CN111554599A - Tool for bearing wafer material box, wafer material box device and method for loading wafer - Google Patents
Tool for bearing wafer material box, wafer material box device and method for loading wafer Download PDFInfo
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- CN111554599A CN111554599A CN202010346337.3A CN202010346337A CN111554599A CN 111554599 A CN111554599 A CN 111554599A CN 202010346337 A CN202010346337 A CN 202010346337A CN 111554599 A CN111554599 A CN 111554599A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a tool for bearing a wafer material box, a wafer material box device and a method for loading a wafer. The tool for bearing the wafer material box comprises: the wedge-shaped carrying platform is provided with a groove on an inclined surface, the bottom of the groove comprises a hollow-out area and a non-hollow-out area, and the non-hollow-out area is used for bearing the edge of the frame so that at least part of the frame is positioned in the groove; the lifting and lifting assembly comprises a driving piece and a lifting arm connected with the driving piece, and the lifting arm acts on the wafer in the wafer bearing area at the corresponding position from the hollow area of the groove under the action of the driving piece, so that the wafer and other adjacent wafer positions are staggered, and the carved marks on the surface of the wafer are exposed. The application provides a bear tool of wafer magazine can utilize the lifting arm to rise the wafer, makes its carving number expose, saves the operation of artifical centre gripping wafer, reduces the wafer damage because of the centre gripping causes, conveniently reads the carving number moreover, checks the carving number.
Description
Technical Field
The present disclosure relates to the field of semiconductor technologies, and more particularly, to a wafer cassette loading jig, a wafer cassette apparatus and a wafer loading method.
Background
Each wafer in a wafer factory in the semiconductor industry has a separate coded lot for distinguishing it from other wafers in each process flow and for tracing back the production history when problems are discovered. In order to facilitate production management, each wafer must be placed in the wafer magazine according to the order recorded by the production data, otherwise, the production data and the actual wafer cannot correspond to each other after production is finished, so that production disorder is caused, and economic loss is brought. Wafer factories below 12 inches generally adopt a method of manually clamping wafers and manually reading and checking the wafer numbers, which is inconvenient to operate and easy to make mistakes, and a jig convenient for reading the wafer numbers needs to be developed.
Disclosure of Invention
The technical problem that this application mainly solved provides a tool, wafer magazine device and the method of loading wafer that bear wafer magazine, can conveniently read the number of carving of the wafer of placing in the wafer magazine.
In order to solve the technical problem, the application adopts a technical scheme that:
the utility model provides a bear tool of wafer magazine, wafer magazine includes the casing, with lid that the casing matches and being located the inside frame that is used for bearing the weight of wafer of casing, the frame includes the wafer bearing area that a plurality of intervals set up, wherein, the tool includes: the wedge-shaped carrying platform is provided with a groove on an inclined surface, the bottom of the groove comprises a hollow-out area and a non-hollow-out area, and the non-hollow-out area is used for bearing the edge of the frame so that at least part of the frame is positioned in the groove; the lifting and lifting assembly comprises a driving piece and a lifting arm connected with the driving piece, the lifting arm is used for lifting the wafer in the wafer bearing area, so that the wafer is staggered with other adjacent wafer positions, and the carved marks on the surface of the wafer are exposed.
The lifting and lifting assembly further comprises a lifting platform, the number of the lifting arms is multiple, the plurality of lifting arms are fixedly arranged on one side of the lifting platform, and the heights of the adjacent lifting arms are different; the driving piece acts on the other side of the lifting platform.
The wafer carried in the frame comprises a first surface and a second surface which are arranged oppositely, and the first surface is provided with the notch; if the first surfaces of all the wafers in the frame are located in the inclined descending direction of the inclined surface relative to the second surfaces, one lifting arm is correspondingly arranged at one wafer position, and the heights of the plurality of lifting arms are gradually increased along the inclined ascending direction of the inclined surface.
The lifting arm is far away from one end of the lifting platform, a clamping groove is formed in the end, far away from the lifting platform, of the clamping groove, the opening size of the end, far away from the lifting platform, of the clamping groove is smaller than the size of the wafer bearing area of the frame at the corresponding position.
Wherein, the tool still includes: the first limiting piece is positioned on the surface of the non-hollowed-out area of the groove and used for limiting the position of the frame.
The number of the first limiting parts is four, and the first limiting parts are respectively arranged at the corners of the non-hollowed-out areas.
