CN105142897B - 附载体铜箔、印刷配线板、覆铜积层板、电子机器及印刷配线板的制造方法 - Google Patents

附载体铜箔、印刷配线板、覆铜积层板、电子机器及印刷配线板的制造方法 Download PDF

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Publication number
CN105142897B
CN105142897B CN201480019381.6A CN201480019381A CN105142897B CN 105142897 B CN105142897 B CN 105142897B CN 201480019381 A CN201480019381 A CN 201480019381A CN 105142897 B CN105142897 B CN 105142897B
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Prior art keywords
copper
carrier
thin layers
copper foil
layer
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CN201480019381.6A
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Chinese (zh)
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CN105142897A (zh
Inventor
古曳伦也
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN201480019381.6A 2013-03-29 2014-03-31 附载体铜箔、印刷配线板、覆铜积层板、电子机器及印刷配线板的制造方法 Active CN105142897B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2013-075188 2013-03-29
JP2013-075201 2013-03-29
JP2013-075198 2013-03-29
JP2013075201 2013-03-29
JP2013075198 2013-03-29
JP2013075188 2013-03-29
PCT/JP2014/059570 WO2014157728A1 (ja) 2013-03-29 2014-03-31 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
CN105142897A CN105142897A (zh) 2015-12-09
CN105142897B true CN105142897B (zh) 2018-09-28

Family

ID=51624683

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480019381.6A Active CN105142897B (zh) 2013-03-29 2014-03-31 附载体铜箔、印刷配线板、覆铜积层板、电子机器及印刷配线板的制造方法

Country Status (4)

Country Link
KR (1) KR101803165B1 (ja)
CN (1) CN105142897B (ja)
TW (1) TWI526299B (ja)
WO (1) WO2014157728A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6403969B2 (ja) * 2013-03-29 2018-10-10 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
JP6867102B2 (ja) * 2014-10-22 2021-04-28 Ｊｘ金属株式会社 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR20160093555A (ko) * 2015-01-29 2016-08-08 제이엑스금속주식회사 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
JP6782561B2 (ja) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6578379B2 (ja) * 2015-12-25 2019-09-18 三井金属鉱業株式会社 キャリア付銅箔、樹脂付銅箔、及びプリント配線板の製造方法
CN109072472B (zh) * 2016-04-14 2020-10-16 三井金属矿业株式会社 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法
TWI817166B (zh) * 2021-07-23 2023-10-01 先豐通訊股份有限公司 電路板及其製作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0398721A2 (en) * 1989-05-17 1990-11-22 Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha Thin copper foil for printed wiring board and method of manufacturing same
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027162A (ja) * 2001-07-13 2003-01-29 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
JP4612978B2 (ja) * 2001-09-20 2011-01-12 日本電解株式会社 複合銅箔及びその製造方法
TW584596B (en) * 2001-12-10 2004-04-21 Mitsui Chemicals Inc Method for manufacturing a polyimide and metal compound sheet
JP2009004423A (ja) * 2007-06-19 2009-01-08 Hitachi Cable Ltd キャリア箔付き銅箔
US20100215982A1 (en) * 2007-10-18 2010-08-26 Nippon Mining And Metals Co., Ltd. Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite
JP5406278B2 (ja) * 2009-03-27 2014-02-05 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔及びその製造方法
CN103154327A (zh) * 2010-10-06 2013-06-12 古河电气工业株式会社 铜箔及其制备方法、带有载体的铜箔及其制备方法、印刷电路板、多层印刷电路板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0398721A2 (en) * 1989-05-17 1990-11-22 Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha Thin copper foil for printed wiring board and method of manufacturing same
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔

Also Published As

Publication number Publication date
CN105142897A (zh) 2015-12-09
KR20150135523A (ko) 2015-12-02
WO2014157728A1 (ja) 2014-10-02
TWI526299B (zh) 2016-03-21
TW201446488A (zh) 2014-12-16
KR101803165B1 (ko) 2017-11-29

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Address after: No.4, 10-fan, erdingmu, huzhimen, Tokyo, Japan

Patentee after: JX Nippon Mining & Metals Corp.

Address before: Tokyo, Japan

Patentee before: JX Nippon Mining & Metals Corp.