CN204289420U - Wafer slice getting device - Google Patents
Wafer slice getting device Download PDFInfo
- Publication number
- CN204289420U CN204289420U CN201520007862.7U CN201520007862U CN204289420U CN 204289420 U CN204289420 U CN 204289420U CN 201520007862 U CN201520007862 U CN 201520007862U CN 204289420 U CN204289420 U CN 204289420U
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- Prior art keywords
- wafer
- jack
- brilliant boat
- getting device
- slice getting
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of wafer slice getting device, comprising: main body; For the brilliant boat fixed mount of fixing brilliant boat, described brilliant boat fixed mount connects described main body; With multiple wafer multiple chip select button one to one; With described multiple chip select button multiple brake mechanism one to one, described brake mechanism is positioned at described main body; And with described multiple brake mechanism multiple jack-up part one to one, described jack-up part is just to described opening.In elected during at least one described chip select button, corresponding described brake mechanism drives corresponding described jack-up part motion, described jack-up part is through described opening, the described wafer of correspondence is ejected, and then with suction pen, the wafer ejected is taken away, described brilliant boat will do not stretched into by described suction pen, thus avoid the front of wafer described in scratch, and the mistake of getting wrong sheet can be avoided, be of value to simultaneously and shorten the operating time.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly relates to a kind of wafer slice getting device.
Background technology
In semiconductor technology manufacture process, wafer (wafer) is generally positioned in brilliant boat (cassette), so that the storage of wafer and transport.When needing to carry out in batches (split) to the wafer being positioned at same brilliant boat, need manually to be taken out from brilliant boat by wafer, general, suction pen can be stretched into brilliant boat by staff, then need wafer in batches by inhaling that pen holds, thus by suction pen, this wafer is taken out.
But the human factor of getting sheet is by hand uncontrollable, easily occurs misoperation, such as, inhale the front of Pen Association's scratch wafer, thus introduce defect (defect), time serious, may sheet be fallen.
Utility model content
The purpose of this utility model is, provides a kind of wafer slice getting device, can avoid the manual misoperation of getting sheet and introducing, reduce the damage of wafer.
For solving the problems of the technologies described above, the utility model provides a kind of wafer slice getting device, for wafer being taken out from brilliant boat, described brilliant boat is for placing multiple described wafer, the placed side that described brilliant boat has wafer conveying end and is oppositely arranged with described wafer conveying end, described placed side has an opening, described wafer slice getting device comprises:
Main body;
For the brilliant boat fixed mount of fixing described brilliant boat, described brilliant boat fixed mount connects described main body;
With described multiple wafer multiple chip select button one to one;
With described multiple chip select button multiple brake mechanism one to one, described brake mechanism is positioned at described main body; And
With described multiple brake mechanism multiple jack-up part one to one, described jack-up part is just to described opening;
In elected during at least one described chip select button, corresponding described brake mechanism drives corresponding described jack-up part motion, and the described wafer of correspondence, through described opening, ejects by described jack-up part from described brilliant boat.
Optionally, described wafer slice getting device also comprises one for controlling the control unit that described jack-up part moves successively, and described control unit is positioned at described main body.
Optionally, described wafer slice getting device also comprises the multiple pressure responsive element for responding to described jack-up part pressure, described multiple pressure responsive element and described multiple jack-up part one_to_one corresponding, when the pressure that described pressure responsive element senses on corresponding described jack-up part is zero, corresponding described jack-up part playback.
Optionally, described pressure responsive element is connected with described control unit, and when the pressure on last described jack-up part is zero, described control unit controls the motion of next jack-up part.
Optionally, described wafer slice getting device also comprises the beginning switch that the described brake mechanism of a control is started working, and described beginning switch connects described control unit.
Optionally, described main body comprises the side of an end face and described end face side, and described brilliant boat fixed mount and then described beginning switch are all positioned at the end face of described main body.
Optionally, described wafer slice getting device also comprises one for controlling the mains switch of described wafer slice getting device energising, and described mains switch connects described control unit.
Optionally, described main body comprises the side of an end face and described end face side, and described brilliant boat fixed mount is positioned at the end face of described main body, and described mains switch is positioned on the side of described main body.
Optionally, the placed side of described brilliant boat also has bracing frame, described brilliant boat fixed mount has the brilliant boat draw-in groove corresponding with support frame as described above.
Optionally, described brilliant boat fixed mount has the supporting surface of the described brilliant boat of a support, the mating shapes of described supporting surface and described placed side.
Optionally, described wafer slice getting device also comprises multiple wafer draw-in groove for holding described wafer, and wafer draw-in groove described in each connects a described jack-up part.
