CN105177661A - High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution - Google Patents
High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution Download PDFInfo
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- CN105177661A CN105177661A CN201510540151.0A CN201510540151A CN105177661A CN 105177661 A CN105177661 A CN 105177661A CN 201510540151 A CN201510540151 A CN 201510540151A CN 105177661 A CN105177661 A CN 105177661A
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- pcb board
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- carbon pores
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Abstract
The invention discloses high-concentration carbon pore solution for a PCB and a preparation method of the high-concentration carbon pore solution, wherein the high-concentration carbon pore solution comprises the following components according to the weight percentage of the finally completed high-concentration carbon pore solution for the PCB: 5-9% of conductive black, 4-8% of a surfactant, 4-8% of an organic dispersing agent, 1-5% of a wetting agent, a pH modifier and the balance of water; the usage amount of the pH modifier is based on the standard of adjusting the pH value of the high-concentration carbon pore solution to 9.5-10.5. The high-concentration carbon pore solution is excessively high in conductivity, excellent in stability, high in effective concentration, non-toxic, pollution-free and environment-friendly, avoids the sedimentation problem during the using process, and reduces the frequency for changing tank liquor.
Description
Technical field
The invention belongs to the hole metallization field of electroplating industry, pcb board carbon pores liquid being specifically related to a kind of high density and preparation method thereof.
Background technology
Traditional pcb board hole metallization has come mainly through electroless copper, and its technical process is loaded down with trivial details, uses tin palladium colloid in process, make copper facing process expensive, and this technological process can cause environmental pollution, and therefore, carbon pores electroplating technology arises at the historic moment.
Carbon pores Direct Electroplating technology is the copper-plated a kind of novel process of substituted chemistry.The carbon dust that its use conductive capability is stronger or graphite are as electro-conductive material.Be characterized in simplifying the technique of hole metallization, save man-hour, reduce the consumption of material and effectively control the quantity discharged of waste water, reduce the production cost of pcb board.
But, along with people to product to go more and more higher, its composition and the requirement of aspect of performance also more and more higher.The particularly increase of aperture and plate thickness, causes the requirement of carbon pores liquid more and more higher.The preparation of lower concentration carbon pores liquid, can cause trouble in transport and use procedure, particularly must change tank liquor in use for some time, the tank liquor process more swapped out also can cause waste and the environmental pollution of resource.
Therefore, pcb board carbon pores liquid providing a kind of high conductivity, high density and preparation method thereof becomes extremely important.
Summary of the invention
The present invention is intended to for the deficiencies in the prior art, pcb board carbon pores liquid that a kind of high conductivity, high density are provided and preparation method thereof, the pcb board carbon pores solution of the high density utilizing the method to prepare metallizes, conductivity is better, it is convenient when carbon pores liquid consumes supply, tank liquor need not be changed frequently, not only safety and environmental protection but also simplify production technique, reduce the production cost of pcb board.
The present invention solves this technical problem adopted technical scheme: a kind of pcb board carbon pores liquid of high density, calculates, graphitized carbon black 5-9% with the pcb board carbon pores liquid weight percent of the described high density finally completed; Tensio-active agent 4-8%; Organic dispersing agent 4-8%; Wetting agent 1-5%, pH adjusting agent, water surplus; The pH value that the amount that described pH adjusting agent uses is the pcb board carbon pores liquid by described high density is adjusted to 9.5-10.5 and is as the criterion.
Wherein, the graphitized carbon black that the present invention adopts, its primary particle diameter is little, is 10-50nm, has better dispersed and higher conductivity.Primary particle diameter is that the graphitized carbon black of 10-50nm can exist in the mode of reuniting; particle after reunion can be micron-sized, the effect of adding physical mechanical under the synergy of organic dispersing agent and wetting agent the grain diameter of graphitized carbon black is reached 100-200 nanometer is dispersed precipitates in the solution and not.Be preferably: the one in F900A superconductive carbon black, CabotXC-72 graphitized carbon black.F900A in F900A superconductive carbon black is the model of superconductive carbon black.It is the carbon black materials of XC-72 that CabotXC-72 graphitized carbon black refers to the type kind that Cabot Co., Ltd of the U.S. produces and sell.
