CN210167333U

CN210167333U - Wafer loading device

Info

Publication number: CN210167333U
Application number: CN201921240063.9U
Authority: CN
Inventors: 黄玠勋; 聂鑫誉
Original assignee: Xinen (qingdao) Integrated Circuit Co Ltd
Current assignee: Xinen (qingdao) Integrated Circuit Co Ltd
Priority date: 2019-08-02
Filing date: 2019-08-02
Publication date: 2020-03-20
Anticipated expiration: 2029-08-02

Abstract

The utility model provides a wafer loading device, equipment includes: a shell and a wafer cassette pusher; the wafer box thruster is arranged inside the shell and used for placing a plurality of wafers; the wafer box pusher comprises a plurality of continuously arranged steps, and each step is used for placing the wafer. The height of each step of the wafer loading equipment is the same, each wafer can be exposed out of the wafer identification mark, and the width of each step is the same as that of each wafer sub-box. When the wafer sub-box is placed on the wafer box propeller, the wafer identification mark of each wafer can be clearly displayed, the visual detection is convenient, and the detection of the sensor is also convenient.

Description

Wafer loading device

Technical Field

The utility model relates to the field of semiconductor technology, concretely relates to wafer loading device.

Background

The cassettes are used primarily for the placement and transport of wafers in semiconductor manufacturing, and are used by chip manufacturers to handle and store wafers for ease of transport and to minimize the risk of contamination. The wafer box is internally provided with symmetrical grooves, and the sizes of the grooves are strictly unified for supporting two sides of a wafer. The wafer box is generally made of a temperature-resistant, wear-resistant and anti-static semitransparent plastic material, and additives with different colors are used for distinguishing metal process sections in semiconductor production. Because the critical dimension of the semiconductor is small, the pattern is dense, the requirement of the granularity in the production is very strict, and the wafer box must ensure a clean environment to be connected to the microenvironment and the reaction cavity of different production machines.

Fig. 1 shows a schematic view of a wafer cassette in the prior art, and as shown in fig. 1(a), the wafer cassette includes a housing 101, and clamps (not shown) for carrying a wafer are provided in the housing 101, and a wafer 102 is placed on each of the clamps. As shown in fig. 1(b), a wafer identification mark 103 is provided on each wafer 102. In the housing 101, each chuck is arranged to overlap in the vertical direction, so that the plurality of wafers 102 are arranged to overlap in the vertical direction in the housing 101, that is, the vertical projections of the plurality of wafers 102 on the horizontal plane have the same projection pattern and area. Before the wafer 102 is processed at the machine loading port, the wafer identification mark 103 is identified by using the sensor, and during identification, the wafer identification mark 103 is adjusted to the same position in the wafer box by the sorter, and then the sensor detects the wafer identification mark 103 on the wafer. Since the sensor may fail, i.e., the sensor may fail or fail to recognize the wafer id 103, the wafer detection error may be caused, and the sensor needs to be replaced, which increases the cost.

Therefore, in order to solve the above-mentioned technical problems, a wafer loading apparatus capable of avoiding wafer detection errors and reducing the cost is needed.

Disclosure of Invention

An embodiment of the utility model provides a wafer loading device to wafer detection mistake and the higher problem of cost among the solution prior art.

According to a first aspect, an embodiment of the present invention provides a wafer loading apparatus, the apparatus including: a shell and a wafer cassette pusher;

the wafer box thruster is arranged inside the shell and used for placing a plurality of wafers;

the wafer box pusher comprises a plurality of continuously arranged steps, and each step is used for placing the wafer.

Optionally, the wafer loading device is a wafer cassette.

Optionally, the width of each step is the same.

Optionally, the wafer sub-box further comprises a plurality of wafer sub-boxes, the width of each wafer sub-box is the same as that of the corresponding step, and the wafer sub-boxes are placed on the steps.

Optionally, the height of each step is the same.

Optionally, each step includes a horizontal surface and a vertical surface, the horizontal surface and the vertical surface have the same width and respectively define the depth and the height of each step, and the ratio of the depth to the height is 1: 2 to 2: 1.

optionally, the ratio of the depth to the height is 1: 1.

optionally, the number of the steps is 10 to 100.

Optionally, clips for bearing the wafer sub-boxes are arranged on two sides of each step, so that an included angle is formed between the radial direction and the vertical direction of the wafer, and the included angle ranges from 0 ° to 10 °.

Optionally, the angle of the included angle is 0 °.

Optionally, the height of the step is 5% -30% of the diameter of the wafer.

Optionally, the height difference is 10% -15% of the wafer diameter.

Optionally, the centers of all the steps are located on the same straight line.

Optionally, the straight line is parallel to a plane in which the side wall of the housing lies.

The utility model provides a cascaded wafer box propeller support, each rank height homogeneous phase to enable every wafer and expose the wafer and discern the number of carving, and the width of every step is the same with the width of every wafer subbox. When the wafer sub-box is placed on the wafer box propeller, the wafer identification mark of each wafer can be clearly displayed, the visual detection is convenient, and the detection of the sensor is also convenient.

Drawings

The features and advantages of the invention will be more clearly understood by reference to the accompanying drawings, which are schematic and should not be understood as imposing any limitation on the invention, in which:

fig. 1 is a schematic view of a wafer cassette in the prior art.

