CN107146779A - 指纹识别芯片的封装结构及封装方法 - Google Patents
指纹识别芯片的封装结构及封装方法 Download PDFInfo
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- CN107146779A CN107146779A CN201710523587.8A CN201710523587A CN107146779A CN 107146779 A CN107146779 A CN 107146779A CN 201710523587 A CN201710523587 A CN 201710523587A CN 107146779 A CN107146779 A CN 107146779A
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- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
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- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 229910052737 gold Inorganic materials 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 14
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83399—Material
- H01L2224/8349—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
- H01L2224/83491—The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (21)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710523587.8A CN107146779B (zh) | 2017-06-30 | 2017-06-30 | 指纹识别芯片的封装结构及封装方法 |
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CN201710523587.8A CN107146779B (zh) | 2017-06-30 | 2017-06-30 | 指纹识别芯片的封装结构及封装方法 |
Publications (2)
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CN107146779A true CN107146779A (zh) | 2017-09-08 |
CN107146779B CN107146779B (zh) | 2020-03-24 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107491772A (zh) * | 2017-09-26 | 2017-12-19 | 硕诺科技(深圳)有限公司 | 一种指纹识别模组及pcb主板 |
CN108155160A (zh) * | 2018-01-29 | 2018-06-12 | 中芯长电半导体(江阴)有限公司 | 指纹识别芯片的封装结构及封装方法 |
CN109181558A (zh) * | 2018-08-16 | 2019-01-11 | 昆山建皇光电科技有限公司 | 预固化焊接胶工艺 |
CN110571307A (zh) * | 2019-09-16 | 2019-12-13 | 无锡中微晶园电子有限公司 | 一种光电探测产品键合涂丝工艺 |
CN110600496A (zh) * | 2019-09-20 | 2019-12-20 | 上海显耀显示科技有限公司 | 一种Micro-LED芯片封装结构 |
CN111029261A (zh) * | 2019-11-22 | 2020-04-17 | 徐州顺意半导体科技有限公司 | 一种生物识别模块及其制备方法 |
CN111092019A (zh) * | 2019-11-22 | 2020-05-01 | 徐州顺意半导体科技有限公司 | 一种指纹识别模块及其制备方法 |
CN111952203A (zh) * | 2020-08-25 | 2020-11-17 | 山东砚鼎电子科技有限公司 | 一种指纹识别封装及其形成方法 |
CN113035795A (zh) * | 2019-06-14 | 2021-06-25 | 深圳市汇顶科技股份有限公司 | 芯片封装结构和电子设备 |
WO2021218161A1 (zh) * | 2020-04-30 | 2021-11-04 | 青岛歌尔微电子研究院有限公司 | 微机电***封装结构及其制作方法 |
Citations (5)
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US20060065964A1 (en) * | 2004-09-30 | 2006-03-30 | Takashi Ohsumi | Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor |
CN103681362A (zh) * | 2012-09-14 | 2014-03-26 | 新科金朋有限公司 | 半导体器件以及在fo-wlcsp中形成双侧互连结构的方法 |
CN105140213A (zh) * | 2015-09-24 | 2015-12-09 | 中芯长电半导体(江阴)有限公司 | 一种芯片封装结构及封装方法 |
CN105470207A (zh) * | 2015-12-24 | 2016-04-06 | 华天科技(西安)有限公司 | 基于高平整度基板的指纹识别芯片封装结构及其制造方法 |
CN207165545U (zh) * | 2017-06-30 | 2018-03-30 | 中芯长电半导体(江阴)有限公司 | 指纹识别芯片的封装结构 |
-
2017
- 2017-06-30 CN CN201710523587.8A patent/CN107146779B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20060065964A1 (en) * | 2004-09-30 | 2006-03-30 | Takashi Ohsumi | Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor |
CN103681362A (zh) * | 2012-09-14 | 2014-03-26 | 新科金朋有限公司 | 半导体器件以及在fo-wlcsp中形成双侧互连结构的方法 |
CN105140213A (zh) * | 2015-09-24 | 2015-12-09 | 中芯长电半导体(江阴)有限公司 | 一种芯片封装结构及封装方法 |
CN105470207A (zh) * | 2015-12-24 | 2016-04-06 | 华天科技(西安)有限公司 | 基于高平整度基板的指纹识别芯片封装结构及其制造方法 |
CN207165545U (zh) * | 2017-06-30 | 2018-03-30 | 中芯长电半导体(江阴)有限公司 | 指纹识别芯片的封装结构 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107491772A (zh) * | 2017-09-26 | 2017-12-19 | 硕诺科技(深圳)有限公司 | 一种指纹识别模组及pcb主板 |
CN108155160A (zh) * | 2018-01-29 | 2018-06-12 | 中芯长电半导体(江阴)有限公司 | 指纹识别芯片的封装结构及封装方法 |
CN109181558A (zh) * | 2018-08-16 | 2019-01-11 | 昆山建皇光电科技有限公司 | 预固化焊接胶工艺 |
CN113035795A (zh) * | 2019-06-14 | 2021-06-25 | 深圳市汇顶科技股份有限公司 | 芯片封装结构和电子设备 |
US11545517B2 (en) | 2019-06-14 | 2023-01-03 | Shenzhen GOODIX Technology Co., Ltd. | Chip package structure, electronic device and method for preparing a chip package structure |
CN110571307A (zh) * | 2019-09-16 | 2019-12-13 | 无锡中微晶园电子有限公司 | 一种光电探测产品键合涂丝工艺 |
CN110600496A (zh) * | 2019-09-20 | 2019-12-20 | 上海显耀显示科技有限公司 | 一种Micro-LED芯片封装结构 |
CN111029261A (zh) * | 2019-11-22 | 2020-04-17 | 徐州顺意半导体科技有限公司 | 一种生物识别模块及其制备方法 |
CN111092019A (zh) * | 2019-11-22 | 2020-05-01 | 徐州顺意半导体科技有限公司 | 一种指纹识别模块及其制备方法 |
CN111092019B (zh) * | 2019-11-22 | 2021-11-02 | 绥化市鸿骏智能科技有限公司 | 一种指纹识别模块及其制备方法 |
WO2021218161A1 (zh) * | 2020-04-30 | 2021-11-04 | 青岛歌尔微电子研究院有限公司 | 微机电***封装结构及其制作方法 |
CN111952203A (zh) * | 2020-08-25 | 2020-11-17 | 山东砚鼎电子科技有限公司 | 一种指纹识别封装及其形成方法 |
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