Further, described tensio-active agent is one or more of alkyl polyoxyethylene ether phosphoric acid ester and salt thereof.Tensio-active agent is preferably alkylphenol polyoxyethylene phosphoric acid ester potassium.
Further, described organic dispersing agent be esters of acrylic acid, acrylic amide one or more.Organic dispersing agent is preferably, acrylate and/or polyacrylamide sylvite.
Further, wetting agent is preferably one or more in JFC, PEG600, PEG1000, fast T, polyethers.
Wherein, the chemical name of JFC is secondary sad polyoxyethylene acid or fatty alcohol-polyoxyethylene ether, and its chemical property is: be muddy shape when 5% aqueous solution is heated to more than 50 DEG C, reduces temperature and still can clarify.Cloud point 40 ~ 50 DEG C.Phenomenon of congealing is had during low temperature.Good stability, resistance to strong acid, alkali, hypochlorite, hard water and heavy metallic salt.Belong to nonionic surface active agent.To various fiber without avidity.The chemical name of fast T is disecoctylmaleate sodium sulfonate, for faint yellow to brown color viscous liquid.Polyethers is also known as polyglycol ether, and it is with oxyethane, propylene oxide, butylene oxide ring etc. for raw material, the simple linear polymer that open loop homopolymerization or copolymerization obtain under catalyst action.PEG600 and PEG1000, PEG refer to polyoxyethylene glycol, 600 and 1000 molecular-weight average referring to this polyoxyethylene glycol.
Further, described pH adjusting agent is boric acid-sodium hydroxide, or, the one in boric acid-borax system.
The pcb board carbon pores liquid and preparation method thereof of high density of the present invention, its step is as follows successively:
1) material A and material B is prepared,
The preparation of material A: be scattered in by the graphitized carbon black of described deal in the wetting agent solution of described deal, soaks 12 hours, obtains described material A;
The preparation of material B: add pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) add described material A to described material B, after high-speed stirring is even, and continue stirring 2 hours, both obtain finished product.
Wherein, described step 2) in high-speed stirring be that 1200 revs/min of ground stir.
Compared with prior art, there is following positively effect: the present invention has prepared a kind of pcb board carbon pores liquid of high density, and its conductivity is extremely strong, good stability, effective concentration are high, avoids settlement issues in use; And reduce the frequency changing tank liquor, nontoxic, pollution-free, environmentally friendly.This formula makes water-fast graphitized carbon black evenly form one deck suspension by the combined action of wetting agent and organic dispersing agent, make the graphitized carbon black particle diameter in suspension reach between 100-200 nanometer by the grinding of physical mechanical simultaneously, so can not sedimentation, good stability.Adjust graphitized carbon black meeting uniform adsorption when producing printed circuit board (PCB) on hole wall by the electric charge of pre-treatment, after completing this operation, test resistance is had by oneself between 10-50 ohm, so conduct electricity very well.
Below in conjunction with drawings and Examples, the invention will be further described.
Accompanying drawing explanation
Fig. 1 is the DTV picture before the pcb board carbon pores liquid effect of high density of the present invention.
Fig. 2 is the DTV picture after the pcb board carbon pores liquid effect of high density of the present invention.
Fig. 3 is the DTV picture of the high Current Zone of Kazakhstan groove detection electroplating efficiency (1A electric current) of embodiment one.
Fig. 4 is the DTV picture in the low current district of Kazakhstan groove detection electroplating efficiency (1A electric current) of embodiment one.
Fig. 5 is the DTV picture of the high Current Zone of Kazakhstan groove detection electroplating efficiency (1A electric current) of embodiment two.
Fig. 6 is the DTV picture in the low current district of Kazakhstan groove detection electroplating efficiency (1A electric current) of embodiment two.
Embodiment
The high density pcb board carbon pores liquid of the present embodiment one, calculate with the high density pcb board carbon pores liquid weight percent finally completed, its proportioning is:
Graphitized carbon black: CabotXC-72 is 5%;
Tensio-active agent: alkylphenol polyoxyethylene phosphoric acid ester potassium is 4%;
Organic dispersing agent: acrylate is 6%;
Wetting agent: PEG600 is 1.6%;
PH adjusting agent: boric acid-sodium hydroxide;
Water surplus.