Wherein, the size of recess is greater than the size of casing, the tool still includes: the second limiting piece is positioned on the inclined surface adjacent to the groove, and the second limiting piece is positioned in the inclined descending direction of the inclined surface relative to the groove.
Wherein, the tool still includes: a light source positioned above the inclined surface; the adjustable light source bracket is fixedly connected with the light source.
In order to solve the above technical problem, another technical solution adopted by the present application is:
there is provided a wafer magazine apparatus including: the wafer material box comprises a shell, a cover body matched with the shell and a frame positioned in the shell and used for bearing wafers, wherein the frame comprises a plurality of wafer bearing areas arranged at intervals; according to the jig for bearing the wafer material box, at least part of the wafer bearing area is correspondingly provided with the lifting arm.
In order to solve the above technical problem, another technical solution adopted by the present application is:
the method for loading the wafer is provided, and the wafer magazine device in the technical scheme is utilized, and the method comprises the following steps: arranging the frame carrying a plurality of wafers in the groove; lifting at least part of the wafer in the frame by using the lifting and lifting assembly, so that the lifted wafer and other adjacent wafers are staggered with each other, and the carved marks on the surface of the lifted wafer are exposed; checking whether the nick number is correct.
If the scribing numbers of all the wafers are correct, the method further comprises the following steps: disposing the frame within the housing; placing the shell on the inclined surface, wherein the shell abuts against a second limiting piece positioned on the inclined surface; the cover body is buckled with the shell along the inclined rising direction of the inclined surface; and checking whether the buckling conditions of all the elastic buckling pieces arranged on the cover body and the wafers at the corresponding positions meet the requirements or not.
The beneficial effect of this application is: be different from prior art's condition, the tool that bears wafer magazine that this application provided includes wedge microscope carrier and lift the subassembly, and the subassembly is lifted in the lift again including driving piece and lift arm. The inclined surface of the wedge-shaped carrying platform is provided with a groove, at least part of the frame of the wafer material box can be positioned in the groove, the bottom of the groove is hollowed out, one side of the hollowed-out part corresponds to a wafer bearing area in the frame, the other side of the hollowed-out part corresponds to the lifting arm, so that the driving part can drive the lifting arm to act on the wafer in the wafer bearing area at the corresponding position from the hollowed-out part, the wafer is further staggered with other adjacent wafers, and the carved marks on the surface of the wafer are exposed. The application provides a bear tool of wafer magazine can utilize the lifting arm to rise the wafer, makes its carving number expose, saves the operation of artifical centre gripping wafer, reduces the wafer damage because of the centre gripping causes, conveniently reads the carving number moreover, checks the carving number.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural view of an embodiment of a tool for holding a wafer cassette according to the present disclosure;
FIG. 2 is a schematic diagram of a wafer cassette according to an embodiment;
FIG. 3 is a top view of the jig shown in FIG. 1, taken in a direction perpendicular to the inclined surface;
FIG. 4 is a schematic view of an embodiment of a lift arm acting on a wafer;
FIG. 5 is a schematic diagram of an embodiment of a lift assembly;
FIG. 6 is a schematic flow chart illustrating a method for loading wafers according to one embodiment of the present disclosure;
FIG. 7 is a schematic flow chart illustrating an embodiment of steps included after step S103 in FIG. 6;
FIG. 8a is a schematic structural view of an embodiment of a cover engaged with a housing when the housing is horizontally disposed;
fig. 8b is a schematic structural view of an embodiment of engaging the cover when the housing is tilted.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments that can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application belong to the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a tool for loading a wafer cassette according to the present application. In the present application, the wafer magazine is a common wafer magazine for each wafer factory, please refer to fig. 2, and fig. 2 is a schematic structural diagram of an embodiment of the wafer magazine, which includes a housing 21, a cover 22 matched with the housing 21, and a frame 23 located inside the housing 21 and used for carrying a wafer 20, where the frame 23 includes a plurality of wafer carrying areas arranged at intervals, and a hollow area is disposed at a position of the bottom of the frame 23 corresponding to the wafer carrying area. When the wafer magazine is horizontally placed, the wafers 20 are at the same height, and it is inconvenient to read the scribing number. The wafer magazine bearing jig provided by the embodiment comprises: a wedge-shaped carrier 11 and a lifting and lifting assembly 12; the wedge-shaped carrying platform 11 is of a hollow structure, a groove 111 is arranged on an inclined surface of the wedge-shaped carrying platform, the bottom of the groove 111 comprises a hollow-out area and a non-hollow-out area, and the non-hollow-out area is used for bearing the edge of the frame 23, so that at least part of the frame 23 is located in the groove 111; the lifting and lifting assembly 12 includes a driving member 121 and a lifting arm 122 connected to the driving member 121, wherein the lifting arm 122 acts on the wafer 20 in the wafer carrying area at the corresponding position from the hollow area of the groove 111 under the action of the driving member 121, so that the wafer 20 is staggered from the adjacent other wafers 20, and the marks on the surface of the wafer 20 are exposed.
