CN111696904A - 搬送装置 - Google Patents
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Abstract
提供搬送装置,其能够抑制为了改变伯努利搬送垫的吸引力而花费的成本和时间。搬送装置(1)以非接触状态吸引并搬送板状被加工物(200)。搬送装置(1、1‑1、1‑2)包含:伯努利搬送垫(8),其向被加工物(200)喷射空气而产生负压;基台(7),其供伯努利搬送垫(8)固定;以及移动单元,其使基台(7)移动。伯努利搬送垫(8)包含垫主体(82),该垫主体(82)具有形成有流体喷出部(83)的下表面(81),垫主体(82)具有环状垫安装部(87),该环状垫安装部(87)供将保持面沿径向扩展而增强吸引力的环状垫(10‑2)安装。
Description
技术领域
本发明涉及对半导体晶片等板状被加工物进行搬送的搬送装置。
背景技术
在进行半导体晶片等的加工时,通常晶片通过真空垫进行吸附固定而被搬送。但是,在使形成有器件的面侧露出而进行搬送时,当器件与真空垫接触时,导致器件的破损,因此研究了具有能够进行非接触吸引的伯努利搬送垫的搬送装置(例如参照专利文献1)。
专利文献1:日本特开2004-119784号公报
但是,关于专利文献1所示的搬送装置,有时要搬送的晶片的重量根据尺寸或厚度等而不同,为了适当地改变伯努利搬送垫的吸引力,需要使伯努利搬送垫与各个晶片对应地进行更换。因此,专利文献1所示的搬送装置为了改变伯努利搬送垫的吸引力需要花费成本和时间。
发明内容
由此,本发明的目的在于提供搬送装置,其能够抑制为了改变伯努利搬送垫的吸引力而花费的成本和时间。
根据本发明,提供搬送装置,其以非接触状态吸引并搬送板状被加工物,其中,该搬送装置具有:伯努利搬送垫,其向该被加工物喷射流体而产生负压;基台,其供该伯努利搬送垫固定;以及移动单元,其使该基台移动,该伯努利搬送垫包含垫主体,该垫主体具有:第1保持面,其形成有流体喷出部;以及环状垫安装部,其供将该第1保持面沿径向扩展而增强吸引力的环状垫安装。
优选该环状垫安装部由该垫主体的圆筒状侧面构成,该伯努利搬送垫还包含安装于该垫主体的环状垫,该环状垫具有内径与该垫主体的该圆筒状侧面的直径相等的第2保持面。优选该环状垫由外径相互不同的多个环状垫构成,将从该多个环状垫中选择的一个环状垫安装于该垫主体。
本发明的搬送装置起到如下的效果:其能够抑制为了改变伯努利搬送垫的吸引力而花费的成本和时间。
附图说明
图1是示出具有实施方式的搬送装置的加工装置的结构例的立体图。
图2是示出实施方式的搬送装置的结构的立体图。
图3是示出图2所示的搬送装置对被加工物进行了非接触吸引的状态的主要部分的剖视图。
图4是示出向图2所示的搬送装置的伯努利搬送垫的垫主体安装的环状垫的一例的剖视图。
图5是示出向图2所示的搬送装置的伯努利搬送垫的垫主体安装的环状垫的另一例的剖视图。
图6是示出向图2所示的搬送装置的伯努利搬送垫的垫主体安装的环状垫的又一例的剖视图。
图7是示出向图2所示的搬送装置的伯努利搬送垫的垫主体上安装环状垫的状态的一例的剖视图。
图8是示出在图2所示的搬送装置的伯努利搬送垫的垫主体上安装有环状垫的状态的一例的剖视图。
图9是示出由具有图8所示的安装有环状垫的伯努利搬送垫的搬送装置对被加工物进行了非接触吸引的状态的主要部分的剖视图。
标号说明
1、1-1、1-2:搬送装置;3:移动单元;7:基台;8:伯努利搬送垫;10-1、10-2、10-3:环状垫;11:下表面(保持面);81:下表面(保持面);82:垫主体;83:流体喷出部;87:环状垫安装部;200:被加工物(板状物);300:空气(流体)。
