CN107030902B - Cutting device - Google Patents

Cutting device Download PDF

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Publication number
CN107030902B
CN107030902B CN201611071041.5A CN201611071041A CN107030902B CN 107030902 B CN107030902 B CN 107030902B CN 201611071041 A CN201611071041 A CN 201611071041A CN 107030902 B CN107030902 B CN 107030902B
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China
Prior art keywords
cutting
unit
carry
chuck table
workpiece
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CN201611071041.5A
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Chinese (zh)
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CN107030902A (en
Inventor
花岛聪
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Disco Corp
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A cutting device is provided. It has the following components: 1 st and 2 nd chuck tables for holding a workpiece and moving in an X-axis direction; 1 st and 2 nd cutting mechanisms for cutting the workpiece held on the 1 st and 2 nd chuck tables; and a cleaning unit for cleaning the cut workpiece, wherein the 1 st chuck table is positioned in the 1 st carry-in area and the 1 st cutting area, the 2 nd chuck table is positioned in the 2 nd carry-in area and the 2 nd cutting area, the 1 st and the 2 nd cutting mechanisms respectively have the 1 st and the 2 nd cutting units, the 1 st and the 2 nd cutting units are provided with 2 rotating main shafts arranged on a straight line in the Y-axis direction and cutting tools respectively arranged at the opposite ends of the 2 rotating main shafts, the 1 st and the 2 nd cutting mechanisms are arranged at positions point-symmetrical by-point by taking the middle position of the 1 st and the 2 nd carry-in areas as an axis, and the cleaning unit is arranged on a straight line in the Y-axis direction connecting the 1 st and the 2 nd carry-in areas.

Description

Cutting device
Technical Field
The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer.
Background
In a semiconductor device manufacturing process, a plurality of regions are defined by planned dividing lines arranged in a lattice pattern on a front surface of a semiconductor wafer having a substantially disk shape, and devices such as an IC and an LSI are formed in the defined regions. Then, the semiconductor wafer is cut along the lines to be divided to divide the region where the device is formed, thereby manufacturing individual semiconductor devices.
A cutting device for cutting a workpiece such as a semiconductor wafer along a line to divide the workpiece includes: a chuck table for holding a workpiece; a cutting unit for cutting the workpiece held on the chuck table; and a cleaning unit for cleaning the processed object cut by the cutting unit, wherein the cutting device can cut the processed object such as a semiconductor wafer along the dividing lines with high precision and divide the processed object into individual devices.
Patent document 1 discloses a cutting device including: the cutting device is provided with 2 chuck tables for holding the workpiece, and 2 cutting units for cutting the workpiece held on the chuck tables, thereby improving the production efficiency.
Patent document 1: japanese patent application laid-open No. 4571851
However, in the cutting device disclosed in patent document 1, when the workpiece held on one chuck table is cut by using 2 cutting units, the work for the workpiece held on the other chuck table is interrupted, and there is a problem that the production efficiency is not necessarily good.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and a main technical object thereof is to provide a cutting apparatus which is excellent in production efficiency and can suppress an increase in size of the apparatus.
In order to solve the above-described main technical problem, according to the present invention, there is provided a cutting device for cutting a workpiece, characterized in that,
the cutting device comprises:
a1 st chuck table and a2 nd chuck table which are configured to hold a workpiece, are movable in an X-axis direction as a machining feed direction, and are arranged adjacent to each other in a Y-axis direction perpendicular to the X-axis direction as an indexing feed direction;
a1 st cutting mechanism and a2 nd cutting mechanism which respectively perform cutting processing on the processed object held by the 1 st chuck table and the 2 nd chuck table; and
a cleaning unit for cleaning the processed object cut by the 1 st cutting mechanism and the 2 nd cutting mechanism,
the 1 st chuck table is configured to be positioned in a1 st carrying-in/out area where a workpiece is carried in/out and a1 st cutting area where the 1 st cutting mechanism is disposed, and the 2 nd chuck table is configured to be positioned in a2 nd carrying-in/out area where the workpiece is carried in/out and a2 nd cutting area where the 2 nd cutting mechanism is disposed adjacent to the 1 st carrying-in/out area on a straight line in a Y axis direction,
the 1 st cutting mechanism comprises a1 st cutting unit and a2 nd cutting unit, the 1 st cutting unit and the 2 nd cutting unit comprise 2 rotating spindles arranged on a straight line in the Y-axis direction and cutting tools respectively mounted on the opposite end parts of the 2 rotating spindles, the 2 nd cutting mechanism comprises a1 st cutting unit and a2 nd cutting unit, the 1 st cutting unit and the 2 nd cutting unit comprise 2 rotating spindles arranged on a straight line in the Y-axis direction and cutting tools respectively mounted on the opposite end parts of the 2 rotating spindles,
the 1 st cutting mechanism and the 2 nd cutting mechanism are arranged at positions point-symmetrical with respect to an intermediate position between the 1 st carrying-in/out area and the 2 nd carrying-in/out area,
the cleaning unit is arranged on a straight line in the Y-axis direction connecting the 1 st carrying-in and carrying-out area and the 2 nd carrying-in and carrying-out area.
The cutting device includes a conveying unit that conveys the workpiece to the 1 st carry-in/out area, the 2 nd carry-in/out area, and the cleaning unit.
In addition, the cutting apparatus includes a temporary placement unit configured to be capable of adjusting an interval between 2 guide rails temporarily placing the workpiece above the cleaning unit, wherein the transport unit transports the workpiece before cutting, temporarily placed in the temporary placement unit, to a1 st chuck table positioned in a1 st carry-in/out area and a2 nd chuck table positioned in a2 nd carry-in/out area, transports the cleaned workpiece from the cleaning unit to the temporary placement unit, and transports the cut workpiece from the 1 st chuck table positioned in the 1 st carry-in/out area and the 2 nd chuck table positioned in the 2 nd carry-in/out area to the cleaning unit.
The conveying unit comprises a1 st conveying unit and a2 nd conveying unit, wherein the 1 st conveying unit conveys the processed object before cutting, which is temporarily placed in the temporary placing unit, to a1 st chuck table positioned in a1 st carrying-in and carrying-out area and a2 nd chuck table positioned in a2 nd carrying-in and carrying-out area, conveys the cleaned processed object to the temporary placing unit from the cleaning unit, and the 2 nd conveying unit conveys the cut processed object to the cleaning unit from the 1 st chuck table positioned in the 1 st carrying-in and carrying-out area and the 2 nd chuck table positioned in the 2 nd carrying-in and carrying-out area.
The cutting device is provided with a cassette table on which a cassette containing a workpiece is placed adjacent to the temporary placement unit in the X-axis direction, and a carrying-in and carrying-out unit that moves forward and backward in the X-axis direction, carries out the workpiece before cutting contained in the cassette placed on the cassette table to the temporary placement unit, and carries in the cleaned workpiece from the temporary placement unit to the cassette.
The cutting device of the invention comprises:
a1 st chuck table and a2 nd chuck table which are configured to hold a workpiece, are movable in an X-axis direction as a machining feed direction, and are arranged adjacent to each other in a Y-axis direction perpendicular to the X-axis direction as an indexing feed direction;
a1 st cutting mechanism and a2 nd cutting mechanism which respectively perform cutting processing on the processed object held by the 1 st chuck worktable and the 2 nd chuck worktable; and
a cleaning unit for cleaning the processed objects cut by the 1 st cutting mechanism and the 2 nd cutting mechanism,
the 1 st chuck table is configured to be positioned in a1 st carrying-in and carrying-out area where a workpiece is carried in and carried out and a1 st cutting area where a1 st cutting mechanism is arranged, the 2 nd chuck table is configured to be positioned in a2 nd carrying-in and carrying-out area where a workpiece is carried in and carried out adjacent to the 1 st carrying-in and carrying-out area on a straight line in the Y-axis direction and a2 nd cutting area where a2 nd cutting mechanism is arranged,
the 1 st cutting mechanism has a1 st cutting unit and a2 nd cutting unit, the 1 st cutting unit and the 2 nd cutting unit have 2 rotating spindles arranged on a straight line in the Y-axis direction and cutting tools respectively mounted on the opposite end parts of the 2 rotating spindles, the 2 nd cutting mechanism has a1 st cutting unit and a2 nd cutting unit, the 1 st cutting unit and the 2 nd cutting unit have 2 rotating spindles arranged on a straight line in the Y-axis direction and cutting tools respectively mounted on the opposite end parts of the 2 rotating spindles,
the 1 st cutting mechanism and the 2 nd cutting mechanism are arranged at positions which are point-symmetrical by taking the intermediate position of the 1 st carrying-in and carrying-out area and the 2 nd carrying-in and carrying-out area as an axis,
since the cleaning unit is disposed on a straight line in the Y-axis direction connecting the 1 st carry-in/out region and the 2 nd carry-in/out region, there is no wasted space in the arrangement of the 1 st and 2 nd chuck tables, the 1 st and 2 nd cutting mechanisms, and the cleaning unit, and it is possible to configure the cutting apparatus to be compact, and to improve the access and workability when the operator performs replacement of the cutting tool.
In the cutting apparatus of the present invention, it is possible to perform the cutting process by causing the 2 cutting tools, i.e., the 1 st cutting unit and the 2 nd cutting unit, constituting the 1 st cutting mechanism to act on the workpiece held on the 1 st chuck table positioned in the 1 st cutting area, and to perform the predetermined cutting process by causing the 2 cutting tools, i.e., the 1 st cutting unit and the 2 nd cutting unit, constituting the 2 nd cutting mechanism to act on the workpiece held on the 2 nd chuck table positioned in the 2 nd cutting area, simultaneously, thereby further improving productivity.
Drawings
Fig. 1 is a perspective view of a cutting device constructed in accordance with the present invention.
Fig. 2 is a perspective view illustrating an exploded structure of a part of the cutting apparatus shown in fig. 1.
Fig. 3 is a perspective view illustrating another part of the cutting apparatus shown in fig. 1 in an exploded manner.
Description of the reference symbols
2: a static base station; 3: 1, a chuck worktable mechanism; 32: moving the base station; 34: 1, a chuck worktable; 35: the 1 st processing and feeding unit; 4: 2, a chuck worktable mechanism; 42: moving the base station; 44: 2, a chuck workbench; 45: a2 nd processing feeding unit; 5: 1, a cutting mechanism; 5 a: 1 st cutting unit; 5 b: a2 nd cutting unit; 55: an indexing feed unit; 6: a2 nd cutting mechanism; 6 a: 1 st cutting unit; 6 b: a2 nd cutting unit; 65: an indexing feed unit; 7: a cleaning unit; 8: a temporary playing unit; 9: a cassette loading unit; 10: a cartridge; 11: a carrying-in/out unit; 12: a conveying unit; 13: a1 st conveying unit; 14: a2 nd conveying unit; f: an annular frame; t: scribing a tape; w: a semiconductor wafer.
Detailed Description
Hereinafter, preferred embodiments of the cutting device according to the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a perspective view showing an embodiment of a cutting apparatus according to the present invention, fig. 2 is a perspective view showing a disassembled and exploded component constituting a part of the cutting apparatus shown in fig. 1, and fig. 3 is a perspective view showing a disassembled and exploded component constituting another part of the cutting apparatus shown in fig. 1.
The cutting device in the illustrated embodiment includes: a stationary base 2; a1 st chuck table mechanism 3 and a2 nd chuck table mechanism 4 which are disposed on the stationary base 2 and hold a workpiece; and a1 st cutting mechanism 5 and a2 nd cutting mechanism 6 for performing cutting processing on the workpiece held by the 1 st chuck table mechanism 3 and the workpiece held by the 2 nd chuck table mechanism 4, respectively.
As shown in fig. 1 and 2, the 1 st chuck table mechanism 3 includes: a pair of X-axis guide rails 31, 31 arranged on the stationary base 2 along the machining feed direction (X-axis direction); a moving base 32 slidably disposed on the pair of X-axis guide rails 31, 31; a1 st chuck table 34 for holding a workpiece rotatably supported by a cylindrical support member 33 disposed on the movable base 32; and a1 st processing and feeding unit 35 for moving the moving base 32 on which the 1 st chuck table 34 is disposed along the pair of X-axis guide rails 31, 31 in a processing and feeding direction (X-axis direction). Continuing with the description with primary reference to fig. 2, the 1 st chuck table 34 has: a table main body 341 rotatably supported by the cylindrical support member 33; an adsorption plate 342 disposed on the upper surface of the table main body 341; and a jig 343 for fixing an annular frame for supporting a wafer as a workpiece to be processed, which will be described later, via a dicing tape. The table main body 341 is formed to have an outer diameter larger than an outer diameter of a wafer to be processed, which will be described later, and smaller than an inner diameter of an annular frame for supporting the wafer via a dicing tape. The suction plate 342 is made of porous ceramic, is connected to a suction unit not shown, and is applied with a negative pressure as appropriate. Therefore, the suction means, not shown, is operated to suck and hold the workpiece placed on the suction tray 342. The 1 st chuck table 34 is rotated by a pulse motor, not shown, disposed in the cylindrical support member 33.
The 1 st machining-feed unit 35 includes an outer screw 351, a bearing 352, and a pulse motor 353, the outer screw 351 being disposed in parallel between the pair of X-axis guides 31 and 31, the bearing 352 rotatably supporting one end of the outer screw 351, and the pulse motor 353 being coupled to the other end of the outer screw 351 and driving the outer screw 351 in the normal rotation or reverse rotation. In the 1 st cutting and feeding unit 35 configured as described above, the male screw 351 is screwed into a female screw, not shown, formed on the movable base 32. Therefore, the 1 st cutting feed unit 35 can move the 1 st chuck table 34 disposed on the moving base 32 along the pair of X-axis guide rails 31, 31 in the machining feed direction (X-axis direction) indicated by the arrow X in fig. 1 and 2 by driving the pulse motor 353 to drive the outer screw 351 in the normal rotation or reverse rotation. The 1 st processing and feeding unit 35 configured as described above positions the 1 st chuck table 34 in the 1 st carrying-in and carrying-out area a1 shown in fig. 1 and 2 where the object to be processed is carried in and out and the 1 st cutting area B1 where the 1 st cutting mechanism 5 is disposed in fig. 1.
The 2 nd chuck table mechanism 4 is disposed adjacent to the 1 st chuck table mechanism 3 in the Y axis direction, and is configured in the same manner as the 1 st chuck table mechanism 3. That is, as shown in fig. 1 and 2, the 2 nd chuck table mechanism 4 includes: a pair of X-axis guide rails 41, 41 disposed on the stationary base 2 along the machining feed direction (X-axis direction) in parallel with the pair of X-axis guide rails 31, 31 constituting the first chuck table mechanism 3; a moving base 42 slidably disposed on the pair of X-axis guide rails 41, 41; a2 nd chuck table 44 for holding a workpiece rotatably supported by a cylindrical support member 43 disposed on the movable base 42; and a2 nd machining feed unit 45 for moving the moving base 42 on which the 2 nd chuck table 44 is disposed along the pair of X-axis guide rails 41, 41 in a machining feed direction (X-axis direction). The 2 nd chuck table 44 has: a table main body 441 rotatably supported by the cylindrical support member 43; an adsorption plate 442 disposed on the upper surface of the table main body 441; and a jig 443 for fixing an annular frame for supporting a wafer as a workpiece to be processed, which will be described later, via a dicing tape. The table main body 441 is formed to have an outer diameter larger than an outer diameter of a wafer to be processed, which will be described later, and smaller than an inner diameter of an annular frame that supports the wafer via a dicing tape. The suction pad 442 is made of porous ceramic, is connected to a suction unit not shown, and is appropriately applied with a negative pressure. Therefore, the suction unit, not shown, is operated to suck and hold the workpiece placed on the suction tray 442. The 2 nd chuck table 44 is rotated by a pulse motor, not shown, disposed in the cylindrical support member 43.
As shown in fig. 1 and 2, the 2 nd processing and feeding unit 45 includes an outer screw 451, a bearing 452, and a pulse motor 453, the outer screw 451 is disposed in parallel between the pair of X-axis guide rails 41 and 41, the bearing 452 rotatably supports one end portion of the outer screw 451, and the pulse motor 453 is coupled to the other end portion of the outer screw 451 and drives the outer screw 451 in the normal rotation or reverse rotation. In the 2 nd cutting feed unit 45 configured as described above, the male screw 451 is screwed to a female screw, not shown, formed on the movable base 42. Therefore, the 2 nd cutting feed unit 45 can move the 2 nd chuck table 44 disposed on the moving base 42 along the pair of X-axis guide rails 41 and 41 in the machining feed direction indicated by the arrow X in fig. 1 and 2 by driving the outer screw 451 in the normal rotation or reverse rotation by driving the pulse motor 453, respectively. The 2 nd processing feeding unit 45 configured as described above positions the 2 nd chuck table 44 in the 1 st carrying-in/out area a1, the 2 nd carrying-in/out area a2 which is adjacent to a straight line in the Y axis direction and carries in and out the object to be processed, and the 2 nd cutting area B2 in which the 2 nd cutting mechanism 6 is disposed in fig. 1.
The 1 st chuck table mechanism 3 and the 2 nd chuck table mechanism 4 are disposed at positions point-symmetrical about an intermediate position between the 1 st carrying-in/out area a1 and the 2 nd carrying-in/out area a 2.
In the illustrated embodiment, the following example is shown: the pulse motor 353 of the 1 st processing feed unit 35 constituting the 1 st chuck table mechanism 3 and the pulse motor 453 of the 2 nd processing feed unit 45 constituting the 2 nd chuck table mechanism 4 are respectively disposed on the side (inner side in the X axis direction) opposite to the side on which the 1 st cutting mechanism 5 and the 2 nd cutting mechanism 6 are disposed, but the maintenance is good by disposing the pulse motor 353 and the pulse motor 453 on the side (outer side in the X axis direction) on which the 1 st cutting mechanism 5 and the 2 nd cutting mechanism 6 are disposed.
Next, the 1 st cutting mechanism 5 and the 2 nd cutting mechanism 6 will be described.
As shown in fig. 1, the 1 st cutting mechanism 5 includes a gate-shaped support frame 51 disposed in the 1 st cutting region B1 on the stationary base 2. The gate-shaped support frame 51 is composed of a1 st column part 511 and a2 nd column part 512, and a support part 513, the 1 st column part 511 and the 2 nd column part 512 are arranged with a gap in the Y-axis direction, the support part 513 connects the upper ends of the 1 st column part 511 and the 2 nd column part 512, and is arranged along an indexing direction (Y-axis direction) perpendicular to the machining feed direction indicated by an arrow X, and the gate-shaped support frame 51 is arranged across the 1 st chuck table mechanism 3.
The 1 st cutting unit 5a and the 2 nd cutting unit 5b are disposed on the outer side surface 513a of the support portion 513 of the gate-shaped support frame 51. Continuing with fig. 2, the 1 st cutting unit 5a and the 2 nd cutting unit 5b have an index moving base 52, a cutting moving base 53, and a spindle unit 54, respectively. Since the 1 st cutting unit 5a and the 2 nd cutting unit 5b have substantially the same configuration, the description will be given with reference to the reference numerals for the 1 st cutting unit 5 a. The indexing base 52 of the 1 st cutting unit 5a and the indexing base 52 of the 2 nd cutting unit 5b are respectively provided with a pair of guided grooves 520 and 520 to be fitted to a pair of Y-axis guides 510 and 510 provided on the outer side surface 513a of the support part 513, and the indexing base 52 can be moved along the pair of Y-axis guides 510 and 510 by fitting the pair of guided grooves 520 and 520 to the pair of Y-axis guides 510 and 510. Further, in the indexing base 52 of the 1 st cutting unit 5a and the indexing base 52 of the 2 nd cutting unit 5b, a relief groove 521 for preventing interference with an indexing-feed unit described later is formed on one surface facing the outer side surface 513a of the support portion 513. Further, a pair of Z- axis guide rails 522 and 522 are provided on the other surface of the indexing base 52 of the 1 st cutting unit 5a and the indexing base 52 of the 2 nd cutting unit 5b, respectively, in the cutting feed direction indicated by the arrow Z.
The cutting movement base 53 of the 1 st cutting unit 5a and the cutting movement base 53 of the 2 nd cutting unit 5b are provided with guided grooves, not shown, which are fitted to the pair of Z- axis guide rails 522 and 522 provided on the index movement base 52, respectively, and are configured such that the cutting movement base 53 can be moved in the cutting feed direction (Z-axis direction) indicated by the arrow Z along the pair of Z- axis guide rails 522 and 522 by fitting the guided grooves to the pair of Z- axis guide rails 522 and 522.
Continuing with fig. 2, the spindle unit 54 is attached to the lower surfaces of the cutting movement bases 53 of the 1 st cutting unit 5a and the 2 nd cutting unit 5b, respectively. The spindle unit 54 of the 1 st cutting unit 5a and the spindle unit 54 of the 2 nd cutting unit 5b each have: a main shaft housing 541; a rotation main shaft 542 rotatably supported by the main shaft housing 541; a cutting tool 543 attached to one end of the rotary spindle 542; and a servo motor, not shown, for rotationally driving the cutting water supply pipe 544 for supplying cutting water and the rotary spindle 542, wherein the spindle unit 54 of the 1 st cutting unit 5a and the spindle unit 54 of the 2 nd cutting unit 5b are arranged such that the axial direction of the rotary spindle 542 is positioned on a straight line in the index feed direction (Y-axis direction) indicated by an arrow Y. The cutting tool 543 of the spindle unit 54 constituting the 1 st cutting unit 5a and the cutting tool (not shown) of the spindle unit 54 constituting the 2 nd cutting unit 5b are arranged to face each other. Further, imaging means 540 for imaging a machining area of the workpiece held on the 1 st chuck table 34 is disposed on each of the spindle housings 541 of the spindle unit 54 constituting the 1 st cutting unit 5a and the spindle unit 54 constituting the 2 nd cutting unit 5b, and the imaging means 540 is disposed on each of the spindle housings 541.
The 1 st cutting unit 5a and the 2 nd cutting unit 5b of the illustrated embodiment include an index feeding unit 55, and the index feeding unit 55 moves the index moving base 52 in an index feeding direction (Y-axis direction) along the pair of Y- axis guide rails 510, 510. The indexing unit 55 is constituted by an outer screw 551, a bearing 552, and a pulse motor 553, the outer screw 551 is disposed in parallel between a pair of Y-axis guide rails 510, the bearing 552 rotatably supports one end of the outer screw 551, and the pulse motor 553 is connected to the other end of the outer screw 551 and drives the outer screw 551 in the normal or reverse direction. The male screw 551 is disposed at a height position corresponding to each relief groove 521 provided in the index movable base 52. In the indexing-feed unit 55 configured as described above, the male screw 551 is screwed into the female screw 523 formed in the indexing-movable base 52. Therefore, the index feeding unit 55 can move the index moving base 52 in the index feeding direction (Y-axis direction) along the pair of Y- axis guide rails 510, 510 by driving the outer screw 551 in the normal rotation or the reverse rotation by driving the pulse motor 553, respectively. When the index base 52 moves, the bearing 552 and the male screw 551 are inserted into the relief groove 521 provided in the index base 52, thereby allowing the index base 52 to move.
The 1 st cutting unit 5a and the 2 nd cutting unit 5b in the illustrated embodiment include a cutting feed unit 56, and the cutting feed unit 56 moves the cutting movement base 53 in a cutting feed direction (Z-axis direction) along a pair of Z- axis guide rails 522 and 522 provided on the index movement base 52. The incision feeding unit 56 is composed of an outer screw 561 disposed in parallel to the pair of Z- axis guide rails 522 and 522, bearings not shown for rotatably supporting one end of the outer screw 561, and a pulse motor 562 connected to the other end of the outer screw 561 for driving the outer screw 561 in forward or reverse rotation, respectively. In the incision feeding unit 56 configured as described above, the male screw 561 is screwed to a female screw (not shown) formed on the incision moving base 53. Therefore, the cutting feed unit 56 can drive the outer screw 561 in the normal rotation or reverse rotation by driving the pulse motor 562, respectively, and move the cutting movement base 53 in the cutting feed direction (Z-axis direction) along the pair of Z- axis guide rails 522 and 522.
Next, the 2 nd cutting mechanism 6 will be explained.
The 2 nd cutting mechanism 6 is disposed at a position point-symmetrical to the 1 st cutting mechanism 5 about an intermediate position between the 1 st carrying-in/out area a1 and the 2 nd carrying-in/out area a 2. The 2 nd cutting mechanism 6 disposed in this way includes: a gate-shaped support frame 61 disposed across the 2 nd chuck table mechanism 4; and a1 st cutting unit 6a and a2 nd cutting unit 6b disposed on an outer side surface 613a of the support portion 613 constituting the gate-shaped support frame 61. The gantry support frame 61 has substantially the same configuration as the gantry support frame 51 of the 1 st cutting mechanism 5, and the 1 st cutting unit 6a and the 2 nd cutting unit 6b have substantially the same configuration as the 1 st cutting unit 5a and the 2 nd cutting unit 5b of the 1 st cutting mechanism 5, and therefore, description thereof is omitted.
As described above, since the 1 st cutting mechanism 5 and the 2 nd cutting mechanism 6 are disposed at positions that are point-symmetrical about the intermediate position between the 1 st carrying-in/out region a1 and the 2 nd carrying-in/out region a2, the cutting apparatus can be configured to be compact without wasted space, and the access is good and the workability is improved when the operator performs replacement of the cutting tool.
As shown in fig. 1 and 2, the cutting apparatus in the illustrated embodiment includes a cleaning unit 7, and the cleaning unit 7 is disposed on a straight line in the Y axis direction connecting a1 st carrying-in/out region a1 where a1 st chuck table 34 is located and a2 nd carrying-in/out region a2 where a2 nd chuck table 44 is located. The cleaning unit 7 is constituted by a known spin cleaning mechanism that holds and cleans the workpiece cut by the 1 st cutting mechanism 5 on the 1 st chuck table 34 and the workpiece cut by the 2 nd cutting mechanism 6 on the 2 nd chuck table 44 on the spin table 71.
Continuing with the description with reference to fig. 1, the cutting apparatus in the illustrated embodiment includes a temporarily placing unit 8, and the temporarily placing unit 8 is disposed above the cleaning unit 7 and temporarily places the workpiece before the cutting process. As shown in fig. 3, the temporary placement means 8 is composed of 2 support rails 81 and 81, the cross section of the 2 support rails 81 and 81 is formed in an L shape, and support rail moving means 82 for supporting the base end portions of the 2 support rails 81 and moving the 2 support rails 81 and 81 in the direction of approaching to each other and in the direction of separating from each other. The 2 support rails 81, 81 are each composed of a horizontal portion 81a and a vertical portion 81b, and an annular frame for supporting a semiconductor wafer as a workpiece to be processed, which will be described later, is supported by the horizontal portion 81 a. The temporary placement unit 8 configured as described above can be adjusted by operating the support rail moving unit 82 so that the inside interval of the vertical portions 81b of the 2 support rails 81 and 81 corresponds to the outside diameter width of the annular frame described later and the inside interval of the horizontal portions 81a of the 2 support rails 81 and 81 is larger than the outside diameter width of the annular frame described later.
To continue the description with reference to fig. 1 and 3, a cassette placing unit 9 having a cassette table 91 is disposed adjacent to the temporary placing unit 8 in the X-axis direction, and the cassette table 91 places a cassette 10 (see fig. 1) containing a semiconductor wafer as a workpiece to be processed, which will be described later. The cassette table 91 of the cassette loading unit 9 is lifted and lowered by a lifting and lowering unit not shown. As shown in fig. 1, the cassette 10 mounted on the cassette table 91 has a plurality of mounting shelves for mounting semiconductor wafers W as objects to be processed before dicing, which are bonded to the front surfaces of the dicing tapes T mounted on the ring-shaped frame F. The cassette 10 for storing the semiconductor wafer W before cutting configured as described above is placed on the cassette table 91 of the cassette placing unit 9.
As will be described with reference to fig. 1 and 3, the cutting apparatus of the illustrated embodiment includes a carrying-in and carrying-out unit 11, and the carrying-in and carrying-out unit 11 carries out the semiconductor wafer W before cutting (hereinafter, simply referred to as the semiconductor wafer W) bonded to the front surface of the dicing tape T attached to the annular frame F housed in the cassette 10 placed on the cassette table 91 to the temporary storage unit 8, and carries the semiconductor wafer W as a workpiece cleaned as described later into the cassette 10 from the temporary storage unit 8. The carrying-in/out unit 11 includes: a transfer arm 111; a gripping member 112 disposed at the distal end of the transfer arm 111 toward the cassette loading unit 9; and a transfer arm moving unit 113 that supports the transfer arm 111 to be movable in the X-axis direction. The gripping member 112 is driven by air pressure supplied from an air cylinder, not shown, and grips the annular frame F. The transfer arm moving means 113 may employ a known operating mechanism, and the operating mechanism may be configured from, for example: a drive pulley driven by a pulse motor; a driven pulley disposed at a predetermined interval from the driving pulley; and an operating wire wound around the drive pulley and the driven pulley.
The cutting apparatus in the illustrated embodiment includes a conveying unit 12, and the conveying unit 12 conveys the workpiece before cutting, which is temporarily placed in the temporary placement unit 8, to the 1 st chuck table 34 positioned in the 1 st carry-in and carry-out area a1 and the 2 nd chuck table 44 positioned in the 2 nd carry-in and carry-out area a2, conveys the cleaned workpiece from the cleaning unit 7 to the temporary placement unit 8, and conveys the cut workpiece from the 1 st chuck table 34 positioned in the 1 st carry-in and carry-out area a1 and the 2 nd chuck table 44 positioned in the 2 nd carry-in and carry-out area a2 to the cleaning unit 7. The conveying unit 12 is constituted by a1 st conveying unit 13 and a2 nd conveying unit 14 in the illustrated embodiment. The 1 st conveying unit 13 includes: a transfer arm 131 formed such that a tip portion thereof protrudes downward; a support rod 132 disposed at a distal end portion of the transfer arm 131 so as to be movable in the vertical direction; 4 suction pads 133 attached to the lower ends of the support rods 132, for sucking and holding the annular frame F; and a transfer arm moving unit 134 supported by the transfer arm 131 to be movable in the Y-axis direction. The support rod 132 is moved in the vertical direction by an elevating means such as an air cylinder, not shown, disposed at the distal end of the transfer arm 131. The 2 nd conveying unit 14 has the same configuration as the 1 st conveying unit 13, and is disposed below the 1 st conveying unit 13 in the illustrated embodiment. The 2 nd conveying unit 14 includes, in the same manner as the 1 st conveying unit 13: a transfer arm 141 having a tip end portion protruding downward; a support rod 142 disposed at a distal end portion of the transfer arm 141 so as to be movable in the vertical direction; 4 suction pads 143 attached to the lower ends of the support rods 142 for sucking and holding the annular frame F; and a transfer arm moving unit 144 that supports the transfer arm 141 so as to be movable in the Y-axis direction. The support rod 142 is moved in the vertical direction by an elevating means such as an air cylinder, not shown, disposed at the distal end of the transfer arm 141.
As shown in fig. 1, the 1 st transport unit 13 and the 2 nd transport unit 14 configured as described above are arranged vertically, and 4 suction pads 133 and 143 are configured to move on a straight line connecting the 1 st carrying-in/out area a1 and the 2 nd carrying-in/out area a2 and the cleaning unit 7 in the Y-axis direction. In the illustrated embodiment, the 1 st transport unit 13 transports the workpiece before cutting, which is temporarily placed in the temporary placement unit 8, to the 1 st chuck table 34 positioned in the 1 st carry-in/out area a1 and the 2 nd chuck table 44 positioned in the 2 nd carry-in/out area a2, and transports the cleaned workpiece from the cleaning unit 7 to the temporary placement unit 8. On the other hand, the 2 nd transfer unit 14 transfers the cut workpiece from the 1 st chuck table 34 positioned in the 1 st carry-in/out area a1 and the 2 nd chuck table 44 positioned in the 2 nd carry-in/out area a2 to the cleaning unit 7. That is, the 2 nd conveying unit 14 has a function of conveying the machined object contaminated with the chips and the cutting water generated by the cutting process to the cleaning unit 7.
The 1 st conveying unit 13 and the 2 nd conveying unit 14 configured as described above are supported on the stationary base 2 by appropriate support means. The conveying arms 131 and 141 of the 1 st conveying unit 13 and the 2 nd conveying unit 14 are positioned at the standby position shown by the two-dot chain line in fig. 3 when the conveying operation is not performed.
The transfer arm moving units 134 and 144 of the 1 st transfer unit 13 and the 2 nd transfer unit 14 may use a known operating mechanism, and the known operating mechanism is configured by the following components as in the transfer arm moving unit 113 of the carry-in/out unit 11: a drive pulley driven by a pulse motor; a driven pulley disposed at a predetermined interval from the driving pulley; and an operating wire wound around the drive pulley and the driven pulley.
The cutting apparatus according to the illustrated embodiment is configured as described above, and the operation thereof will be described below mainly with reference to fig. 1.
In order to cut a semiconductor wafer as a workpiece by using the above-described cutting device, a cassette 10 is placed on a cassette table 91 of a cassette placing unit 9, and the cassette 10 stores a semiconductor wafer W before cutting bonded to the front surface of a dicing tape T attached to an annular frame F. Next, the transfer arm moving unit 113 of the carry-in/out unit 11 is operated to move the transfer arm 111 forward toward the cassette 10 placed on the cassette table 91, and the gripping member 112 disposed on the transfer arm 111 is operated to grip the annular frame F that supports the semiconductor wafer W stored in the cassette 10 at a predetermined position via the dicing tape T. After the ring-shaped frame F is gripped by the gripping member 112, the conveying arm moving means 113 is operated to move the conveying arm 111 backward toward the opposite side of the cassette 10, the ring-shaped frame F is carried out to the horizontal portions 81a of the 2 support rails 81 and 81 constituting the temporary placement means 8, the gripping state of the gripping member 112 is released, and the ring-shaped frame F is temporarily placed on the horizontal portions 81a of the 2 support rails 81 and 81. Then, the support rail moving means 82 of the temporary placement means 8 is operated to move the 2 support rails 81 and 81 in the direction of approaching each other, and the annular frame F is temporarily held by the vertical portion 81b, thereby performing positioning.
After the semiconductor wafer W is aligned in this way, the transfer arm moving unit 113 of the carry-in/out unit 11 is operated to further move the transfer arm 111 backward toward the opposite side of the cassette 10, and the semiconductor wafer W is isolated from the area of the temporary storage unit 8. Next, the transfer arm moving unit 134 of the 1 st transfer unit 13 is operated to position the suction pad 133 attached to the support rod 132 disposed on the transfer arm 131 above the semiconductor wafer W temporarily placed in the temporary placement unit 8. Then, the support rod 132 is moved downward to bring the suction pad 133 into contact with the upper surface of the ring-shaped frame F supporting the semiconductor wafer W via the dicing tape T, and the suction unit, not shown, is operated to suck and hold the ring-shaped frame F via the suction pad 133. After the annular frame F is sucked and held by the suction pad 133 in this way, the support rod 132 is moved upward, and the transfer arm moving means 134 is operated to transfer the annular frame F held by the suction pad 133 to the upper side of the 1 st chuck table 34 positioned in the 1 st carrying-in/out area a 1. Next, the support rod 132 is moved downward to place the semiconductor wafer W, which is supported by the ring-shaped frame F via the dicing tape T and is sucked and held by the suction pad 133, on the 1 st chuck table 34, and the suction and holding of the ring-shaped frame F by the suction pad 133 is released. By operating the suction unit, not shown, in this way, the semiconductor wafer W is sucked and held on the 1 st chuck table 34, and the semiconductor wafer W is supported by the ring-shaped frame F placed on the 1 st chuck table 34 via the dicing tape T. The annular frame F is fixed by a clamp 343.
While the semiconductor wafer W temporarily placed and aligned in the temporary placement unit 8 is being transported to the 1 st chuck table 34, the carry-in/out unit 11 is operated to carry out alignment while the semiconductor wafer W to be cut next, which is stored in the cassette 10 (in a state of being supported on the annular frame F via the dicing tape T), is carried out to the temporary placement unit 8. Therefore, the 1 st transfer unit 13 transfers the semiconductor wafer W temporarily placed and aligned in the temporary placement unit 8 to the 1 st chuck table 34, and then transfers the semiconductor wafer W subsequently transferred and aligned to the temporary placement unit 8 to the 2 nd chuck table 44. In this way, the suction unit, not shown, is operated to suck and hold the semiconductor wafer W on the 2 nd chuck table 44, and the semiconductor wafer W is supported by the ring-shaped frame F placed on the 2 nd chuck table 44 via the dicing tape T. The annular frame F is fixed by a jig 443.
After the semiconductor wafer W is sucked and held on the 1 st chuck table 34 and the 2 nd chuck table 44 as described above, the 1 st machining feed means 35 is operated to move the 1 st chuck table 34 to the 1 st cutting area B1 where the 1 st cutting mechanism 5 is disposed, and the 2 nd machining feed means 45 is operated to move the 2 nd chuck table 44 to the 2 nd cutting area B2 where the 2 nd cutting mechanism 6 is disposed. Then, the alignment operation is performed on the semiconductor wafer W held on the 1 st chuck table 34 positioned in the 1 st cutting area B1, and the processing area is detected by the imaging units 540 provided in the 1 st cutting unit 5a and the 2 nd cutting unit 5B constituting the 1 st cutting mechanism 5, respectively. Next, the cutting tools 543 of the 1 st cutting unit 5a and the 2 nd cutting unit 5B constituting the 1 st cutting mechanism 5 are operated to perform a predetermined cutting process on the semiconductor wafer W held on the 1 st chuck table 34 positioned in the 1 st cutting region B1. The semiconductor wafer W held on the 2 nd chuck table 44 positioned in the 2 nd cutting area B2 is subjected to the above-described alignment operation and predetermined cutting processing by the 1 st cutting unit 6a and the 2 nd cutting unit 6B constituting the 2 nd cutting mechanism 6.
As described above, in the cutting apparatus of the illustrated embodiment, the 2 cutting tools 543 of the 1 st cutting unit 5a and the 2 nd cutting unit 5B constituting the 1 st cutting mechanism 5 can be operated to perform cutting with respect to the semiconductor wafer W held on the 1 st chuck table 34 positioned in the 1 st cutting region B1, and the 2 cutting tools 6a and the 2 nd cutting unit 6B constituting the 2 nd cutting mechanism 6 can be operated to perform predetermined cutting with respect to the semiconductor wafer W held on the 2 nd chuck table 44 positioned in the 2 nd cutting region B2, whereby productivity can be further improved.
After the semiconductor wafer W held by the 1 st chuck table 34 and the semiconductor wafer W held by the 2 nd chuck table 44 are subjected to the predetermined cutting process as described above, the 1 st process feeding means 35 is operated to return the 1 st chuck table 34 to the 1 st carry-in/out area a1, and the 2 nd process feeding means 45 is operated to return the 2 nd chuck table 44 to the 2 nd carry-in/out area a 2. Next, the transfer arm moving unit 144 of the 2 nd transfer unit 14 is operated to position the suction pad 143 attached to the support rod 142 disposed on the transfer arm 141 above the semiconductor wafer W placed on the 1 st chuck table 34. Then, the support rod 142 is moved downward, the suction pad 143 is brought into contact with the upper surface of the annular frame F supporting the semiconductor wafer W via the dicing tape T, and the annular frame F is sucked and held by the suction pad 143. After the annular frame F is sucked and held by the suction pad 143 in this manner, the support rod 142 is moved upward, and the transfer arm moving unit 144 is operated to transfer the annular frame F held by the suction pad 143 to the upper side of the cleaning unit 7. Next, the support rod 142 is moved downward to place the semiconductor wafer W, which is sucked and held by the suction pad 143 and supported by the annular frame F via the dicing tape T, on the rotary table 71 of the cleaning unit 7, and the suction and holding of the annular frame F by the suction pad 143 is released. At this time, the interval between the inner sides of the horizontal portions 81a of the 2 support rails 81, 81 constituting the temporary placement unit 8 is enlarged to a size larger than the outer diameter width of the annular frame F. In this way, the semiconductor wafer W cut and carried to the rotary table 71 of the cleaning unit 7 is spin-cleaned.
The transfer arm 141 is positioned at a standby position shown by a two-dot chain line in fig. 3 with respect to the 2 nd transfer unit 14 that transfers the semiconductor wafer W cut as described above to the rotary table 71 of the cleaning unit 7.
After the semiconductor wafer W after the cutting process is cleaned in the cleaning unit 7 as described above, the transfer arm moving unit 134 of the 1 st transfer unit 13 is operated to position the suction pad 133 attached to the support rod 132 disposed on the transfer arm 131 above the semiconductor wafer W cleaned in the cleaning unit 7. Then, the support rod 132 is moved downward to bring the suction pad 133 into contact with the upper surface of the ring-shaped frame F supporting the semiconductor wafer W via the dicing tape T, and the suction unit, not shown, is operated to suck and hold the ring-shaped frame F via the suction pad 133. Then, the support rod 132 is moved upward to position the annular frame F sucked and held by the suction pad 133 above the 2 support rails 81 and 81 of the temporary placement unit 8. Next, after the inner space of the vertical portion 81b of the 2 support rails 81, 81 of the temporary placement unit 8 is adjusted to a size slightly wider than the outer diameter width of the annular frame F, the support rod 132 of the 1 st conveyance unit 13 is moved downward to place the annular frame F sucked and held by the suction pad 133 on the horizontal portions 81a of the 2 support rails 81, and the suction and holding of the suction pad 133 is released. After the ring-shaped frame F supporting the semiconductor wafer W by the dicing tape T is placed on the horizontal portions 81a of the 2 support rails 81, 81 of the temporary placement unit 8, the suction pad 133 of the 1 st transport unit 13 is separated from the temporary placement unit 8, and the carry-in/out unit 11 is operated to carry in and store the cleaned semiconductor wafer W to a predetermined position of the cassette 10.
In this way, after the semiconductor wafer W subjected to the cutting process and held on the 1 st chuck table 34 returned to the 1 st carry-in/out area a1 is transferred to the cleaning unit 7 and cleaned, and the cleaned semiconductor wafer W is carried into the predetermined position of the cassette 10 and stored, the 2 nd transfer unit 14 is operated to transfer the semiconductor wafer W subjected to the cutting process and held on the 2 nd chuck table 44 returned to the 2 nd carry-in/out area a2 to the cleaning unit 7. After the semiconductor wafer W after the cutting process carried to the cleaning unit 7 is cleaned in the cleaning unit 7, the 1 st carrying unit 13 is operated to carry the cleaned semiconductor wafer W to the temporary storage unit 8, and the carry-in/carry-out unit 11 is operated to carry the cleaned semiconductor wafer W carried to the temporary storage unit 8 to a predetermined position of the cassette 10 and store the wafer W.