In this embodiment, when the notch numbers of one or more wafers 20 loaded in the frame need to be checked, the jig for bearing the wafer magazine can lift the wafer 20 by using the lifting arm 122, and the position of the wafer 20 is staggered with that of the adjacent other wafers 20, and the notch number of the wafer 20 after being lifted is higher than the upper surface of the frame, so that no other wafer 20 is shielded, the effect of exposing the notch number of the wafer 20 is realized, the operation of manually clamping the wafer 20 is omitted, the damage to the wafer 20 caused by clamping is reduced, and the notch number can be conveniently read and checked.
Further, with reference to fig. 1, the lifting and supporting assembly 12 of the jig of the present embodiment further includes a plurality of supporting platforms 123, the number of the supporting arms 122 is plural, the plurality of supporting arms 122 are fixedly disposed on one side of the supporting platforms 123, and the heights of the adjacent supporting arms 122 are different; the driving member 121 acts on the other side of the lifting platform 123. In order to enable the lifting arms 122 to smoothly extend into the corresponding wafer carrying areas from the hollow areas at the bottom of the groove 111 to lift the wafer 20, in this embodiment, the lifting platform 123 is preferably disposed parallel to the bottom of the groove 111, and each lifting arm 122 is vertically and fixedly disposed at one side of the lifting platform 123. The driving member 121 includes a telescopic rod that extends or retracts to make the lifting platform 123 drive the lifting arm 122 to move close to or away from the bottom of the groove 111, so that the wafer 20 is lifted by the lifting arm 122 or placed back into the frame 23. In other embodiments, the lifting arm 122 may also be configured to be removable from the lifting platform 123, i.e., movably connected to the lifting platform 123, but will not shake after being connected, and can extend into the wafer loading area to act on the wafer 20 quickly and accurately.
Referring to fig. 3 in conjunction with fig. 1, fig. 3 is a top view of the jig shown in fig. 1, in a direction perpendicular to the inclined surface, the number of the hollow spaces in the hollow area at the bottom of the groove 111 corresponds to the number of the wafer carrying areas in the frame 23 of the wafer cassette, so that when the frame 23 is fully loaded with wafers 20, all the wafers 20 can be lifted by the lifting arms 122 at the corresponding positions.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment in which a lift arm acts on a wafer. The heights of the adjacent lifting arms 122 are different, so that when the adjacent wafers 20 are lifted by the corresponding lifting arms 122, the positions are staggered, the carved numbers of the wafers 20 can be exposed, and the carved numbers can be read conveniently. Generally, the wafer 20 carried in the frame 23 includes a first side and a second side opposite to each other, and the first side is provided with a mark; if the first surface of all the wafers 20 in the frame 23 is in the inclined descending direction of the inclined surface relative to the second surface, i.e. the direction a in fig. 4, one lifting arm 122 is correspondingly disposed at a position of one wafer 20, and the heights of the plurality of lifting arms 122 gradually increase along the inclined ascending direction of the inclined surface (i.e. the direction B in fig. 4). For example, along the direction B, the heights of the plurality of lifting arms 122 may be set to be arranged in an arithmetic progression with gradually increasing differences, and the differences in the rows are greater than or equal to the heights occupied by the etching marks on the wafers, so that the wafer 20 in each wafer carrying area in the frame 23 may be lifted by the lifting arm 122 at the corresponding position at the same time, the heights of the etching marks of the wafer 20 relative to the inclined plane are also arranged in an arithmetic progression, and the etching marks of each wafer are exposed and not shielded, thereby facilitating the reading of the etching marks of all the wafers 20 at one time, and the process of reading the etching marks is not damaged for the wafer 20.
In other embodiments, the number of the lifting arms 122 may be only one, so as to read the scribing marks of the wafers 20 one by one, rather than lifting all the wafers 20 at once. At this time, the jig may not include the lifting platform 123, the lifting arm 122 is directly disposed at the top end of the driving member 121, and the lifting assembly 12 may move horizontally, and the minimum distance of the horizontal movement may be set to a fixed value, so that the lifting arm 122 corresponds to one wafer carrying area at a time, and is used to lift the wafer 20 in the wafer carrying area, so that the mark thereof is exposed.
