CN105655259B - 引线框的制造方法 - Google Patents

引线框的制造方法 Download PDF

Info

Publication number: CN105655259B
Authority: CN; China
Prior art keywords: mentioned; lead frame; mask; etching; pattern
Prior art date: 2014-12-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN201510859485.4A

Other languages

English (en)

Chinese (zh)

Other versions

CN105655259A (zh

Inventor

高桥俊弘

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Chang Wah Technology Co Ltd

Original Assignee

Da Kun Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-12-01

Filing date

2015-11-30

Publication date

2019-01-11

2015-11-30 Application filed by Da Kun Electric Co Ltd filed Critical Da Kun Electric Co Ltd

2016-06-08 Publication of CN105655259A publication Critical patent/CN105655259A/zh

2019-01-11 Application granted granted Critical

2019-01-11 Publication of CN105655259B publication Critical patent/CN105655259B/zh

Status Active legal-status Critical Current

2035-11-30 Anticipated expiration legal-status Critical

Links

238000004519 manufacturing process Methods 0.000 title claims abstract description 35
238000005530 etching Methods 0.000 claims abstract description 83
238000000034 method Methods 0.000 claims abstract description 64
238000007788 roughening Methods 0.000 claims abstract description 61
238000012545 processing Methods 0.000 claims abstract description 47
229910052751 metal Inorganic materials 0.000 claims abstract description 42
239000002184 metal Substances 0.000 claims abstract description 42
239000004065 semiconductor Substances 0.000 claims description 69
238000007747 plating Methods 0.000 claims description 14
239000007788 liquid Substances 0.000 claims description 13
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
239000010931 gold Substances 0.000 claims description 3
229910052737 gold Inorganic materials 0.000 claims description 3
230000003628 erosive effect Effects 0.000 claims 1
230000015572 biosynthetic process Effects 0.000 abstract description 18
239000010410 layer Substances 0.000 description 78
239000011347 resin Substances 0.000 description 22
229920005989 resin Polymers 0.000 description 22
239000000243 solution Substances 0.000 description 20
238000005755 formation reaction Methods 0.000 description 17
238000009713 electroplating Methods 0.000 description 9
239000000463 material Substances 0.000 description 9
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 7
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
239000011248 coating agent Substances 0.000 description 5
238000000576 coating method Methods 0.000 description 5
229910052802 copper Inorganic materials 0.000 description 5
239000010949 copper Substances 0.000 description 5
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
230000005611 electricity Effects 0.000 description 4
238000005538 encapsulation Methods 0.000 description 4
238000002347 injection Methods 0.000 description 4
239000007924 injection Substances 0.000 description 4
229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
238000004140 cleaning Methods 0.000 description 3
239000011521 glass Substances 0.000 description 3
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
229910052759 nickel Inorganic materials 0.000 description 3
229910052763 palladium Inorganic materials 0.000 description 3
229920002120 photoresistant polymer Polymers 0.000 description 3
235000011121 sodium hydroxide Nutrition 0.000 description 3
239000007921 spray Substances 0.000 description 3
239000012790 adhesive layer Substances 0.000 description 2
239000007864 aqueous solution Substances 0.000 description 2
239000000470 constituent Substances 0.000 description 2
230000000694 effects Effects 0.000 description 2
230000005484 gravity Effects 0.000 description 2
239000007769 metal material Substances 0.000 description 2
239000000126 substance Substances 0.000 description 2
229910000881 Cu alloy Inorganic materials 0.000 description 1
239000002253 acid Substances 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
230000003321 amplification Effects 0.000 description 1
239000003963 antioxidant agent Substances 0.000 description 1
230000003078 antioxidant effect Effects 0.000 description 1
235000006708 antioxidants Nutrition 0.000 description 1
238000013459 approach Methods 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000011161 development Methods 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
238000007772 electroless plating Methods 0.000 description 1
239000012776 electronic material Substances 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
229910052738 indium Inorganic materials 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000003199 nucleic acid amplification method Methods 0.000 description 1
238000011084 recovery Methods 0.000 description 1
238000007789 sealing Methods 0.000 description 1
230000003746 surface roughness Effects 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Manufacturing & Machinery (AREA)
Lead Frames For Integrated Circuits (AREA)
Chemical & Material Sciences (AREA)
Inorganic Chemistry (AREA)
ing And Chemical Polishing (AREA)

