CN101631427B - Method for plating thick gold layer in circuit board manufacturing process - Google Patents
Method for plating thick gold layer in circuit board manufacturing process Download PDFInfo
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- CN101631427B CN101631427B CN2008101416127A CN200810141612A CN101631427B CN 101631427 B CN101631427 B CN 101631427B CN 2008101416127 A CN2008101416127 A CN 2008101416127A CN 200810141612 A CN200810141612 A CN 200810141612A CN 101631427 B CN101631427 B CN 101631427B
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Abstract
The invention discloses a method for plating a gold thick layer in a circuit board manufacturing process, which comprises the following steps of: A, firstly, subjecting a circuit board to pattern tin plating, circuit wire etching, solder-mask printing and chemical nickel and gold processing treatments of depositing a nickel layer and depositing a gold layer; B, carrying out the anti-oxidation post treatment of the circuit board subjected to the chemical nickel and gold processing treatments; C, covering a non-gold plated area of the circuit board; and D, after pre-treating the surface of the circuit board, plating the thick gold layer on a lead of the circuit board by a post drawing process. The invention provides a method for plating thick gold layer in the circuit board manufacturing process, which has advantages of pollution prevention, environment protection, gold salt conservation, good quality and easily controllable gold color.
Description
Technical field
The present invention relates to a kind of circuit board gold plating method, relate in particular to the thick golden method of plating in a kind of circuit board making process.
Background technology
At present, the printing of common circuit plate is to adopt the oil sealing of a nickel gold to plate thick technology for gold, as shown in Figure 1, its key step is nickel gold, two-sided envelope wet film, a gold-plated pre-treatment, plates thick gold, wherein, a) nickel plating gold is to form containing in the plating bath of halogen, contains halogen plating bath contaminated environment; B), two-sided envelope wet film is along with the thick increase of gold, poor, the easily plating of anti-plate; C), since two-sided envelope wet film along with the prolongation of gold-plated time, wet film is dissolved in gold plating liquid, pollutes golden cylinder, makes goldenly in the gold-plated process to be difficult to control; D), the thick golden pre-treatment of plating is polish-brush, so has the phenomenon of wet film.
Summary of the invention
The technical problem to be solved in the present invention is, at the above-mentioned defective of prior art, provide a kind of environment friendly and pollution-free, save the thick golden method of plating in golden salt, good, the golden manageable circuit board making process of quality.
The technical solution adopted for the present invention to solve the technical problems is: the thick golden method of the plating in a kind of circuit board making process may further comprise the steps:
A, the chemical nickel and gold of at first substrate of circuit board being carried out pattern tin plating, etched circuit line, solder-mask printing, heavy nickel dam, turmeric layer are handled;
B, the circuit board after the chemical nickel and gold is carried out anti-oxidation reprocessing;
C, covering treatment is carried out in the non-gold-plated zone of circuit board;
D, to after the circuit board surface preliminary treatment, circuit board is carried out the post-tensioning bus bar plates thick gold.
The thick golden method of plating in the circuit board making process, in the steps A, the step of preferred described pattern tin plating is:
A1, open on the circuit board of material and hole, the heavy copper facing of circuit board;
After b1, the heavy copper facing, carry out figure transfer;
C1 and then heavy copper facing;
D1, to the pattern tin plating on the circuit board.
The thick golden method of plating in the circuit board making process, in the steps A, most preferably the step of described pattern tin plating is:
A1, open the heavy copper facing in boring back on the circuit board of material, wherein circuit board is immersed copper facing in the copper plating bath, copper plating bath CU
2+Concentration is: contain the CU that 60-80 restrains in every liter of solution
2+, CL
-: 40-80ppm contains H in per 100 liters of solution
2SO
4The 8-12 liter;
After b1, the heavy copper facing, nog plate is carried out pre-treatment, print wet film again or paste dry film, bake plate, contraposition then, go out figure after described wet film or dry film are exposed, develop;
C1 and then electro-coppering;
D1, to the pattern tin plating on the circuit board: after handling through the circuit board pickling of electroplating once more, it is zinc-plated to put into electric tin cylinder energising, wherein in the tin plating electrolyte, contains the SN of 20-30 gram in every liter of solution
2+, per 100 liters of solution contain 8-12 gram sulfuric acid.
The thick golden method of plating in the circuit board making process, in the steps A, the step of preferred described etched circuit line is:
A2, to the circuit board after the pattern tin plating under 40～60 ℃ of temperature, the sodium hydroxide solution with 5～10% moves back warm film or dry film;
B2, then under 45～55 ℃, to circuit board etched circuit line, in the etching liquid, every liter of solution contains 180-190 gram chloride ion, 130-150 restrains copper ion;
C2, move back tin: circuit board is put into moved back the tin cylinder, swing is moved back tin by tin stripping liquid gently, and tin-stripping solution is with nitric acid and to protect copper liquid be the aqueous solution that primary raw material is formed;
D2, nog plate: will move back the circuit board that tin finishes and put into clear water, and open the Plate grinder nog plate, the Plate grinder nog plate finishes, and changes the QC room over to through visual examination.
The thick golden method of plating in the circuit board making process, in the steps A, the step of preferred described solder-mask printing is:
A3, naked circuit board is carried out nog plate handle: at first naked circuit board is carried out pickling, then in template machine nog plate, nog plate after washing, oven dry;
B3, printing: circuit board seal green oil after nog plate handled or dirty oil, white oil, left standstill 15 minutes then;
C3, drying-plate: the plate after the printing is changed over to baking box, under 75 ℃ ± 2 ℃, roasting 15 minutes～25 minutes;
D3, contraposition: the plate after the baking changes the contraposition room over to, and the inspection film is windowed and is fixed on the location hole;
E3, development: in developing machine, put into circuit board and develop development after washing, oven dry.The thick golden method of plating in the circuit board making process, in the steps A, the step of preferred described heavy nickel dam is:
A4, to circuit board brush board cleaning, and immerse the acid solution oil removing, washing;
After b4, the circuit board washing, working concentration is the sodium peroxydisulfate solution microetch circuit board of 30-50g/L;
C4, to the circuit board after microetch washing, activate in advance then;
After d4, the pre-activation, preactivated plate is put into immerse in the solution of palladium sulfate and activated in 1-2 minute;
After e4, the activation, under 80-85 ℃ of temperature, be 4.6-5.2, Ni at PH
2+Concentration is: heavy nickel dam in the plating bath of 4.6-5.2g/L.
Among the thick golden method step A of plating in the circuit board making process, preferred described turmeric layer step is: finish the back pure water at heavy nickel dam and clean, under 80-90 ℃ temperature, the plate that cleans through pure water is put into constantly swing turmeric layer of turmeric cylinder, turmeric finishes, and pure water is clean dries.
The thick golden method of plating in the circuit board making process, preferred among the step B: it is 30-60 second in 15% the sulfuric acid solution that circuit board is immersed concentration, and washing uses 1000-1200 order brush gently to grind then, washing again, 90 ± 10 ℃ of oven dry down.
The thick golden method of plating in the circuit board making process, preferred among the step C: as C, covering treatment to be carried out in the non-gold-plated zone of circuit board; Open adhesive-tape application machine, put into circuit board, plate thick golden reverse side in the part and tape, circuit board was inserted frame after rubberizing was finished.
The thick golden method of plating in the circuit board making process preferably includes following steps among the step D:
After the circuit board surface preliminary treatment, circuit board is carried out the post-tensioning bus bar plate thick gold.
D1, to plating Hou Jin district nog plate: carry out nog plate through 1000-1200 order brush, wash then, dry, slotting frame;
D2, the circuit board behind the nog plate is sandwiched on the Electropolating hangers, puts in the citric acid together with hanger and immerse the several seconds;
D3, begin to plate first thick gold: hanger is clipped on the negative electrode of electric thick gold and switches on, setting-up time is electroplated;
D4, first plate Thickness Measurement by Microwave: to putting into the thickness of surveying metal instrumentation build-in test gold after first plate oven dry of plating thick gold, to gold-plated not enough, adjust electroplating time, it is thick qualified to survey gold again, produces in batches.
The present invention is because a nickel plating gold changes chemical nickel and gold into, so whole process is the flow process of product whole world environmental protection; Because two-sided oil sealing changes into and taping, so anti-plate is good, not plating; Because hide non-plating district in invention with adhesive tape, utmost point anti-plate does not pollute golden plating bath, so easy to control in the thick golden process gold of plating; Processing before the thick gold of plating is moulding band operation wherein, its method is to open the running of pressing Plate grinder, and the oven dry section, temperature is made as 30-40 ℃, plate is put into charging aperture press through each pressure reel and get final product (but pressure reel can not start), so surface treatment is well not contaminated.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the process chart of prior art;
Fig. 2 is a process chart of the present invention.
Embodiment
As shown in Figure 2, be process chart of the present invention.
Embodiment 1, and the thick golden method of the plating in a kind of circuit board making process may further comprise the steps:
A, the chemical nickel and gold of at first circuit board being carried out pattern tin plating, etched circuit line, solder-mask printing, heavy nickel dam, turmeric layer are handled;
Wherein pattern tin plating may further comprise the steps:
A1, open the heavy copper facing in boring back on the circuit board of material, wherein circuit board is immersed copper facing in the copper plating bath, copper plating bath CU
2+Concentration is: contain 60 CU that restrain in every liter of solution
2+, CL
-: 40ppm contains H in per 100 liters of solution
2SO
48 liters;
After b1, the heavy copper facing, nog plate is carried out pre-treatment, print wet film again or paste dry film, bake plate, contraposition then, go out figure after described wet film or dry film are exposed, develop;
C1 and then electro-coppering;
D1, to the pattern tin plating on the circuit board: after handling through the circuit board pickling of electroplating once more, it is zinc-plated to put into electric tin cylinder energising, wherein in the tin plating electrolyte, contains the SN of 20 grams in every liter of solution
2+, per 100 liters of solution contain 12 gram sulfuric acid.
The step of described etched circuit line is:
A2, to the circuit board after the pattern tin plating under 45 ℃ of temperature, the sodium hydroxide solution with 10% moves back warm film or dry film;
B2, then under 55 ℃, to circuit board etched circuit line, in the etching liquid, every liter of solution contains 180 gram chloride ions, 150 gram copper ions;
C2, move back tin: circuit board is put into moved back the tin cylinder, swing is moved back tin by tin stripping liquid gently, and tin-stripping solution is with nitric acid and to protect copper liquid be the aqueous solution that primary raw material is formed;
D2, nog plate: will move back the circuit board that tin finishes and put into clear water, and open the Plate grinder nog plate, the Plate grinder nog plate finishes, and changes the QC room over to through visual examination.
The concrete steps of described solder-mask printing are:
A3, naked circuit board is carried out nog plate handle: at first naked circuit board is carried out pickling, then in template machine nog plate, nog plate after washing, oven dry;
B3, printing: circuit board seal green oil after nog plate handled or dirty oil, white oil, left standstill 15 minutes then;
C3, drying-plate: the plate after the printing is changed over to baking box, under 75 ℃, roasting 15 minutes;
D3, contraposition: the plate after the baking changes the contraposition room over to, and the inspection film is windowed and is fixed on the location hole;
E3, development: in developing machine, put into circuit board and develop development after washing, oven dry.
The concrete steps of heavy nickel dam are:
A4, to circuit board brush board cleaning, and immerse the acid solution oil removing, washing;
After b4, the circuit board washing, working concentration is the sodium peroxydisulfate solution microetch circuit board of 50g/L;
C4, to the circuit board after microetch washing, activate in advance then;
After d4, the pre-activation, preactivated plate is put into immerse in the solution of palladium sulfate and activated in 2 minutes;
After e4, the activation, under 80 ℃ of temperature, be 5.2 at PH, Ni
2+Concentration is: heavy nickel dam in the plating bath of 4.6g/L.
Turmeric layer concrete steps are: pure water cleaning after heavy nickel dam finishes, under 80 ℃ temperature, the plate that cleans through pure water is put into constantly swing turmeric layer of turmeric cylinder, and turmeric finishes, and pure water is clean dries.
B, the circuit board after the chemical nickel and gold is carried out anti-oxidation reprocessing: it is in 3% the sulfuric acid solution 50 seconds that circuit board is immersed concentration, and washing uses 1200 order brushes gently to grind then, washing again, 90 ℃ of oven dry down;
C, covering treatment is carried out in the non-gold-plated zone of circuit board; Open adhesive-tape application machine, put into circuit board, plate thick golden reverse side in the part and tape, circuit board was inserted frame after rubberizing was finished;
D, to after the circuit board surface preliminary treatment, circuit board is carried out the post-tensioning bus bar plates thick gold;
D1, to plating Hou Jin district nog plate: carry out nog plate through 1000 order brushes, wash then, dry, slotting frame;
D2, the circuit board behind the nog plate is sandwiched on the Electropolating hangers, puts in the citric acid together with hanger and immerse the several seconds;
D3, begin to plate first thick gold: hanger is clipped on the negative electrode of electric thick gold and switches on, setting-up time is electroplated;
D4, first plate Thickness Measurement by Microwave: to putting into the thickness of surveying metal instrumentation build-in test gold after first plate oven dry of plating thick gold, to gold-plated not enough, adjust electroplating time, it is thick qualified to survey gold again, produces in batches.
A, the chemical nickel and gold of at first circuit board being carried out pattern tin plating, etched circuit line, solder-mask printing, heavy nickel dam, turmeric layer are handled;
Wherein pattern tin plating may further comprise the steps:
A1, open the heavy copper facing in boring back on the circuit board of material, wherein circuit board is immersed copper facing in the copper plating bath, copper plating bath CU
2+Concentration is: contain 80 CU that restrain in every liter of solution
2+, CL
-: 80ppm contains H in per 100 liters of solution
2SO
410 liters;
After b1, the heavy copper facing, nog plate is carried out pre-treatment, print wet film again or paste dry film, bake plate, contraposition then, go out figure after described wet film or dry film are exposed, develop;
C1 and then electro-coppering;
D1, to the pattern tin plating on the circuit board: after handling through the circuit board pickling of electroplating once more, it is zinc-plated to put into electric tin cylinder energising, wherein in the tin plating electrolyte, contains the SN of 25 grams in every liter of solution
2+, per 100 liters of solution contain 8 gram sulfuric acid.
The step of described etched circuit line is:
A2, to the circuit board after the pattern tin plating under 60 ℃ of temperature, the sodium hydroxide solution with 8% moves back warm film or dry film;
B2, then under 50 ℃, to circuit board etched circuit line, in the etching liquid, every liter of solution contains 190 gram chloride ions, 130 gram copper ions;
C2, move back tin: circuit board is put into moved back the tin cylinder, swing is moved back tin by tin stripping liquid gently, and tin-stripping solution is with nitric acid and to protect copper liquid be the aqueous solution that primary raw material is formed;
D2, nog plate: will move back the circuit board that tin finishes and put into clear water, and open the Plate grinder nog plate, the Plate grinder nog plate finishes, and changes the QC room over to through visual examination.
The concrete steps of described solder-mask printing are:
A3, naked circuit board is carried out nog plate handle: at first naked circuit board is carried out pickling, then in template machine nog plate, nog plate after washing, oven dry;
B3, printing: circuit board seal green oil after nog plate handled or dirty oil, white oil, left standstill 15 minutes then;
C3, drying-plate: the plate after the printing is changed over to baking box, under 77 ℃, roasting 25 minutes;
D3, contraposition: the plate after the baking changes the contraposition room over to, and the inspection film is windowed and is fixed on the location hole;
E3, development: in developing machine, put into circuit board and develop development after washing, oven dry.
The concrete steps of heavy nickel dam are:
A4, to circuit board brush board cleaning, and immerse the acid solution oil removing, washing;
After b4, the circuit board washing, working concentration is the sodium peroxydisulfate solution microetch circuit board of 30g/L;
C4, to the circuit board after microetch washing, activate in advance then;
After d4, the pre-activation, preactivated plate is put into immerse in the solution of palladium sulfate and activated in 1.5 minutes;
After e4, the activation, under 82 ℃ of temperature, be 4.6 at PH, Ni
2+Concentration is: heavy nickel dam in the plating bath of 5.2g/L.
Turmeric layer concrete steps are: pure water cleaning after heavy nickel dam finishes, under 85 ℃ temperature, the plate that cleans through pure water is put into constantly swing turmeric layer of turmeric cylinder, and turmeric finishes, and pure water is clean dries.
B, the circuit board after the chemical nickel and gold is carried out anti-oxidation reprocessing: it is in 1% the sulfuric acid solution 60 seconds that circuit board is immersed concentration, and washing uses 1100 order brushes gently to grind then, washing again, 100 ℃ of oven dry down;
C, covering treatment is carried out in the non-gold-plated zone of circuit board; Open adhesive-tape application machine, put into circuit board, plate thick golden reverse side in the part and tape, circuit board was inserted frame after rubberizing was finished;
D, to after the circuit board surface preliminary treatment, circuit board is carried out the post-tensioning bus bar plates thick gold;
D1, to plating Hou Jin district nog plate: carry out nog plate through 1200 order brushes, wash then, dry, slotting frame;
D2, the circuit board behind the nog plate is sandwiched on the Electropolating hangers, puts in the citric acid together with hanger and immerse the several seconds;
D3, begin to plate first thick gold: hanger is clipped on the negative electrode of electric thick gold and switches on, setting-up time is electroplated;
D4, first plate Thickness Measurement by Microwave: to putting into the thickness of surveying metal instrumentation build-in test gold after first plate oven dry of plating thick gold, to gold-plated not enough, adjust electroplating time, it is thick qualified to survey gold again, produces in batches.
A, the chemical nickel and gold of at first circuit board being carried out pattern tin plating, etched circuit line, solder-mask printing, heavy nickel dam, turmeric layer are handled;
Wherein pattern tin plating may further comprise the steps:
A1, open the heavy copper facing in boring back on the circuit board of material, wherein circuit board is immersed copper facing in the copper plating bath, copper plating bath CU
2+Concentration is: contain 70 CU that restrain in every liter of solution
2+, CL
-: 60ppm contains H in per 100 liters of solution
2SO
412 liters;
After b1, the heavy copper facing, nog plate is carried out pre-treatment, print wet film again or paste dry film, bake plate, contraposition then, go out figure after described wet film or dry film are exposed, develop;
C1 and then electro-coppering;
D1, to the pattern tin plating on the circuit board: after handling through the circuit board pickling of electroplating once more, it is zinc-plated to put into electric tin cylinder energising, wherein in the tin plating electrolyte, contains the SN of 30 grams in every liter of solution
2+, per 100 liters of solution contain 10 gram sulfuric acid.
The step of described etched circuit line is:
A2, to the circuit board after the pattern tin plating under 40 ℃ of temperature, the sodium hydroxide solution with 5% moves back warm film or dry film;
B2, then under 45 ℃, to circuit board etched circuit line, in the etching liquid, every liter of solution contains 185 gram chloride ions, 140 gram copper ions;
C2, move back tin: circuit board is put into moved back the tin cylinder, swing is moved back tin by tin stripping liquid gently, and tin-stripping solution is with nitric acid and to protect copper liquid be the aqueous solution that primary raw material is formed;
D2, nog plate: will move back the circuit board that tin finishes and put into clear water, and open the Plate grinder nog plate, the Plate grinder nog plate finishes, and changes the QC room over to through visual examination.
The concrete steps of described solder-mask printing are:
A3, naked circuit board is carried out nog plate handle: at first naked circuit board is carried out pickling, then in template machine nog plate, nog plate after washing, oven dry;
B3, printing: circuit board seal green oil after nog plate handled or dirty oil, white oil, left standstill 15 minutes then;
C3, drying-plate: the plate after the printing is changed over to baking box, under 73 ℃, roasting 20 minutes;
D3, contraposition: the plate after the baking changes the contraposition room over to, and the inspection film is windowed and is fixed on the location hole;
E3, development: in developing machine, put into circuit board and develop development after washing, oven dry.
The concrete steps of heavy nickel dam are:
A4, to circuit board brush board cleaning, and immerse the acid solution oil removing, washing;
After b4, the circuit board washing, working concentration is the sodium peroxydisulfate solution microetch circuit board of 40g/L;
C4, to the circuit board after microetch washing, activate in advance then;
After d4, the pre-activation, preactivated plate is put into immerse in the solution of palladium sulfate and activated in 1 minute;
After e4, the activation, under 85 ℃ of temperature, be 5 at PH, Ni
2+Concentration is: heavy nickel dam in the plating bath of 5g/L.