Referring to fig. 5 in conjunction with fig. 1, fig. 5 is a schematic structural diagram of an embodiment of a lifting assembly. A clamping groove 1220 is disposed at an end of the lifting arm 122 away from the lifting platform 123, and an opening size of the clamping groove 1220 away from the end of the lifting platform 123 is smaller than a size of the wafer bearing area of the frame 23 at the corresponding position. In this embodiment, the slot 1220 at one end of the lifting arm 122 is preferably designed as a Y-shaped opening, so as to reduce the contact area with the surface of the wafer when lifting the wafer as much as possible, and reduce the damage to the wafer. The size of the Y-shaped opening is set to be smaller than the size of the hollow grids at the bottom of the groove 111 at the corresponding position and smaller than the size of the wafer bearing area, so that the lifting arm 122 can enter the wafer bearing area from the hollow grids at the bottom of the groove 111 to act on the wafer, and the wafer is lifted to expose the carved number.
Further, with reference to fig. 1 and fig. 3, the wafer cassette fixture of the present application further includes at least one first limiting member 13 disposed on the surface of the non-hollow area of the groove 111 for limiting the position of the frame 23. Preferably, the number of the first limiting members 13 is four, and the first limiting members are respectively disposed at four corners of the non-hollow area. When the frame 23 loaded with the wafer 20 is disposed inside the groove 111, the frame 23 is just limited by the four first limiting members 13, so that the frame 23 does not move inside the groove 111, each wafer carrying area of the frame 23 can be aligned with each hollow grid at the bottom of the groove 111, and each lifting arm 122 can enter the corresponding wafer carrying area from each corresponding hollow grid at the bottom of the groove 111 to lift the wafer 20.
Further, referring to fig. 1 to 3, the size of the groove 111 on the inclined surface of the wedge-shaped carrier 11 is larger than the size of the housing 21 of the wafer cassette, after the frame 23 is placed in the housing 21, the frame can still be placed in the groove 111, the jig for carrying the wafer cassette further includes a second limiting member 14 located on the inclined surface adjacent to the groove 111, and the second limiting member 14 is located in an inclined descending direction of the inclined surface relative to the groove 111. The second limiting member 14 is preferably configured to be an elongated member, and when the frame 23 or the housing 21 is placed in the groove 111, the second limiting member 14 can prevent the frame 23 or the housing 21 from falling down, so as to prevent the wafer from being broken. When the housing 21 is disposed in the groove 111, the bottom of the housing 21 can be directly disposed on the first limiting member 13, and the position of the first limiting member is limited by the second limiting member 14, so that the cover 22 can be conveniently matched with the housing 21.
Further, with reference to fig. 1, the jig for loading a wafer cassette of the present application further includes a light source 15 and an adjustable light source bracket 16, the light source 15 is located above the inclined surface, and the adjustable light source bracket 16 is fixedly connected to the light source 15. When the number needs to be read, the light source 15 can provide illumination, so that the number can be read clearly, the adjustable light source support 16 can adjust the light source 15 at any angle, and the number can be read conveniently.
The application also provides a wafer magazine device, includes: a wafer material box and a tool for bearing the wafer material box in any one of the above embodiments; the wafer material box comprises a shell, a cover body matched with the shell and a frame positioned in the shell and used for bearing wafers, wherein the frame comprises a plurality of wafer bearing areas arranged at intervals; the jig for bearing the wafer material box comprises a lifting arm, and at least part of the wafer bearing area is correspondingly provided with the lifting arm. The specific structure can be found in any of the above embodiments, and is not described herein again.
Referring to fig. 6 in conjunction with fig. 4, fig. 6 is a schematic flow chart illustrating a method for loading a wafer according to an embodiment of the present invention, the method for loading a wafer includes the following steps:
s101, arranging a frame carrying a plurality of wafers in the groove.
Before or after a certain process flow, the notch number needs to be read and checked, at this time, the frame 23 loaded with the plurality of wafers 20 can be taken out from the housing 21, then the frame 23 is placed in the groove 111 on the inclined surface of the wedge-shaped carrier 11, and the first stopper 13 at the bottom of the groove 111 can limit the position of the frame 23, so that the frame does not move in the groove 111, and the subsequent operation of reading the notch number is facilitated.
S102, at least a part of the wafers in the frame are lifted by the lifting and lifting assembly, so that the lifted wafers and other adjacent wafers are staggered, and marks on the surfaces of the lifted wafers are exposed.