The step of the pcb board carbon pores liquid and preparation method thereof of the high density of preparation embodiment one is as follows:
1) material A and material B is prepared,
The preparation of material A: be scattered in by the graphitized carbon black of described deal in the wetting agent solution of described deal, soaks 12 hours, obtains described material A;
The preparation of material B: add pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) add described material A to described material B, after high-speed stirring is even, and continue stirring 2 hours, both obtain finished product.
After diluting 5 times, the performance of the pcb board carbon pores liquid of the high density of embodiment one is assessed: this carbon pores liquid can stablize a not sedimentation in month, it is hole, high Current Zone 8 that Kazakhstan groove detects electroplating efficiency (1A electric current), hole, low current district 7, this DTV sheet under the 1A electric current condition of 10 minutes all on copper, as shown in Figure 3 and Figure 4.
Embodiment two
The pcb board carbon pores liquid of the high density of the present embodiment two, calculate with the high density pcb board carbon pores liquid weight percent finally completed, its proportioning is:
Graphitized carbon black: F900A superconductive carbon black is 9%;
Tensio-active agent: alkyl polyoxyethylene ether phosphoric acid ester is 8%;
Organic dispersing agent: polyacrylamide potassium is 4%;
Wetting agent: polyethers is 2%;
PH adjusting agent: boric acid-borax;
Water surplus.
The step of the pcb board carbon pores liquid and preparation method thereof of the high density of preparation embodiment two is as follows:
1) material A and material B is prepared,
The preparation of material A: be scattered in by the graphitized carbon black of described deal in the wetting agent solution of described deal, soaks 12 hours, obtains described material A;
The preparation of material B: add pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) add described material A to described material B, after high-speed stirring is even, and continue stirring 2 hours, both obtain finished product.
After diluting 5 times, the performance of the high density pcb board carbon pores liquid of embodiment two is assessed: this carbon pores liquid can stablize a not sedimentation in month, it is hole, high Current Zone 8 that Kazakhstan groove detects electroplating efficiency (1A electric current), hole, low current district 7, this DTV sheet under the 1A electric current condition of 10 minutes all on copper, as shown in Figure 5 and Figure 6.
It should be noted that, the amount that the pH adjusting agent of the present embodiment two uses, as long as be enough to the pH value of the high density pcb board carbon pores liquid of the present embodiment two to be adjusted to 9.5-10.5.
Embodiment three
The pcb board carbon pores liquid of the high density of the present embodiment three, calculate with the high density pcb board carbon pores liquid weight percent finally completed, its proportioning is:
Graphitized carbon black: F900A superconductive carbon black is 7%;
Tensio-active agent: alkylphenol polyoxyethylene sodium phosphate is 6%;
Organic dispersing agent: polyacrylamide potassium is 8%;
Wetting agent: JFC is 5%;
PH adjusting agent: boric acid-borax;
Water surplus.
The step of the pcb board carbon pores liquid and preparation method thereof of the high density of preparation embodiment three is as follows:
1) material A and material B is prepared,
The preparation of material A: be scattered in by the graphitized carbon black of described deal in the wetting agent solution of described deal, soaks 12 hours, obtains described material A;
The preparation of material B: add pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) add described material A to described material B, after high-speed stirring is even, and continue stirring 2 hours, both obtain finished product.
Assess the performance of the high density pcb board carbon pores liquid of embodiment three after diluting 5 times: this carbon pores liquid can stablize a not sedimentation in month, it is hole, high Current Zone 8 that Kazakhstan groove detects electroplating efficiency (1A electric current), hole, low current district 7.
It should be noted that, the amount that the pH adjusting agent of the present embodiment three uses, as long as be enough to the pH value of the high density pcb board carbon pores liquid of the present embodiment three to be adjusted to 9.5-10.5.
Compared with prior art, there is following positively effect: the present invention has prepared a kind of pcb board carbon pores liquid of high density, and its conductivity is extremely strong, good stability, effective concentration are high, avoids settlement issues in use; And reduce the frequency changing tank liquor, nontoxic, pollution-free, environmentally friendly.
The present invention is not limited to above-mentioned embodiment, if do not depart from the spirit and scope of the present invention to various change of the present invention or modification, if these are changed and modification belongs within claim of the present invention and equivalent technologies scope, then the present invention is also intended to comprise these change and modification.
Claims (8)
1. the pcb board of a high density carbon pores liquid, is characterized in that: calculate with the pcb board carbon pores liquid weight percent of the described high density finally completed, graphitized carbon black 5-9%; Tensio-active agent 4-8%; Organic dispersing agent 4-8%; Wetting agent 1-5%, pH adjusting agent, water surplus; The pH value that the amount that described pH adjusting agent uses is the pcb board carbon pores liquid by described high density is adjusted to 9.5-10.5 and is as the criterion.
2. the pcb board of high density carbon pores liquid as claimed in claim 1, is characterized in that: the primary particle diameter of described graphitized carbon black is 10-50nm.
3. high dense pcb board carbon pores liquid as claimed in claim 1, is characterized in that: described tensio-active agent is one or more of alkyl polyoxyethylene ether phosphoric acid ester and salt thereof.
4. the pcb board of high density carbon pores liquid as claimed in claim 1, is characterized in that: described organic dispersing agent is macromolecule dispersing agent.
5. the pcb board of high density carbon pores liquid as claimed in claim 4, is characterized in that: described organic dispersing agent be esters of acrylic acid, acrylic amide one or more.
6. the pcb board of high density carbon pores liquid as claimed in claim 1, is characterized in that: described pH adjusting agent is boric acid-sodium hydroxide, or, the one in boric acid-borax system.
7. the pcb board of high density carbon pores liquid as claimed in claim 1, is characterized in that: described wetting agent is the one in JFC, fast T, polyethers.
8. the pcb board preparation method of carbon pores liquid of high density described in any one of claim 1 to 7, its step is as follows successively:
1) preparation of material A, is scattered in the wetting agent solution of described deal by the graphitized carbon black of described deal, soak 12 hours, obtain described material A;
The preparation of material B, adds pH adjusting agent in the surfactant soln of described deal, after adjust ph to 9.5-10.5, adds the organic dispersing agent of described deal, stirs into clear solution, obtains described material B;
2) described material B mixes with material A, stirs, and both obtains finished product.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510540151.0A CN105177661A (en) | 2015-08-28 | 2015-08-28 | High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution |
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| CN201510540151.0A CN105177661A (en) | 2015-08-28 | 2015-08-28 | High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106319604A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Blackhole solution formula |
| CN106535505A (en) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | Black hole solution for manufacturing printed board |
| CN108834309A (en) * | 2018-08-30 | 2018-11-16 | 陈伟元 | A kind of graphene metallization solution and the preparation method and application thereof |
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| CN1063395A (en) * | 1991-01-10 | 1992-08-05 | 机械电子工业部第十五研究所 | The non-chemical plating hole metallizing process-hole blackening method |
| JPH09118996A (en) * | 1995-08-23 | 1997-05-06 | Mec Kk | Electroplating method |
| CN103173824A (en) * | 2013-03-01 | 2013-06-26 | 溧阳市新力机械铸造有限公司 | Black hole solution for printed circuit board |
| CN104818506A (en) * | 2015-05-28 | 2015-08-05 | 哈尔滨工业大学 | Solution for metalizing printed circuit board hole |
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2015
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1063395A (en) * | 1991-01-10 | 1992-08-05 | 机械电子工业部第十五研究所 | The non-chemical plating hole metallizing process-hole blackening method |
| JPH09118996A (en) * | 1995-08-23 | 1997-05-06 | Mec Kk | Electroplating method |
| CN103173824A (en) * | 2013-03-01 | 2013-06-26 | 溧阳市新力机械铸造有限公司 | Black hole solution for printed circuit board |
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Non-Patent Citations (1)
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106319604A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Blackhole solution formula |
| CN106535505A (en) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | Black hole solution for manufacturing printed board |
| CN106535505B (en) * | 2016-11-23 | 2019-04-02 | 昆山尚宇电子科技有限公司 | Blank hole liquid for printed board manufacture |
| CN108834309A (en) * | 2018-08-30 | 2018-11-16 | 陈伟元 | A kind of graphene metallization solution and the preparation method and application thereof |
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