Optionally, the groove depth of described wafer draw-in groove is 2mm ~ 4mm.
Optionally, described brake mechanism comprises a motor, a gear and a connection chain, and described motor drives described pinion rotation by described connection chain.
Optionally, described jack-up part comprises a push rod, and described push rod has the screw thread matched with described gear, and described in described gear driven, push rod moves.
Compared with prior art, the wafer slice getting device that the utility model provides has the following advantages:
In the wafer slice getting device that the utility model provides, described wafer slice getting device comprises: main body, brilliant boat fixed mount, chip select button, brake mechanism, jack-up part, when the wafer in brilliant boat need be taken out, described brilliant boat is fixed on described brilliant boat fixed mount, when to choose with the described wafer that need take out to corresponding described chip select button, corresponding described brake mechanism drives corresponding described jack-up part motion, described jack-up part is through described opening, the described wafer of correspondence is ejected, and then with suction pen, the wafer ejected is taken away, described brilliant boat will do not stretched into by described suction pen, thus avoid the front of wafer described in scratch, and the mistake of getting wrong sheet can be avoided, be of value to simultaneously and shorten the operating time.
Accompanying drawing explanation
Fig. 1 is the stereogram of wafer slice getting device when fixing brilliant boat in the utility model one embodiment;
Fig. 2 is the schematic diagram of brilliant boat in the utility model one embodiment;
Fig. 3 is the internal structure schematic diagram of wafer slice getting device in the utility model one embodiment;
Fig. 4 is the left view of wafer slice getting device when fixing brilliant boat in the utility model one embodiment;
Fig. 5 is the left view of wafer slice getting device when jack-up part ejects wafer in the utility model one embodiment.
Embodiment
Below in conjunction with schematic diagram, wafer slice getting device of the present utility model is described in more detail, which show preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
In order to clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, a large amount of implementation detail must be made to realize the specific objective of developer, such as, according to regarding system or the restriction about business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, more specifically the utility model is described by way of example with reference to accompanying drawing.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, a kind of wafer slice getting device is provided, for wafer being taken out from brilliant boat, described brilliant boat is for placing multiple described wafer, the placed side that described brilliant boat has wafer conveying end and is oppositely arranged with described wafer conveying end, described placed side has an opening, described wafer slice getting device comprises: main body; For the brilliant boat fixed mount of fixing described brilliant boat, described brilliant boat fixed mount connects described main body; With described multiple wafer multiple chip select button one to one; With described multiple chip select button multiple brake mechanism one to one, described brake mechanism is positioned at described main body; With described multiple brake mechanism multiple jack-up part one to one, described jack-up part is just to described opening.
When the wafer in brilliant boat need be taken out, described brilliant boat is fixed on described brilliant boat fixed mount, when to choose with the described wafer that need take out to corresponding described chip select button, corresponding described brake mechanism drives corresponding described jack-up part motion, described jack-up part is through described opening, the described wafer of correspondence is ejected, and then with suction pen, the wafer ejected is taken away, described brilliant boat will do not stretched into by described suction pen, thus avoid the front of wafer described in scratch, and the mistake of getting wrong sheet can be avoided, be of value to simultaneously and shorten the operating time.
Wafer slice getting device in the present embodiment is described below in conjunction with Fig. 1-Fig. 5.Wherein, Fig. 1 is the stereogram of wafer slice getting device when fixing brilliant boat in the utility model one embodiment; Fig. 2 is the schematic diagram of brilliant boat in the utility model one embodiment; Fig. 3 is the internal structure schematic diagram of wafer slice getting device in the utility model one embodiment; Fig. 4 is the left view of wafer slice getting device when fixing brilliant boat in the utility model one embodiment; Fig. 5 is the left view of wafer slice getting device when jack-up part ejects wafer in the utility model one embodiment.
As shown in Figure 1, described wafer slice getting device comprises a main body 200, and described main body is provided with one for the brilliant boat fixed mount 210 of fixing brilliant boat 10, described brilliant boat 10 is equipped with multiple wafer 19, and such as described brilliant boat 10 can be equipped with 25 wafer 19.As shown in Figure 2, described brilliant boat 10 has wafer conveying end 11 and placed side 12, and described wafer conveying end 11 is oppositely arranged with placed side 12, and described wafer conveying end 11 is for picking and placeing described wafer 19.In the present embodiment, described placed side 12 is arcwall face, to mate the radian of described wafer 19, described placed side 12 has an opening 13, and the placed side 12 of described brilliant boat 10 also has bracing frame 14, and support frame as described above 14 is in order to support described brilliant boat 10.