After restraining the frame 23 at the bottom of the recess 111, the lift assembly 12 is used to lift at least a portion of the wafer 20 within the frame. When all the wafers 20 in the fully loaded frame 23 need to read the scribing mark, the driving member 121 is directly utilized to drive the lifting platform 123 to drive the plurality of lifting arms 122 corresponding to each wafer 20 to enter the corresponding wafer carrying area from the hollow grids at the bottom of the groove 111, so as to lift the wafer 20. When only a part of the wafers 20 in the frame need to read the scribing marks, the lifting arm 122 corresponding to the part of the wafers 20 that do not need to read the scribing marks can be taken down from the lifting platform 123, and then the driving member 121 drives the lifting platform 123 to drive the remaining lifting arms 122 to enter the corresponding wafer carrying areas from the hollow grids at the bottom of the groove 111, so as to lift the wafers 20. Moreover, the different heights of the lifting arm 122 make the lifted wafer 20 staggered with other adjacent wafers 20, and the marks on the surface of the lifted wafer 20 are exposed and not shielded, so that the marks can be read and checked conveniently.
S103, checking whether the nick number is correct.
After the wafer 20 is lifted, the light source 15 can be turned on and the distance and angle of the light source can be adjusted to illuminate, so that the mark can be conveniently read and whether the mark is correct or not can be checked, and whether the mark corresponds to the record on the production data or not can be checked.
In the embodiment, all or part of the wafers 20 loaded in the frame 23 can be lifted at the same time, so that the marks of the wafers 20 are exposed and are not shielded, and the marks can be read and checked conveniently.
Further, referring to fig. 7, fig. 7 is a schematic flowchart illustrating an embodiment of steps included after step S103 in fig. 6, where if the wafer numbers of all the wafers are checked to be correct after step S103, the method for loading the wafers further includes the following steps:
s201, arranging the frame in the shell.
After the mark number is checked, the frame 23 is first placed in the housing 21, which facilitates the subsequent operation of applying the cover 22.
S202, the shell is placed on the inclined surface, and the shell abuts against the second limiting piece on the inclined surface.
The housing 21 loaded with the frame 23 is placed on the inclined surface, and the housing 21 abuts against the second stopper 14 on the inclined surface. Specifically, the housing 21 can be placed in the groove 111 of the inclined surface, and the second limiting member 14 abuts against the housing 21, which helps to prevent the housing 21 from falling. A block body with the size equivalent to that of the groove 111 may be further provided, the block body may be completely placed in the groove 111, which is equivalent to that the groove 111 is filled, and then the housing 21 is placed on the block body to abut against the second limiting member 14, so that the same effect can be achieved.
And S203, the cover body is buckled with the shell along the inclined rising direction of the inclined surface.
Referring to fig. 8a and 8b, fig. 8a is a schematic structural view of an embodiment of engaging with a cover when the housing is horizontally placed, and fig. 8b is a schematic structural view of an embodiment of engaging with a cover when the housing is obliquely placed. If the housing 21 is placed on a horizontal plane, since the width of the wafer carrying area is greater than the thickness of the wafer 20, the direction of the wafer 20 in the wafer carrying area will be random, and the directions of the wafers 20 will not be completely consistent, and if the cover 22 and the housing 21 are fastened at this time, some wafers 20 will not be clamped between the elastic fasteners 220 corresponding to the wafers 20 and disposed on the cover 22, which may cause the wafers 20 to be damaged due to stress. If the housing 21 is disposed on the inclined surface, the wafer 20 will show a completely consistent direction in the wafer carrying area due to the gravity, and will face a direction uniformly, at this time, the lid 22 will be fastened with the housing 21 along the inclined ascending direction of the inclined surface, and all the wafers 20 will be clamped in the middle of the elastic fastener 220, so as to reduce the probability of stress damage to the wafer 20.
S204, checking whether the fastening conditions of the elastic fastening pieces arranged on all the cover bodies and the wafers at the corresponding positions meet the requirements or not.
After the cover 22 and the housing 21 are fastened, the light source 15 may be used to further check whether the fastening conditions of the elastic fasteners 220 disposed on all the covers 22 and the wafers 20 at the corresponding positions meet the requirements, that is, check whether all the wafers 20 are clamped in the middle of the elastic fasteners 220, and if not, open the covers 22 and further adjust the directions of the wafers 20.