具体实施方式
以下,参照附图对本发明的实施方式进行详细说明。本发明并不被以下实施方式所记载的内容限定。另外,在以下所记载的结构要素中包含本领域技术人员能够容易想到的内容、实质上相同的内容。另外,以下所记载的结构可以适当组合。另外,可以在不脱离本发明的主旨的范围内进行结构的各种省略、置换或变更。
根据附图,对本发明的实施方式的搬送装置进行说明。图1是示出具有实施方式的搬送装置的加工装置的结构例的立体图。图2是示出实施方式的搬送装置的结构的立体图。图3是示出图2所示的搬送装置对被加工物进行了非接触吸引的状态的主要部分的剖视图。
实施方式的搬送装置1构成图1所示的加工装置100。加工装置100是对板状被加工物200进行切削(加工)的切削装置。
在实施方式中,被加工物200是以硅、蓝宝石、镓等作为母材的圆板状的半导体晶片或光器件晶片等晶片。被加工物200在正面201上在由呈格子状形成的多条分割预定线202呈格子状划分的区域内形成有器件203。另外,实施方式的被加工物200是半导体晶片或光器件晶片等晶片,但本发明的被加工物200不限于晶片。
图1所示的加工装置100是对被加工物200进行切削而将被加工物200分割成各个器件203的装置。如图1所示,加工装置100具有:卡盘工作台110,其利用保持面111对被加工物200进行吸引保持;切削单元120,其是对卡盘工作台110所保持的被加工物200进行切削的加工单元;以及搬送装置1。
另外,如图1所示,加工装置100至少具有:未图示的X轴移动单元,其将卡盘工作台110在与水平方向平行的X轴方向上进行加工进给;Y轴移动单元130,其将切削单元120在与水平方向平行且与X轴方向垂直的Y轴方向上进行分割进给;Z轴移动单元140,其将切削单元120在与垂直于X轴方向和Y轴方向这双方的铅垂方向平行的Z轴方向上进行切入进给;以及未图示的控制装置。如图1所示,加工装置100是具有两个切削单元120的切削装置,即两个主轴的划片机、所谓的面对双轴型的切削装置。
卡盘工作台110利用保持面111对被加工物200的正面201的背面侧的背面204进行吸引保持。卡盘工作台110是圆盘形状,对被加工物200进行保持的保持面111由多孔陶瓷等形成。另外,卡盘工作台110设置成通过X轴移动单元沿着切削单元120的下方的加工区域和远离切削单元120的下方且搬入搬出被加工物200的搬入搬出区域在X轴方向上移动自如,并且设置成通过旋转驱动源绕与Z轴方向平行的轴心旋转自如。卡盘工作台110与未图示的真空吸引源连接,通过真空吸引源进行吸引而对载置于保持面111的被加工物200进行吸引保持。
切削单元120具有未图示的主轴,该主轴具有与Y轴方向平行的旋转轴,安装对卡盘工作台110所保持的被加工物200进行切削的切削刀具121。切削单元120分别相对于卡盘工作台110所保持的被加工物200设置成通过Y轴移动单元130在Y轴方向上移动自如且设置成通过Z轴移动单元140在Z轴方向上移动自如。
如图1所示,一方的切削单元120借助Y轴移动单元130、Z轴移动单元140等而设置于从装置主体101竖立设置的门型的支承框架102的一方的柱部。如图1所示,另一方的切削单元120借助Y轴移动单元130、Z轴移动单元140等而设置于从支承框架102的装置主体101竖立设置的另一方的柱部。另外,柱部的上端通过水平梁连结。
切削单元120能够通过Y轴移动单元130和Z轴移动单元140将切削刀具121定位于卡盘工作台110的保持面111的任意的位置和高度。切削单元120具有:主轴壳体122,其设置成通过Y轴移动单元130和Z轴移动单元140在Y轴方向和Z轴方向上移动自如;以及未图示的主轴,其绕轴心旋转自如地设置于主轴壳体122且通过电动机进行旋转,并且在前端安装有切削刀具121。切削刀具121是具有大致环形状的极薄的切削磨具。