As shown in Figure 1, in the present embodiment, described main body 200 comprises the side 202 of an end face 201 and described end face 201 side, and described brilliant boat fixed mount 210 is positioned at the end face 201 of described main body.As shown in Figure 3, preferably, described brilliant boat fixed mount 210 has the brilliant boat draw-in groove 211 corresponding with support frame as described above 14, as shown in Figure 4, when described brilliant boat 10 is positioned on described wafer slice getting device 1, support frame as described above 14 snaps in described brilliant boat draw-in groove 211, with fixing described brilliant boat 10, prevents described brilliant boat 10 from rocking on described wafer slice getting device 1.Preferably, described brilliant boat fixed mount 210 has the supporting surface 212 of the described brilliant boat 10 of a support, the mating shapes of described supporting surface 212 and described placed side 12, in the present embodiment, described supporting surface 212 is cambered surface, as shown in Figure 4, when being positioned on described wafer slice getting device 1 by described brilliant boat 10, described supporting surface supports described placed side 12.
As shown in Figure 1, described wafer slice getting device 1 has and multiple chip select button 220, described multiple chip select button 220 and described multiple wafer 19 one_to_one corresponding, in the present embodiment, have 25 described chip select buttons 220.In FIG, described chip select button 220 is positioned in described main body 200, and is arranged in two row on first direction X, and to save space, in other embodiment of the present utility model, described chip select button 220 can also have other arrangement mode, does not repeat one by one at this.
Described wafer slice getting device 1 also comprises and described multiple chip select button 220 multiple brake mechanism one to one, and comprises and described multiple brake mechanism multiple jack-up part one to one, and described brake mechanism is positioned at described main body 200.As shown in Figure 4, in the present embodiment, a described brake mechanism 230 comprises motor 231, gear 232 and a connection chain 233, and described motor 231 drives described gear 232 to rotate by described connection chain 233.Described jack-up part 240 is push rod, and described push rod 240 has the screw thread 241 matched with described gear 232, and described gear 232 rotates, and described gear 232 is engaged described screw thread 241, thus drives described push rod 240 to move to move on second direction Z.Wherein, described jack-up part 242 is just to described opening 13, and to facilitate described jack-up part 242 through described opening 13, and wafer 19 described in jack-up, described opening 13 exposes all described wafers 19.
Preferably, as shown in Figure 3, described wafer slice getting device 1 also comprises multiple wafer draw-in groove 242, described multiple wafer draw-in groove 242 and described multiple wafer 19 one_to_one corresponding, in the present embodiment, described wafer slice getting device 1 comprises 25 wafer draw-in grooves 242, in the present embodiment, described wafer draw-in groove 242 is positioned at one end of described jack-up part 240, when described jack-up part 240 jack-up, described wafer draw-in groove 242, for holding described wafer 19, prevents described wafer 19 from rocking.As shown in Figure 3, the shape of wafer 19 described in the form fit of described wafer draw-in groove 242, the cross section of described wafer draw-in groove 242 is grooved, and this is what it will be appreciated by those skilled in the art that, and therefore not to repeat here.Preferably, the groove depth of described wafer draw-in groove 242 is 2mm ~ 4mm, is preferably 2.5mm, 3mm, 3.5mm etc., can blocks described wafer 19, can not damage again the chip (die) of described wafer.
In the present embodiment, described wafer slice getting device 1 has 25 brake mechanisms and 25 jack-up parts, in order to clearly the present embodiment is described, only depict a described brake mechanism 230 and a described jack-up part 240 in the diagram, according to the foregoing description of the present embodiment, described in other, the structure of brake mechanism 230 and jack-up part 240 is what those having ordinary skill in the art will appreciate that, and therefore not to repeat here.
Preferably, as shown in Figure 3, described wafer slice getting device 1 also comprises one for controlling the control unit 250 that described jack-up part 240 moves successively, described control unit 250 can be MCU(micro-control unit) etc., described control unit 250 is positioned at described main body, in the present embodiment, described control unit 250 connects described chip select button 220 and brake mechanism 230 respectively, when pressing described chip select button 220, chip select information transmission is given described control unit 250 by described chip select button 220, and described control unit 250 controls corresponding described brake mechanism 230 and works.In addition, described control unit 250 can also control the jack-up height of described jack-up part 240.