Fig. 2 is a side view of the wafer loading apparatus according to the present invention.

Fig. 3 is a front view of the wafer loading apparatus according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

Example one

The utility model provides a wafer loading device, it can be a wafer box. Fig. 2 is a side view of the wafer loading apparatus of the present invention, and fig. 3 is a front view of the wafer loading apparatus of the present invention. As shown in fig. 2-3, the wafer loading apparatus includes a housing 201, a pod pusher 202. A plurality of wafers 203 are placed on the pod pusher 202. The pod pusher 202 is disposed inside the housing 201, and has a plurality of steps disposed in series, the width of each step may be set to be the same, and the height of each step may also be set to be the same. Each wafer 203 is loaded by a wafer sub-cassette. In one particular embodiment, the width of each sub-cassette is the same as the width of each step. Each step has a horizontal surface and a vertical surface defining a depth and a height, respectively, of the each step, the ratio of the depth to the height may be 1: 2 to 2: 1. in a specific embodiment, the depth to height ratio is 1: 1. the depth of the step means the width of the step tread, and is the width in the direction perpendicular to the width of the step. When the ratio of depth to height takes a large value, for example 2: 1, the spacing between adjacent wafers is larger, which makes viewing easier. For example, because the distance between adjacent wafers is large, an operator can observe the wafers from above the wafer loading device or from a direction forming a large angle with the horizontal direction, so that the identification mark of each wafer 203 can be clearly displayed, and the detection by naked eyes is convenient.

Clips (not shown) for carrying the wafer 203 are provided on both sides of each step, and the wafer 203 is placed on each clip. The number of the plurality of steps may be determined according to the size of the housing 201 of the wafer loading apparatus and the number of the wafers 203 in actual operation, and may be 10 to 100. In a specific embodiment, the number of steps is 25. The position and angle of the clamp are properly adjusted so that an included angle exists between the radial direction and the vertical direction of the wafer 203 loaded on the clamp, and the included angle ranges from 0 to 10 degrees. In a specific embodiment, the included angle is 0 °, i.e., the radial direction of the wafer 203 is the same as the vertical direction.

As shown in fig. 3, the wafer identification mark 204 on each wafer 203 is exposed from the front due to the presence of the pod pusher 202. In order to expose the wafer id 204 on each wafer 203, before identifying the wafer 203, the wafer 203 is subjected to a sorter operation in the wafer loader to align all the wafer id 204 vertically above the wafer 203, and then the wafer id 204 on the wafer 203 is detected by a sensor or by visual inspection. The height of the step is 5% -30% of the diameter of the wafer 203; in a specific embodiment, the height of the step is 10% -15% of the diameter of the wafer 203. The centers of all the steps are located on the same straight line, which is parallel to the plane where the side wall of the housing 201 is located. The centers of all the wafer identification marks 204 and the centers of all the wafers 203 are in the same vertical plane and are located at the upper parts of all the wafers 203.

The utility model provides a cascaded wafer box propeller 202 support, each rank height homogeneous phase to enable every wafer 203 to expose wafer discernment number 204 of carving. When the wafer sub-box is placed on the wafer box pusher 202, the wafer identification mark 204 of each wafer 203 can be clearly displayed, so that the visual detection is facilitated, and the detection by a sensor is also facilitated.

The above-described embodiments are merely illustrative of the principles of the present invention and its efficacy, rather than limiting the same, and various modifications and variations can be made by those skilled in the art without departing from the spirit and scope of the invention, such modifications and variations all falling within the scope of the appended claims.

Claims

1. A wafer loading apparatus, comprising: a shell and a wafer cassette pusher;

2. The wafer loading apparatus of claim 1, wherein the wafer loading apparatus is a wafer cassette.

3. The wafer loading apparatus according to claim 1 or 2, wherein the width of each step is the same.

4. The wafer loading apparatus of claim 3, further comprising a plurality of sub-cassettes, the sub-cassettes having a width that is the same as the width of the step, and the sub-cassettes being placed on the step.

5. The wafer loading apparatus according to claim 1 or 2, wherein the height of each of the steps is the same.

6. The wafer loading apparatus of claim 1 or 2, wherein each step comprises a horizontal surface and a vertical surface, the horizontal surface and the vertical surface having the same width and defining a depth and a height of each step, respectively, the ratio of the depth to the height being 1: 2 to 2: 1.

7. the wafer loading apparatus of claim 6, wherein the ratio of the depth to the height is 1: 1.

8. the wafer loading apparatus according to claim 1 or 2, wherein the number of the steps is 10 to 100.

9. The wafer loading equipment as claimed in claim 4, wherein two sides of each step are provided with clamps for bearing the wafer sub-boxes, so that the radial direction and the vertical direction of the wafer form an included angle, and the included angle is in the range of 0-10 degrees.

10. The wafer loading apparatus of claim 9, wherein the included angle is 0 °.

11. The wafer loading apparatus of claim 1, wherein the height of the step is 5% -30% of the wafer diameter.

12. The wafer loading apparatus of claim 11, wherein the height of the step is 10% -15% of the wafer diameter.

13. The wafer loading apparatus according to claim 1 or 2, wherein centers of all the steps are located on the same straight line.

14. The wafer loading apparatus of claim 13, wherein the line is parallel to a plane in which the side wall of the housing lies.