CN107030902B - 切削装置 - Google Patents

切削装置 Download PDF

Info

Publication number
CN107030902B
CN107030902B CN201611071041.5A CN201611071041A CN107030902B CN 107030902 B CN107030902 B CN 107030902B CN 201611071041 A CN201611071041 A CN 201611071041A CN 107030902 B CN107030902 B CN 107030902B
Authority
CN
China
Prior art keywords
cutting
unit
carry
chuck table
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201611071041.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN107030902A (zh
Inventor
花岛聪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN107030902A publication Critical patent/CN107030902A/zh
Application granted granted Critical
Publication of CN107030902B publication Critical patent/CN107030902B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201611071041.5A 2015-11-30 2016-11-28 切削装置 Active CN107030902B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015233110A JP6560110B2 (ja) 2015-11-30 2015-11-30 切削装置
JP2015-233110 2015-11-30

Publications (2)

Publication Number Publication Date
CN107030902A CN107030902A (zh) 2017-08-11
CN107030902B true CN107030902B (zh) 2020-05-26

Family

ID=59018191

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611071041.5A Active CN107030902B (zh) 2015-11-30 2016-11-28 切削装置

Country Status (4)

Country Link
JP (1) JP6560110B2 (ja)
KR (1) KR102463660B1 (ja)
CN (1) CN107030902B (ja)
TW (1) TWI691018B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7045841B2 (ja) * 2017-12-08 2022-04-01 株式会社ディスコ 切削装置
JP7032122B2 (ja) * 2017-12-22 2022-03-08 株式会社ディスコ 切削装置
CN108573905B (zh) * 2018-04-14 2020-12-01 芜湖拓达电子科技有限公司 一种半导体元件清洗设备及其使用方法
JP7165510B2 (ja) * 2018-05-25 2022-11-04 株式会社ディスコ 搬送用治具及び交換方法
JP7490304B2 (ja) * 2020-04-08 2024-05-27 株式会社ディスコ 切削装置及び搬送システム

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4339452B2 (ja) * 1999-07-09 2009-10-07 株式会社ディスコ Ｃｓｐ基板分割装置
JP4616969B2 (ja) * 2000-06-16 2011-01-19 株式会社ディスコ 切断機
JP2002359211A (ja) * 2001-05-30 2002-12-13 Disco Abrasive Syst Ltd 切削機
TWI272673B (en) * 2001-11-21 2007-02-01 Disco Corp Cutting machine
JP4532895B2 (ja) * 2003-12-18 2010-08-25 株式会社ディスコ 板状物の切削装置
KR20060029927A (ko) * 2004-10-04 2006-04-07 삼성전자주식회사 복수의 소잉 블레이드를 갖는 반도체 소잉 장치
JP4571851B2 (ja) * 2004-11-30 2010-10-27 株式会社ディスコ 切削装置
JP4813855B2 (ja) * 2005-09-12 2011-11-09 株式会社ディスコ 切削装置および加工方法
DE102007050471A1 (de) * 2007-10-23 2009-04-30 MAPAL Fabrik für Präzisionswerkzeuge Dr. Kress KG Werkzeug zur spanenden Bearbeitung von Werkstücken
KR101464804B1 (ko) * 2007-11-19 2014-11-24 가부시키가이샤 토쿄 세이미쯔 다이싱 방법
JP5026235B2 (ja) * 2007-11-29 2012-09-12 キヤノンマシナリー株式会社 基板切断装置
JP5420226B2 (ja) * 2008-11-07 2014-02-19 アピックヤマダ株式会社 切断装置
JP5386276B2 (ja) * 2009-09-02 2014-01-15 株式会社ディスコ 切削装置
JP5406676B2 (ja) * 2009-11-10 2014-02-05 株式会社ディスコ ウエーハの加工装置
JP5619559B2 (ja) * 2010-10-12 2014-11-05 株式会社ディスコ 加工装置
JP2013008823A (ja) * 2011-06-24 2013-01-10 Disco Abrasive Syst Ltd 切断装置
JP5947010B2 (ja) * 2011-09-15 2016-07-06 株式会社ディスコ 分割装置
JP5785069B2 (ja) * 2011-12-05 2015-09-24 株式会社ディスコ 切削装置
JP6214901B2 (ja) * 2013-04-04 2017-10-18 株式会社ディスコ 切削装置
JP6441737B2 (ja) * 2015-04-28 2018-12-19 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
KR20170063379A (ko) 2017-06-08
KR102463660B1 (ko) 2022-11-03
CN107030902A (zh) 2017-08-11
TW201727820A (zh) 2017-08-01
TWI691018B (zh) 2020-04-11
JP2017103274A (ja) 2017-06-08
JP6560110B2 (ja) 2019-08-14

Similar Documents

Publication Publication Date Title
CN107030902B (zh) 切削装置
CN106956370B (zh) 加工装置的搬送机构
JP4571851B2 (ja) 切削装置
JP6441737B2 (ja) 切削装置
JP5399690B2 (ja) 切断装置
JP6218600B2 (ja) 加工装置
JP5785069B2 (ja) 切削装置
TWI699265B (zh) 切削裝置
JP6665041B2 (ja) 切削装置
KR20180113165A (ko) 절삭 장치
CN111696904A (zh) 搬送装置
JP6762220B2 (ja) 加工装置の搬送機構
KR20170072137A (ko) 가공 장치
JP2005051094A (ja) 切削装置
JP2017112227A (ja) 加工装置
JP3978218B2 (ja) 工作機械
JP2018196923A (ja) 加工装置及びそれを用いた加工方法
JP6448456B2 (ja) 加工装置
JP6855130B2 (ja) 加工装置
KR20190076855A (ko) 절삭 장치
JP4731265B2 (ja) 切削装置
JP2021171881A (ja) 切削装置及び載置プレート
JP2014220448A (ja) 加工装置
JPH10181838A (ja) 部品給排ユニット、部品給排装置及び部品給排方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant