obtained partial images of all the hole array codes to obtain the complete hole array code.
- 2. The product full-process quality tracing method according to claim 1, wherein, at a server end, a corresponding record item is created for each two-dimensional code;and for each of the composition units and the composite structures, when the composition units and the composite structures pass through any procedure in the processing flow, reading the hole array codes or the two-dimensional codes on the current composition units and the composite structures, and synchronizing the current production related information into the corresponding record items of the server side.
- 3. The method for product full-flow quality traceability according to claim 1, wherein the method for dividing the m x m-sized binary table from the whole into at least two binary table sections comprises:obtaining the drilling precision of the machineSize L of hole array code area1×L2And the specification m × m of the two-dimensional code; said L1Is length, L2Is the width;
according to the formulaCalculating to obtain a combined column number n;
obtaining an equal division number x according to a formula x ═ m/n ];and dividing the binary table with the m x m specification into x parts according to the mode that each part of combined column is n. - 4. The method for tracing the quality of the whole process of a product according to claim 1, wherein said method for converting each binary table portion into a corresponding hole array code partial graph respectively comprises:converting the data in each binary table portion to decimal data and dividing by 2nSo that each number in the table is smaller than 1, and a hole array code table with the specification of m multiplied by 1 is obtained;and drawing a corresponding hole array code local graph according to the hole array code table with the m multiplied by 1 specification.
- 5. The product full-process quality tracing method according to claim 1, wherein when the specification of the two-dimensional code is that m × m is not greater than a preset threshold, the method for converting the two-dimensional code into the hole array code comprises:converting the two-dimensional code with the m × m specification into a lattice code with the m × m specification, and then converting the lattice code with the m × m specification into a binary table with the m × m specification, wherein the m × m is smaller than a preset value;converting the binary table with the m × m specification into a decimal table with the m × 1 specification;and converting the decimal table with the m × 1 specification into a hole array code with the m × 1 specification.
- 6, kinds of product whole process quality tracing method, the product is processed and made according to the preset processing procedure, characterized in that, the product whole process quality tracing method includes:the method comprises the steps of processing a product, distributing two-dimensional codes of only to the product, converting the two-dimensional codes into hole array codes of only and drilling the hole array codes on the product in a designated procedure in the processing flow, reading the hole array codes on the product, converting the hole array codes into corresponding two-dimensional codes and then arranging the two-dimensional codes on the product in a second designated procedure in the processing flow;when the specification m multiplied by m of the two-dimensional code is larger than a preset threshold value, the conversion method from the two-dimensional code to the hole array code comprises the following steps: converting the m × m-standard two-dimensional code into an m × m-standard dot matrix code and then converting the m × m-standard dot matrix code into an m × m-standard binary table; dividing the m x m sized binary table from the whole into at least two binary table portions; converting each binary table part into a corresponding hole array code local graph respectively; and combining the obtained partial images of the at least two hole array codes to obtain a complete hole array code.
- 7. The product full-process quality tracing method according to claim 6, wherein, at a server end, a corresponding record item is created for the two-dimensional code;when the product passes any procedure in the processing flow, reading the hole array code or the two-dimensional code on the product, and synchronizing the current production related information to the corresponding record item of the server side.
- 8. The method for product full-flow quality traceability according to claim 6, wherein the method for dividing the m x m sized binary table from the whole into at least two binary table sections comprises:obtaining the drilling precision of the machineSize L of hole array code area1×L2And the specification m × m of the two-dimensional code; said L1Is length, L2Is the width;
according to the formulaCalculating to obtain a combined column number n;
obtaining an equal division number x according to a formula x ═ m/n ];and dividing the binary table with the m x m specification into x parts according to the mode that each part of combined column is n. - 9. The method for tracing the quality of the whole process of a product according to claim 6, wherein said method for converting each binary table portion into a corresponding hole array code partial graph respectively comprises:converting the data in each binary table portion to decimal data and dividing by 2nSo that each number in the table is smaller than 1, and a hole array code table with the specification of m multiplied by 1 is obtained;and drawing a corresponding hole array code local graph according to the hole array code table with the m multiplied by 1 specification.
- 10. The product full-process quality tracing method according to claim 6, wherein when the specification of the two-dimensional code is that m × m is not greater than a preset threshold, the method for converting the two-dimensional code into the hole array code comprises:converting the two-dimensional code with the m × m specification into a lattice code with the m × m specification, and then converting the lattice code with the m × m specification into a binary table with the m × m specification, wherein the m × m is smaller than a preset value;converting the binary table with the m × m specification into a decimal table with the m × 1 specification;and converting the decimal table with the m × 1 specification into a hole array code with the m × 1 specification.
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