As described above, in the illustrated embodiment, the 2 nd conveying unit 14 is used when conveying the workpiece contaminated with chips and cutting water generated by the cutting process from the 1 st chuck table 34 positioned in the 1 st carry-in and carry-out area a1 and the 2 nd chuck table 44 positioned in the 2 nd carry-in and carry-out area a2 to the cleaning unit 7, and the 1 st conveying unit 13 is used when conveying the other workpieces before the cutting process temporarily placed in the temporary placement unit 8 to the 1 st chuck table 34 positioned in the 1 st carry-in and carry-out area a1 and the 2 nd chuck table 44 positioned in the 2 nd carry-out and carry-in area a2 and conveying the cleaned workpiece from the cleaning unit 7 to the temporary placement unit 8, so that the annular frame F supporting the workpiece by the dicing tape T is not contaminated.
In order to reduce the time loss, it is preferable that the cleaning unit 7 cleans the cut semiconductor wafer W held on the 1 st chuck table 34, the carrying-in/out unit 11 is operated to carry out the semiconductor wafer W stored in the cassette 10 to the temporary storage unit 8, and the 1 st transfer unit 13 is operated to transfer the semiconductor wafer W carried out to the temporary storage unit 8 to the 1 st chuck table 34.
In order to reduce the time loss, it is preferable that the cleaning unit 7 cleans the semiconductor wafer W after the cutting process held on the 2 nd chuck table 44, the carrying-in/out unit 11 is operated to carry the semiconductor wafer W stored in the cassette 10 out to the temporary storage unit 8, and the 1 st transfer unit 13 is operated to transfer the semiconductor wafer W carried out to the temporary storage unit 8 to the 2 nd chuck table 44.
The present invention has been described above with reference to the illustrated embodiments, but the present invention is not limited to the embodiments and various modifications can be made within the scope of the present invention. For example, although the above-described embodiment shows an example in which the cutting device is implemented by a single body, even when the present invention is applied to a case in which an automation system is constructed by providing a plurality of devices along a conveying line as disclosed in, for example, japanese patent application laid-open No. 2015-8195, the 1 st cutting mechanism 5 and the 2 nd cutting mechanism 6 are disposed at positions point-symmetrical about the intermediate position between the 1 st carrying-in/out area a1 and the 2 nd carrying-in/out area a2, so that the present invention provides a good access and enables quick maintenance when an operator performs replacement of a cutting tool.

Claims (5)

1. A cutting device for cutting a workpiece, characterized in that,
the cutting device comprises:
a1 st chuck table and a2 nd chuck table which are configured to hold a workpiece, are movable in an X-axis direction as a machining feed direction, and are arranged adjacent to each other in a Y-axis direction perpendicular to the X-axis direction as an indexing feed direction;
a1 st cutting mechanism and a2 nd cutting mechanism which respectively perform cutting processing on the processed object held by the 1 st chuck table and the 2 nd chuck table; and
a cleaning unit for cleaning the processed object cut by the 1 st cutting mechanism and the 2 nd cutting mechanism,
the 1 st chuck table is configured to be positioned in a1 st carrying-in/out area where a workpiece is carried in/out and a1 st cutting area where the 1 st cutting mechanism is disposed, and the 2 nd chuck table is configured to be positioned in a2 nd carrying-in/out area where the workpiece is carried in/out and a2 nd cutting area where the 2 nd cutting mechanism is disposed adjacent to the 1 st carrying-in/out area on a straight line in a Y axis direction,
the 1 st cutting mechanism comprises a1 st cutting unit and a2 nd cutting unit, the 1 st cutting unit and the 2 nd cutting unit comprise 2 rotating spindles arranged on a straight line in the Y-axis direction and cutting tools respectively mounted on the opposite end parts of the 2 rotating spindles, the 2 nd cutting mechanism comprises a1 st cutting unit and a2 nd cutting unit, the 1 st cutting unit and the 2 nd cutting unit comprise 2 rotating spindles arranged on a straight line in the Y-axis direction and cutting tools respectively mounted on the opposite end parts of the 2 rotating spindles,
the 1 st cutting mechanism and the 2 nd cutting mechanism are arranged at positions point-symmetrical with respect to an intermediate position between the 1 st carrying-in/out area and the 2 nd carrying-in/out area,
the cleaning unit is arranged on a straight line in the Y-axis direction connecting the 1 st carrying-in and carrying-out area and the 2 nd carrying-in and carrying-out area.
2. The cutting apparatus of claim 1,
the cutting device includes a conveying unit that conveys the workpiece to the 1 st carry-in/out area, the 2 nd carry-in/out area, and the cleaning unit.
3. The cutting apparatus of claim 2,
the cutting device is provided with a temporary placing unit which is configured to be capable of adjusting the interval of 2 guide rails temporarily placing the processed object above the cleaning unit,
the conveying unit conveys the workpiece before cutting processing temporarily placed in the temporary placing unit to the 1 st chuck table positioned in the 1 st carry-in and carry-out area and the 2 nd chuck table positioned in the 2 nd carry-in and carry-out area, conveys the cleaned workpiece from the cleaning unit to the temporary placing unit, and conveys the workpiece after cutting processing to the cleaning unit from the 1 st chuck table positioned in the 1 st carry-in and carry-out area and the 2 nd chuck table positioned in the 2 nd carry-in and carry-out area.
4. The cutting apparatus of claim 3,
the carrying unit has a1 st carrying unit and a2 nd carrying unit,
the 1 st conveying unit conveys the workpiece before cutting processing temporarily placed in the temporary placement unit to the 1 st chuck table positioned in the 1 st carry-in/out area and the 2 nd chuck table positioned in the 2 nd carry-in/out area, and conveys the cleaned workpiece from the cleaning unit to the temporary placement unit,
the 2 nd conveying unit conveys the machined object after cutting to the cleaning unit from the 1 st chuck table positioned in the 1 st carry-in and carry-out area and the 2 nd chuck table positioned in the 2 nd carry-in and carry-out area.
5. The cutting device according to claim 3 or 4,
the cutting device is provided with a cassette table on which a cassette containing a workpiece is placed adjacent to the temporary placement unit in the X-axis direction, and with a carry-in and carry-out unit which moves forward and backward in the X-axis direction, carries out the workpiece before cutting contained in the cassette placed on the cassette table to the temporary placement unit, and carries the cleaned workpiece from the temporary placement unit into the cassette.
CN201611071041.5A 2015-11-30 2016-11-28 Cutting device Active CN107030902B (en)

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JP6560110B2 (en) 2019-08-14
TW201727820A (en) 2017-08-01
KR102463660B1 (en) 2022-11-03
JP2017103274A (en) 2017-06-08
CN107030902A (en) 2017-08-11
KR20170063379A (en) 2017-06-08

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