CN105132962A - High-concentration carbon pore solution applied to PCB boards and preparation method thereof - Google Patents
High-concentration carbon pore solution applied to PCB boards and preparation method thereof Download PDFInfo
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- CN105132962A CN105132962A CN201510540108.4A CN201510540108A CN105132962A CN 105132962 A CN105132962 A CN 105132962A CN 201510540108 A CN201510540108 A CN 201510540108A CN 105132962 A CN105132962 A CN 105132962A
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- pcb board
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Abstract
The invention discloses a high-concentration carbon pore solution applied to PCB boards and a preparation method thereof. The high-concentration carbon pore solution applied to PCB boards calculated according to the finally prepared high-concentration carbon pore solution applied to the PCB boards comprises the following components in percentage by weight: 5-10% of a conductive carbon material, 4-8% of a surfactant, 4-8% of an organic dispersant, 1-5% of a wetting agent, a pH regulator and the balance being water, wherein the consumption amount of the pH regulator is subject to the condition that the pH value of the high-concentration carbon pore solution applied to the PCB boards is adjusted to 9.5-10.5. The high-concentration carbon pore solution applied to the PCB boards is extremely high in conductivity, high in stability and high in effective concentration; the problem of deposition in the using process is avoided; meanwhile, the frequency for replacing tank liquid is reduced; and the high-concentration carbon pore solution applied to the PCB boards is non-toxic, pollution-free and environmentally-friendly.
Description
Technical field
The invention belongs to the hole metallization field of electroplating industry, be specifically related to a kind of for high density pcb board carbon pores liquid and preparation method thereof.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed circuit board, and also known as printed-wiring board (PWB), being important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.Because it adopts electron printing to make, therefore be called as " printing " circuit card.
Traditional pcb board hole metallization has come mainly through electroless copper, and its technical process is loaded down with trivial details, uses tin palladium colloid in process, make copper facing process expensive, and this technological process can cause environmental pollution, and therefore, carbon pores electroplating technology arises at the historic moment.
Carbon pores Direct Electroplating technology is the copper-plated a kind of novel process of substituted chemistry.The carbon dust that its use conductive capability is stronger or graphite are as electro-conductive material.Be characterized in simplifying the technique of hole metallization, save man-hour, reduce the consumption of material and effectively control the quantity discharged of waste water, reduce the production cost of pcb board.
But, along with people to product to go more and more higher, its composition and the requirement of aspect of performance also more and more higher.The particularly increase of aperture and plate thickness, causes the requirement of carbon pores liquid more and more higher.The preparation of lower concentration carbon pores liquid, can cause trouble in transport and use procedure, particularly must change tank liquor in use for some time, the tank liquor process more swapped out also can cause waste and the environmental pollution of resource.
Therefore, pcb board carbon pores liquid providing a kind of high conductivity, high density and preparation method thereof becomes extremely important.
Summary of the invention
The present invention is intended to for the deficiencies in the prior art, pcb board carbon pores liquid that a kind of high conductivity, high density are provided and preparation method thereof, the high density pcb board carbon pores solution utilizing the method to prepare metallizes, conductivity is better, it is convenient when carbon pores liquid consumes supply, tank liquor need not be changed frequently, not only safety and environmental protection but also simplify production technique, reduce the production cost of pcb board.
The present invention solves this technical problem adopted technical scheme: a kind of high density pcb board carbon pores liquid, calculates, conductive carbon material 5-10% with the described high density pcb board carbon pores liquid weight percent finally completed; Tensio-active agent 4-8%; Organic dispersing agent 4-8%; Wetting agent 1-5%, pH adjusting agent, water surplus; The amount that described pH adjusting agent uses is as the criterion for the pH value of described high density pcb board carbon pores liquid is adjusted to 9.5-10.5.
Wherein, the conductive carbon material that the present invention adopts, its primary particle diameter is little, is 10-50nm, has better dispersed and higher conductivity.Primary particle diameter is that the conductive carbon material of 10-50nm can exist in the mode of reuniting; particle after reunion can be micron-sized, the effect of adding physical mechanical under the synergy of organic dispersing agent and wetting agent the grain diameter of conductive carbon material is reached 100-200 nanometer is dispersed precipitates in the solution and not.Being preferably graphitized carbon black is: the one in F900A superconductive carbon black, CabotXC-72 graphitized carbon black.F900A in F900A superconductive carbon black is the model of superconductive carbon black.It is the carbon black materials of XC-72 that CabotXC-72 graphitized carbon black refers to the type kind that Cabot Co., Ltd of the U.S. produces and sell.