Turmeric layer concrete steps are: pure water cleaning after heavy nickel dam finishes, under 90 ℃ temperature, the plate that cleans through pure water is put into constantly swing turmeric layer of turmeric cylinder, and turmeric finishes, and pure water is clean dries.
B, the circuit board after the chemical nickel and gold is carried out anti-oxidation reprocessing: it is in 5% the sulfuric acid solution 30 seconds that circuit board is immersed concentration, and washing uses 1000 order brushes gently to grind then, washing again, 80 ℃ of oven dry down;
C, covering treatment is carried out in the non-gold-plated zone of circuit board; Open adhesive-tape application machine, put into circuit board, plate thick golden reverse side in the part and tape, circuit board was inserted frame after rubberizing was finished;
D, to after the circuit board surface preliminary treatment, circuit board is carried out the post-tensioning bus bar plates thick gold;
D1, to plating Hou Jin district nog plate: carry out nog plate through 1100 order brushes, wash then, dry, slotting frame;
D2, the circuit board behind the nog plate is sandwiched on the Electropolating hangers, puts in the citric acid together with hanger and immerse the several seconds;
D3, begin to plate first thick gold: hanger is clipped on the negative electrode of electric thick gold and switches on, setting-up time is electroplated;
D4, first plate Thickness Measurement by Microwave: to putting into the thickness of surveying metal instrumentation build-in test gold after first plate oven dry of plating thick gold, to gold-plated not enough, adjust electroplating time, it is thick qualified to survey gold again, produces in batches.
Claims (10)
1. the thick golden method of plating in the circuit board making process is characterized in that, may further comprise the steps:
A, the chemical nickel and gold of at first substrate of circuit board being carried out pattern tin plating, etched circuit line, solder-mask printing, heavy nickel dam, turmeric layer are handled;
B, the circuit board after the chemical nickel and gold is carried out anti-oxidation reprocessing;
C, the non-gold-plated zone of circuit board is hidden preliminary treatment;
D, to after the circuit board surface preliminary treatment, circuit board is carried out the post-tensioning bus bar plates thick gold.
2. the thick golden method of the plating in the circuit board making process according to claim 1 is characterized in that, in the steps A, the step of described pattern tin plating is:
A1, open on the circuit board of material and hole, the heavy copper facing of circuit board;
After b1, the heavy copper facing, carry out figure transfer;
C1 and then electro-coppering;
D1, to the pattern tin plating on the circuit board.
3. the thick golden method of the plating in the circuit board making process according to claim 2 is characterized in that, in the steps A, the step of described pattern tin plating is:
A1, open the heavy copper facing in boring back on the circuit board of material, wherein circuit board is immersed copper facing in the copper plating bath, copper plating bath CU
2+Concentration is: contain the CU that 60-80 restrains in every liter of solution
2+, CL
-: 40-80ppm contains H in per 100 liters of solution
2S0
4The 8-12 liter.
After b1, the heavy copper facing, nog plate is carried out pre-treatment, print wet film again or paste dry film, bake plate, contraposition then, go out figure after described wet film or dry film are exposed, develop.
C1 and then electro-coppering;
D1, to the pattern tin plating on the circuit board: after handling through the circuit board pickling of electroplating once more, it is zinc-plated to put into electric tin cylinder energising, wherein in the tin plating electrolyte, contains the SN of 20-30 gram in every liter of solution
2+, per 100 liters of solution contain 8-12 gram sulfuric acid.
4. the thick golden method of the plating in the circuit board making process according to claim 1 is characterized in that, in the steps A, the step of described etched circuit line is:
A2, to the circuit board after the pattern tin plating under 40～60 ℃ of temperature, the sodium hydroxide solution with 5～10% moves back warm film or dry film.
B2, then under 45～55 ℃, to circuit board etched circuit line, in the etching liquid, every liter of solution contains 180-190 gram chloride ion, 130-150 restrains copper ion.
C2, move back tin: circuit board is put into moved back the tin cylinder, swing is moved back tin by tin stripping liquid gently, and tin-stripping solution is with nitric acid and to protect copper liquid be the aqueous solution that primary raw material is formed;
D2, nog plate: will move back the circuit board that tin finishes and put into clear water, and open the Plate grinder nog plate, the Plate grinder nog plate finishes, and changes the QC room over to through visual examination.
