CN110023837A - 感光性元件、抗蚀图案的形成方法及印刷布线板的制造方法 - Google Patents
感光性元件、抗蚀图案的形成方法及印刷布线板的制造方法 Download PDFInfo
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- CN110023837A CN110023837A CN201680091251.2A CN201680091251A CN110023837A CN 110023837 A CN110023837 A CN 110023837A CN 201680091251 A CN201680091251 A CN 201680091251A CN 110023837 A CN110023837 A CN 110023837A
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- 239000011976 maleic acid Substances 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- DNXIASIHZYFFRO-UHFFFAOYSA-N pyrazoline Chemical compound C1CN=NC1 DNXIASIHZYFFRO-UHFFFAOYSA-N 0.000 description 1
- 150000003219 pyrazolines Chemical class 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/085893 WO2018100730A1 (fr) | 2016-12-02 | 2016-12-02 | Élément photosensible, procédé de formation d'un motif de réserve et procédé de production de carte à câblage imprimé |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110023837A true CN110023837A (zh) | 2019-07-16 |
Family
ID=62242060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680091251.2A Pending CN110023837A (zh) | 2016-12-02 | 2016-12-02 | 感光性元件、抗蚀图案的形成方法及印刷布线板的制造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2018100730A1 (fr) |
KR (1) | KR20190082258A (fr) |
CN (1) | CN110023837A (fr) |
WO (1) | WO2018100730A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022102101A1 (fr) * | 2020-11-13 | 2022-05-19 | 昭和電工マテリアルズ株式会社 | Élément photosensible, procédé de production d'article durci, procédé de production d'un motif d'article durci, et procédé de production de carte de câblage |
CN116830038A (zh) | 2021-01-29 | 2023-09-29 | 旭化成株式会社 | 感光性元件和抗蚀图案的形成方法 |
KR20240093985A (ko) | 2022-02-03 | 2024-06-24 | 후지필름 가부시키가이샤 | 폴리에스터 필름의 제조 방법, 폴리에스터 필름, 드라이 필름 레지스트, 및, 박리 필름 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101600995A (zh) * | 2007-01-31 | 2009-12-09 | 日立化成工业株式会社 | 感光性元件 |
WO2010013623A1 (fr) * | 2008-07-31 | 2010-02-04 | 日立化成工業株式会社 | Élément photosensible, procédé de formation de motif de réserve utilisant celui-ci, et procédé de fabrication de carte imprimée |
CN102331684A (zh) * | 2010-07-13 | 2012-01-25 | 日立化成工业株式会社 | 感光性元件、抗蚀图案的形成方法、印刷电路布线板的制造方法及印刷电路布线板 |
JP2012037872A (ja) * | 2010-07-13 | 2012-02-23 | Hitachi Chem Co Ltd | 感光性エレメント、それを用いたレジストパターンの形成方法、プリント配線板の製造方法及びプリント配線板 |
CN103261966A (zh) * | 2010-12-16 | 2013-08-21 | 日立化成株式会社 | 感光性元件、抗蚀图案的形成方法以及印刷布线板的制造方法 |
CN104834184A (zh) * | 2014-02-12 | 2015-08-12 | 日立化成株式会社 | 感光性元件 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001013681A (ja) | 1999-06-28 | 2001-01-19 | Hitachi Chem Co Ltd | 感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
JP2007264483A (ja) * | 2006-03-29 | 2007-10-11 | Fujifilm Corp | パターン形成材料及びパターン形成方法 |
JP5412039B2 (ja) * | 2008-02-06 | 2014-02-12 | 日立化成株式会社 | 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法 |
JP2014074764A (ja) | 2012-10-03 | 2014-04-24 | Hitachi Chemical Co Ltd | 感光性エレメント及びこれを用いたレジストパターンの形成方法、プリント配線板の製造方法 |
JP6267602B2 (ja) * | 2014-08-19 | 2018-01-24 | 新光電気工業株式会社 | レジストパターン形成方法及び配線基板の製造方法 |
JP6432283B2 (ja) * | 2014-10-31 | 2018-12-05 | 東レ株式会社 | ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム |
-
2016
- 2016-12-02 JP JP2018553617A patent/JPWO2018100730A1/ja active Pending
- 2016-12-02 KR KR1020197015574A patent/KR20190082258A/ko not_active IP Right Cessation
- 2016-12-02 CN CN201680091251.2A patent/CN110023837A/zh active Pending
- 2016-12-02 WO PCT/JP2016/085893 patent/WO2018100730A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101600995A (zh) * | 2007-01-31 | 2009-12-09 | 日立化成工业株式会社 | 感光性元件 |
WO2010013623A1 (fr) * | 2008-07-31 | 2010-02-04 | 日立化成工業株式会社 | Élément photosensible, procédé de formation de motif de réserve utilisant celui-ci, et procédé de fabrication de carte imprimée |
CN102331684A (zh) * | 2010-07-13 | 2012-01-25 | 日立化成工业株式会社 | 感光性元件、抗蚀图案的形成方法、印刷电路布线板的制造方法及印刷电路布线板 |
JP2012037872A (ja) * | 2010-07-13 | 2012-02-23 | Hitachi Chem Co Ltd | 感光性エレメント、それを用いたレジストパターンの形成方法、プリント配線板の製造方法及びプリント配線板 |
CN103261966A (zh) * | 2010-12-16 | 2013-08-21 | 日立化成株式会社 | 感光性元件、抗蚀图案的形成方法以及印刷布线板的制造方法 |
CN104834184A (zh) * | 2014-02-12 | 2015-08-12 | 日立化成株式会社 | 感光性元件 |
Also Published As
Publication number | Publication date |
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KR20190082258A (ko) | 2019-07-09 |
WO2018100730A1 (fr) | 2018-06-07 |
JPWO2018100730A1 (ja) | 2019-10-17 |
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