JPWO2018100730A1 - 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法 - Google Patents

感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法 Download PDF

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Publication number
JPWO2018100730A1
JPWO2018100730A1 JP2018553617A JP2018553617A JPWO2018100730A1 JP WO2018100730 A1 JPWO2018100730 A1 JP WO2018100730A1 JP 2018553617 A JP2018553617 A JP 2018553617A JP 2018553617 A JP2018553617 A JP 2018553617A JP WO2018100730 A1 JPWO2018100730 A1 JP WO2018100730A1
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JP
Japan
Prior art keywords
support film
layer
photosensitive
photosensitive layer
photosensitive element
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Pending
Application number
JP2018553617A
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English (en)
Japanese (ja)
Inventor
壮和 粂
壮和 粂
遼 松村
遼 松村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corporation
Showa Denko Materials Co Ltd
Original Assignee
Resonac Corporation
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corporation, Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Resonac Corporation
Publication of JPWO2018100730A1 publication Critical patent/JPWO2018100730A1/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2018553617A 2016-12-02 2016-12-02 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法 Pending JPWO2018100730A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/085893 WO2018100730A1 (fr) 2016-12-02 2016-12-02 Élément photosensible, procédé de formation d'un motif de réserve et procédé de production de carte à câblage imprimé

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020182659A Division JP2021015296A (ja) 2020-10-30 2020-10-30 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2018100730A1 true JPWO2018100730A1 (ja) 2019-10-17

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JP2018553617A Pending JPWO2018100730A1 (ja) 2016-12-02 2016-12-02 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法

Country Status (4)

Country Link
JP (1) JPWO2018100730A1 (fr)
KR (1) KR20190082258A (fr)
CN (1) CN110023837A (fr)
WO (1) WO2018100730A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022102101A1 (fr) * 2020-11-13 2022-05-19 昭和電工マテリアルズ株式会社 Élément photosensible, procédé de production d'article durci, procédé de production d'un motif d'article durci, et procédé de production de carte de câblage
CN116830038A (zh) 2021-01-29 2023-09-29 旭化成株式会社 感光性元件和抗蚀图案的形成方法
KR20240093985A (ko) 2022-02-03 2024-06-24 후지필름 가부시키가이샤 폴리에스터 필름의 제조 방법, 폴리에스터 필름, 드라이 필름 레지스트, 및, 박리 필름

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007264483A (ja) * 2006-03-29 2007-10-11 Fujifilm Corp パターン形成材料及びパターン形成方法
WO2008093643A1 (fr) * 2007-01-31 2008-08-07 Hitachi Chemical Company, Ltd. Elément photosensible
JP2009186780A (ja) * 2008-02-06 2009-08-20 Hitachi Chem Co Ltd 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法
JP2015166866A (ja) * 2014-02-12 2015-09-24 日立化成株式会社 感光性エレメント

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001013681A (ja) 1999-06-28 2001-01-19 Hitachi Chem Co Ltd 感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP5223923B2 (ja) * 2008-07-31 2013-06-26 日立化成株式会社 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法
JP5768521B2 (ja) * 2010-07-13 2015-08-26 日立化成株式会社 感光性エレメント、それを用いたレジストパターンの形成方法及びプリント配線板の製造方法
CN106918991A (zh) * 2010-07-13 2017-07-04 日立化成工业株式会社 感光性元件、抗蚀图案的形成方法、印刷电路布线板的制造方法及印刷电路布线板
JP5573961B2 (ja) * 2010-12-16 2014-08-20 日立化成株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2014074764A (ja) 2012-10-03 2014-04-24 Hitachi Chemical Co Ltd 感光性エレメント及びこれを用いたレジストパターンの形成方法、プリント配線板の製造方法
JP6267602B2 (ja) * 2014-08-19 2018-01-24 新光電気工業株式会社 レジストパターン形成方法及び配線基板の製造方法
JP6432283B2 (ja) * 2014-10-31 2018-12-05 東レ株式会社 ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007264483A (ja) * 2006-03-29 2007-10-11 Fujifilm Corp パターン形成材料及びパターン形成方法
WO2008093643A1 (fr) * 2007-01-31 2008-08-07 Hitachi Chemical Company, Ltd. Elément photosensible
JP2009186780A (ja) * 2008-02-06 2009-08-20 Hitachi Chem Co Ltd 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法
JP2015166866A (ja) * 2014-02-12 2015-09-24 日立化成株式会社 感光性エレメント

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CN110023837A (zh) 2019-07-16
KR20190082258A (ko) 2019-07-09
WO2018100730A1 (fr) 2018-06-07

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