Further, described tensio-active agent is one or more in alkylphosphonic acid carboxylic acid and salt, alkyl sulfuric ester and salt thereof, is preferably 1-isobutyl-3,5-dimethylhexylphosphoric acid potassium, MOA-3PK and/or sodium lauryl sulphate.
Further, stating organic dispersing agent is one or more of vinylformic acid and its esters, is preferably sodium polyacrylate.
Further, wetting agent is preferably one or more in JFC, PEG600, PEG1000, fast T, polyethers.
Wherein, the chemical name of JFC is secondary sad polyoxyethylene acid or fatty alcohol-polyoxyethylene ether, and its chemical property is: be muddy shape when 5% aqueous solution is heated to more than 50 DEG C, reduces temperature and still can clarify.Cloud point 40 ~ 50 DEG C.Phenomenon of congealing is had during low temperature.Good stability, resistance to strong acid, alkali, hypochlorite, hard water and heavy metallic salt.Belong to nonionic surface active agent.To various fiber without avidity.The chemical name of fast T is disecoctylmaleate sodium sulfonate, for faint yellow to brown color viscous liquid.Polyethers is also known as polyglycol ether, and it is with oxyethane, propylene oxide, butylene oxide ring etc. for raw material, the simple linear polymer that open loop homopolymerization or copolymerization obtain under catalyst action.PEG600 and PEG1000, PEG refer to polyoxyethylene glycol, 600 and 1000 molecular-weight average referring to this polyoxyethylene glycol.
Further, described pH adjusting agent is sodium hydroxide-glycine, or, potassium hydroxide-glycine.
High density pcb board carbon pores liquid and preparation method thereof of the present invention, its step is as follows successively:
1) material A and material B is prepared,
The preparation of material A: be scattered in by the conductive carbon material of described deal in the wetting agent solution of described deal, soaks 12 hours, obtains described material A;
The preparation of material B: add pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) add described material A to described material B, after high-speed stirring is even, and continue stirring 2 hours, both obtain finished product.
Wherein, described step 2) in high-speed stirring be that 1200 revs/min of ground stir.
Compared with prior art, there is following positively effect: the present invention has prepared a kind of high density pcb board carbon pores liquid, and its conductivity is extremely strong, good stability, effective concentration are high, avoids settlement issues in use; And reduce the frequency changing tank liquor, nontoxic, pollution-free, environmentally friendly.This formula makes water-fast conductive carbon material evenly form one deck suspension by the combined action of wetting agent and organic dispersing agent, make the conductive carbon material particle diameter in suspension reach between 100-200 nanometer by the grinding of physical mechanical simultaneously, so can not sedimentation, good stability.Adjust conductive carbon material meeting uniform adsorption when producing printed circuit board (PCB) on hole wall by the electric charge of pre-treatment, after completing this operation, test resistance is had by oneself between 10-50 ohm, so conduct electricity very well.
Below in conjunction with drawings and Examples, the invention will be further described.
Accompanying drawing explanation
Fig. 1 is the DTV picture before high density pcb board carbon pores liquid of the present invention effect.
Fig. 2 is the DTV picture after high density pcb board carbon pores liquid of the present invention effect.
Fig. 3 is the DTV picture of the high Current Zone of Kazakhstan groove detection electroplating efficiency (1A electric current) of embodiment one.
Fig. 4 is the DTV picture in the low current district of Kazakhstan groove detection electroplating efficiency (1A electric current) of embodiment one.
Fig. 5 is the DTV picture of the high Current Zone of Kazakhstan groove detection electroplating efficiency (1A electric current) of embodiment two.
Fig. 6 is the DTV picture in the low current district of Kazakhstan groove detection electroplating efficiency (1A electric current) of embodiment two.
Embodiment
Embodiment one
The high density pcb board carbon pores liquid of the present embodiment one, calculate with the high density pcb board carbon pores liquid weight percent finally completed, its proportioning is:
Conductive carbon material: CabotXC-72 is 5%;
Tensio-active agent: sodium lauryl sulphate is 4%;
Organic dispersing agent: sodium polyacrylate is 6%;
Wetting agent: PEG600 is 1.6%;
PH adjusting agent: Glycine-NaOH;
Water surplus.
The step of the high density pcb board carbon pores liquid and preparation method thereof of preparation embodiment one is as follows:
1) material A and material B is prepared,
The preparation of material A: be scattered in by the conductive carbon material of described deal in the wetting agent solution of described deal, soaks 12 hours, obtains described material A;
The preparation of material B: add pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) add described material A to described material B, after high-speed stirring is even, and continue stirring 2 hours, both obtain finished product.
After diluting 5 times, the performance of the high density pcb board carbon pores liquid of embodiment one is assessed: this carbon pores liquid can stablize a not sedimentation in month, it is hole, high Current Zone 8 that Kazakhstan groove detects electroplating efficiency (1A electric current), hole, low current district 7, this DTV sheet under the 1A electric current condition of 10 minutes all on copper, as shown in Figure 3 and Figure 4.
It should be noted that, the amount that the pH adjusting agent of the present embodiment one uses, as long as be enough to the pH value of the high density pcb board carbon pores liquid of the present embodiment one to be adjusted to 9.5-10.5.
Embodiment two
The high density pcb board carbon pores liquid of the present embodiment two, calculate with the high density pcb board carbon pores liquid weight percent finally completed, its proportioning is:
Conductive carbon material: F900A superconductive carbon black is 10%;
Tensio-active agent: 1-isobutyl-3,5-dimethylhexylphosphoric acid potassium is 8%;
Organic dispersing agent: sodium lignosulfonate is 4%;
Wetting agent: polyethers is 2%;
PH adjusting agent: glycine-potassium hydroxide;
Water surplus.
The step of the high density pcb board carbon pores liquid and preparation method thereof of preparation embodiment two is as follows:
1) material A and material B is prepared,
The preparation of material A: be scattered in by the conductive carbon material of described deal in the wetting agent solution of described deal, soaks 12 hours, obtains described material A;
The preparation of material B: add pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) add described material A to described material B, after high-speed stirring is even, and continue stirring 2 hours, both obtain finished product.
After diluting 5 times, the performance of the high density pcb board carbon pores liquid of embodiment two is assessed: this carbon pores liquid can stablize a not sedimentation in month, it is hole, high Current Zone 8 that Kazakhstan groove detects electroplating efficiency (1A electric current), hole, low current district 7, this DTV sheet under the 1A electric current condition of 10 minutes all on copper, as shown in Figure 5 and Figure 6.
It should be noted that, the amount that the pH adjusting agent of the present embodiment two uses, as long as be enough to the pH value of the high density pcb board carbon pores liquid of the present embodiment two to be adjusted to 9.5-10.5.
Embodiment three
The high density pcb board carbon pores liquid of the present embodiment three, calculate with the high density pcb board carbon pores liquid weight percent finally completed, its proportioning is:
Conductive carbon material: F900A superconductive carbon black is 9%;
Tensio-active agent: sodium lauryl sulphate is 7%;
Organic dispersing agent: lignosulfonic acid potassium is 8%;
Wetting agent: JFC is 5%;
PH adjusting agent: Glycine-NaOH;
Water surplus.
The step of the high density pcb board carbon pores liquid and preparation method thereof of preparation embodiment three is as follows:
1) material A and material B is prepared,
The preparation of material A: be scattered in by the conductive carbon material of described deal in the wetting agent solution of described deal, soaks 12 hours, obtains described material A;
The preparation of material B: add pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) add described material A to described material B, after high-speed stirring is even, and continue stirring 2 hours, both obtain finished product.
After diluting 5 times, the performance of the high density pcb board carbon pores liquid of embodiment three is assessed: this carbon pores liquid can stablize a not sedimentation in month.
It should be noted that, the amount that the pH adjusting agent of the present embodiment three uses, as long as be enough to the pH value of the high density pcb board carbon pores liquid of the present embodiment three to be adjusted to 9.5-10.5.