In the embodiment, the inclination angle of the inclined surface of the wedge-shaped carrier 11 can be utilized to enable all the wafers 20 to face the same direction in the wafer bearing area, so that after the cover 22 and the shell 21 are fastened, all the wafers 20 are clamped in the middle of the elastic fastener 220, and the probability of stress damage to the wafers 20 is reduced.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (11)
1. The utility model provides a bear tool of wafer magazine, the wafer magazine include the casing, with lid that the casing matches and being located the inside frame that is used for bearing the weight of wafer of casing, the frame includes the wafer bearing area that a plurality of intervals set up, its characterized in that, the tool includes:
the wedge-shaped carrying platform is provided with a groove on an inclined surface, the bottom of the groove comprises a hollow-out area and a non-hollow-out area, and the non-hollow-out area is used for bearing the edge of the frame so that at least part of the frame is positioned in the groove;
the lifting and lifting assembly comprises a driving piece and a lifting arm connected with the driving piece, the lifting arm is used for lifting the wafer in the wafer bearing area, the hollow area of the groove is used for acting on the wafer in the corresponding position under the action of the driving piece, so that the wafer is staggered with other adjacent wafer positions, and the carved marks on the surface of the wafer are exposed.
2. The fixture according to claim 1,
the lifting and lifting assembly further comprises a plurality of lifting platforms, the number of the lifting arms is multiple, the plurality of lifting arms are fixedly arranged on one side of each lifting platform, and the heights of the adjacent lifting arms are different; the driving piece acts on the other side of the lifting platform.
3. The fixture according to claim 2,
the wafer carried in the frame comprises a first surface and a second surface which are arranged oppositely, and the first surface is provided with the carved number; if the first surfaces of all the wafers in the frame are located in the inclined descending direction of the inclined surface relative to the second surfaces, one lifting arm is correspondingly arranged at one wafer position, and the heights of the plurality of lifting arms are gradually increased along the inclined ascending direction of the inclined surface.
4. The fixture according to claim 2,
the lifting arm is far away from one end of the lifting platform, a clamping groove is formed in the end, far away from the lifting platform, of the clamping groove, the opening size of the end, far away from the lifting platform, of the clamping groove is smaller than the size of the wafer bearing area of the frame at the corresponding position.
5. The jig of claim 1, further comprising:
the first limiting piece is positioned on the surface of the non-hollowed-out area of the groove and used for limiting the position of the frame.
6. The fixture according to claim 5,
the number of the first limiting parts is four, and the first limiting parts are respectively arranged at the corners of the non-hollowed-out areas.
7. The jig of claim 1, wherein the size of the groove is larger than the size of the housing, the jig further comprising:
the second limiting piece is positioned on the inclined surface adjacent to the groove, and the second limiting piece is positioned in the inclined descending direction of the inclined surface relative to the groove.
8. The jig of claim 1, further comprising:
a light source positioned above the inclined surface;
the adjustable light source bracket is fixedly connected with the light source.
9. A wafer magazine apparatus, comprising:
the wafer material box comprises a shell, a cover body matched with the shell and a frame positioned in the shell and used for bearing wafers, wherein the frame comprises a plurality of wafer bearing areas arranged at intervals;
the tool for holding wafer cassettes of any one of claims 1-8, wherein at least a portion of the wafer holding area is provided with the lift arm.
10. A method of loading a wafer using the wafer magazine apparatus of claim 9, the method comprising:
arranging the frame carrying a plurality of wafers in the groove;
lifting at least part of the wafer in the frame by using the lifting and lifting assembly, so that the lifted wafer and other adjacent wafers are staggered with each other, and the carved marks on the surface of the lifted wafer are exposed;
checking whether the nick number is correct.
11. The method of claim 10, wherein if the lot numbers of all the wafers are correct, the method further comprises:
disposing the frame within the housing;
placing the shell on the inclined surface, wherein the shell abuts against a second limiting piece positioned on the inclined surface;
the cover body is buckled with the shell along the inclined rising direction of the inclined surface;
and checking whether the buckling conditions of all the elastic buckling pieces arranged on the cover body and the wafers at the corresponding positions meet the requirements or not.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010346337.3A CN111554599B (en) | 2020-04-27 | 2020-04-27 | Tool for bearing wafer material box, wafer material box device and method for loading wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010346337.3A CN111554599B (en) | 2020-04-27 | 2020-04-27 | Tool for bearing wafer material box, wafer material box device and method for loading wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111554599A true CN111554599A (en) | 2020-08-18 |
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Cited By (1)
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| CN111554599B (en) | 2022-07-26 |
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