CN201510859485.4A 2014-12-01 2015-11-30 引线框的制造方法 Active CN105655259B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2014-242864		2014-12-01
JP2014242864A JP6362111B2 (ja)	2014-12-01	2014-12-01	リードフレームの製造方法

Publications (2)

Publication Number	Publication Date
CN105655259A CN105655259A (zh)	2016-06-08
CN105655259B true CN105655259B (zh)	2019-01-11

Family

ID=56102785

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201510859485.4A Active CN105655259B (zh)	2014-12-01	2015-11-30	引线框的制造方法

Country Status (4)

Country	Link
JP (1)	JP6362111B2 (ja)
KR (1)	KR101773260B1 (ja)
CN (1)	CN105655259B (ja)
TW (1)	TWI600131B (ja)

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6259139B1 (ja) *	2017-03-24	2018-01-10	シチズンファインデバイス株式会社	板状部材、部材、矩形状片、部材製造方法および流体噴射オリフィスプレートの製造方法
JP6724851B2 (ja) *	2017-04-14	2020-07-15	株式会社デンソー	基材、それを用いたモールドパーケージ、基材の製造方法、およびモールドパッケージの製造方法
JP7353794B2 (ja)	2019-05-13	2023-10-02	ローム株式会社	半導体装置、その製造方法、及びモジュール
TW202129077A (zh) *	2019-10-11	2021-08-01	日商聯合精密科技股份有限公司	金屬加工部件及其製造方法、具備該金屬加工部件的部件搭載模組
JP7292776B2 (ja) *	2020-01-30	2023-06-19	大口マテリアル株式会社	リードフレーム
CN113534612B (zh) *	2020-04-17	2023-02-17	中铝洛阳铜加工有限公司	一种检测蚀刻用高精度引线框架材料平整度的快速方法
CN112151489B (zh) *	2020-09-01	2023-06-06	通富微电科技(南通)有限公司	引线框架、引线框架的形成方法及引线框架封装体
JPWO2022113661A1 (ja) *	2020-11-30	2022-06-02
JP7494107B2 (ja)	2020-12-28	2024-06-03	新光電気工業株式会社	リードフレーム、リードフレームの製造方法及び半導体装置
JP7413626B1 (ja)	2023-05-02	2024-01-16	長華科技股▲ふん▼有限公司	リードフレーム及びその製造方法

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Publication number	Priority date	Publication date	Assignee	Title
TW441062B (en) *	1998-12-24	2001-06-16	Shinko Electric Ind Co	Carrier substrate for producing semiconductor device
JP2014187122A (ja) *	2013-03-22	2014-10-02	Toppan Printing Co Ltd	Ｌｅｄパッケージとその製造方法
JP6347960B2 (ja) *	2014-01-29	2018-06-27	Ａｓｔｉ株式会社	マイクロニードルユニットと注射装置