另外,加工装置100具有对卡盘工作台110的保持面111所保持的被加工物200进行拍摄的拍摄单元150。在实施方式中,拍摄单元150安装于一方的切削单元120,与一方的切削单元120一体地移动。拍摄单元150具有CCD相机,该CCD相机对卡盘工作台110所保持的切削前的被加工物200的要分割的区域进行拍摄。CCD相机对卡盘工作台110所保持的被加工物200进行拍摄而得到用于执行对准、即进行被加工物200和切削刀具121的对位的图像,将所得到的图像输出至控制装置。
X轴移动单元、Y轴移动单元130以及Z轴移动单元140具有:周知的滚珠丝杠,其设置成绕轴心旋转自如;周知的脉冲电动机,其使滚珠丝杠绕轴心旋转;以及周知的导轨,其将卡盘工作台110或切削单元120支承为在X轴方向、Y轴方向或Z轴方向上移动自如。
另外,加工装置100具有:盒升降机160,其载置对切削前后的被加工物200进行收纳的盒161且使盒161在Z轴方向上移动;清洗装置180,其对切削后的被加工物200进行清洗;以及搬入搬出单元170,其使被加工物200相对于盒161出入。清洗装置180将切削后的被加工物200吸引保持于卡盘工作台181的保持面182而对被加工物200进行清洗。
控制装置分别对上述构成要素进行控制而使加工装置100实施对于被加工物200的加工动作。另外,控制装置包含计算机***。控制装置具有:运算处理装置,其具有CPU(central processing unit,中央处理器)那样的微处理器;存储装置,其具有ROM(readonly memory,只读存储器)或RAM(random access memory,随机存取存储器)那样的存储器;以及输入输出接口装置。控制装置的运算处理装置按照存储于存储装置的计算机程序实施运算处理,将用于控制加工装置100的控制信号经由输入输出接口装置而输出至加工装置100的上述构成要素。另外,控制装置与由显示加工动作的状态或图像等的液晶显示装置等构成的未图示的显示单元、操作者在登记加工内容信息等时使用的输入单元连接。输入单元由设置于显示单元的触摸面板和键盘等中的至少一个构成。
在实施方式中,加工装置100是切削装置,但本发明不限于此,加工装置可以是清洗装置、激光加工装置或磨削装置等进行各种加工的加工装置。另外,在实施方式中,作为加工单元,示出切削单元120,但不限于此,作为加工单元,可以是清洗单元、激光光线照射单元或磨削单元等各种加工单元。
在实施方式中,图2所示的搬送装置1将被加工物200相对于卡盘工作台110、181的保持面111、182搬入或搬出。在实施方式中,加工装置100具有第1搬送装置1(以下用标号1-1表示)和第2搬送装置1(以下用标号1-2表示)作为搬送装置1,第1搬送装置1-1在搬入搬出单元170与卡盘工作台110之间搬送被加工物200,第2搬送装置1-2在卡盘工作台110与清洗装置180的卡盘工作台181之间搬送被加工物200。第1搬送装置1-1将切削前的被加工物200从搬入搬出单元170搬出并搬入至卡盘工作台110。第2搬送装置1-2将切削后的被加工物200从卡盘工作台110搬出并搬入至清洗装置180的卡盘工作台181。第1搬送装置1-1将清洗后的被加工物200从卡盘工作台181搬出并搬入至搬入搬出单元170。
搬送装置1-1、1-2沿着图3所示的伯努利搬送垫8的下表面81喷射作为流体的空气300,在下表面的中央部产生负压,通过该负压对被加工物200进行吸引。搬送装置1-1、1-2通过在被加工物200与下表面81之间流动的空气300而产生反作用力,阻止与被加工物200的接触,以非接触状态对被加工物200进行吸引并进行搬送。
如图1和图2所示,搬送装置1-1、1-2具有:保持单元2,其以非接触状态对被加工物200进行吸引;以及移动单元3,其使保持单元2移动。移动单元3具有:Y轴移动机构5,其使在前端设置有保持单元2的单元支承臂4在Y轴方向上移动;以及升降机构6,其设置于单元支承臂4的前端且使保持单元2在Z轴方向上移动。Y轴移动机构5设置于水平梁106,该水平梁106将从装置主体101竖立设置且设置于比支承框架102靠搬入搬出区域的门型的第2支承框架103的一对柱部104、105彼此连结。Y轴移动机构5包含:周知的滚珠丝杠,其设置成绕轴心旋转自如;周知的脉冲电动机,其使滚珠丝杠绕轴心旋转;以及周知的导轨,其将单元支承臂4支承为在Y轴方向上移动自如。升降机构6由周知的气缸构成。
如图2和图3所示,保持单元2具有:圆盘状的基台7、安装于基台7的伯努利搬送垫8以及外周支承部件9。基台7安装于移动单元3的升降机构6的杆的下端。因此,移动单元3使基台7移动。基台7在下表面上固定有伯努利搬送垫8。
伯努利搬送垫8固定于基台7,对被加工物200喷射空气300,在作为保持面的下表面81的中央产生负压。在实施方式中,伯努利搬送垫8在基台7的周向上等间隔地固定有三个。伯努利搬送垫8具有:厚的圆盘状的垫主体82;流体喷出部83,其从垫主体82的下表面81的中心部沿着下表面81喷射空气300;以及连通管84,其与垫主体82的上表面连接且与流体喷出部83连通。伯努利搬送垫8的垫主体82由不锈钢等金属或合成树脂形成。
即,垫主体82具有形成有流体喷出部83的下表面81。下表面81沿着水平方向平坦地形成。连通管84形成为从垫主体82的上表面的中心部竖立设置的圆筒状,如图2所示,经由开闭阀85而与作为流体提供源的加压空气提供源86连接。伯努利搬送垫8将连通管84通入到贯通基台7的贯通孔71,使垫主体82的上表面重叠在基台7的下表面上,并且将贯通基台7的螺栓72拧入垫主体82而固定于基台7。
伯努利搬送垫8将从加压空气提供源86提供的空气300通过连通管84而从流体喷出部83沿着垫主体82的下表面81喷出,在垫主体82的下表面81的中心部产生负压,通过该负压对被加工物200进行吸引。当伯努利搬送垫8接近被加工物200时,在垫主体82的下表面81与被加工物200之间流动的空气300作为反作用力发挥作用,阻止与被加工物200的接触,如图3所示,以非接触状态对被加工物200进行吸引。
外周支承部件9固定于基台7,与被加工物200的外缘抵接而限制被加工物200的水平方向的移动。在实施方式中,外周支承部件9在基台7的周向上等间隔地固定有三个。另外,外周支承部件9配置于沿着基台7的周向相互相邻的伯努利搬送垫8之间且配置于比伯努利搬送垫8靠基台7的外周的位置。外周支承部件9将贯通基台7的螺栓73拧入而固定于基台7,下表面91随着朝向基台7的中心部而慢慢向朝上的方向倾斜。外周支承部件9使上述那样倾斜的下表面91与被加工物200的外缘接触,限制伯努利搬送垫8以非接触状态吸引的被加工物200的水平方向的移动。
接着,本说明书对安装于实施方式的搬送装置1-1、1-2的伯努利搬送垫8的垫主体82的环状垫10-1、10-2、10-3进行说明。图4是示出向图2所示的搬送装置的伯努利搬送垫的垫主体安装的环状垫的一例的剖视图。图5是示出向图2所示的搬送装置的伯努利搬送垫的垫主体安装的环状垫的另一例的剖视图。图6是示出向图2所示的搬送装置的伯努利搬送垫的垫主体安装的环状垫的又一例的剖视图。图7是示出向图2所示的搬送装置的伯努利搬送垫的垫主体安装环状垫的状态的一例的剖视图。图8是示出在图2所示的搬送装置的伯努利搬送垫的垫主体上安装有环状垫的状态的一例的剖视图。图9是示出由具有图8所示的安装有环状垫的伯努利搬送垫的搬送装置对被加工物进行了非接触吸引的状态的主要部分的剖视图。