In addition, described wafer slice getting device 1 can also comprise the multiple pressure responsive element 260 for responding to described jack-up part 240 pressure, described multiple pressure responsive element 260 and described multiple jack-up part 240 one_to_one corresponding, described pressure responsive element 260 can be positioned at one end of described jack-up part 240, in the present embodiment, described pressure responsive element 260 is positioned on described wafer draw-in groove 242, to facilitate induction pressure, when the pressure that described pressure responsive element 260 senses on corresponding described jack-up part 240 is zero (the described wafer 19 of described jack-up part 240 correspondence is removed), corresponding described jack-up part 240 playbacks.
Preferably, described pressure responsive element 260 is connected with described control unit 250, with the playback and the jack-up order that facilitate described control unit 250 to control described jack-up part 240, when the pressure on last described jack-up part 240 is zero, described control unit 240 controls next jack-up part 240 and moves, to make once only there is wafer 19 described in a slice by jack-up, conveniently get described wafer 19.
As shown in Figure 3, described wafer slice getting device 1 can also comprise beginning switch that the described brake mechanism of a control 230 starts working 270 and for controlling the mains switch 280 of described wafer slice getting device 1 energising, and described beginning switch 270 and mains switch 280 all connect described control unit 250.Described beginning switch 270 is positioned at the end face 201 of described main body 200, and described mains switch 280 is positioned on the side 202 of described main body 200, to prevent from touching by described mains switch 280 during described wafer 19 landing.
In the present embodiment, when the wafer 19 in brilliant boat 10 need be taken out, described brilliant boat 19 is fixed on described brilliant boat fixed mount 210, open described mains switch 280, described wafer slice getting device 1 is energized, and starts working, choose with the described wafer 19 that need take out to corresponding described chip select button 220, such as, as shown in Figure 1, need to take out first wafer 19a and the second wafer 19b:
First, press two the described chip select buttons 220 corresponding with described first wafer 19a, described control unit 250 controls the described brake mechanism 230 corresponding with first wafer 19a and works, described brake mechanism 230 drives corresponding described jack-up part 240 to move, as shown in Figure 5, first wafer 19a, through described opening 13, ejects by described jack-up part 240, and then is taken away by the first wafer 19a ejected with suction pen;
The described pressure responsive element 260 corresponding with first wafer 19a senses that first wafer 19a is removed, this information is passed to described control unit 250 by described pressure responsive element 260, described control unit 250 controls the described jack-up part 240 corresponding with first wafer 19a and playbacks, and the control described brake mechanism 230 corresponding with the second wafer 19b works, described brake mechanism 230 drives corresponding described jack-up part 240 to move, described jack-up part 240 is through described opening 13, second wafer 19b is ejected, and then with suction pen, the second wafer 19b ejected is taken away,
The described pressure responsive element 260 corresponding with the second wafer 19b senses that the second wafer 19b is removed, this information is passed to described control unit 250 by described pressure responsive element 260, and described control unit 250 controls the described jack-up part 240 corresponding with the second wafer 19b and playbacks.
In the present embodiment, the orientation of described wafer 19 is first direction X, and the moving direction of described push rod 240 is second direction Z, and the bearing of trend of described jack-up part 240 is third direction Y, and described first direction X, second direction Z, third direction Y are mutually vertical.
Preferred embodiment of the present utility model is described above, but, be not limited to above-mentioned scope of disclosure, such as: described brilliant boat fixed mount 210 is not limited to the placed side 12 supporting described brilliant boat 10, described brilliant boat fixed mount 210 can also be clip, clamp the brilliant boat side 15 of described brilliant boat 10, with fixing described brilliant boat 10, also within thought range of the present utility model; Certainly, described brake mechanism 230 drives the mode of described jack-up part 240 to be also not limited to gear and screw thread, as long as the structure of described brake mechanism 230 can drive described jack-up part 240 to move, also within thought range of the present utility model, do not enumerate at this.
Obviously, those skilled in the art can carry out various change and modification to the utility model and not depart from spirit and scope of the present utility model.Like this, if these amendments of the present utility model and modification belong within the scope of the utility model claim and equivalent technologies thereof, then the utility model is also intended to comprise these change and modification.
Claims (14)
1. a wafer slice getting device, for wafer being taken out from brilliant boat, described brilliant boat is for placing multiple described wafer, the placed side that described brilliant boat has wafer conveying end and is oppositely arranged with described wafer conveying end, described placed side has an opening, it is characterized in that, described wafer slice getting device comprises:
Main body;
For the brilliant boat fixed mount of fixing described brilliant boat, described brilliant boat fixed mount connects described main body;
With described multiple wafer multiple chip select button one to one;
With described multiple chip select button multiple brake mechanism one to one, described brake mechanism is positioned at described main body; And
With described multiple brake mechanism multiple jack-up part one to one, described jack-up part is just to described opening;
In elected during at least one described chip select button, corresponding described brake mechanism drives corresponding described jack-up part motion, and the described wafer of correspondence, through described opening, ejects by described jack-up part from described brilliant boat.
