CN109181558A - Adhesive process is welded in precuring - Google Patents
Adhesive process is welded in precuring Download PDFInfo
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- CN109181558A CN109181558A CN201810932463.XA CN201810932463A CN109181558A CN 109181558 A CN109181558 A CN 109181558A CN 201810932463 A CN201810932463 A CN 201810932463A CN 109181558 A CN109181558 A CN 109181558A
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- Prior art keywords
- solder paste
- temperature
- hot pressing
- precuring
- technique according
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to electronic component manufacturing technology field, be related to a kind of precuring welding adhesive process, step include by solder paste -20 DEG C at a temperature of freeze；By solder paste take out and 25 DEG C at a temperature of place 2 hours, become the moderate fluid of viscosity；By solder paste fluid injection point gluing equipment；Product gluing with the speed point of 0.6 ± 0.05mg/s in 20 ± 1mm of length is sewed on；It is toasted at a temperature of 50~70 DEG C；Hot pressing is carried out at high temperature, and solder paste is fully cured；The product blanking packaging that hot pressing is finished.This technique can make full use of glue property, is connected and is combined closely with high frequency by the effect that the means such as dispensing, baking, hot pressing realize high strength bond.
Description
Technical field
The present invention relates to electronic component manufacturing technology field, in particular to adhesive process is welded in a kind of precuring.
Background technique
As electronics industry rapidly develops, it is connect in some electronic product PCB with FPC, in order to improve junction intensity
And excessive glue, generally can all a kind of hot melt adhesive be used to bond, it is also necessary to have and facilitate operation convenience.However traditional method all can
Using a kind of hot melt adhesive, the poor and bonding part of hot melt adhesive high frequency conducting can generate cavity and be difficult to control, and be easy to fall off, especially
The impact of performance is poor, be easy to cause high frequency sexual exhaustion.
With the universal use of the rapid development welding technique of electronic technology, more and more electronic products are now in order to save
About assembling space, in order to preferably fix and protect high frequency turn-on effect, the tin cream that generally can all use conduction relatively good
And the stronger glue of viscosity is combined into solder paste, that is, solder grain is dispersed in glue, and one kind is made respectively to different
The conductive slurry of property.But solder paste adhesion strength at present on the market is not high enough, easily short circuit under resistance height and extreme condition.
There is the peel strength and 5 of 3kgF under the glue sector width for requiring 0.1mm in our optical fingerprint mould set product
Ω impedance below.In order to reach this requirement, precuring is the key that control bond quality reliability, and bonding profile is efficient
High-intensitive pre-cure process have important value, while by increase advanced treatment process realize reuse with reduce to FPC with
The bonding and conducting of PCB is of great significance.
Summary of the invention
The main purpose of the present invention is to provide a kind of precuring to weld adhesive process, can carry out precuring to glue,
Prevent carry when splash and adhesion after splash formed cavity.
The present invention is achieved through the following technical solutions above-mentioned purpose: a kind of precuring welding adhesive process, step include:
1. refrigeration: by solder paste -20 DEG C at a temperature of freeze；
2. rising again: by solder paste take out and 25 DEG C at a temperature of place 2 hours, become the moderate fluid of viscosity；
3. feeding: by solder paste fluid injection point gluing equipment；
4. dispensing: the product gluing with the speed point of 0.6 ± 0.05mg/s in 20 ± 1mm of length is sewed on；
5. baking: being toasted at a temperature of 50~70 DEG C；
6. hot pressing: carrying out hot pressing at high temperature, solder paste is fully cured；
7. blanking: the product blanking that hot pressing is finished is packed.
Specifically, the dispensing time of the step 4. is 10s.
Specifically, the baking time of the step 5. is 10~36s.
Specifically, the hot pressing temperature of the step 6. is 190~230 DEG C.
Specifically, it is described welding glue formula include in mass ratio 5~15% tin, 10~20% bismuths, 5~15% naphthalene nucleus
Oxygen, 10~20% acrylic resin modified, 1~3% phenolic resin, 0.5~1.5% fumed silica, 0.5~1.5%
Adipic acid, 0.1~0.5% silane coupling agent, 5~15% curing agent and surplus epoxy resin.
By adopting the above technical scheme, the beneficial effect of technical solution of the present invention is:
This technique can make full use of glue property, realize high strength bond by means such as dispensing, baking, hot pressing
Effect is connected with high frequency and combines closely.
Detailed description of the invention
Fig. 1 is the flow chart that adhesive process is welded in embodiment precuring.
Specific embodiment
As shown in Figure 1, adhesive process is welded in a kind of precuring, step includes:
1. refrigeration: by solder paste -20 DEG C at a temperature of freeze；
2. rising again: by solder paste take out and 25 DEG C at a temperature of place 2 hours, become the moderate fluid of viscosity；
3. feeding: by solder paste fluid injection point gluing equipment；
4. dispensing: the product gluing with the speed point of 0.6 ± 0.05mg/s in 20 ± 1mm of length is sewed on；
5. baking: being toasted at a temperature of 50~70 DEG C；
6. hot pressing: carrying out hot pressing at high temperature, solder paste is fully cured；
7. blanking: the product blanking that hot pressing is finished is packed.
Here solder paste is a kind of highly conductive solder paste of our company's independent development, formula in mass ratio include 5~
15% tin, 10~20% bismuths, 5~15% naphthalene nucleus oxygen, 10~20% acrylic resin modified, 1~3% phenolic resin,
0.5~1.5% fumed silica, 0.5~1.5% adipic acid, 0.1~0.5% silane coupling agent, 5~15% it is hard
The epoxy resin of agent and surplus.