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JPH0231844B2 (ja) *	1986-08-18	1990-07-17	Toppan Printing Co Ltd	Handotaisochoriidofureemunoseizohoho
JP3077918B2 (ja) *	1991-07-04	2000-08-21	共同印刷株式会社	エッチング方法
JPH11126859A (ja) *	1997-10-23	1999-05-11	Toppan Printing Co Ltd	リードフレームの製造方法
JP3879410B2 (ja) *	2001-02-06	2007-02-14	凸版印刷株式会社	リードフレームの製造方法
JP3963655B2 (ja) *	2001-03-22	2007-08-22	三洋電機株式会社	回路装置の製造方法
EP1602749A1 (en) *	2003-01-17	2005-12-07	Toppan Printing Co., Ltd.	Metal photo-etching product and production method therefor
JP4857594B2 (ja) *	2005-04-26	2012-01-18	大日本印刷株式会社	回路部材、及び回路部材の製造方法
JP2008187045A (ja)	2007-01-30	2008-08-14	Matsushita Electric Ind Co Ltd	半導体装置用リードフレームとその製造方法、半導体装置
JP5087787B2 (ja) *	2008-02-12	2012-12-05	住友金属鉱山株式会社	部分めっきリードフレームの製造方法
JP2009302209A (ja) *	2008-06-11	2009-12-24	Nec Electronics Corp	リードフレーム、半導体装置、リードフレームの製造方法および半導体装置の製造方法
JP2010010634A (ja) *	2008-06-30	2010-01-14	Shinko Electric Ind Co Ltd	リードフレーム及び半導体装置の製造方法
JP5387374B2 (ja) *	2009-12-04	2014-01-15	住友金属鉱山株式会社	リードフレームの製造方法
TW201250964A (en) *	2011-01-27	2012-12-16	Dainippon Printing Co Ltd	Resin-attached lead frame, method for manufacturing same, and lead frame
JP5813335B2 (ja) *	2011-02-08	2015-11-17	新光電気工業株式会社	リードフレーム、半導体装置、リードフレームの製造方法及び半導体装置の製造方法
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2014
- 2014-12-01 JP JP2014242864A patent/JP6362111B2/ja active Active
2015
- 2015-11-23 TW TW104138669A patent/TWI600131B/zh active
- 2015-11-30 CN CN201510859485.4A patent/CN105655259B/zh active Active
- 2015-11-30 KR KR1020150169367A patent/KR101773260B1/ko active IP Right Grant

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TW441062B (en) *	1998-12-24	2001-06-16	Shinko Electric Ind Co	Carrier substrate for producing semiconductor device
JP2014187122A (ja) *	2013-03-22	2014-10-02	Toppan Printing Co Ltd	Ｌｅｄパッケージとその製造方法
JP6347960B2 (ja) *	2014-01-29	2018-06-27	Ａｓｔｉ株式会社	マイクロニードルユニットと注射装置

Also Published As

Publication number	Publication date
TWI600131B (zh)	2017-09-21
TW201631725A (zh)	2016-09-01
KR101773260B1 (ko)	2017-08-31
JP6362111B2 (ja)	2018-07-25
CN105655259A (zh)	2016-06-08
JP2016105432A (ja)	2016-06-09
KR20160065763A (ko)	2016-06-09

Legal Events

Date	Code	Title	Description
2016-06-08	C06	Publication
2016-06-08	PB01	Publication
2016-07-06	C10	Entry into substantive examination
2016-07-06	SE01	Entry into force of request for substantive examination
2018-08-21	TA01	Transfer of patent application right
2018-08-21	TA01	Transfer of patent application right	Effective date of registration: 20180801 Address after: Kagoshima County, Japan Applicant after: Oguchi Electric Materials Co.,Ltd. Address before: Tokyo, Japan Applicant before: SH MATERIALS CO.,LTD.
2019-01-11	GR01	Patent grant
2019-01-11	GR01	Patent grant
2023-12-08	TR01	Transfer of patent right
2023-12-08	TR01	Transfer of patent right	Effective date of registration: 20231122 Address after: The road development processing zone Kaohsiung city Taiwan China No. 24 Patentee after: CHANG WAH TECHNOLOGY Co.,Ltd. Address before: Kagoshima County, Japan Patentee before: Oguchi Electric Materials Co.,Ltd.

Publication	Publication Date	Title
CN105655259B (zh)	2019-01-11	引线框的制造方法
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JP5549066B2 (ja)	2014-07-16	リードフレーム型基板とその製造方法、及び半導体装置
US8304294B2 (en)	2012-11-06	Lead frame substrate and method of manufacturing the same
WO2006115267A1 (ja)	2006-11-02	回路部材、回路部材の製造方法、半導体装置、及び回路部材表面の積層構造
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CN107799475A (zh)	2018-03-13	引线框架和电子部件装置
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CN104425431B (zh)	2018-12-21	基板结构、封装结构及其制造方法
KR20140005463A (ko)	2014-01-15	스마트 ｉｃ용 인쇄회로기판 및 그 제조방법
JP5846655B2 (ja)	2016-01-20	半導体装置の製造方法
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