5. the thick golden method of the plating in the circuit board making process according to claim 1 is characterized in that, in the steps A, the step of described solder-mask printing is:
A3, naked circuit board is carried out nog plate handle: at first naked circuit board is carried out pickling, then at the Plate grinder nog plate, nog plate after washing, oven dry.
B3, printing: circuit board seal green oil, dirty oil or white oil to after the nog plate processing, left standstill 15 minutes then.
C3, drying-plate: the plate after the printing is changed over to baking box, under 75 ℃ ± 2 ℃, roasting 15 minutes～25 minutes.
D3, contraposition: the plate after the baking changes the contraposition room over to, and the inspection film is windowed and is fixed on the location hole.
E3, development: in developing machine, put into circuit board and develop development after washing, oven dry.
6. the thick golden method of the plating in the circuit board making process according to claim 1 is characterized in that, in the steps A, the step of described heavy nickel dam is:
A4, to circuit board brush board cleaning, and immerse the acid solution oil removing, washing;
After b4, the circuit board washing, working concentration is the sodium peroxydisulfate solution microetch circuit board of 30-50g/L;
C4, to the circuit board after microetch washing, activate in advance then;
After d4, the pre-activation, preactivated plate is put into immerse in the solution of palladium sulfate and activated in 1-2 minute.
After e4, the activation, under 80-85 ℃ of temperature, be 4.6-5.2, Ni at PH
2+Concentration is: heavy nickel dam in the plating bath of 4.6-5.2g/L.
7. the thick golden method of the plating in the circuit board making process according to claim 1, it is characterized in that, in the steps A, described turmeric layer step is: finish the back pure water at heavy nickel dam and clean, under 80-90 ℃ temperature, the plate that cleans through pure water is put into constantly swing turmeric layer of turmeric cylinder, and turmeric finishes, and pure water is clean dries.
8. the thick golden method of the plating in the circuit board making process according to claim 1 is characterized in that, among the step B, circuit board is immersed 30-60 second in the sulfuric acid solution that concentration is 1-5%, washing uses 1000-1200 order brush gently to grind then, washing again, oven dry under 90 ± 10 ℃.
9. the thick golden method of the plating in the circuit board making process according to claim 1 is characterized in that, among the step C, covering treatment is carried out in the non-gold-plated zone of circuit board; Open adhesive-tape application machine, put into circuit board, plate thick golden reverse side in the part and tape, circuit board was inserted frame after rubberizing was finished.
10. the thick golden method of the plating in the circuit board making process according to claim 1 is characterized in that, may further comprise the steps among the step D:
D1, to plating Hou Jin district nog plate: carry out nog plate through 1000-1200 order brush, wash then, dry, slotting frame;
D2, the circuit board behind the nog plate is sandwiched on the Electropolating hangers, puts in the citric acid together with hanger and immerse the several seconds;
D3, begin to plate first thick gold: hanger is clipped on the negative electrode of electric thick gold and switches on, setting-up time is electroplated;
D4, first plate Thickness Measurement by Microwave: to putting into the thickness of surveying metal instrumentation build-in test gold after first plate oven dry of plating thick gold, to gold-plated not enough, adjust electroplating time, it is thick qualified to survey gold again, produces in batches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101416127A CN101631427B (en) | 2008-07-14 | 2008-07-14 | Method for plating thick gold layer in circuit board manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101416127A CN101631427B (en) | 2008-07-14 | 2008-07-14 | Method for plating thick gold layer in circuit board manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101631427A CN101631427A (en) | 2010-01-20 |
| CN101631427B true CN101631427B (en) | 2011-07-27 |
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| CN2008101416127A Expired - Fee Related CN101631427B (en) | 2008-07-14 | 2008-07-14 | Method for plating thick gold layer in circuit board manufacturing process |
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| CN106255333A (en) * | 2016-08-18 | 2016-12-21 | 苏州市惠利华电子有限公司 | A kind ofization gold adds the hybrid process technique of gold finger plate |
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| CN101631427A (en) | 2010-01-20 |
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