CN105142897B - 附载体铜箔、印刷配线板、覆铜积层板、电子机器及印刷配线板的制造方法 - Google Patents
附载体铜箔、印刷配线板、覆铜积层板、电子机器及印刷配线板的制造方法 Download PDFInfo
- Publication number
- CN105142897B CN105142897B CN201480019381.6A CN201480019381A CN105142897B CN 105142897 B CN105142897 B CN 105142897B CN 201480019381 A CN201480019381 A CN 201480019381A CN 105142897 B CN105142897 B CN 105142897B
- Authority
- CN
- China
- Prior art keywords
- copper
- carrier
- thin layers
- copper foil
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-075188 | 2013-03-29 | ||
JP2013-075201 | 2013-03-29 | ||
JP2013-075198 | 2013-03-29 | ||
JP2013075201 | 2013-03-29 | ||
JP2013075198 | 2013-03-29 | ||
JP2013075188 | 2013-03-29 | ||
PCT/JP2014/059570 WO2014157728A1 (ja) | 2013-03-29 | 2014-03-31 | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105142897A CN105142897A (zh) | 2015-12-09 |
CN105142897B true CN105142897B (zh) | 2018-09-28 |
Family
ID=51624683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480019381.6A Active CN105142897B (zh) | 2013-03-29 | 2014-03-31 | 附载体铜箔、印刷配线板、覆铜积层板、电子机器及印刷配线板的制造方法 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101803165B1 (ja) |
CN (1) | CN105142897B (ja) |
TW (1) | TWI526299B (ja) |
WO (1) | WO2014157728A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6403969B2 (ja) * | 2013-03-29 | 2018-10-10 | Jx金属株式会社 | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 |
JP6867102B2 (ja) * | 2014-10-22 | 2021-04-28 | Jx金属株式会社 | 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法 |
KR101852671B1 (ko) * | 2015-01-21 | 2018-06-04 | 제이엑스금속주식회사 | 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법 |
KR20160093555A (ko) * | 2015-01-29 | 2016-08-08 | 제이엑스금속주식회사 | 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법 |
JP6782561B2 (ja) * | 2015-07-16 | 2020-11-11 | Jx金属株式会社 | キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
JP6058182B1 (ja) | 2015-07-27 | 2017-01-11 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6339636B2 (ja) | 2015-08-06 | 2018-06-06 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6200042B2 (ja) | 2015-08-06 | 2017-09-20 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6190500B2 (ja) | 2015-08-06 | 2017-08-30 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6578379B2 (ja) * | 2015-12-25 | 2019-09-18 | 三井金属鉱業株式会社 | キャリア付銅箔、樹脂付銅箔、及びプリント配線板の製造方法 |
CN109072472B (zh) * | 2016-04-14 | 2020-10-16 | 三井金属矿业株式会社 | 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法 |
TWI817166B (zh) * | 2021-07-23 | 2023-10-01 | 先豐通訊股份有限公司 | 電路板及其製作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0398721A2 (en) * | 1989-05-17 | 1990-11-22 | Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha | Thin copper foil for printed wiring board and method of manufacturing same |
JP2000269637A (ja) * | 1999-03-18 | 2000-09-29 | Furukawa Circuit Foil Kk | 高密度超微細配線板用銅箔 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003027162A (ja) * | 2001-07-13 | 2003-01-29 | Nippon Mining & Metals Co Ltd | 積層板用銅合金箔 |
JP4612978B2 (ja) * | 2001-09-20 | 2011-01-12 | 日本電解株式会社 | 複合銅箔及びその製造方法 |
TW584596B (en) * | 2001-12-10 | 2004-04-21 | Mitsui Chemicals Inc | Method for manufacturing a polyimide and metal compound sheet |
JP2009004423A (ja) * | 2007-06-19 | 2009-01-08 | Hitachi Cable Ltd | キャリア箔付き銅箔 |
US20100215982A1 (en) * | 2007-10-18 | 2010-08-26 | Nippon Mining And Metals Co., Ltd. | Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite |
JP5406278B2 (ja) * | 2009-03-27 | 2014-02-05 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔及びその製造方法 |
CN103154327A (zh) * | 2010-10-06 | 2013-06-12 | 古河电气工业株式会社 | 铜箔及其制备方法、带有载体的铜箔及其制备方法、印刷电路板、多层印刷电路板 |
-
2014
- 2014-03-31 WO PCT/JP2014/059570 patent/WO2014157728A1/ja active Application Filing
- 2014-03-31 KR KR1020157031096A patent/KR101803165B1/ko active IP Right Review Request
- 2014-03-31 TW TW103111942A patent/TWI526299B/zh active
- 2014-03-31 CN CN201480019381.6A patent/CN105142897B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0398721A2 (en) * | 1989-05-17 | 1990-11-22 | Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha | Thin copper foil for printed wiring board and method of manufacturing same |
JP2000269637A (ja) * | 1999-03-18 | 2000-09-29 | Furukawa Circuit Foil Kk | 高密度超微細配線板用銅箔 |
Also Published As
Publication number | Publication date |
---|---|
CN105142897A (zh) | 2015-12-09 |
KR20150135523A (ko) | 2015-12-02 |
WO2014157728A1 (ja) | 2014-10-02 |
TWI526299B (zh) | 2016-03-21 |
TW201446488A (zh) | 2014-12-16 |
KR101803165B1 (ko) | 2017-11-29 |
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Address after: No.4, 10-fan, erdingmu, huzhimen, Tokyo, Japan Patentee after: JX Nippon Mining & Metals Corp. Address before: Tokyo, Japan Patentee before: JX Nippon Mining & Metals Corp. |