Compared with prior art, there is following positively effect: the present invention has prepared a kind of high density pcb board carbon pores liquid, and its conductivity is extremely strong, good stability, effective concentration are high, avoids settlement issues in use; And reduce the frequency changing tank liquor, nontoxic, pollution-free, environmentally friendly.
The present invention is not limited to above-mentioned embodiment, if do not depart from the spirit and scope of the present invention to various change of the present invention or modification, if these are changed and modification belongs within claim of the present invention and equivalent technologies scope, then the present invention is also intended to comprise these change and modification.
Claims (8)
1. a high density pcb board carbon pores liquid, is characterized in that: calculate with the described high density pcb board carbon pores liquid weight percent finally completed, conductive carbon material 5-10%; Tensio-active agent 4-8%; Organic dispersing agent 4-8%; Wetting agent 1-5%, pH adjusting agent, water surplus; The amount that described pH adjusting agent uses is as the criterion for the pH value of described high density pcb board carbon pores liquid is adjusted to 9.5-10.5.
2. high density pcb board carbon pores liquid as claimed in claim 1, it is characterized in that: described conductive carbon material is graphitized carbon black, primary particle diameter is 10-50nm.
3. high density pcb board carbon pores liquid as claimed in claim 1, is characterized in that: described tensio-active agent is one or more in alkylphosphonic acid carboxylic acid and salt, alkyl sulfuric ester and salt thereof.
4. high density pcb board carbon pores liquid as claimed in claim 1, is characterized in that: described organic dispersing agent is macromolecule dispersing agent.
5. high density pcb board carbon pores liquid as claimed in claim 4, is characterized in that: described organic dispersing agent is one or more of vinylformic acid and its esters.
6. high density pcb board carbon pores liquid as claimed in claim 1, is characterized in that: described pH adjusting agent is sodium hydroxide-glycine, or, potassium hydroxide-glycine.
7. high density pcb board carbon pores liquid as claimed in claim 1, is characterized in that: described wetting agent is the one in JFC, fast T, polyethers.
8. the high density pcb board preparation method of carbon pores liquid described in any one of claim 1 to 7, its step is as follows successively:
1) preparation of material A, is scattered in the wetting agent solution of described deal by the conductive carbon material of described deal, soak 12 hours, obtain described material A;
The preparation of material B, adds pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) described material B mixes with material A, stirs, and both obtains finished product.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106319604A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Blackhole solution formula |
| CN107740145A (en) * | 2017-10-16 | 2018-02-27 | 广州市天承化工有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
| CN108323036A (en) * | 2018-02-10 | 2018-07-24 | 深圳市祥盛兴科技有限公司 | A kind of blank hole liquid and black holes chemical industry skill |
| CN108834309A (en) * | 2018-08-30 | 2018-11-16 | 陈伟元 | A kind of graphene metallization solution and the preparation method and application thereof |
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| JPH09118996A (en) * | 1995-08-23 | 1997-05-06 | Mec Kk | Electroplating method |
| CN103173824A (en) * | 2013-03-01 | 2013-06-26 | 溧阳市新力机械铸造有限公司 | Black hole solution for printed circuit board |
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2015
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| CN1063395A (en) * | 1991-01-10 | 1992-08-05 | 机械电子工业部第十五研究所 | The non-chemical plating hole metallizing process-hole blackening method |
| JPH09118996A (en) * | 1995-08-23 | 1997-05-06 | Mec Kk | Electroplating method |
| CN103173824A (en) * | 2013-03-01 | 2013-06-26 | 溧阳市新力机械铸造有限公司 | Black hole solution for printed circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106319604A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Blackhole solution formula |
| CN107740145A (en) * | 2017-10-16 | 2018-02-27 | 广州市天承化工有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
| CN108323036A (en) * | 2018-02-10 | 2018-07-24 | 深圳市祥盛兴科技有限公司 | A kind of blank hole liquid and black holes chemical industry skill |
| CN108834309A (en) * | 2018-08-30 | 2018-11-16 | 陈伟元 | A kind of graphene metallization solution and the preparation method and application thereof |
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