实施方式的搬送装置1-1、1-2的伯努利搬送垫8具有将图4、图5和图6中示例的环状垫10-1、10-2、10-3向垫主体82安装的环状垫安装部87。在实施方式中,环状垫安装部87是垫主体82的外周面。
图4、图5和图6中示例的环状垫10-1、10-2、10-3形成为内径与垫主体82的外径相等的圆环状,外径相互不同。如图7所示那样,在环状垫10-1、10-2、10-3的内侧***垫主体82,从而如图8所示那样将环状垫10-1、10-2、10-3安装于伯努利搬送垫8的垫主体82。另外,图7和图8以环状垫10-1、10-2、10-3中的环状垫10-2为代表而示出,在本发明中,环状垫10-1、10-3也同样地安装于伯努利搬送垫8。环状垫10-1、10-2、10-3由不锈钢等金属或合成树脂形成。环状垫10-1、10-2、10-3对于垫主体82的固定方法没有特别限定,例如通过多个位置的螺钉紧固等进行固定。
环状垫10-1、10-2、12-3的作为保持面的下表面11平坦地形成,在将环状垫10-1、10-2、12-3安装于伯努利搬送垫8时,下表面11与水平方向平行。在将环状垫10-1、10-2、12-3安装于伯努利搬送垫8时,如图8和图9所示那样环状垫10-1、10-2、12-3的下表面11与下表面81成为同一平面。环状垫10-1、10-2、12-3安装于伯努利搬送垫8时,下表面11与下表面81成为同一平面,犹如将保持面沿径向扩展,增强在下表面11、81上流动的空气300的负压,伯努利搬送垫8对被加工物200进行吸引的吸引力增强。
另外,图4、图5和图6示出环状垫10-1、10-2、10-3作为例子,但在本发明中,安装于伯努利搬送垫8的环状垫10-1、10-2、10-3不限于这些。伯努利搬送垫8根据所吸引保持的被加工物200的重量等而选择安装多个环状垫10-1、10-2、10-3中的环状垫,并且有时也在未安装环状垫10-1、10-2、10-3的状态下使用。
关于以上说明的实施方式的搬送装置1-1、1-2,伯努利搬送垫8的环状垫安装部87是垫主体82的外周面,能够供环状垫10-1、10-2、10-3安装,因此通过适当变更安装于环状垫安装部87的环状垫10-1、10-2、10-3,能够容易地提高伯努利搬送垫8的吸引力,并且能够进行变更。其结果是起到如下的效果:搬送装置1-1、1-2能够根据搬送对象物的被加工物200而调整吸引力,并且能够抑制为了改变伯努利搬送垫8的吸引力而花费的成本和时间。
另外,本发明并不限于上述实施方式。即,可以在不脱离本发明的主旨的范围内进行各种变形并实施。
Claims (3)
1.一种搬送装置,其以非接触状态吸引并搬送板状被加工物,其中,
该搬送装置具有:
伯努利搬送垫,其向该被加工物喷射流体而产生负压;
基台,其供该伯努利搬送垫固定;以及
移动单元,其使该基台移动,
该伯努利搬送垫包含垫主体,该垫主体具有:
第1保持面,其形成有流体喷出部;以及
环状垫安装部,其供将该第1保持面沿径向扩展而增强吸引力的环状垫安装。
2.根据权利要求1所述的搬送装置,其中,
该环状垫安装部由该垫主体的圆筒状侧面构成,
该伯努利搬送垫还包含安装于该垫主体的环状垫,该环状垫具有内径与该垫主体的该圆筒状侧面的直径相等的第2保持面。
3.根据权利要求2所述的搬送装置,其中,
该环状垫包含外径分别不同的多个环状垫,将从该多个环状垫中选择的一个环状垫安装于该垫主体的该圆筒状侧面上。
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