CN109860127A - 一种芯片封装体及其封装工艺 - Google Patents
一种芯片封装体及其封装工艺 Download PDFInfo
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- CN109860127A CN109860127A CN201910285020.0A CN201910285020A CN109860127A CN 109860127 A CN109860127 A CN 109860127A CN 201910285020 A CN201910285020 A CN 201910285020A CN 109860127 A CN109860127 A CN 109860127A
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- 238000012536 packaging technology Methods 0.000 title claims abstract description 13
- 239000010410 layer Substances 0.000 claims abstract description 134
- 238000005538 encapsulation Methods 0.000 claims abstract description 44
- 238000003466 welding Methods 0.000 claims abstract description 19
- 239000011241 protective layer Substances 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 238000012545 processing Methods 0.000 claims abstract description 6
- 239000000084 colloidal system Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 238000004513 sizing Methods 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000003139 buffering effect Effects 0.000 claims 1
- 238000005253 cladding Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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CN201910285020.0A CN109860127A (zh) | 2019-04-10 | 2019-04-10 | 一种芯片封装体及其封装工艺 |
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CN201910285020.0A CN109860127A (zh) | 2019-04-10 | 2019-04-10 | 一种芯片封装体及其封装工艺 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110321992A (zh) * | 2019-07-04 | 2019-10-11 | 军事科学院***工程研究院后勤科学与技术研究所 | 一种颈部标识牌 |
CN112992819A (zh) * | 2021-04-26 | 2021-06-18 | 佛山市国星光电股份有限公司 | 一种封装器件及其制作方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1996575A (zh) * | 2005-12-31 | 2007-07-11 | 财团法人工业技术研究院 | 芯片封装结构与芯片封装工艺 |
CN101820045A (zh) * | 2010-04-09 | 2010-09-01 | 江苏伯乐达光电科技有限公司 | Led的封装支架、led封装方法及利用该方法制作的led |
US20160218025A1 (en) * | 2015-01-26 | 2016-07-28 | Michael A. Tischler | Systems for adhesive bonding of electronic devices |
CN106298722A (zh) * | 2016-09-26 | 2017-01-04 | 无锡新洁能股份有限公司 | 一种大电流功率半导体器件的封装结构及制造方法 |
CN109065305A (zh) * | 2018-06-28 | 2018-12-21 | 南京先正电子股份有限公司 | 一种带双温度保险压敏电阻器及其制备方法 |
CN208507648U (zh) * | 2018-07-11 | 2019-02-15 | 珠海格力电器股份有限公司 | 一种电子元件封装结构及半导体器件 |
CN209880580U (zh) * | 2019-04-10 | 2019-12-31 | 深圳市槟城电子有限公司 | 一种芯片封装体及其电子设备 |
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2019
- 2019-04-10 CN CN201910285020.0A patent/CN109860127A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1996575A (zh) * | 2005-12-31 | 2007-07-11 | 财团法人工业技术研究院 | 芯片封装结构与芯片封装工艺 |
CN101820045A (zh) * | 2010-04-09 | 2010-09-01 | 江苏伯乐达光电科技有限公司 | Led的封装支架、led封装方法及利用该方法制作的led |
US20160218025A1 (en) * | 2015-01-26 | 2016-07-28 | Michael A. Tischler | Systems for adhesive bonding of electronic devices |
CN106298722A (zh) * | 2016-09-26 | 2017-01-04 | 无锡新洁能股份有限公司 | 一种大电流功率半导体器件的封装结构及制造方法 |
CN109065305A (zh) * | 2018-06-28 | 2018-12-21 | 南京先正电子股份有限公司 | 一种带双温度保险压敏电阻器及其制备方法 |
CN208507648U (zh) * | 2018-07-11 | 2019-02-15 | 珠海格力电器股份有限公司 | 一种电子元件封装结构及半导体器件 |
CN209880580U (zh) * | 2019-04-10 | 2019-12-31 | 深圳市槟城电子有限公司 | 一种芯片封装体及其电子设备 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110321992A (zh) * | 2019-07-04 | 2019-10-11 | 军事科学院***工程研究院后勤科学与技术研究所 | 一种颈部标识牌 |
CN112992819A (zh) * | 2021-04-26 | 2021-06-18 | 佛山市国星光电股份有限公司 | 一种封装器件及其制作方法 |
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Effective date of registration: 20210506 Address after: 243000 south of workshop 1, building 5, 2189, huxinan Road, Maanshan economic and Technological Development Zone, Maanshan City, Anhui Province Applicant after: Ma On Shan Penang Electronics Co.,Ltd. Address before: 518116 Shenzhen, Longgang, Guangdong province Longgang Street Baolong community Baolong four road 3 Lan Pu Yuan Industrial Zone 1 Factory A501 Applicant before: Shenzhen Bencent Electronics Co.,Ltd. |
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Effective date of registration: 20210610 Address after: 243000 south of workshop 1, building 5, 2189, huxinan Road, Maanshan economic and Technological Development Zone, Maanshan City, Anhui Province Applicant after: MAANSHAN Penang Electronics Co.,Ltd. Address before: No.1 Workshop a501, lanpuyuan Industrial Zone, No.3, Baolong 4th Road, Baolong community, Longgang street, Longgang District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Bencent Electronics Co.,Ltd. |