Invention is further described in detail combined with specific embodiments below.
Embodiment 1-10:
Product treatment is carried out according to the condition of table 1, and is shelled using the product that non-pre-cure process obtains as reference examples
From intensity, impedance and width detection, glues width and passes through no more than 0.1mm expression:
Table 1
As shown in Table 1, it can be realized the requirement of the ultra-fine electrode spacing of 0.1mm using the electronic product that this technique obtains；And
The standard requirements of 3kgF, even up to 6kgF or more are fully achieved in peel strength；Impedance simultaneously is more below the design requirement of 5 Ω,
Even up to 2.4 Ω.Illustrate that conductive structure requirement, connection request and conductive requirement can be fully achieved in this technique.
The method have the characteristics that converting half curdled appearance by precuring for liquid glue, do not splash conducive to carrying,
It can be sufficient filling with, be conducive to adhesion combination, do not splash, be completely combined no cavity, minimum can fill 0.1mm electrode spacing, keep away
Exempt to the problem for causing adhesion strength effect difference in cavity is generated at PCB and FPC electrode, it can be right in combination with pre-cure process
PCB and FPC realizes high frequency conducting, furthermore can also give full play to the advantage of high strength bond, be advantageously implemented pre-cure process
Normal operation, guarantee adhesion strength it is up to standard or meet high frequency conducting.Pre-cure process can make full use of glue property, lead to
It crosses the means such as dispensing, baking, hot pressing and realizes the effect of high strength bond and be connected and combine closely with high frequency.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art, not
Under the premise of being detached from the invention design, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.
Claims (5)
1. adhesive process is welded in a kind of precuring, it is characterised in that step includes:
1. refrigeration: by solder paste -20 DEG C at a temperature of freeze；
2. rising again: by solder paste take out and 25 DEG C at a temperature of place 2 hours, become the moderate fluid of viscosity；
3. feeding: by solder paste fluid injection point gluing equipment；
4. dispensing: the product gluing with the speed point of 0.6 ± 0.05mg/s in 20 ± 1mm of length is sewed on；
5. baking: being toasted at a temperature of 50~70 DEG C；
6. hot pressing: carrying out hot pressing at high temperature, solder paste is fully cured；
7. blanking: the product blanking that hot pressing is finished is packed.
2. technique according to claim 1, it is characterised in that: the dispensing time of the step 4. is 10s.
3. technique according to claim 1, it is characterised in that: the baking time of the step 5. is 10~36s.
4. technique according to claim 1, it is characterised in that: the hot pressing temperature of the step 6. is 190~230 DEG C.
5. technique according to claim 1, it is characterised in that: the welding glue formula includes 5~15% in mass ratio
Tin, 10~20% bismuths, 5~15% naphthalene nucleus oxygen, 10~20% acrylic resin modified, 1~3% phenolic resin, 0.5~
1.5% fumed silica, 0.5~1.5% adipic acid, 0.1~0.5% silane coupling agent, 5~15% curing agent with
And the epoxy resin of surplus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810932463.XA CN109181558A (en) | 2018-08-16 | 2018-08-16 | Adhesive process is welded in precuring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810932463.XA CN109181558A (en) | 2018-08-16 | 2018-08-16 | Adhesive process is welded in precuring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109181558A true CN109181558A (en) | 2019-01-11 |
Family
ID=64918068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810932463.XA Pending CN109181558A (en) | 2018-08-16 | 2018-08-16 | Adhesive process is welded in precuring |
Country Status (1)
| Country | Link |
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| CN (1) | CN109181558A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101025796A (en) * | 2006-02-17 | 2007-08-29 | 李树群 | Electronic label reverse packaging process |
| KR20150054188A (en) * | 2013-11-11 | 2015-05-20 | 삼성전기주식회사 | Bonding apparatus |
| CN104650789A (en) * | 2015-02-11 | 2015-05-27 | 武汉轻工大学 | Anisotropic conductive adhesive and packaging method |
| CN104718234A (en) * | 2013-01-17 | 2015-06-17 | 积水化学工业株式会社 | Curable composition for electronic component and connection structure |
| CN107146779A (en) * | 2017-06-30 | 2017-09-08 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
-
2018
- 2018-08-16 CN CN201810932463.XA patent/CN109181558A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101025796A (en) * | 2006-02-17 | 2007-08-29 | 李树群 | Electronic label reverse packaging process |
| CN104718234A (en) * | 2013-01-17 | 2015-06-17 | 积水化学工业株式会社 | Curable composition for electronic component and connection structure |
| KR20150054188A (en) * | 2013-11-11 | 2015-05-20 | 삼성전기주식회사 | Bonding apparatus |
| CN104650789A (en) * | 2015-02-11 | 2015-05-27 | 武汉轻工大学 | Anisotropic conductive adhesive and packaging method |
| CN107146779A (en) * | 2017-06-30 | 2017-09-08 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
Non-Patent Citations (4)
| Title |
|---|
| 仝兴存: "《电子封装热管理先进材料》", 30 April 2016, 国防工业出版社 * |
| 吕银祥: "《现代信息材料导论》", 30 September 2008, 华东理工大学出版社 * |
| 周清军: "《嵌入式RAM的优化设计及前后端关键技术研究》", 31 July 2016, 西北工业大学出版社 * |
| 贺曼罗: "《环氧树脂胶粘剂》", 30 April 2004, 中国石化出版社 * |
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Application publication date: 20190111 |