2. wafer slice getting device as claimed in claim 1, it is characterized in that, described wafer slice getting device also comprises one for controlling the control unit that described jack-up part moves successively, and described control unit is positioned at described main body.
3. wafer slice getting device as claimed in claim 2, it is characterized in that, described wafer slice getting device also comprises the multiple pressure responsive element for responding to described jack-up part pressure, described multiple pressure responsive element and described multiple jack-up part one_to_one corresponding, when the pressure that described pressure responsive element senses on corresponding described jack-up part is zero, corresponding described jack-up part playback.
4. wafer slice getting device as claimed in claim 3, it is characterized in that, described pressure responsive element is connected with described control unit, and when the pressure on last described jack-up part is zero, described control unit controls the motion of next jack-up part.
5. wafer slice getting device as claimed in claim 2, it is characterized in that, described wafer slice getting device also comprises the beginning switch that the described brake mechanism of a control is started working, and described beginning switch connects described control unit.
6. wafer slice getting device as claimed in claim 5, it is characterized in that, described main body comprises the side of an end face and described end face side, and described brilliant boat fixed mount and described beginning switch are all positioned at the end face of described main body.
7. wafer slice getting device as claimed in claim 2, is characterized in that, described wafer slice getting device also comprises one for controlling the mains switch of described wafer slice getting device energising, and described mains switch connects described control unit.
8. wafer slice getting device as claimed in claim 7, it is characterized in that, described main body comprises the side of an end face and described end face side, and described brilliant boat fixed mount is positioned at the end face of described main body, and described mains switch is positioned on the side of described main body.
9. wafer slice getting device as claimed in claim 1, it is characterized in that the placed side of described brilliant boat also has bracing frame, described brilliant boat fixed mount has the brilliant boat draw-in groove corresponding with support frame as described above.
10. wafer slice getting device as claimed in claim 9, it is characterized in that, described brilliant boat fixed mount has the supporting surface of the described brilliant boat of a support, the mating shapes of described supporting surface and described placed side.
11., as the wafer slice getting device in claim 1 to 10 as described in any one, is characterized in that, described wafer slice getting device also comprises multiple wafer draw-in groove for holding described wafer, and wafer draw-in groove described in each connects a described jack-up part.
12. wafer slice getting devices as claimed in claim 11, is characterized in that, the groove depth of described wafer draw-in groove is 2mm ~ 4mm.
13., as the wafer slice getting device in claim 1 to 10 as described in any one, is characterized in that, described brake mechanism comprises a motor, a gear and a connection chain, and described motor drives described pinion rotation by described connection chain.
14. wafer slice getting devices as claimed in claim 13, it is characterized in that, described jack-up part comprises a push rod, and described push rod has the screw thread matched with described gear, and described in described gear driven, push rod moves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520007862.7U CN204289420U (en) | 2015-01-07 | 2015-01-07 | Wafer slice getting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520007862.7U CN204289420U (en) | 2015-01-07 | 2015-01-07 | Wafer slice getting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204289420U true CN204289420U (en) | 2015-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520007862.7U Expired - Fee Related CN204289420U (en) | 2015-01-07 | 2015-01-07 | Wafer slice getting device |
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| CN (1) | CN204289420U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109216247A (en) * | 2018-08-23 | 2019-01-15 | 广东利扬芯片测试股份有限公司 | Wafer separating system and its sharding method |
| CN111554599A (en) * | 2020-04-27 | 2020-08-18 | 厦门通富微电子有限公司 | Tool for bearing wafer material box, wafer material box device and method for loading wafer |
-
2015
- 2015-01-07 CN CN201520007862.7U patent/CN204289420U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109216247A (en) * | 2018-08-23 | 2019-01-15 | 广东利扬芯片测试股份有限公司 | Wafer separating system and its sharding method |
| CN109216247B (en) * | 2018-08-23 | 2021-01-05 | 广东利扬芯片测试股份有限公司 | Wafer slicing system and slicing method thereof |
| CN111554599A (en) * | 2020-04-27 | 2020-08-18 | 厦门通富微电子有限公司 | Tool for bearing wafer material box, wafer material box device and method for loading wafer |
| CN111554599B (en) * | 2020-04-27 | 2022-07-26 | 厦门通富微电子有限公司 | Tool for bearing wafer material box, wafer material box device and method for loading wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20190107 |