CN109181558A - 预固化焊接胶工艺 - Google Patents
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Abstract
本发明属于电子元器件制造技术领域,涉及一种预固化焊接胶工艺,步骤包括将焊接胶在‑20℃的温度下冷冻;将焊接胶取出并在25℃的温度下放置2小时,变成粘性适中的流体;将焊接胶流体注入点胶设备;以0.6±0.05mg/s的速度点在长度20±1mm的产品涂胶缝上;在50~70℃温度下烘烤;在高温下进行热压,使焊接胶完全固化;将热压完毕的产品下料包装。本工艺能够充分利用胶水特性,通过点胶、烘烤、热压等手段实现了高强度粘结的效果与高频性导通紧密结合。
Description
技术领域
本发明涉及电子元器件制造技术领域,特别涉及一种预固化焊接胶工艺。
背景技术
随着电子行业迅速发展,在一些电子产品PCB与FPC连接上,为了提高连接处强度及溢胶,一般都会使用一种热熔胶粘结,还需要具备方便操作便捷性。然而传统的方法都会使用一种热熔胶,热熔胶高频性导通较差及粘结处会产生空洞不易控制,容易脱落,特别是性能效果较差,容易造成高频性衰竭。
随着电子技术的迅速发展焊接技术的普及使用,现在越来越多的电子产品为了节约组装空间,为了更好的固定并保护高频性导通效果,一般都会使用导通性比较好的锡膏及粘性比较强的胶水组合成焊接胶,也就是将焊料颗粒分散在胶水当中,制成一种各向异性的导电料浆。但是目前市面上的焊接胶粘结强度不够高,电阻高且极端条件下易短路。
在我们的光学式指纹模组产品中要求0.1mm的胶区宽度下有3kgF的剥离强度和5Ω以下的阻抗。为了达到这个要求,预固化是控制粘结质量可靠性的关键,粘结轮廓是高效的高强度预固化工艺具有重要价值,同时通过增加深度处理工艺实现回用以减少对FPC与PCB的粘合及导通具有重要意义。
发明内容
本发明的主要目的在于提供一种预固化焊接胶工艺,其能够对胶水进行预固化,防止在搬运时泼洒以及粘连后飞溅形成空洞。
本发明通过如下技术方案实现上述目的:一种预固化焊接胶工艺,步骤包括:
①冷藏:将焊接胶在-20℃的温度下冷冻;
②回温:将焊接胶取出并在25℃的温度下放置2小时,变成粘性适中的流体;
③上料:将焊接胶流体注入点胶设备;
④点胶:以0.6±0.05mg/s的速度点在长度20±1mm的产品涂胶缝上;
⑤烘烤:在50~70℃温度下烘烤;
⑥热压:在高温下进行热压,使焊接胶完全固化;
⑦下料:将热压完毕的产品下料包装。
具体的,所述步骤④的点胶时间为10s。
具体的,所述步骤⑤的烘烤时间为10~36s。
具体的,所述步骤⑥的热压温度为190~230℃。
具体的,所述焊接胶配方按质量比包括5~15%的锡、10~20%铋、5~15%的萘环氧、10~20%改性丙烯酸树脂、1~3%的酚醛树脂、0.5~1.5%的煅制氧化硅、0.5~1.5%的己二酸、0.1~0.5%的硅烷偶联剂、5~15%的硬化剂以及余量的环氧树脂。
采用上述技术方案,本发明技术方案的有益效果是:
本工艺能够充分利用胶水特性,通过点胶、烘烤、热压等手段实现了高强度粘结的效果与高频性导通紧密结合。
附图说明
图1为实施例预固化焊接胶工艺的流程图。
具体实施方式
如图1所示,一种预固化焊接胶工艺,步骤包括:
①冷藏:将焊接胶在-20℃的温度下冷冻;
②回温:将焊接胶取出并在25℃的温度下放置2小时,变成粘性适中的流体;
③上料:将焊接胶流体注入点胶设备;
④点胶:以0.6±0.05mg/s的速度点在长度20±1mm的产品涂胶缝上;
⑤烘烤:在50~70℃温度下烘烤;
⑥热压:在高温下进行热压,使焊接胶完全固化;
⑦下料:将热压完毕的产品下料包装。
这里的焊接胶是一种本公司自主开发的高导电焊接胶,配方按质量比包括5~15%的锡、10~20%铋、5~15%的萘环氧、10~20%改性丙烯酸树脂、1~3%的酚醛树脂、0.5~1.5%的煅制氧化硅、0.5~1.5%的己二酸、0.1~0.5%的硅烷偶联剂、5~15%的硬化剂以及余量的环氧树脂。
下面结合具体实施例对本发明作进一步详细说明。
实施例1-10:
按照表1的条件进行产品处理,并以非预固化工艺得到的产品作为对照例进行剥离强度、阻抗和宽度检测,上胶宽度不超过0.1mm表示通过:
表1
由表1可知,采用本工艺获得的电子产品能够实现0.1mm超细电极距的要求;而且剥离强度完全达到3kgF的标准要求,甚至达到6kgF以上;同时阻抗更低于5Ω的设计要求,甚至达到2.4Ω。说明本工艺可以完全达到导电结构要求、连接要求和导电要求。
本发明的特点在于将液体胶水通过预固化转化为半凝固状态,利于搬运不泼洒,能够充分填充,有利于粘连结合,不飞溅,完全结合无空洞,最小可以填充0.1mm电极距,避免了对PCB与FPC电极处产生空洞造成粘结强度效果差的难题,同时结合预固化工艺能够对PCB和FPC实现高频性导通,此外还能充分发挥高强度粘结的优势,有利于实现预固化工艺的正常运行,保证粘结强度达标或满足高频性导通。预固化工艺能够充分利用胶水特性,通过点胶、烘烤、热压等手段实现了高强度粘结的效果与高频性导通紧密结合。
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。
Claims (5)
1.一种预固化焊接胶工艺,其特征在于步骤包括:
①冷藏:将焊接胶在-20℃的温度下冷冻;
②回温:将焊接胶取出并在25℃的温度下放置2小时,变成粘性适中的流体;
③上料:将焊接胶流体注入点胶设备;
④点胶:以0.6±0.05mg/s的速度点在长度20±1mm的产品涂胶缝上;
⑤烘烤:在50~70℃温度下烘烤;
⑥热压:在高温下进行热压,使焊接胶完全固化;
⑦下料:将热压完毕的产品下料包装。
2.根据权利要求1所述的工艺,其特征在于:所述步骤④的点胶时间为10s。
3.根据权利要求1所述的工艺,其特征在于:所述步骤⑤的烘烤时间为10~36s。
4.根据权利要求1所述的工艺,其特征在于:所述步骤⑥的热压温度为190~230℃。
5.根据权利要求1所述的工艺,其特征在于:所述焊接胶配方按质量比包括5~15%的锡、10~20%铋、5~15%的萘环氧、10~20%改性丙烯酸树脂、1~3%的酚醛树脂、0.5~1.5%的煅制氧化硅、0.5~1.5%的己二酸、0.1~0.5%的硅烷偶联剂、5~15%的硬化剂以及余量的环氧树脂。
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